Design Center Leaders in Next Generation Package Design Semiconductor IC Package Design Services Amkor – Driving Advanced Semiconductor Package Design Amkor’s design engineers are trained experts and are experienced in all of the latest design tools and packaging technology. This allows our World Class Design Centers to reduce design cycle times and provide expert advice and service to our customers. Amkor plays a leading role in supporting customers in the development of next generation package design for existing and emerging products. We process thousands of new designs for our customers every year. As a result, we have an unparalleled level of package design expertise and can provide “best in class” leadframe, laminate or wafer level design services, including: ■ Highly trained and experienced design staff ■ High quality, reliable and cost effective designs ■ Design for Performance (DFP), Design for Manufacturing (DFM) and Design for Cost (DFC) ■ Excellent customer design collaboration to meet thermal, electrical and mechanical requirements Design For Performance (DFP) Amkor has developed an interactive design optimization method (co-design) that helps reduce the number of design iterations, design cycles and the overall cycle time. Our fully integrated design and simulation teams work together to meet our customers’ most stringent performance requirements. Whether you need a simple simulation or an extensive engineering analysis, Amkor design and simulation teams are here to help meet or exceed your requirements and expectations. Antiquated Design Process 1 2 3 4 5 6 Electricall/Thermal/ Mechanical Simulation Design Approved 5 6 Customer Provide Design Information Electrical/lThermal/ Electrical/Thermal/ Mechanical Simulation Electrical/lThermal/l Electrical/Thermal/ Mechanical Simulation Electrical/Thermal/ Electrical/l/Thermal/ Mechanical Simulation Amkor Complete Preliminary Design Design Revision Design Revision Design Revision 4 Advanced Co-design Process Customer 1 2 3 Provide Design Information AND Electrical/Thermal/ Mechanical Requirements Design Verification / Simulation/Sign-Off Design Approved YES Amkor Interactive Design AND Simulation NO Meets Requirements? Design For Manufacturing (DFM) ■ Design DropBox Amkor now offers a suite of Design Rule Checks (DRC) and design automation that has been developed specifically for customer use. This exclusive design automation can significantly reduce cycle time, the number of cycles and improve overall efficiency. Our Design for Manufacturing and Design Automation Suite includes: Online Design Rules, Wafer Level Package Design Kits (PDKs), Design DropBox, Design Quick Start and the Automatic Package Outline Drawing Generator. Design DropBox is a secure, cloud based, nextgeneration application that verifies design data. Simply “drop off” your design and let the Design DropBox do the work for you! The application is available 24 hours a day, 365 days a year. The Design DropBox verifies design data and automatically emails results directly to the customer. ■ Design Quick Start (DQS) Design Quick Start creates database start files for customer use. No more inefficient and time consuming searches for a similar design size and lead count when starting your next design. DQS allows you to start a new design quickly and more efficiently. Design Automation Suite ■ Online Design Rules Amkor’s Design Rules are available for customer use. To access the rules, a customer must register for a login and password. Once registered, customers can access and download the design rules. ■ Automatic Package Outline Drawing Generator Automatic Package Outline Drawing Generator allows customers to create package outline drawings parametrically by filling out a few required fields. Drawings are automatically generated and sent to customers via email. ■ Wafer-Level Package Design Kits (PDKs) Amkor has developed PDKs for wafer-level packages. PDKs allow customers to design wafer level packages and verify that their designs meet Amkor manufacturing requirements. Design For Cost (DFC) Amkor performs cost based analysis on all designs completed by the Amkor design Center. Cost based design analysis and optimization are done before, during and post design. The process also evaluates cost versus performance requirements and balances substrate and assembly trade-offs. It is an iterative process that has proven to successfully reduce cost on a vast majority of designs. Design For Cost 6 Design Options at 3 Suppliers $0.60 $0.50 $0.40 $0.30 $0.00 Option A Option B Supplier A Option C Supplier B Option D Option E Supplier C $0.40 $0.38 $0.37 $0.50 $0.47 $0.41 $0.42 $0.39 $0.37 $0.34 $0.34 $0.31 $0.37 $0.36 $0.35 $0.33 $0.31 $0.10 $0.31 $0.20 Option F The Evolution of Package Design Package design requirements continue to evolve in complexity and I/O density which can lead to an increase in cost. Understanding and controlling the factors that contribute to unnecessary cost can be a challenge. To design a package with the lowest possible cost, the balance between assembly, substrate and material cost needs to be considered. 10 Years Ago 5 Years Ago Current Design Cycle Time 5 Days 2-3 Weeks 1+ Month Design Requirements Design Manufacturing (DFM) Design for Performance (DFP) Customer Collaboration Involved after die tape out Involved prior to die tape out Design Iterations Minimal iterations Designer Role Layout designer Several iterations Package design engineer DFM, DFP Design for Cost (DFC) Involved before and during die tape out Constant iterations Package consultant Without accurately knowing and considering the individual costs of each of these parameters, the accumulated cost can be much greater than necessary. Amkor has the talent, tools and teamwork required to ensure delivery of the highest quality products at the lowest possible cost. At Amkor, we continue to exceed customer expectations and provide our customers with a distinct competitive advantage. Amkor incorporates “Design For Cost” and “Design For Manufacturing” when “Designing for Performance”. Our World Class Design Centers are strategically located in the United States, Korea, China, Philippines and Taiwan. We provide expertise in all aspects of package design beginning with our existing product line through our next generation technology. Our worldwide design team works together to ensure our customers receive fast, courteous and professional design services. Laminate Design US Korea China Leadframe Design Wafer Level Design Design Automation Electrical Simulation Thermal/Mechanical Simulation R&D Amkor Technology 2045 E. Innovation Circle | Tempe, AZ 85284 Contact us at: [email protected] Product info: www.amkor.com Philippines Taiwan For more information on our value added IC package design services, please contact the Amkor sales office near you or your account manager.