Material Content Data Sheet Sales Product Name BSZ042N06NS MA# MA001014864 Package PG-TSDSON-8-26 Issued 17. June 2015 Weight* 36.77 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead phosphorus zinc iron copper phosphorus zinc iron copper 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7723-14-0 7440-66-6 7439-89-6 7440-50-8 0.629 1.71 0.002 0.01 0.010 0.03 268 0.197 0.54 5351 7.988 21.73 22.31 217271 222957 0.027 0.07 0.07 725 725 0.037 0.10 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.71 17110 17110 67 1002 1.897 5.16 16.486 44.83 50.09 448405 501011 0.400 1.09 1.09 10885 10885 0.020 0.06 0.06 553 553 0.023 0.06 0.019 0.05 0.895 2.43 0.001 0.00 0.005 0.01 128 0.094 0.26 2556 3.816 10.38 0.001 0.00 0.005 0.01 138 0.101 0.28 2755 4.112 11.19 51604 637 510 2.54 24331 10.65 103787 2. 3. 11.48 111851 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 106503 34 Important Remarks: 1. 25478 32 114778 1000000