Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized listing of package thermal characteristics (Junction-toAmbient and Junction-to-Case). This listing is not specific to individual devices sold by Analog Devices; it is representative of typical values for a given package and pin count. When the data sheet for a specific product lists thermal characteristics, that data is correct for that specific device and reflects any thermal enhancements that have been made in the packaging of that device. The JEDEC boards are horizontally mounted. Each board is made of FR4, is 1.57 mm thick, and consists of 2 oz/ft copper traces on one or both of the exposed sur faces. This is a low effect thermal conductivity test board. The JEDEC 4 layer boards are intended to give a near best-case thermal performance value. The JEDEC 4 layer board is made of FR4, is 1.60 mm thick, and consists of four copper layers. The two internal layers are solid copper (1 oz/ft or 35 um thick). The two surface layers utilize 2 oz/ft copper. PROCEDURE USED �JA test data was taken from either SEMI or JEDEC standard boards. The SEMI boards are vertically mounted and comply with the SEMI standard G42-88; the test Table I. Package Leads �JA �JC Board Type Layers Comments BGA 225 58 8.5 JEDEC 2 (19 × 19 mm) BGA 225 23 1.7 SEMI 2 (23 × 23 mm) BGA 225 29.9 8.5 JEDEC 4 (19 × 19 mm) BGA 225 27.5 BGA 256 BGA 256 BGA 10.6 JEDEC 4 (19 × 19 mm) 1.2 SEMI 2 (27 × 27 mm) 14.3 0.8 JEDEC 4 (27 × 27 mm) 260 31.8 12.4 JEDEC 4 (19 × 19 mm) BGA 304 27 JEDEC 2 (31 × 31 mm) BGA 313 48.7 5.3 SEMI 2 BGA 316 30 9.38 JEDEC 4 (23 × 23 mm) BGA 352 17.2 SEMI 2 (35 × 35 mm) BGA 352 12.7 2.8 JEDEC 4 (35 × 35 mm) BGA 400 25 3.6 BGA 400 15.7 BGA 484 16.6 BGA 500 BGA 625 JEDEC 2 (27 × 27 mm) JEDEC 4 (27 × 27 mm) 6.7 JEDEC 4 (19 × 19 mm) 9.3 2.2 JEDEC 4 (37.5 × 37.5 mm) 13.8 3.1 JEDEC 4 (27 × 27 mm) Data represents general results for packages. Result for specific devices can be found in their respective data sheets. a O n e T e c h n o l o g y W a y • P . O . B o x 9 1 0 6 • N o r w o o d , M A 0 2 0 6 2 - 9 1 0 6 • T e l : 7 8 1 - 937- 1428 • F a x : 7 8 1 - 3 2 6 - 8 7 0 3 • w w w . a n a l o g . c o m a Table I. (continued) Package Leads �JA CERDIP 16 CERDIP �JC Board Type Layers 75.9 SEMI 2 18 72.3 SEMI 2 CERDIP 20 70.4 SEMI 2 CERDIP 24 66.9 SEMI 2 CERDIP 28 50.9 SEMI 2 CERDIP 40 44.5 SEMI 2 CQFP 240 (32 ×32) 20 JEDEC 2 Heat sink CSP 20 (4 ×4) 135.7 JEDEC 2 Paddle soldered to board, no thermal vias in pad CSP 20 (4 ×4) 30.4 JEDEC 4 Paddle soldered to board, 9 thermal vias in pad CSP 20 (4 ×4) 70.5 JEDEC 2S2P Paddle not soldered to board CSP 32 (5 ×5) 108.2 JEDEC 2 Paddle soldered to board, no thermal vias in pad CSP 32 (5 ×5) 27.3 JEDEC 4 CSP 32 (5 ×5) 46 32.7 JEDEC 2S2P Paddle not soldered to board CSP 32 (5 ×5) 32.5 32.1 JEDEC 2S2P Paddle soldered to board, 9 thermal vias in pad CSP 48 (7 ×7) 25.9 JEDEC 4 CSP BGA 28 88.8 JEDEC 2 (7 × 7 mm) CSP BGA 28 47 JEDEC 4 (7 × 7 mm) CSP BGA 48 100 JEDEC 2 (7 × 7 mm) 0.25 20 Comments CSP BGA 52 77.7 JEDEC 4 (5 × 5 mm) CSP BGA 64 165 JEDEC 2 (9 × 9 mm) CSP BGA 64 129 JEDEC 4 (9 × 9 mm) CSP BGA 108 71.7 JEDEC 2 (10 × 10 mm) CSP BGA 108 37.3 JEDEC 4 (10 × 10 mm) CSP BGA 144 70.7 JEDEC 2 (10 × 10 mm) CSP BGA 144 67.6 SEMI 2 (13 × 13 mm) CSP BGA 144 34.4 JEDEC 4 (10 × 10 mm) CSP BGA 144 32.7 JEDEC 4 (13 × 13 mm) CSP BGA 160 62.3 5.8 JEDEC 2 (12 × 12 mm) CSP BGA 196 43.7 5 JEDEC 2 (15 × 15 mm) CSP BGA 196 38.5 JEDEC 4 (15 × 15 mm) JLCC 44 53 LCC 20 76.1 LCC 28 66.1 4.1 SEMI 2 LCC 44 49 10 SEMI 2 LCC 44 40 6 SEMI 2 LGA 16 (9.1 ×11.6) 25.7 25.9 JEDEC 4 8.3 7.4 7 nonstd SEMI 2 w/heat slug Data represents general results for packages. Result for specific devices can be found in their respective data sheets. –2– REV. 0 a Table I. (continued) Package Leads �JA �JC Board Type Layers Comments LQFP 34 121 45 SEMI 2 (7 × 7 mm) LQFP 44 43.3 JEDEC 4 (10 × 10 mm) LQFP 48 91 SEMI 2 (7 × 7 mm) LQFP 48 50.1 JEDEC 4 (7 × 7 mm) LQFP 52 29.9 1.5 SEMI 2 (14 × 14 mm) w/heat slug LQFP 64 65.9 11.1 SEMI 2 (10 × 10 mm) LQFP 64 53 3 SEMI 2 (10 × 10 mm) w/heat slug LQFP 64 68 13 SEMI 2 (14 × 14 mm) LQFP 64 47 11.1 nonstandard 4 (10 × 10 mm) LQFP 64 37.3 3.1 JEDEC 4 (10 × 10 mm) LQFP LQFP 64 80 41.3 48 1.2 JEDEC SEMI 4 2 (7 × 7 mm) w/heat slug (12 × 12 mm) LQFP 80 69 10 SEMI 2 (14 × 14 mm) JEDEC 4 (12 × 12 mm) 7.6 nonstandard 4 (14 × 14 mm) 19 LQFP 80 38.7 LQFP 80 38.1 LQFP 100 40 SEMI 2 (14 × 14 mm) LQFP 100 29.8 nonstandard 4 (14 × 14 mm) LQFP 120 35 SEMI 2 (14 × 14 mm) LQFP 120 46.4 SEMI 2 (14 × 14 mm) w/heat slug LQFP 128 47.1 SEMI 2 (14 × 14 mm) LQFP 128 36.1 SEMI 2 (14 × 20 mm) LQFP 144 42.1 SEMI 2 (20 × 20 mm) LQFP 144 22.5 0.6 SEMI 2 (20 × 20 mm) w/heat slug LQFP 144 45.3 1 JEDEC Lg Bd 2 (20 × 20 mm) w/exposed pad LQFP 144 33.8 nonstandard 4 (20 × 20 mm) LQFP 176 21 JEDEC Lg Bd 2 (24 × 24 mm) w/heat slug LQFP 176 21 JEDEC 4 (24 × 24 mm) LQFP 184 30.2 JEDEC 2 (20 × 20 mm) MSOP 8 214 44 SEMI 2 0.060 × 0.086 die MSOP 8 141.9 43.7 nonstandard 4 PDIP (N) 16 116.8 38.9 SEMI 2 PDIP (N) 20 102 30.6 SEMI 2 PDIP (N) 24 105 34.7 SEMI 2 PDIP (W) 28 73.6 23.5 SEMI 2 PLCC 20 89.4 46 SEMI 2 PLCC 28 79.3 36.7 SEMI 2 PLCC 44 47.7 17.5 SEMI 2 5 3.8 PLCC 44 35.6 19.4 nonstandard 4 PLCC 68 46.1 14.6 SEMI 2 PLCC 84 31.7 10.5 SEMI 2 44 30.2 PLCC (Thermally Enhanced) SEMI 2 Data represents general results for packages. Result for specific devices can be found in their respective data sheets. REV. 0 –3– a Table I. (continued) Package Leads PSOP 20 PSOP 20 PSOP 20 �JA �JC Board Type Layers Comments 0.85 SEMI 2 can handle 5.89 W, body size is 11 × 15.9 × 3.15 mm 53 SEMI 2 slug up 23.3 nonstandard 4 slug up PSOP 28 23.7 nonstandard 4 slug down QFP 44 93 22 SEMI 2 (10 × 10 mm) QFP QFP 44 52 72 122 22 nonstandard SEMI 4 2 (10 × 10 mm) (10 × 10 mm) QFP 64 48 SEMI 2 (10 × 10 × 2.7 mm) QFP 64 44 24.6 nonstandard 4 (14 × 14 mm) QFP 80 44.1 SEMI 2 (14 × 14 × 2.7 mm) QFP 100 50 6 SEMI 2 (14 × 20 mm) QFP 100 42.1 0.7 SEMI 2 (14 × 20 mm) power quad w/heat slug QFP 128 36 8.4 SEMI 2 (14 × 20 mm) QFP 128 37.5 JEDEC 4 (14 × 20 mm) QFP 160 40.5 6.7 SEMI 2 (28 × 28 mm) QFP 160 24.2 6 SEMI 2 (28 × 28 mm) heat slug 13.8 QFP 208 33.5 JEDEC 2 (28 × 28 mm) QFP 208 29.4 nonstandard 4 (28 × 28 mm) QFP 240 25.9 SEMI 2 (32 × 32 mm) QFP 240 15.9 SEMI 2 (32 × 32 mm) heat slug QFP 240 12.4 0.4 JEDEC 4 (32 × 32 mm) heat slug QFP 304 25.9 8.9 nonstandard 4 (40 × 40 mm) QSOP 16 150 39 SEMI 2 QSOP 16 105.4 38.8 nonstandard 4 QSOP 20 125.8 SEMI 2 QSOP 20 83.2 nonstandard 4 QSOP 24 122.3 31.3 SEMI 2 QSOP 24 82.1 31.3 nonstandard 4 QSOP 28 115.2 27 SEMI 2 QSOP 28 78.6 27 nonstandard 4 QSOP 36 58 SEMI 2 SC70 3 211.4 177.4 nonstandard 4 SC70 5 331.4 223.9 nonstandard 4 SC70 6 340.2 228.9 nonstandard 4 Data represents general results for packages. Result for specific devices can be found in their respective data sheets. –4– REV. 0 a Table I. (continued) Package Leads �JA �JC Board Type Layers SOIC 8 157 56 SEMI 2 SOIC 8 121.3 nonstandard 4 SOIC 14 104.5 SEMI 2 SOIC 16 124.9 42.9 SEMI 2 SOIC 16 80.6 42.9 nonstandard 4 SOIC (W) 16 89.2 55.6 SEMI 2 SOIC (W) 16 55.6 29.3 nonstandard 4 SOIC (W) 20 75.3 38 SEMI 2 SOIC (W) 20 57.7 nonstandard 4 SOIC (W) 28 71 23 SEMI 2 SOIC (W) Batwing 24 61 22 JEDEC 2 SOIC (W) Batwing 24 44.1 Eval 4 SOT143 4 368 SEMI 2 SOT143 4 265 nonstandard 4 SOT23 3 333 102 SEMI 2 SOT23 3 270 102 nonstandard 4 SOT23 5 240 SEMI 2 SOT23 6 229.6 92 SEMI 2 92 SOT23 6 169.5 SOT23 8 211.5 nonstandard 4 SEMI 2 SSOP 16 139 56 SEMI 2 SSOP 20 126 46 SEMI 2 SSOP 24 112 33.8 SEMI 2 SSOP 28 109 39 SEMI 2 SSOP 28 63.6 nonstandard 4 TSSOP 8 208 SEMI 2 TSSOP 8 140.8 nonstandard 4 TSSOP 14 136 SEMI 2 TSSOP 14 89.2 TSSOP 16 150.4 TSSOP 16 112.6 TSSOP 20 143 TSSOP 24 128 TSSOP 28 98 TSSOP 28 41.8 TSSOP 38 109.5 TSSOP 38 TSSOP TSSOP nonstandard 4 SEMI 2 nonstandard 4 SEMI 2 42 SEMI 2 14 SEMI 2 JEDEC 4 SEMI 2 71.1 nonstandard 4 28 (W) 96 SEMI 2 28 (W) 68.6 nonstandard 4 TSSOP 48 (W) 115 SEMI 2 TSSOP 48 (W) 70.5 nonstandard 4 27.6 45 9 32 Comments Data represents general results for packages. Result for specific devices can be found in their respective data sheets. REV. 0 –5–