Design Center Brochure

Design Center
Leaders in Next Generation Package Design
Semiconductor IC Package
Design Services
Amkor – Driving Advanced Semiconductor Package Design
Amkor’s design engineers are trained experts and are experienced in
all of the latest design tools and packaging technology. This allows our
World Class Design Centers to reduce design cycle times and provide
expert advice and service to our customers.
Amkor plays a leading role in supporting customers in the
development of next generation package design for existing and
emerging products. We process thousands of new designs for our
customers every year. As a result, we have an unparalleled level of
package design expertise and can provide “best in class” leadframe,
laminate or wafer level design services, including:
■ Highly trained and experienced design staff
■ High quality, reliable and cost effective designs
■ Design for Performance (DFP), Design for Manufacturing
(DFM) and Design for Cost (DFC)
■ Excellent customer design collaboration to meet
thermal, electrical and mechanical requirements
Design For Performance (DFP)
Amkor has developed an interactive design optimization method (co-design) that helps reduce the number of
design iterations, design cycles and the overall cycle time. Our fully integrated design and simulation teams
work together to meet our customers’ most stringent performance requirements. Whether you need a simple
simulation or an extensive engineering analysis, Amkor design and simulation teams are here to help meet or
exceed your requirements and expectations.
Antiquated Design Process
1
2
3
4
5
6
Electricall/Thermal/
Mechanical
Simulation
Design Approved
5
6
Customer
Provide Design
Information
Electrical/lThermal/
Electrical/Thermal/
Mechanical
Simulation
Electrical/lThermal/l
Electrical/Thermal/
Mechanical
Simulation
Electrical/Thermal/
Electrical/l/Thermal/
Mechanical
Simulation
Amkor
Complete
Preliminary
Design
Design Revision
Design Revision
Design Revision
4
Advanced Co-design Process
Customer
1
2
3
Provide Design
Information AND
Electrical/Thermal/
Mechanical Requirements
Design Verification /
Simulation/Sign-Off
Design Approved
YES
Amkor
Interactive Design
AND Simulation
NO
Meets
Requirements?
Design For Manufacturing (DFM)
■ Design DropBox
Amkor now offers a suite of Design Rule Checks
(DRC) and design automation that has been
developed specifically for customer use. This
exclusive design automation can significantly reduce
cycle time, the number of cycles and improve overall
efficiency. Our Design for Manufacturing and Design
Automation Suite includes: Online Design Rules,
Wafer Level Package Design Kits (PDKs), Design
DropBox, Design Quick Start and the Automatic
Package Outline Drawing Generator.
Design DropBox is a secure, cloud based, nextgeneration application that verifies design data.
Simply “drop off” your design and let the Design
DropBox do the work for you! The application
is available 24 hours a day, 365 days a year.
The Design DropBox verifies design data and
automatically emails results directly to the customer.
■ Design Quick Start (DQS)
Design Quick Start creates database start files
for customer use. No more inefficient and time
consuming searches for a similar design size and
lead count when starting your next design. DQS
allows you to start a new design quickly and more
efficiently.
Design Automation Suite
■ Online Design Rules
Amkor’s Design Rules are available for customer
use. To access the rules, a customer must register
for a login and password. Once registered,
customers can access and download the design
rules.
■ Automatic Package Outline Drawing Generator
Automatic Package Outline Drawing Generator
allows customers to create package outline
drawings parametrically by filling out a few required
fields. Drawings are automatically generated and
sent to customers via email.
■ Wafer-Level Package Design Kits (PDKs)
Amkor has developed PDKs for wafer-level
packages. PDKs allow customers to design wafer
level packages and verify that their designs meet
Amkor manufacturing requirements.
Design For Cost (DFC)
Amkor performs cost based analysis on all designs completed by the Amkor design Center. Cost based design
analysis and optimization are done before, during and post design. The process also evaluates cost versus
performance requirements and balances substrate and assembly trade-offs. It is an iterative process that has
proven to successfully reduce cost on a vast majority of designs.
Design For Cost
6 Design Options at 3 Suppliers
$0.60
$0.50
$0.40
$0.30
$0.00
Option A
Option B
Supplier A
Option C
Supplier B
Option D
Option E
Supplier C
$0.40
$0.38
$0.37
$0.50
$0.47
$0.41
$0.42
$0.39
$0.37
$0.34
$0.34
$0.31
$0.37
$0.36
$0.35
$0.33
$0.31
$0.10
$0.31
$0.20
Option F
The Evolution of Package Design
Package design requirements
continue to evolve in
complexity and I/O density
which can lead to an increase
in cost. Understanding and
controlling the factors that
contribute to unnecessary cost
can be a challenge. To design
a package with the lowest
possible cost, the balance
between assembly, substrate
and material cost needs to be
considered.
10 Years Ago
5 Years Ago
Current
Design
Cycle Time
5 Days
2-3 Weeks
1+ Month
Design
Requirements
Design
Manufacturing
(DFM)
Design for
Performance
(DFP)
Customer
Collaboration
Involved after die
tape out
Involved prior
to die tape out
Design Iterations
Minimal iterations
Designer Role
Layout designer
Several iterations
Package design
engineer
DFM, DFP
Design for Cost
(DFC)
Involved before
and during die
tape out
Constant iterations
Package
consultant
Without accurately knowing and considering the
individual costs of each of these parameters,
the accumulated cost can be much greater
than necessary. Amkor has the talent, tools and
teamwork required to ensure delivery of the
highest quality products at the lowest possible
cost.
At Amkor, we continue to exceed customer expectations and provide our customers with a distinct competitive
advantage. Amkor incorporates “Design For Cost” and “Design For Manufacturing” when “Designing for
Performance”. Our World Class Design Centers are strategically located in the United States, Korea, China,
Philippines and Taiwan. We provide expertise in all aspects of package design beginning with our existing
product line through our next generation technology. Our worldwide design team works together to ensure our
customers receive fast, courteous and professional design services.
Laminate Design
US
Korea
China
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Leadframe Design
Wafer Level Design
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Design Automation
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Electrical Simulation
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Thermal/Mechanical
Simulation
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R&D
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Amkor Technology
2045 E. Innovation Circle | Tempe, AZ 85284
Contact us at: [email protected]
Product info: www.amkor.com
Philippines Taiwan
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For more information on our value
added IC package design services,
please contact the Amkor sales office
near you or your account manager.
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