LAMINATE Data Sheet FBGA Features Fine Pitch BGA Packages (FBGA) J-Devices wide array of FBGA portfolio can provide a solution for most any customer need. • Body size line-up covers 3 mm up to 22 mm • Minimum BGA pitch is 0.35 mm • Multi die integration is available with both side-by-side and stack-up type Applications • Cell phones, games, handheld devices, memory, automotive, computer and industrial applications • Applications where low profile, lightweight, minimum space, low cost and high density package is required • Low cost option using J-Device standard FBGA bill of materials selection • 3-22 mm body size • Square or rectangle packages available • 25-900 ball counts • 1.0-0.35 mm ball pitch • 2 and 4 layers substrate available • 0.5-1.7 mm total package thickness • JEDEC MO-216 compliant for 0.8 mm & 1.0 mm ball pitch • JEDEC MO-195 compliant for 0.5 mm & 0.65 mm ball pitch • JEDEC MO-298 compliant for 0.4 mm ball pitch • RoHS-6 (green) BOM options for 100% of FBGA family Thermal Performance Process Highlights • • • • • Die thickness: 0.05-0.25 mm Marking: Laser mark Wafer back grinding: Available Encapsulated SMT components: Available Micro Pb-free covered LGA Pads/LGAs: Available θJA at 1.0W 0 Airflow (°C/W) Body Size (mm) LFBGA TFBGA VFBGA 5x5 44.39 44.58 45.29 10 x 10 23.23 23.28 24.61 15 x 15 20.49 20.54 21.37 *Additional thermal data available Reliability Qualification • Moisture Sensitivity: Pre-condition of 30°C/60% RH,192 hours, IR reflow 260°C 3X • Temp/Humidity Bias: 85°C/85% RH, 1000 hours • Temp/Humidity Unbiased: 110°C/85% RH, 500 hours • Temp Cycle: -55°C/+125°C, 1000 cycles • High Temp Storage: 150°C, 1000 hours *Board level reliability available DSJD405A Rev Date: 5/15 www.j-devices.co.jp LAMINATE Data Sheet FBGA Standard Materials Test Services • Package substrate – Conductor: Cu – Dielectric: Epoxy resin glass reinforced • Die attach: Adhesive low stress elastomer • Mold compound: Epoxy mold compound • Low alpha material: Available • Solder ball: Pb-free • Wire type: Au, Cu • • • • • • Program conversion Product engineering Wafer sort 256 pin x 20 MHz test system available Burn-in capability Tape and reel services Shipping • JEDEC outline trays, tape & reel With respect to the information in this document, J-Devices makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. J-Devices shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify J-Devices’ warranty on any product beyond that set forth in its standard terms and conditions of sale. J-Devices reserves the right to make changes in its product and specifications at any time and without notice. © 2015, J-Devices Corporation. All Rights Reserved. DSJD405A Rev Date: 5/15 www.j-devices.co.jp