Data Sheet

LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB
flash with ISP/IAP, fast ports and 10-bit ADC
Rev. 04 — 2 June 2009
Product data sheet
1. General description
The LPC2101/02/03 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with
real-time emulation that combines the microcontroller with 8 kB, 16 kB or 32 kB of
embedded high-speed flash memory. A 128-bit wide memory interface and a unique
accelerator architecture enable 32-bit code execution at the maximum clock rate. For
critical performance in interrupt service routines and DSP algorithms, this increases
performance up to 30 % over Thumb mode. For critical code size applications, the
alternative 16-bit Thumb mode reduces code by more than 30 % with minimal
performance penalty.
Due to their tiny size and low power consumption, the LPC2101/02/03 are ideal for
applications where miniaturization is a key requirement. A blend of serial communications
interfaces ranging from multiple UARTs, SPI to SSP and two I2C-buses, combined with
on-chip SRAM of 2 kB/4 kB/8 kB, make these devices very well suited for communication
gateways and protocol converters. The superior performance also makes these devices
suitable for use as math coprocessors. Various 32-bit and 16-bit timers, an improved
10-bit ADC, PWM features through output match on all timers, and 32 fast GPIO lines with
up to nine edge or level sensitive external interrupt pins make these microcontrollers
particularly suitable for industrial control and medical systems.
2. Features
2.1 Enhanced features
Enhanced features are available in parts LPC2101/02/03 labelled Revision A and higher:
n Deep power-down mode with option to retain SRAM memory and/or RTC.
n Three levels of flash Code Read Protection (CRP) implemented.
2.2 Key features
n 16-bit/32-bit ARM7TDMI-S microcontroller in tiny LQFP48 and HVQFN48 packages.
n 2 kB/4 kB/8 kB of on-chip static RAM and 8 kB/16 kB/32 kB of on-chip flash program
memory. 128-bit wide interface/accelerator enables high-speed 70 MHz operation.
n ISP/IAP via on-chip bootloader software. Single flash sector or full chip erase in
100 ms and programming of 256 bytes in 1 ms.
n EmbeddedICE-RT offers real-time debugging with the on-chip RealMonitor software.
n The 10-bit ADC provides eight analog inputs, with conversion times as low as 2.44 µs
per channel and dedicated result registers to minimize interrupt overhead.
n Two 32-bit timers/external event counters with combined seven capture and seven
compare channels.
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
n Two 16-bit timers/external event counters with combined three capture and seven
compare channels.
n Low power Real-Time Clock (RTC) with independent power and dedicated 32 kHz
clock input.
n Multiple serial interfaces including two UARTs (16C550), two Fast I2C-buses
(400 kbit/s), SPI and SSP with buffering and variable data length capabilities.
n Vectored interrupt controller with configurable priorities and vector addresses.
n Up to thirty-two, 5 V tolerant fast general purpose I/O pins.
n Up to 13 edge or level sensitive external interrupt pins available.
n 70 MHz maximum CPU clock available from programmable on-chip PLL with a
possible input frequency of 10 MHz to 25 MHz and a settling time of 100 µs.
n On-chip integrated oscillator operates with an external crystal in the range from 1 MHz
to 25 MHz.
n Power saving modes include Idle mode, Power-down mode with RTC active, and
Power-down mode.
n Individual enable/disable of peripheral functions as well as peripheral clock scaling for
additional power optimization.
n Processor wake-up from Power-down and Deep power-down (Revision A and higher)
mode via external interrupt or RTC.
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC2101FBD48
LQFP48
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm
SOT313-2
LPC2102FBD48
LQFP48
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm
SOT313-2
LPC2103FBD48
LQFP48
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm
SOT313-2
LPC2102FHN48
HVQFN48
plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 × 7 × 0.85 mm
SOT619-7
LPC2103FHN48
HVQFN48
plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 × 7 × 0.85 mm
SOT619-7
LPC2103FHN48H HVQFN48
plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 × 6 × 0.85 mm
SOT778-3
3.1 Ordering options
Table 2.
Ordering options
Type number
Flash memory
RAM
ADC
LPC2101FBD48
8 kB
2 kB
8 inputs
−40 to +85
LPC2102FBD48
16 kB
4 kB
8 inputs
−40 to +85
LPC2103FBD48
32 kB
8 kB
8 inputs
−40 to +85
LPC2102FHN48
16 kB
4 kB
8 inputs
−40 to +85
LPC2103FHN48
32 kB
8 kB
8 inputs
−40 to +85
LPC2103FHN48H
32 kB
8 kB
8 inputs
−40 to +85
LPC2101_02_03_4
Product data sheet
Temperature
range (°C)
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
2 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
4. Block diagram
TMS
TRST
LPC2101/2102/2103
P0[31:0]
HIGH SPEED
GENERAL
PURPOSE I/O
8 kB
BOOT ROM
TDI
TCK
XTAL2 VDD(3V3) VDD(1V8)
XTAL1
TDO
RST
VSS
TEST/DEBUG
INTERFACE
PLL
ARM7TDMI-S
AHB BRIDGE
system
clock
ARM7 local bus
SYSTEM
FUNCTIONS
VECTORED
INTERRUPT
CONTROLLER
AMBA AHB
(Advanced High-performance Bus)
INTERNAL
SRAM
CONTROLLER
MEMORY
ACCELERATOR
2 kB/4 kB/
8 kB SRAM
8 kB/16 kB/
32 kB FLASH
AHB TO APB
BRIDGE
APB (ARM
peripheral bus)
EINT2 to
EINT0(1)
3 × CAP0(1)
4 × CAP1(1)
3 × CAP2(1)
3 × MAT0(1)
4 × MAT1(1)
3 × MAT2(1)
4 × MAT3(1)
EXTERNAL
INTERRUPTS
I2C-BUS SERIAL
INTERFACES 0 AND 1
CAPTURE/COMPARE
EXTERNAL COUNTER
TIMER 0/TIMER 1/
TIMER 2/TIMER 3
SPI AND SSP
SERIAL INTERFACES
SDA0, SDA1(1)
SCK0, SCK1(1)
MOSI0, MOSI1(1)
MISO0, MISO1(1)
SSEL0, SSEL1(1)
TXD0, TXD1(1)
AD0[7:0]
P0[31:0]
SCL0, SCL1(1)
ADC
UART0/UART1
GENERAL
PURPOSE I/O
REAL-TIME CLOCK
WATCHDOG
TIMER
SYSTEM CONTROL
RXD0, RXD1(1)
DSR1, CTS1,
RTS1, DTR1
DCD1, RI1
RTCX1
RTCX2
VBAT
002aab814
(1) Pins shared with GPIO.
Fig 1.
Block diagram
LPC2101_02_03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
3 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
5. Pinning information
37 P0.12/DSR1/MAT1.0/AD0.5
38 P0.25/AD0.6
39 P0.26/AD0.7
40 VDD(3V3)
41 P0.13/DTR1/MAT1.1
42 VDDA
43 VSS
44 P0.14/DCD1/SCK1/EINT1
45 P0.15/RI1/EINT2
46 P0.16/EINT0/MAT0.2
47 P0.17/CAP1.2/SCL1
48 P0.18/CAP1.3/SDA1
5.1 Pinning
P0.19/MAT1.2/MISO1
1
36 P0.11/CTS1/CAP1.1/AD0.4
P0.20/MAT1.3/MOSI1
2
35 P0.10/RTS1/CAP1.0/AD0.3
P0.21/SSEL1/MAT3.0
3
34 P0.24/AD0.2
VBAT
4
33 P0.23/AD0.1
VDD(1V8)
5
RST
6
VSS
7
P0.27/TRST/CAP2.0
8
29 P0.8/TXD1/MAT2.1
P0.28/TMS/CAP2.1
9
28 P0.7/SSEL0/MAT2.0
32 P0.22/AD0.0
LPC2101FBD48
LPC2102FBD48
LPC2103FBD48
31 VSSA
30 P0.9/RXD1/MAT2.2
P0.29/TCK/CAP2.2 10
27 DBGSEL
Fig 2.
P0.6/MOSI0/CAP0.2 24
P0.5/MISO0/MAT0.1 23
P0.4/SCK0/CAP0.1 22
P0.3/SDA0/MAT0.0 21
002aab821
Pin configuration (LQFP48)
LPC2101_02_03_4
Product data sheet
VSS 19
RTCX1 20
VDD(3V3) 17
P0.2/SCL0/CAP0.0 18
P0.31/TDO 16
P0.30/TDI/MAT3.3 15
25 RTCX2
P0.1/RXD0/MAT3.2 14
26 RTCK
XTAL2 12
P0.0/TXD0/MAT3.1 13
XTAL1 11
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
4 of 37
LPC2101/02/03
NXP Semiconductors
37 P0.12/DSR1/MAT1.0/AD0.5
38 P0.25/AD0.6
40 VDD(3V3)
39 P0.26/AD0.7
41 P0.13/DTR1/MAT1.1
43 VSS
42 VDDA
44 P0.14/DCD1/SCK1/EINT1
45 P0.15/RI1/EINT2
46 P0.16/EINT0/MAT0.2
terminal 1
index area
47 P0.17/CAP1.2/SCL1
48 P0.18/CAP1.3/SDA1
Single-chip 16-bit/32-bit microcontrollers
P0.19/MAT1.2/MISO1
1
36 P0.11/CTS1/CAP1.1/AD0.4
P0.20/MAT1.3/MOSI1
2
35 P0.10/RTS1/CAP1.0/AD0.3
P0.21/SSEL1/MAT3.0
3
34 P0.24/AD0.2
VBAT
4
33 P0.23/AD0.1
VDD(1V8)
5
RST
6
VSS
7
P0.27/TRST/CAP2.0
8
29 P0.8/TXD1/MAT2.1
P0.28/TMS/CAP2.1
9
28 P0.7/SSEL0/MAT2.0
32 P0.22/AD0.0
LPC2102FHN48
LPC2103FHN48
LPC2103FHN48H
31 VSSA
30 P0.9/RXD1/MAT2.2
P0.29/TCK/CAP2.2 10
27 DBGSEL
P0.6/MOSI0/CAP0.2 24
P0.5/MISO0/MAT0.1 23
P0.4/SCK0/CAP0.1 22
RTCX1 20
P0.3/SDA0/MAT0.0 21
VSS 19
P0.2/SCL0/CAP0.0 18
VDD(3V3) 17
P0.31/TDO 16
P0.30/TDI/MAT3.3 15
25 RTCX2
P0.0/TXD0/MAT3.1 13
26 RTCK
XTAL2 12
P0.1/RXD0/MAT3.2 14
XTAL1 11
002aad918
Transparent top view
Fig 3.
Pin configuration (HVQFN48)
LPC2101_02_03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
5 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
5.2 Pin description
Table 3.
Pin description
Symbol
Pin
P0.0 to P0.31
P0.0/TXD0/
MAT3.1
13[1]
P0.1/RXD0/
MAT3.2
14[1]
P0.2/SCL0/
CAP0.0
18[2]
P0.3/SDA0/
MAT0.0
21[2]
P0.4/SCK0/
CAP0.1
22[1]
P0.5/MISO0/
MAT0.1
23[1]
P0.6/MOSI0/
CAP0.2
24[1]
P0.7/SSEL0/
MAT2.0
28[1]
P0.8/TXD1/
MAT2.1
29[1]
P0.9/RXD1/
MAT2.2
30[1]
P0.10/RTS1/
CAP1.0/AD0.3
35[3]
Type
Description
I/O
Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit.
A total of 31 pins of the Port 0 can be used as general purpose bidirectional
digital I/Os while P0.31 is an output only pin. The operation of port 0 pins
depends upon the pin function selected via the pin connect block.
I/O
P0.0 — General purpose input/output digital pin.
O
TXD0 — Transmitter output for UART0.
O
MAT3.1 — PWM output 1 for Timer 3.
I/O
P0.1 — General purpose input/output digital pin.
I
RXD0 — Receiver input for UART0.
O
MAT3.2 — PWM output 2 for Timer 3.
I/O
P0.2 — General purpose input/output digital pin. Output is open-drain.
I/O
SCL0 — I2C0 clock Input/output. Open-drain output (for I2C-bus compliance).
I
CAP0.0 — Capture input for Timer 0, channel 0.
I/O
P0.3 — General purpose input/output digital pin. Output is open-drain.
I/O
SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus compliance).
O
MAT0.0 — PWM output for Timer 0, channel 0. Output is open-drain.
I/O
P0.4 — General purpose input/output digital pin.
I/O
SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave.
I
CAP0.1 — Capture input for Timer 0, channel 1.
I/O
P0.5 — General purpose input/output digital pin.
I/O
MISO0 — Master In Slave Out for SPI0. Data input to SPI master or data
output from SPI slave.
O
MAT0.1 — PWM output for Timer 0, channel 1.
I/O
P0.6 — General purpose input/output digital pin.
I/O
MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data
input to SPI slave.
I
CAP0.2 — Capture input for Timer 0, channel 2.
I/O
P0.7 — General purpose input/output digital pin.
I
SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave.
O
MAT2.0 — PWM output for Timer 2, channel 0.
I/O
P0.8 — General purpose input/output digital pin.
O
TXD1 — Transmitter output for UART1.
O
MAT2.1 — PWM output for Timer 2, channel 1.
I/O
P0.9 — General purpose input/output digital pin.
I
RXD1 — Receiver input for UART1.
O
MAT2.2 — PWM output for Timer 2, channel 2.
I/O
P0.10 — General purpose input/output digital pin.
O
RTS1 — Request to Send output for UART1.
I
CAP1.0 — Capture input for Timer 1, channel 0.
I
AD0.3 — ADC 0, input 3.
LPC2101_02_03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
6 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0.11/CTS1/
CAP1.1/AD0.4
36[3]
I/O
P0.11 — General purpose input/output digital pin.
I
CTS1 — Clear to Send input for UART1.
I
CAP1.1 — Capture input for Timer 1, channel 1.
I
AD0.4 — ADC 0, input 4.
I/O
P0.12 — General purpose input/output digital pin.
I
DSR1 — Data Set Ready input for UART1.
O
MAT1.0 — PWM output for Timer 1, channel 0.
I
AD0.5 — ADC 0, input 5.
I/O
P0.13 — General purpose input/output digital pin.
O
DTR1 — Data Terminal Ready output for UART1.
O
MAT1.1 — PWM output for Timer 1, channel 1.
I/O
P0.14 — General purpose input/output digital pin.
I
DCD1 — Data Carrier Detect input for UART1.
I/O
SCK1 — Serial Clock for SPI1. SPI clock output from master or input to slave.
I
EINT1 — External interrupt 1 input.
I/O
P0.15 — General purpose input/output digital pin.
I
RI1 — Ring Indicator input for UART1.
I
EINT2 — External interrupt 2 input.
I/O
P0.16 — General purpose input/output digital pin.
P0.12/DSR1/
MAT1.0/AD0.5
37[3]
P0.13/DTR1/
MAT1.1
41[1]
P0.14/DCD1/
SCK1/EINT1
44[4][5]
P0.15/RI1/
EINT2
45[4]
P0.16/EINT0/
MAT0.2
46[4]
P0.17/CAP1.2/
SCL1
P0.18/CAP1.3/
SDA1
P0.19/MAT1.2/
MISO1
P0.20/MAT1.3/
MOSI1
P0.21/SSEL1/
MAT3.0
47[6]
48[6]
1[1]
2[1]
3[1]
I
EINT0 — External interrupt 0 input.
O
MAT0.2 — PWM output for Timer 0, channel 2.
I/O
P0.17 — General purpose input/output digital pin. The output is not
open-drain.
I
CAP1.2 — Capture input for Timer 1, channel 2.
I/O
SCL1 — I2C1 clock Input/output. This pin is an open-drain output if I2C1
function is selected in the pin connect block.
I/O
P0.18 — General purpose input/output digital pin. The output is not
open-drain.
I
CAP1.3 — Capture input for Timer 1, channel 3.
I/O
SDA1 — I2C1 data Input/output. This pin is an open-drain output if I2C1
function is selected in the pin connect block.
I/O
P0.19 — General purpose input/output digital pin.
O
MAT1.2 — PWM output for Timer 1, channel 2.
I/O
MISO1 — Master In Slave Out for SSP. Data input to SSP master or data
output from SSP slave.
I/O
P0.20 — General purpose input/output digital pin.
O
MAT1.3 — PWM output for Timer 1, channel 3.
I/O
MOSI1 — Master Out Slave for SSP. Data output from SSP master or data
input to SSP slave.
I/O
P0.21 — General purpose input/output digital pin.
I
SSEL1 — Slave Select for SPI1. Selects the SPI interface as a slave.
O
MAT3.0 — PWM output for Timer 3, channel 0.
LPC2101_02_03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
7 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0.22/AD0.0
32[3]
I/O
P0.22 — General purpose input/output digital pin.
I
AD0.0 — ADC 0, input 0.
P0.23/AD0.1
33[3]
I/O
P0.23 — General purpose input/output digital pin.
I
AD0.1 — ADC 0, input 1.
P0.24/AD0.2
34[3]
I/O
P0.24 — General purpose input/output digital pin.
I
AD0.2 — ADC 0, input 2.
P0.25/AD0.6
38[3]
I/O
P0.25 — General purpose input/output digital pin.
I
AD0.6 — ADC 0, input 6.
P0.26/AD0.7
39[3]
I/O
P0.26 — General purpose input/output digital pin.
I
AD0.7 — ADC 0, input 7.
P0.27/TRST/
CAP2.0
8[1]
I/O
P0.27 — General purpose input/output digital pin.
I
TRST — Test Reset for JTAG interface. If DBGSEL is HIGH, this pin is
automatically configured for use with EmbeddedICE (Debug mode).
I
CAP2.0 — Capture input for Timer 2, channel 0.
P0.28/TMS/
CAP2.1
9[1]
I/O
P0.28 — General purpose input/output digital pin.
I
TMS — Test Mode Select for JTAG interface. If DBGSEL is HIGH, this pin is
automatically configured for use with EmbeddedICE (Debug mode).
I
CAP2.1 — Capture input for Timer 2, channel 1.
P0.29/TCK/
CAP2.2
10[1]
I/O
P0.29 — General purpose input/output digital pin.
I
TCK — Test Clock for JTAG interface. This clock must be slower than 1⁄6 of the
CPU clock (CCLK) for the JTAG interface to operate. If DBGSEL is HIGH, this
pin is automatically configured for use with EmbeddedICE (Debug mode).
I
CAP2.2 — Capture input for Timer 2, channel 2.
P0.30/TDI/
MAT3.3
15[1]
I/O
P0.30 — General purpose input/output digital pin.
I
TDI — Test Data In for JTAG interface. If DBGSEL is HIGH, this pin is
automatically configured for use with EmbeddedICE (Debug mode).
O
MAT3.3 — PWM output 3 for Timer 3.
P0.31/TDO
16[1]
O
P0.31 — General purpose output only digital pin.
O
TDO — Test Data Out for JTAG interface. If DBGSEL is HIGH, this pin is
automatically configured for use with EmbeddedICE (Debug mode).
RTCX1
20[7][8]
I
Input to the RTC oscillator circuit. Input voltage must not exceed 1.8 V.
RTCX2
25[7][8]
O
Output from the RTC oscillator circuit.
RTCK
26[7]
I/O
Returned test clock output: Extra signal added to the JTAG port. Assists
debugger synchronization when processor frequency varies. Bidirectional pin
with internal pull-up.
XTAL1
11
I
Input to the oscillator circuit and internal clock generator circuits. Input voltage
must not exceed 1.8 V.
XTAL2
12
O
Output from the oscillator amplifier.
DBGSEL
27
I
Debug select: When LOW, the part operates normally. When externally
pulled HIGH at reset, P0.27 to P0.31 are configured as JTAG port, and the
part is in Debug mode[9]. Input with internal pull-down.
RST
6
I
External reset input: A LOW on this pin resets the device, causing I/O ports
and peripherals to take on their default states and processor execution to
begin at address 0. TTL with hysteresis, 5 V tolerant.
LPC2101_02_03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
8 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
VSS
7, 19, 43
I
Ground: 0 V reference.
VSSA
31
I
Analog ground: 0 V reference. This should be nominally the same voltage as
VSS but should be isolated to minimize noise and error.
VDDA
42
I
Analog 3.3 V power supply: This should be nominally the same voltage as
VDD(3V3) but should be isolated to minimize noise and error. The level on this
pin also provides a voltage reference level for the ADC.
VDD(1V8)
5
I
1.8 V core power supply: This is the power supply voltage for internal
circuitry and the on-chip PLL.
VDD(3V3)
17, 40
I
3.3 V pad power supply: This is the power supply voltage for the I/O ports.
VBAT
4
I
RTC power supply: 3.3 V on this pin supplies the power to the RTC.
[1]
5 V tolerant (if VDD(3V3) and VDDA ≥ 3.0 V) pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
[2]
Open-drain 5 V tolerant (if VDD(3V3) and VDDA ≥ 3.0 V) digital I/O I2C-bus 400 kHz specification compatible pad. It requires external
pull-up to provide an output functionality. Open-drain configuration applies to ALL functions on that pin.
[3]
5 V tolerant (if VDD(3V3) and VDDA ≥ 3.0 V) pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and
analog input function. If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When
configured as an ADC input, digital section of the pad is disabled.
[4]
5 V tolerant (if VDD(3V3) and VDDA ≥ 3.0 V) pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns.
[5]
A LOW level during reset on pin P0.14 is considered as an external hardware request to start the ISP command handler.
[6]
Open-drain 5 V tolerant (if VDD(3V3) and VDDA ≥ 3.0 V) digital I/O I2C-bus 400 kHz specification compatible pad. It requires external
pull-up to provide an output functionality. Open-drain configuration applies only to I2C function on that pin.
[7]
Pad provides special analog functionality.
[8]
For lowest power consumption, pin should be left floating when the RTC is not used.
[9]
See LPC2101/02/03 User manual UM10161 for details.
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6. Functional description
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed Complex
Instruction Set Computers (CISC). This simplicity results in a high instruction throughput
and impressive real-time interrupt response from a small and cost-effective processor
core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• The standard 32-bit ARM set.
• A 16-bit Thumb set.
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
The particular flash implementation in the LPC2101/02/03 allows for full speed execution
also in ARM mode. It is recommended to program performance critical and short code
sections in ARM mode. The impact on the overall code size will be minimal but the speed
can be increased by 30 % over Thumb mode.
6.2 On-chip flash program memory
The LPC2101/02/03 incorporate a 8 kB, 16 kB or 32 kB flash memory system
respectively. This memory may be used for both code and data storage. Programming of
the flash memory may be accomplished in several ways. It may be programmed in system
via the serial port. The application program may also erase and/or program the flash while
the application is running, allowing a great degree of flexibility for data storage field
firmware upgrades, etc. The entire flash memory is available for user code as the
bootloader resides in a separate memory.
The LPC2101/02/03 flash memory provides a minimum of 100,000 erase/write cycles and
20 years of data-retention memory.
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6.3 On-chip static RAM
On-chip static RAM may be used for code and/or data storage. The SRAM may be
accessed as 8-bits, 16-bits, and 32-bits. The LPC2101/02/03 provide 2 kB, 4 kB or 8 kB of
static RAM.
6.4 Memory map
The LPC2101/02/03 memory map incorporates several distinct regions, as shown in
Figure 4.
In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either
flash memory (the default) or on-chip static RAM. This is described in Section 6.17
“System control”.
4.0 GB
0xFFFF FFFF
AHB PERIPHERALS
0xF000 0000
3.75 GB
APB PERIPHERALS
3.5 GB
0xE000 0000
3.0 GB
0xC000 0000
RESERVED ADDRESS SPACE
2.0 GB
BOOT BLOCK
0x8000 0000
0x7FFF FFFF
0x7FFF E000
0x7FFF DFFF
RESERVED ADDRESS SPACE
0x4000 2000
0x4000 1FFF
8 kB ON-CHIP STATIC RAM (LPC2103)
4 kB ON-CHIP STATIC RAM (LPC2102)
2 kB ON-CHIP STATIC RAM (LPC2101)
0x4000 0800
0x4000 07FF
0x4000 0000
1.0 GB
RESERVED ADDRESS SPACE
32 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2103)
16 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2102)
0.0 GB
0x4000 1000
0x4000 0FFF
8 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2101)
0x0000 8000
0x0000 7FFF
0x0000 4000
0x0000 3FFF
0x0000 2000
0x0000 1FFF
0x0000 0000
002aab822
Fig 4.
LPC2101/02/03 memory map
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6.5 Interrupt controller
The VIC accepts all of the interrupt request inputs and categorizes them as FIQ, vectored
IRQ, and non-vectored IRQ as defined by programmable settings. The programmable
assignment scheme means that priorities of interrupts from the various peripherals can be
dynamically assigned and adjusted.
FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC
combines the requests to produce the FIQ signal to the ARM processor. The fastest
possible FIQ latency is achieved when only one request is classified as FIQ, because then
the FIQ service routine does not need to branch into the interrupt service routine but can
run from the interrupt vector location. If more than one request is assigned to the FIQ
class, the FIQ service routine will read a word from the VIC that identifies which FIQ
source(s) is (are) requesting an interrupt.
Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned
to this category. Any of the interrupt requests can be assigned to any of the 16 vectored
IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.
Non-vectored IRQs have the lowest priority.
The VIC combines the requests from all the vectored and non-vectored IRQs to produce
the IRQ signal to the ARM processor. The IRQ service routine can start by reading a
register from the VIC and jumping there. If any of the vectored IRQs are pending, the VIC
provides the address of the highest-priority requesting IRQs service routine, otherwise it
provides the address of a default routine that is shared by all the non-vectored IRQs. The
default routine can read another VIC register to see what IRQs are active.
6.5.1 Interrupt sources
Each peripheral device has one interrupt line connected to the Vectored Interrupt
Controller, but may have several internal interrupt flags. Individual interrupt flags may also
represent more than one interrupt source.
6.6 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on chip peripherals. Peripherals should be connected to the appropriate pins
prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any
enabled peripheral function that is not mapped to a related pin should be considered
undefined.
The pin control module with its pin select registers defines the functionality of the
microcontroller in a given hardware environment.
After reset all pins of Port 0 are configured as input with the following exceptions: If the
DBGSEL pin is HIGH (Debug mode enabled), the JTAG pins will assume their JTAG
functionality for use with EmbeddedICE and cannot be configured via the pin connect
block.
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6.7 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back, as well as the current state of the port pins.
LPC2101/02/03 introduce accelerated GPIO functions over prior LPC2000 devices:
• GPIO registers are relocated to the ARM local bus for the fastest possible I/O timing.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
• All GPIO registers are byte addressable.
• Entire port value can be written in one instruction.
6.7.1 Features
• Bit-level set and clear registers allow a single instruction set or clear of any number of
bits in one port.
• Direction control of individual bits.
• Separate control of output set and clear.
• All I/O default to inputs after reset.
6.8 10-bit ADC
The LPC2101/02/03 contain one ADC. It is a single 10-bit successive approximation ADC
with eight channels.
6.8.1 Features
•
•
•
•
•
Measurement range of 0 V to 3.3 V.
Each converter capable of performing more than 400,000 10-bit samples per second.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition on input pin or Timer Match signal.
Every analog input has a dedicated result register to reduce interrupt overhead.
6.9 UARTs
The LPC2101/02/03 each contain two UARTs. In addition to standard transmit and
receive data lines, UART1 also provides a full modem control handshake interface.
Compared to previous LPC2000 microcontrollers, UARTs in LPC2101/02/03 include a
fractional baud rate generator for both UARTs. Standard baud rates such as 115200 can
be achieved with any crystal frequency above 2 MHz.
6.9.1 Features
• 16 byte Receive and Transmit FIFOs.
• Register locations conform to 16C550 industry standard.
• Receiver FIFO trigger points at 1, 4, 8, and 14 bytes
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• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Transmission FIFO control enables implementation of software (XON/XOFF) flow
control on both UARTs.
• UART1 is equipped with standard modem interface signals. This module also
provides full support for hardware flow control (auto-CTS/RTS).
6.10 I2C-bus serial I/O controllers
The LPC2101/02/03 each contain two I2C-bus controllers.
The I2C-bus is bidirectional, for inter-IC control using only two wires: a Serial Clock Line
(SCL), and a Serial Data Line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., LCD driver) or a transmitter with the
capability to both receive and send information such as serial memory. Transmitters
and/or receivers can operate in either master or slave mode, depending on whether the
chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus,
it can be controlled by more than one bus master connected to it.
The I2C-bus implemented in LPC2101/02/03 supports bit rates up to 400 kbit/s (Fast
I2C-bus).
6.10.1 Features
•
•
•
•
•
•
Compliant with standard I2C-bus interface.
Easy to configure as Master, Slave, or Master/Slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can also be used for test and diagnostic purposes.
6.11 SPI serial I/O controller
The LPC2101/02/03 each contain one SPI controller. The SPI is a full duplex serial
interface, designed to handle multiple masters and slaves connected to a given bus. Only
a single master and a single slave can communicate on the interface during a given data
transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the
slave, and the slave always sends 8 bits to 16 bits of data to the master.
6.11.1 Features
• Compliant with SPI specification.
• Synchronous, Serial, Full Duplex, Communication.
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• Combined SPI master and slave.
• Maximum data bit rate of one eighth of the input clock rate.
6.12 SSP serial I/O controller
The LPC2101/02/03 each contain one SSP. The SSP controller is capable of operation on
a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the
bus. However, only a single master and a single slave can communicate on the bus during
a given data transfer. The SSP supports full duplex transfers, with data frames of 4 bits to
16 bits flowing from the master to the slave and from the slave to the master. Often only
one of these data streams carries meaningful data.
6.12.1 Features
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor’s Microwire buses
•
•
•
•
Synchronous serial communication
Master or slave operation
8-frame FIFOs for both transmit and receive
Four bits to 16 bits per frame
6.13 General purpose 32-bit timers/external event counters
The Timer/Counter is designed to count cycles of the Peripheral Clock (PCLK) or an
externally supplied clock and optionally generate interrupts or perform other actions at
specified timer values, based on four match registers. It also includes four capture inputs
to trap the timer value when an input signal transitions, optionally generating an interrupt.
Multiple pins can be selected to perform a single capture or match function, providing an
application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.
The LPC2101/02/03 can count external events on one of the capture inputs if the
minimum external pulse is equal or longer than a period of the PCLK. In this configuration,
unused capture lines can be selected as regular timer capture inputs or used as external
interrupts.
6.13.1 Features
• A 32-bit timer/counter with a programmable 32-bit prescaler.
• External event counter or timer operation.
• Four 32-bit capture channels per timer/counter that can take a snapshot of the timer
value when an input signal transitions. A capture event may also optionally generate
an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Four external outputs per timer/counter corresponding to match registers, with the
following capabilities:
– Set LOW on match.
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– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
6.14 General purpose 16-bit timers/external event counters
The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an
externally supplied clock and optionally generate interrupts or perform other actions at
specified timer values, based on four match registers. It also includes three capture inputs
to trap the timer value when an input signal transitions, optionally generating an interrupt.
Multiple pins can be selected to perform a single capture or match function, providing an
application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.
The LPC2101/02/03 can count external events on one of the capture inputs if the
minimum external pulse is equal or longer than a period of the PCLK. In this configuration,
unused capture lines can be selected as regular timer capture inputs or used as external
interrupts.
6.14.1 Features
• Two 16-bit timer/counters with a programmable 16-bit prescaler.
• External event counter or timer operation.
• Three 16-bit capture channels that can take a snapshot of the timer value when an
input signal transitions. A capture event may also optionally generate an interrupt.
• Four 16-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Four external outputs per timer/counter corresponding to match registers, with the
following capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
6.15 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
6.15.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
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•
•
•
•
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 32-bit timer with internal pre-scaler.
Selectable time period from (TPCLK × 256 × 4) to (TPCLK × 232 × 4) in multiples of
TPCLK × 4.
6.16 Real-time clock
The Real-Time Clock (RTC) is designed to provide a set of counters to measure time
when normal or idle operating mode is selected. The RTC has been designed to use little
power, making it suitable for battery powered systems where the CPU is not running
continuously (Idle mode).
6.16.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra-low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day
of Year.
• Can use either the RTC dedicated 32 kHz oscillator input or clock derived from the
external crystal/oscillator input at XTAL1. The programmable reference clock divider
allows fine adjustment of the RTC.
• Dedicated power supply pin can be connected to a battery or the main 3.3 V.
6.17 System control
6.17.1 Crystal oscillator
The on-chip integrated oscillator operates with external crystal in range of 1 MHz to
25 MHz. The oscillator output frequency is called fosc and the ARM processor clock
frequency is referred to as CCLK for purposes of rate equations, etc. fosc and CCLK are
the same value unless the PLL is running and connected. Refer to Section 6.17.2 “PLL”
and Section 10.1 “XTAL1 input” for additional information.
6.17.2 PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up into the range of 10 MHz to 70 MHz with a Current Controlled
Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the
multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper
frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so
there is an additional divider in the loop to keep the CCO within its frequency range while
the PLL is providing the desired output frequency. The output divider may be set to divide
by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2,
it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and
bypassed following a chip reset and may be enabled by software. The program must
configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL as a
clock source. The PLL settling time is 100 µs.
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6.17.3 Reset and wake-up timer
Reset has two sources on the LPC2101/02/03: the RST pin and watchdog reset. The RST
pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of chip reset by
any source starts the wake-up timer (see wake-up timer description below), causing the
internal chip reset to remain asserted until the external reset is de-asserted, the oscillator
is running, a fixed number of clocks have passed, and the on-chip flash controller has
completed its initialization.
When the internal reset is removed, the processor begins executing at address 0, which is
the reset vector. At that point, all of the processor and peripheral registers have been
initialized to predetermined reset values.
The wake-up timer ensures that the oscillator and other analog functions required for chip
operation are fully functional before the processor is allowed to execute instructions. This
is important at power on, all types of reset, and whenever any of the aforementioned
functions are turned off for any reason. Since the oscillator and other functions are turned
off during Power-down and Deep power-down mode, any wake-up of the processor from
the Power-down modes makes use of the wake-up timer.
The wake-up timer monitors the crystal oscillator as the means of checking whether it is
safe to begin code execution. When power is applied to the chip, or some event caused
the chip to exit Power-down mode, some time is required for the oscillator to produce a
signal of sufficient amplitude to drive the clock logic. The amount of time depends on
many factors, including the rate of VDD ramp (in the case of power on), the type of crystal
and its electrical characteristics (if a quartz crystal is used), as well as any other external
circuitry (e.g., capacitors), and the characteristics of the oscillator itself under the existing
ambient conditions.
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6.17.4 Code security (Code Read Protection - CRP)
This feature of the LPC2101/02/03 allows user to enable different levels of security in the
system so that access to the on-chip flash and use of the JTAG and ISP can be restricted.
When needed, CRP is invoked by programming a specific pattern into a dedicated flash
location. IAP commands are not affected by the CRP.
Implemented in bootloader code version 2.21 are three levels of the Code Read
Protection:
1. CRP1 disables access to chip via the JTAG and allows partial flash update (excluding
flash sector 0) using a limited set of the ISP commands. This mode is useful when
CRP is required and flash field updates are needed but all sectors cannot be erased.
2. CRP2 disables access to chip via the JTAG and only allows full flash erase and
update using a reduced set of the ISP commands.
3. Running an application with level CRP3 selected fully disables any access to chip via
the JTAG pins and the ISP. This mode effectively disables ISP override using P0.14
pin, too. It is up to the user’s application to provide (if needed) flash update
mechanism using IAP calls or call reinvoke ISP command to enable flash update via
UART0.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
Remark: Parts LPC2101/02/03 Revision ‘-’ have CRP2 enabled only (bootloader code
version 2.2).
6.17.5 External interrupt inputs
The LPC2101/02/03 include up to three edge or level sensitive external interrupt inputs as
selectable pin functions. When the pins are combined, external events can be processed
as three independent interrupt signals. The external interrupt inputs can optionally be
used to wake-up the processor from Power-down mode and Deep power-down mode.
Additionally all 10 capture input pins can also be used as external interrupts without the
option to wake the device up from Power-down mode.
6.17.6 Memory mapping control
The memory mapping control alters the mapping of the interrupt vectors that appear
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip
flash memory, or to the on-chip static RAM. This allows code running in different memory
spaces to have control of the interrupts.
6.17.7 Power control
The LPC2101/02/03 supports three reduced power modes: Idle mode, Power-down
mode, and Deep power-down mode.
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In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs.
Peripheral functions continue operation during Idle mode and may generate interrupts to
cause the processor to resume execution. Idle mode eliminates power used by the
processor itself, memory systems and related controllers, and internal buses.
In Power-down mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Power-down mode and the logic levels of chip output pins remain
static. The Power-down mode can be terminated and normal operation resumed by either
a reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Power-down mode reduces chip power
consumption to nearly zero.
Selecting an external 32 kHz clock instead of the PCLK as a clock-source for the on-chip
RTC will enable the microcontroller to have the RTC active during Power-down mode.
Power-down current is increased with RTC active. However, it is significantly lower than in
Idle mode.
In Deep-power down mode all power is removed from the internal chip logic except for the
RTC module, the I/O ports, the SRAM, and the 32 kHz external oscillator. For additional
power savings, SRAM and the 32 kHz oscillator can be powered down individually. The
Deep power-down mode produces the lowest possible power consumption without
actually removing power from the entire chip. In Deep power-down mode, the contents of
registers and memory are not preserved except for SRAM, if selected, and three general
purpose registers. Therefore, to resume operations, a full chip reset process is required.
A power selector module switches the RTC power supply from VBAT to VDD(1V8) whenever
the core voltage is present on pin VDD(1V8) to conserve battery power.
A power control for peripherals feature allows individual peripherals to be turned off if they
are not needed in the application, resulting in additional power savings during Active and
Idle mode.
6.17.8 APB
The APB divider determines the relationship between the processor clock (CCLK) and the
clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first
is to provide peripherals with the desired PCLK via APB so that they can operate at the
speed chosen for the ARM processor. In order to achieve this, the APB may be slowed
down to 1⁄2 to 1⁄4 of the processor clock rate. Because the APB must work properly at
power-up (and its timing cannot be altered if it does not work since the APB divider control
registers reside on the APB), the default condition at reset is for the APB to run at 1⁄4 of the
processor clock rate. The second purpose of the APB divider is to allow power savings
when an application does not require any peripherals to run at the full processor rate.
Because the APB divider is connected to the PLL output, the PLL remains active (if it was
running) during Idle mode.
6.18 Emulation and debugging
The LPC2101/02/03 support emulation and debugging via a JTAG serial port.
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6.18.1 EmbeddedICE
Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of
the target system requires a host computer running the debugger software and an
EmbeddedICE protocol converter. The EmbeddedICE protocol converter converts the
remote debug protocol commands to the JTAG data needed to access the ARM core.
The ARM core has a debug communication channel function built-in. The debug
communication channel allows a program running on the target to communicate with the
host debugger or another separate host without stopping the program flow or even
entering the debug state. The debug communication channel is accessed as a
coprocessor 14 by the program running on the ARM7TDMI-S core. The debug
communication channel allows the JTAG port to be used for sending and receiving data
without affecting the normal program flow. The debug communication channel data and
control registers are mapped in to addresses in the EmbeddedICE logic. The JTAG clock
(TCK) must be slower than 1⁄6 of the CPU clock (CCLK) for the JTAG interface to operate.
6.18.2 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2101/02/03 contain a specific configuration of
RealMonitor software programmed into the on-chip boot ROM memory.
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7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Min
Max
Unit
supply voltage (1.8 V)
[2]
−0.5
+2.5
V
VDD(3V3)
supply voltage (3.3 V)
[3]
−0.5
+4.6
V
VDDA
analog 3.3 V pad supply voltage
−0.5
+4.6
V
Vi(VBAT)
input voltage on pin VBAT
VDD(1V8)
Parameter
Conditions
−0.5
+4.6
V
[4]
−0.5
+5.1
V
[5][6]
−0.5
+6.0
V
[5]
−0.5
VDD + 0.5[7] V
supply current
[8]
-
100[9]
ISS
ground current
[10]
-
100[9]
mA
Tstg
storage temperature
[11]
−65
+150
°C
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
-
1.5
W
VESD
electrostatic discharge voltage
Human Body
Model (HBM)
−4000
+4000
V[12]
Machine Model
(MM)
−200
+200
V[13]
Charged Device
Model (CDM)
−800
+800
V[14]
for the RTC
analog input voltage
VIA
input voltage
VI
5 V tolerant I/O
pins
other I/O pins
IDD
mA
[1]
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Core and internal rail.
[3]
External rail.
[4]
On ADC related pins.
[5]
Including voltage on outputs in 3-state mode.
[6]
Only valid when the VDD(3V3) supply voltage is present.
[7]
Not to exceed 4.6 V.
[8]
Per supply pin.
[9]
The peak current is limited to 25 times the corresponding maximum current.
[10] Per ground pin.
[11] Dependent on package type.
[12] Performed per AEC-Q100-002.
[13] Performed per AEC-Q100-003.
[14] Performed per AEC-Q100-011.
LPC2101_02_03_4
Product data sheet
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Rev. 04 — 2 June 2009
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NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
8. Static characteristics
Table 5.
Static characteristics
Tamb= −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
1.65
1.8
1.95
V
2.6[4]
3.3
3.6
V
VDD(1V8)
supply voltage
(1.8 V)
[2]
VDD(3V3)
supply voltage
(3.3 V)
[3]
VDDA
analog 3.3 V pad
supply voltage
2.6[5]
3.3
3.6
V
Vi(VBAT)
input voltage on pin
VBAT
2.0[6]
3.3
3.6
V
Standard port pins, RST, RTCK
IIL
LOW-level input
current
VI = 0 V; no pull-up
-
-
3
µA
IIH
HIGH-level input
current
VI = VDD(3V3); no pull-down
-
-
3
µA
IOZ
OFF-state output
current
VO = 0 V, VO = VDD(3V3); no
pull-up/down
-
-
3
µA
Ilatch
I/O latch-up current
−(0.5VDD(3V3)) < VI < (1.5VDD(3V3));
-
-
100
mA
VI
input voltage
0
-
5.5
V
VDD(3V3)
V
Tj < 125 °C
VO
output voltage
VIH
pin configured to provide a digital
function; VDD(3V3) and VDDA ≥ 3.0 V
[7][8]
pin configured to provide a digital
function; VDD(3V3) and VDDA < 3.0 V
[7][8]
[9]
0
[9]
output active
0
-
VDD(3V3)
V
HIGH-level input
voltage
2.0
-
-
V
VIL
LOW-level input
voltage
-
-
0.8
V
Vhys
hysteresis voltage
0.4
-
-
V
VDD(3V3) − 0.4 -
-
V
VOH
HIGH-level output
voltage
IOH = −4 mA
[10]
VOL
LOW-level output
voltage
IOL = −4 mA
[10]
-
-
0.4
V
IOH
HIGH-level output
current
VOH = VDD(3V3) − 0.4 V
[10]
−4
-
-
mA
IOL
LOW-level output
current
VOL = 0.4 V
[10]
4
-
-
mA
IOHS
HIGH-level
short-circuit output
current
VOH = 0 V
[11]
-
-
−45
mA
IOLS
LOW-level
short-circuit output
current
VOL = VDDA
[11]
-
-
50
mA
Ipd
pull-down current
VI = 5 V[12]
10
50
150
µA
LPC2101_02_03_4
Product data sheet
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Rev. 04 — 2 June 2009
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LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 5.
Static characteristics …continued
Tamb= −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Ipu
Parameter
pull-up current
Min
Typ[1]
Max
Unit
−15
−50
−85
µA
0
0
0
µA
-
41
70
mA
VDD(1V8) = 1.8 V; Tamb = 25 °C
-
2.5
25
µA
VDD(1V8) = 1.8 V; Tamb = 85 °C
-
35
105
µA
-
0.7
-
µA
-
10
15
µA
VDD(1V8) = 1.8 V; Vi(VBAT) = 2.5 V
-
7
12
µA
VDD(1V8) = 1.8 V; Vi(VBAT) = 3.0 V
-
8
12
µA
-
8
-
µA
V
Conditions
VI = 0 V
VDD(3V3) < VI < 5
IDD(CORE) core supply current
[13]
V[12]
Active mode;
code
while(1){}
executed from flash; all peripherals
enabled via PCONP register but not
configured to run; CCLK = 70 MHz
VDD(1V8) = 1.8 V; Tamb = 25 °C
Power-down mode;
Deep power-down mode;
RTC off; SRAM off; Tamb = 25 °C
Vi(VBAT) = 3.3 V; VDD(1V8) = 1.8 V
IBAT
battery supply
current
Active mode; CCLK = 70 MHz;
PCLK = 17.5 MHz;
PCLK enabled to RTCK;
RTC clock = 32 kHz (from RTCX
pins); Tamb = 25 °C
[14]
VDD(1V8) = 1.8 V; Vi(VBAT) = 3.0 V
Power-down mode;
RTC clock = 32 kHz
(from RTCX pins); Tamb = 25 °C
Deep power-down mode;
RTC off; SRAM off; Tamb = 25 °C
VDD(1V8) = 1.8 V; Vi(VBAT) = 3.0 V
I2C-bus pins
VIH
HIGH-level input
voltage
0.7VDD(3V3)
-
-
VIL
LOW-level input
voltage
-
-
0.3VDD(3V3) V
Vhys
hysteresis voltage
-
0.5VDD(3V3) -
V
-
-
0.4
V
-
2
4
µA
-
10
22
µA
0
-
1.8
V
VOL
LOW-level output
voltage
IOLS = 3 mA
ILI
input leakage
current
VI = VDD(3V3)
VI = 5 V
[10]
[15]
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
LPC2101_02_03_4
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Rev. 04 — 2 June 2009
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LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 5.
Static characteristics …continued
Tamb= −40 °C to +85 °C for commercial applications, unless otherwise specified.
Min
Typ[1]
Max
Unit
output voltage on
pin XTAL2
0
-
1.8
V
input voltage on pin
RTCX1
0
-
1.8
V
0
-
1.8
V
Symbol
Parameter
Vo(XTAL2)
Vi(RTCX1)
Conditions
Vo(RTCX2) output voltage on
pin RTCX2
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
[2]
Core and internal rail.
[3]
External rail.
[4]
If VDD(3V3) < 3.0 V, the I/O pins are not 5 V tolerant, and the ADC input voltage is limited to VDDA = 3.0 V.
[5]
If VDDA < 3.0 V, the I/O pins are not 5 V tolerant.
[6]
The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[7]
Including voltage on outputs in 3-state mode.
[8]
VDD(3V3) supply voltages must be present.
[9]
3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[10] Accounts for 100 mV voltage drop in all supply lines.
[11] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[12] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. VDDA ≥ 3.0 V and VDD(3V3) ≥ 3.0 V.
[13] Applies to P0.25:16.
[14] Battery supply current on pin VBAT.
[15] Input leakage current to VSS.
Table 6.
ADC static characteristics
VDDA = 2.5 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified. ADC frequency 4.5 MHz.
Symbol
Parameter
VIA
analog input voltage
Cia
analog input capacitance
Conditions
differential linearity error
ED
Min
Typ
Max
Unit
0
-
VDDA
V
-
-
1
pF
[1][2][3]
-
-
±1
LSB
EL(adj)
integral non-linearity
[1][4]
-
-
±2
LSB
EO
offset error
[1][5]
-
-
±3
LSB
gain error
[1][6]
-
-
±0.5
%
absolute error
[1][7]
-
-
±4
LSB
EG
ET
[1]
Conditions: VSSA = 0 V, VDDA = 3.3 V and VDD(3V3) = 3.3 V for 10-bit resolution at full speed; VDDA = 2.6 V, VDD(3V3) = 2.6 V for 8-bit
resolution at full speed.
[2]
The ADC is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 5.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 5.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 5.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 5.
[7]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC
and the ideal transfer curve. See Figure 5.
LPC2101_02_03_4
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Rev. 04 — 2 June 2009
25 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
offset
error
EO
gain
error
EG
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
offset error
EO
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
1 LSB =
VDDA − VSSA
1024
002aac046
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 5.
ADC conversion characteristics
LPC2101_02_03_4
Product data sheet
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Rev. 04 — 2 June 2009
26 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
8.1 Power consumption in Deep power-down mode
002aae680
1.5
IDD(CORE)
(µA)
1.25
1
VDD(1V8) =1.8 V
1.7 V
0.75
1.65 V
0.5
−40
−15
10
35
60
85
Temperature (°C)
Test conditions: Deep power-down mode entered; RTC off; SRAM off;
Vi(VBAT) = VDD(3V3) = VDDA = 3.3 V.
Fig 6.
Core supply current IDD(CORE) measured at different temperatures and supply
voltages
002aae681
15
IBAT
(µA)
RTC on; SRAM on
RTC on; SRAM off
12.5
10
RTC off; SRAM on
RTC off; SRAM off
7.5
5
−40
−15
10
35
60
85
Temperature (°C)
Test conditions: Deep power-down mode entered; Vi(BAT) = 3.3 V; VDD(1V8) = 1.8 V;
VDD(3V3) = VDDA = 3.3 V.
Fig 7.
Battery supply current IBAT measured at different temperatures and conditions
LPC2101_02_03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
27 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
002aae682
0.20
IDD(IO)
(µA)
0.15
0.10
0.05
0
−40
−15
10
35
60
85
Temperature (°C)
Test conditions: Deep power-down mode entered; RTC off; SRAM off; VDD(3V3) = 3.3 V;
VDD(1V8) = 1.8 V; Vi(BAT) = VDDA = 3.3 V.
Fig 8.
I/O supply current IDD(IO) measured at different temperatures
LPC2101_02_03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
28 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
9. Dynamic characteristics
Table 7.
Dynamic characteristics
Tamb = 0 °C to 70 °C for commercial applications, −40 °C to +85 °C for industrial applications, VDD(1V8), VDD(3V3) over
specified ranges[1].
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
External clock
fosc
oscillator frequency
10
-
25
MHz
Tcy(clk)
clock cycle time
40
-
100
ns
tCHCX
clock HIGH time
Tcy(clk) × 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) × 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Port pins (except P0.2 and P0.3)
tr(o)
output rise time
-
10
-
ns
tf(o)
output fall time
-
10
-
ns
20 + 0.1 × Cb[3]
-
-
ns
I2C-bus
pins (P0.2 and P0.3)
output fall time
tf(o)
VIH to VIL
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
[3]
Bus capacitance Cb in pF, from 10 pF to 400 pF.
10. Application information
10.1 XTAL1 input
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave
mode, a minimum of 200 mV (RMS) is needed. For more details see the LPC2101/02/03
User manual UM10161.
LPC2xxx
XTAL1
Ci
100 pF
Cg
002aae718
Fig 9.
Slave mode operation of the on-chip oscillator
LPC2101_02_03_4
Product data sheet
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Rev. 04 — 2 June 2009
29 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
10.2 XTAL and RTC Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1 and Cx2, and Cx3 in
case of third overtone crystal usage, have a common ground plane. The external
components must also be connected to the ground plain. Loops must be made as small
as possible, in order to keep the noise coupled in via the PCB as small as possible. Also
parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen
smaller accordingly to the increase in parasitics of the PCB layout.
LPC2101_02_03_4
Product data sheet
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Rev. 04 — 2 June 2009
30 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
11. Package outline
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
c
y
X
36
25
A
37
24
ZE
e
E HE
A A2
(A 3)
A1
w M
θ
bp
pin 1 index
Lp
L
13
48
1
detail X
12
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
7.1
6.9
0.5
9.15
8.85
9.15
8.85
1
0.75
0.45
0.2
0.12
0.1
Z D (1) Z E (1)
θ
0.95
0.55
7
o
0
0.95
0.55
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT313-2
136E05
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 10. Package outline SOT313-2 (LQFP48)
LPC2101_02_03_4
Product data sheet
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Rev. 04 — 2 June 2009
31 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm
D
SOT619-7
A
B
terminal 1
index area
E
A
A1
c
detail X
e1
C
e
1/2 e
v
w
b
13
M
M
y1 C
C A B
C
y
24
L
25
12
e
e2
Eh
1/2 e
1
36
terminal 1
index area
48
37
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
7.1
6.9
3.45
3.15
7.1
6.9
3.45
3.15
0.5
5.5
5.5
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT619-7
---
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
05-10-24
05-10-25
Fig 11. Package outline SOT619-7 (HVQFN48)
LPC2101_02_03_4
Product data sheet
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Rev. 04 — 2 June 2009
32 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 x 6 x 0.85 mm
A
B
D
SOT778-3
terminal 1
index area
E
A
A1
c
detail X
C
e1
e
v
w
b
1/2 e
13
M
M
y1 C
C A B
C
y
24
L
25
12
e
e2
Eh
1/2 e
1
terminal 1
index area
36
48
37
X
Dh
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
mm
1
0.05
0.00
0.25
0.15
0.2
6.1
5.9
3.95
3.65
6.1
5.9
3.95
3.65
0.4
4.4
4.4
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT778-3
---
---
---
EUROPEAN
PROJECTION
ISSUE DATE
04-06-16
04-06-23
Fig 12. Package outline SOT778-3 (HVQFN48)
LPC2101_02_03_4
Product data sheet
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Rev. 04 — 2 June 2009
33 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
12. Abbreviations
Table 8.
Acronym list
Acronym
Description
ADC
Analog-to-Digital Converter
AMBA
Advanced Microcontroller Bus Architecture
APB
Advanced Peripheral Bus
DCC
Debug Communications Channel
DSP
Digital Signal Processor
FIFO
First In, First Out
FIQ
Fast Interrupt reQuest
GPIO
General Purpose Input/Output
IAP
In-Application Programming
IRQ
Interrupt Request
ISP
In-System Programming
PLL
Phase-Locked Loop
PWM
Pulse Width Modulator
SPI
Serial Peripheral Interface
SRAM
Static Random Access Memory
SSI
Synchronous Serial Interface
SSP
Synchronous Serial Port
TTL
Transistor-Transistor Logic
UART
Universal Asynchronous Receiver/Transmitter
VIC
Vectored Interrupt Controller
LPC2101_02_03_4
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NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
13. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
LPC2101_02_03_4
20090602
Product data sheet
Modifications:
LPC2101_02_03_3
Section 6.17.4 “Code security (Code Read Protection - CRP)”: added description of three
CRP levels (applicable to Revision A and higher).
•
Section 6.17.7 “Power control”: added description of Deep power-down mode (applicable to
Revision A and higher).
•
•
•
Section 10.1 “XTAL1 input” added.
•
•
•
Modifications:
Supersedes
•
•
•
LPC2101_02_03_3
Change
notice
Section 10.2 “XTAL and RTC Printed Circuit Board (PCB) layout guidelines” added.
Figure 6, Figure 7, Figure 8: added power consumption data for Deep power-down mode
(applicable to Revision A and higher).
Table 3: added table note 7.
Table 3: modified description of P0.14, RTCX1, RTCX2, XTAL1, XTAL2, JTAG, and DBGSEL
pins.
Table 4: modified value for VDD(3V3).
Table 5: added and modified values for Vhys.
Table 5: Voltage range for pins VDD(3V3) and VDDA extended to 2.6 V.
20081007
•
•
•
•
•
•
•
•
•
•
•
Product data sheet
-
LPC2101_02_03_2
Updated data sheet status to Product data sheet.
Table 1 and Table 2: added LPC2102FHN48 and LPC2103FHN48.
Table 1, Table 2, Table 3 and related figures: removed LPC2103FA44.
Table 3: updated pad descriptions.
Table 3: updated description of pin 47, SCL1.
Table 3: updated description of pins VDDA and VDD(1V8).
Table 4: changed storage temperature range from −40 °C/125 °C to −65 °C/150 °C.
Table 5: added or modified values for IDD(act), IDD(pd), IBATpd, IBATact.
Table 5: removed “CCLK = 10 MHz” and associated values for IDD(act).
Section 5: added Figure 3.
Section 11: added Figure 11.
LPC2101_02_03_2
20071218
Preliminary data sheet
-
LPC2101_02_03_1
LPC2101_02_03_1
20060118
Preliminary data sheet
-
-
LPC2101_02_03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
35 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
LPC2101_02_03_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 2 June 2009
36 of 37
LPC2101/02/03
NXP Semiconductors
Single-chip 16-bit/32-bit microcontrollers
16. Contents
1
2
2.1
2.2
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
6.5
6.5.1
6.6
6.7
6.7.1
6.8
6.8.1
6.9
6.9.1
6.10
6.10.1
6.11
6.11.1
6.12
6.12.1
6.13
6.13.1
6.14
6.14.1
6.15
6.15.1
6.16
6.16.1
6.17
6.17.1
6.17.2
6.17.3
6.17.4
6.17.5
6.17.6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Enhanced features . . . . . . . . . . . . . . . . . . . . . . 1
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . 10
Architectural overview. . . . . . . . . . . . . . . . . . . 10
On-chip flash program memory . . . . . . . . . . . 10
On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 11
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 12
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 12
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 12
Fast general purpose parallel I/O . . . . . . . . . . 13
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C-bus serial I/O controllers. . . . . . . . . . . . . . 14
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 14
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SSP serial I/O controller . . . . . . . . . . . . . . . . . 15
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
General purpose 32-bit timers/external
event counters . . . . . . . . . . . . . . . . . . . . . . . . 15
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
General purpose 16-bit timers/external
event counters . . . . . . . . . . . . . . . . . . . . . . . . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
System control . . . . . . . . . . . . . . . . . . . . . . . . 17
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 17
PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Reset and wake-up timer . . . . . . . . . . . . . . . . 18
Code security (Code Read Protection - CRP) 19
External interrupt inputs . . . . . . . . . . . . . . . . . 19
Memory mapping control . . . . . . . . . . . . . . . . 19
6.17.7
Power control . . . . . . . . . . . . . . . . . . . . . . . . .
6.17.8
APB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.18
Emulation and debugging. . . . . . . . . . . . . . . .
6.18.1
EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . .
6.18.2
RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . .
7
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
8
Static characteristics . . . . . . . . . . . . . . . . . . .
8.1
Power consumption in Deep power-down
mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9
Dynamic characteristics . . . . . . . . . . . . . . . . .
10
Application information . . . . . . . . . . . . . . . . .
10.1
XTAL1 input . . . . . . . . . . . . . . . . . . . . . . . . . .
10.2
XTAL and RTC Printed Circuit Board (PCB)
layout guidelines. . . . . . . . . . . . . . . . . . . . . . .
11
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
13
Revision history . . . . . . . . . . . . . . . . . . . . . . .
14
Legal information . . . . . . . . . . . . . . . . . . . . . .
14.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
14.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
14.3
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . .
14.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
15
Contact information . . . . . . . . . . . . . . . . . . . .
16
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
19
20
20
21
21
22
23
27
29
29
29
30
31
34
35
36
36
36
36
36
36
37
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 2 June 2009
Document identifier: LPC2101_02_03_4
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