Data Sheet

LPC2917/2919/01
ARM9 microcontroller with CAN and LIN
Rev. 03 — 9 December 2009
Product data sheet
1. General description
The LPC2917/2919/01 combine an ARM968E-S CPU core with two integrated TCM
blocks operating at frequencies of up to 125 MHz, CAN and LIN, 56 kB SRAM, up to
768 kB flash memory, external memory interface, two 10-bit ADCs, and multiple serial and
parallel interfaces in a single chip targeted at consumer, industrial, medical, and
communication markets. To optimize system power consumption, the LPC2917/2919/01
has a very flexible Clock Generation Unit (CGU) that provides dynamic clock gating and
scaling.
2. Features
„ ARM968E-S processor running at frequencies of up to 125 MHz maximum.
„ Multi-layer AHB system bus at 125 MHz with three separate layers.
„ On-chip memory:
‹ Two Tightly Coupled Memories (TCM), 16 kB Instruction TCM (ITCM), 16 kB Data
TCM (DTCM).
‹ Two separate internal Static RAM (SRAM) instances; 32 kB SRAM and 16 kB
SRAM.
‹ 8 kB ETB SRAM also available for code execution and data.
‹ Up to 768 kB high-speed flash-program memory.
‹ 16 kB true EEPROM, byte-erasable and programmable.
„ Dual-master, eight-channel GPDMA controller on the AHB multi-layer matrix which can
be used with the SPI interfaces and the UARTs, as well as for memory-to-memory
transfers including the TCM memories.
„ External Static Memory Controller (SMC) with eight memory banks; up to 32-bit data
bus; up to 24-bit address bus.
„ Serial interfaces:
‹ Two-channel CAN controller supporting FullCAN and extensive message filtering
‹ Two LIN master controllers with full hardware support for LIN communication. The
LIN interface can be configured as UART to provide two additional UART
interfaces.
‹ Two 550 UARTs with 16-byte Tx and Rx FIFO depths, DMA support, and
RS485/EIA-485 (9 bit) support.
‹ Three full-duplex Q-SPIs with four slave-select lines; 16 bits wide; 8 locations deep;
Tx FIFO and Rx FIFO.
‹ Two I2C-bus interfaces.
NXP Semiconductors
LPC2917/01; LPC2919/01
ARM9 microcontroller with CAN and LIN
„ Other peripherals:
‹ Two 10-bit ADCs, 8 channels each, with 3.3 V measurement range and conversion
times as low as 2.44 μs per channel. Each channel provides a compare function to
minimize interrupts.
‹ Multiple trigger-start option for all ADCs: timer, PWM, other ADC, and external
signal input.
‹ Four 32-bit timers each containing four capture-and-compare registers linked to
I/Os.
‹ Four six-channel PWMs (Pulse-Width Modulators) with capture and trap
functionality.
‹ Two dedicated 32-bit timers to schedule and synchronize PWM and ADC.
‹ Quadrature encoder interface that can monitor one external quadrature encoder.
‹ 32-bit watchdog with timer change protection, running on safe clock.
„ Up to 108 general-purpose I/O pins with programmable pull-up, pull-down, or bus
keeper.
„ Vectored Interrupt Controller (VIC) with 16 priority levels.
„ Up to 19 level-sensitive external interrupt pins, including CAN and LIN wake-up
features.
„ Configurable clock-out pin for driving external system clocks.
„ Processor wake-up from power-down via external interrupt pins; CAN or LIN activity.
„ Flexible Reset Generator Unit (RGU) able to control resets of individual modules.
„ Flexible Clock-Generation Unit (CGU0) able to control clock frequency of individual
modules:
‹ On-chip very low-power ring oscillator; fixed frequency of 0.4 MHz; always on to
provide a Safe_Clock source for system monitoring.
‹ On-chip crystal oscillator with a recommended operating range from 10 MHz to
25 MHz. PLL input range 10 MHz to 25 MHz.
‹ On-chip PLL allows CPU operation up to a maximum CPU rate of 125 MHz.
‹ Generation of up to 11 base clocks.
‹ Seven fractional dividers.
„ Second CGU (CGU1) with its own PLL generates a configurable clock output.
„ Highly configurable system Power Management Unit (PMU):
‹ clock control of individual modules.
‹ allows minimization of system operating power consumption in any configuration.
„ Standard ARM test and debug interface with real-time in-circuit emulator.
„ Boundary-scan test supported.
„ ETM/ETB debug functions with 8 kB of dedicated SRAM also accessible for
application code and data storage.
„ Dual power supply:
‹ CPU operating voltage: 1.8 V ± 5 %.
‹ I/O operating voltage: 2.7 V to 3.6 V; inputs tolerant up to 5.5 V.
„ 144-pin LQFP package.
„ −40 °C to +85 °C ambient operating temperature range.
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
2 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC2917FBD144/01
LQFP144 plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm
SOT486-1
LPC2919FBD144/01
LQFP144 plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm
SOT486-1
3.1 Ordering options
Table 2.
Part options
Type number
Flash memory
SRAM
SMC
LIN 2.0
CAN
Package
LPC2917FBD144/01
512 kB
56 kB + 2 × 16 kB TCM
32-bit
2
2
LQFP144
LPC2919FBD144/01
768 kB
56 kB + 2 × 16 kB TCM
32-bit
2
2
LQFP144
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
3 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
4. Block diagram
JTAG
interface
TEST/DEBUG
INTERFACE
LPC2917/01
LPC2919/01
ITCM
16 kB
DTCM
16 kB
8 kB SRAM
ARM968E-S
1 × master
2 × slave
VECTORED
INTERRUPT
CONTROLLER
AHB TO DTL
BRIDGE
master
slave
master
slave
slave
CLOCK
GENERATION
UNIT CGU0/1
GPDMA CONTROLLER
AHB TO DTL
BRIDGE
GPDMA REGISTERS
slave
RESET
GENERATION
UNIT
EXTERNAL STATIC
MEMORY CONTROLLER
slave
EMBEDDED SRAM 16 kB
POWER
MANAGEMENT
UNIT
slave
EMBEDDED SRAM 32 kB
slave
slave
TIMER0/1 MTMR
AHB TO APB
BRIDGE
PWM0/1/2/3
AHB
MULTI
LAYER
MATRIX
EMBEDDED FLASH
512/768 kB
16 kB
EEPROM
slave
AHB TO APB
BRIDGE
SYSTEM CONTROL
EVENT ROUTER
3.3 V ADC1/2
CHIP FEATURE ID
slave
QUADRATURE
ENCODER
CAN0/1
AHB TO APB
BRIDGE
AHB TO APB
BRIDGE
slave
GENERAL PURPOSE I/O
PORTS 0/1/2/3
TIMER 0/1/2/3
GLOBAL
ACCEPTANCE
FILTER
SPI0/1/2
RS485 UART0/1
LIN0/1
WDT
I2C0/1
002aad959
Grey-shaded blocks represent peripherals and memory regions accessible by the GPDMA.
Fig 1.
LPC2917/2919/01 block diagram
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
4 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
5. Pinning information
109
144
5.1 Pinning
1
108
LPC2917FBD144/01
LPC2919FBD144/01
Fig 2.
72
73
37
36
002aae265
Pin configuration for SOT486-1 (LQFP144)
5.2 Pin description
5.2.1 General description
The LPC2917/2919/01 has up to four ports: two of 32 pins each, one of 28 pins and one of
16 pins. The pin to which each function is assigned is controlled by the SFSP registers in
the SCU. The functions combined on each port pin are shown in the pin description tables
in this section.
5.2.2 LQFP144 pin assignment
Table 3.
LQFP144 pin assignment
Pin name
Pin
Description
Default function
Function 1
Function 2
Function 3
TDO
1[1]
IEEE 1149.1 test data out
P2[21]/SDI2/
PCAP2[1]/D19
2[1]
GPIO 2, pin 21
SPI2 SDI
PWM2 CAP1
EXTBUS D19
P0[24]/TXD1/
3[1]
TXDC1/SCS2[0]
GPIO 0, pin 24
UART1 TXD
CAN1 TXD
SPI2 SCS0
P0[25]/RXD1/
RXDC1/SDO2
4[1]
GPIO 0, pin 25
UART1 RXD
CAN1 RXD
SPI2 SDO
P0[26]/TXD1/
SDI2
5[1]
GPIO 0, pin 26
-
UART1 TXD
SPI2 SDI
P0[27]/RXD1/
SCK2
6[1]
GPIO 0, pin 27
-
UART1 RXD
SPI2 SCK
P0[28]/CAP0[0]/ 7[1]
MAT0[0]
GPIO 0, pin 28
-
TIMER0 CAP0
TIMER0 MAT0
P0[29]/CAP0[1]/ 8[1]
MAT0[1]
GPIO 0, pin 29
-
TIMER0 CAP1
TIMER0 MAT1
VDD(IO)
9
3.3 V power supply for I/O
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
5 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
Table 3.
LQFP144 pin assignment …continued
Pin name
Pin
Description
Default function
Function 1
Function 2
Function 3
P2[22]/SCK2/
PCAP2[2]/D20
10[1]
GPIO 2, pin 22
SPI2 SCK
PWM2 CAP2
EXTBUS D20
P2[23]/SCS1[0]/ 11[1]
PCAP3[0]/D21
GPIO 2, pin 23
SPI1 SCS0
PWM3 CAP0
EXTBUS D21
P3[6]/SCS0[3]/
PMAT1[0]/
TXDL1
12[1]
GPIO 3, pin 6
SPI0 SCS3
PWM1 MAT0
LIN1/UART TXD
P3[7]/SCS2[1]/
PMAT1[1]/
RXDL1
13[1]
GPIO 3, pin 7
SPI2 SCS1
PWM1 MAT1
LIN1/UART RXD
P0[30]/CAP0[2]/ 14[1]
MAT0[2]
GPIO 0, pin 30
-
TIMER0 CAP2
TIMER0 MAT2
P0[31]/CAP0[3]/ 15[1]
MAT0[3]
GPIO 0, pin 31
-
TIMER0 CAP3
TIMER0 MAT3
P2[24]/SCS1[1]/ 16[1]
PCAP3[1]/D22
GPIO 2, pin 24
SPI1 SCS1
PWM3 CAP1
EXTBUS D22
P2[25]/SCS1[2]/ 17[1]
PCAP3[2]/D23
GPIO 2, pin 25
SPI1 SCS2
PWM3 CAP2
EXTBUS D23
VDD(CORE)
18
1.8 V power supply for digital core
VSS(CORE)
19
ground for digital core
P1[31]/CAP0[1]/
MAT0[1]/EI5
20[1]
GPIO 1, pin 31
TIMER0 CAP1
TIMER0 MAT1
EXTINT5
VSS(IO)
21
ground for I/O
GPIO 1, pin 30
TIMER0 CAP0
TIMER0 MAT0
EXTINT4
23[1]
GPIO 3, pin 8
SPI2 SCS0
PWM1 MAT2
-
P3[9]/SDO2/PM 24[1]
AT1[3]
GPIO 3, pin 9
SPI2 SDO
PWM1 MAT3
-
P1[29]/CAP1[0]/ 25[1]
TRAP0/
PMAT3[5]
GPIO 1, pin 29
TIMER1 CAP0
PWM TRAP0
PWM3 MAT5
P1[28]/CAP1[1]/ 26[1]
TRAP1/
PMAT3[4]
GPIO 1, pin 28
TIMER1 CAP1, ADC1
EXT START
PWM TRAP1
PWM3 MAT4
P2[26]/CAP0[2]/ 27[1]
MAT0[2]/EI6
GPIO 2, pin 26
TIMER0 CAP2
TIMER0 MAT2
EXTINT6
P2[27]/CAP0[3]/ 28[1]
MAT0[3]/EI7
GPIO 2, pin 27
TIMER0 CAP3
TIMER0 MAT3
EXTINT7
P1[27]/CAP1[2]/ 29[1]
TRAP2/
PMAT3[3]
GPIO 1, pin 27
TIMER1 CAP2, ADC2
EXT START
PWM TRAP2
PWM3 MAT3
30[1]
GPIO 1, pin 26
PWM2 MAT0
PWM TRAP3
PWM3 MAT2
P1[30]/CAP0[0]/ 22[1]
MAT0[0]/EI4
P3[8]/SCS2[0]/
PMAT1[2]
P1[26]/
PMAT2[0]/
TRAP3/
PMAT3[2]
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
6 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
Table 3.
LQFP144 pin assignment …continued
Pin name
Pin
Description
Default function
Function 1
Function 2
Function 3
VDD(IO)
31
3.3 V power supply for I/O
P1[25]/
PMAT1[0]/
PMAT3[1]
32[1]
GPIO 1, pin 25
PWM1 MAT0
-
PWM3 MAT1
P1[24]/
PMAT0[0]/
PMAT3[0]
33[1]
GPIO 1, pin 24
PWM0 MAT0
-
PWM3 MAT0
P1[23]/
RXD0/CS5
34[1]
GPIO 1, pin 23
UART0 RXD
-
EXTBUS CS5
P1[22]/TXD0/
CS4
35[1]
GPIO 1, pin 22
UART0 TXD
-
EXTBUS CS4
TMS
36[1]
IEEE 1149.1 test mode select, pulled up internally
TCK
37[1]
IEEE 1149.1 test clock
P1[21]/CAP3[3]/
CAP1[3]/D7
38[1]
GPIO 1, pin 21
TIMER3 CAP3
TIMER1 CAP3,
MSCSS PAUSE
EXTBUS D7
P1[20]/CAP3[2]/ 39[1]
SCS0[1]/D6
GPIO 1, pin 20
TIMER3 CAP2
SPI0 SCS1
EXTBUS D6
P1[19]/CAP3[1]/ 40[1]
SCS0[2]/D5
GPIO 1, pin 19
TIMER3 CAP1
SPI0 SCS2
EXTBUS D5
P1[18]/CAP3[0]/ 41[1]
SDO0/D4
GPIO 1, pin 18
TIMER3 CAP0
SPI0 SDO
EXTBUS D4
P1[17]/CAP2[3]/ 42[1]
SDI0/D3
GPIO 1, pin 17
TIMER2 CAP3
SPI0 SDI
EXTBUS D3
VSS(IO)
43
ground for I/O
P1[16]/CAP2[2]/
SCK0/D2
44[1]
GPIO 1, pin 16
TIMER2 CAP2
SPI0 SCK
EXTBUS D2
P2[0]/MAT2[0]/
TRAP3/D8
45[1]
GPIO 2, pin 0
TIMER2 MAT0
PWM TRAP3
EXTBUS D8
P2[1]/MAT2[1]/
TRAP2/D9
46[1]
GPIO 2, pin 1
TIMER2 MAT1
PWM TRAP2
EXTBUS D9
P3[10]/SDI2/
PMAT1[4]
47[1]
GPIO 3, pin 10
SPI2 SDI
PWM1 MAT4
-
P3[11]/SCK2/
PMAT1[5]
48[1]
GPIO 3, pin 11
SPI2 SCK
PWM1 MAT5
-
P1[15]/CAP2[1]/ 49[1]
SCS0[0]/D1
GPIO 1, pin 15
TIMER2 CAP1
SPI0 SCS0
EXTBUS D1
P1[14]/CAP2[0]/ 50[1]
SCS0[3]/D0
GPIO 1, pin 14
TIMER2 CAP0
SPI0 SCS3
EXTBUS D0
P1[13]/SCL1/
EI3/WE
51[1]
GPIO 1, pin 13
EXTINT3
I2C1 SCL
EXTBUS WE
P1[12]/SDA1/
EI2/OE
52[1]
GPIO 1, pin 12
EXTINT2
I2C1 SDA
EXTBUS OE
VDD(IO)
53
3.3 V power supply for I/O
P2[2]/MAT2[2]/
TRAP1/D10
54[1]
GPIO 2, pin 2
PWM TRAP1
EXTBUS D10
TIMER2 MAT2
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
7 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
Table 3.
LQFP144 pin assignment …continued
Pin name
Pin
Description
Default function
Function 1
Function 2
Function 3
P2[3]/MAT2[3]/
TRAP0/D11
55[1]
GPIO 2, pin 3
TIMER2 MAT3
PWM TRAP0
EXTBUS D11
P1[11]/SCK1/
SCL0/CS3
56[1]
GPIO 1, pin 11
SPI1 SCK
I2C0 SCL
EXTBUS CS3
P1[10]/SDI1/
SDA0/CS2
57[1]
GPIO 1, pin 10
SPI1 SDI
I2C0 SDA
EXTBUS CS2
P3[12]/SCS1[0]/ 58[1]
EI4
GPIO 3, pin 12
SPI1 SCS0
EXTINT4
-
VSS(CORE)
59
ground for digital core
VDD(CORE)
60
1.8 V power supply for digital core
P3[13]/SDO1/
EI5/IDX0
61[1]
GPIO 3, pin 13
SPI1 SDO
EXTINT5
QEI0 IDX
P2[4]/MAT1[0]/
EI0/D12
62[1]
GPIO 2, pin 4
TIMER1 MAT0
EXTINT0
EXTBUS D12
P2[5]/MAT1[1]/
EI1/D13
63[1]
GPIO 2, pin 5
TIMER1 MAT1
EXTINT1
EXTBUS D13
P1[9]/SDO1/
RXDL1/CS1
64[1]
GPIO 1, pin 9
SPI1 SDO
LIN1/UART RXD
EXTBUS CS1
VSS(IO)
65
ground for I/O
P1[8]/SCS1[0]/
TXDL1/CS0
66[1]
GPIO 1, pin 8
SPI1 SCS0
LIN1/UART TXD
EXTBUS CS0
P1[7]/SCS1[3]/
RXD1/A7
67[1]
GPIO 1, pin 7
SPI1 SCS3
UART1 RXD
EXTBUS A7
P1[6]/SCS1[2]/
TXD1/A6
68[1]
GPIO 1, pin 6
SPI1 SCS2
UART1 TXD
EXTBUS A6
P2[6]/MAT1[2]/
EI2/D14
69[1]
GPIO 2, pin 6
TIMER1 MAT2
EXTINT2
EXTBUS D14
P1[5]/SCS1[1]/
PMAT3[5]/A5
70[1]
GPIO 1, pin 5
SPI1 SCS1
PWM3 MAT5
EXTBUS A5
P1[4]/SCS2[2]/
PMAT3[4]/A4
71[1]
GPIO 1, pin 4
SPI2 SCS2
PWM3 MAT4
EXTBUS A4
TRST
72[1]
IEEE 1149.1 test reset NOT; active LOW; pulled up internally
RST
73[1]
asynchronous device reset; active LOW; pulled up internally
VSS(OSC)
74
ground for oscillator
XOUT_OSC
75[2]
crystal out for oscillator
XIN_OSC
76[2]
crystal in for oscillator
VDD(OSC)
77
1.8 V supply for oscillator
VSS(PLL)
78
ground for PLL
P2[7]/MAT1[3]/
EI3/D15
79[1]
GPIO 2, pin 7
TIMER1 MAT3
EXTINT3
EXTBUS D15
P3[14]/SDI1/
EI6/TXDC0
80[1]
GPIO 3, pin 14
SPI1 SDI
EXTINT6
CAN0 TXD
P3[15]/SCK1/
EI7/RXDC0
81[1]
GPIO 3, pin 15
SPI1 SCK
EXTINT7
CAN0 RXD
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
8 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
Table 3.
LQFP144 pin assignment …continued
Pin name
Pin
Description
Default function
Function 1
Function 2
Function 3
VDD(IO)
82
3.3 V power supply for I/O
P2[8]/
CLK_OUT/
PMAT0[0]/
SCS0[2]
83[1]
GPIO 2, pin 8
CLK_OUT
PWM0 MAT0
SPI0 SCS2
P2[9]/PMAT0[1]/ 84[1]
SCS0[1]
GPIO 2, pin 9
-
PWM0 MAT1
SPI0 SCS1
P1[3]/SCS2[1]/
PMAT3[3]/A3
85[1]
GPIO 1, pin 3
SPI2 SCS1
PWM3 MAT3
EXTBUS A3
P1[2]/SCS2[3]/
PMAT3[2]/A2
86[1]
GPIO 1, pin 2
SPI2 SCS3
PWM3 MAT2
EXTBUS A2
P1[1]/EI1/
PMAT3[1]/A1
87[1]
GPIO 1, pin 1
EXTINT1
PWM3 MAT1
EXTBUS A1
VSS(CORE)
88
ground for digital core
VDD(CORE)
89
1.8 V power supply for digital core
P1[0]/EI0/
PMAT3[0]/A0
90[1]
GPIO 1, pin 0
EXTINT0
PWM3 MAT0
EXTBUS A0
P2[10]/
PMAT0[2]/
SCS0[0]
91[1]
GPIO 2, pin 10
-
PWM0 MAT2
SPI0 SCS0
P2[11]/
92[1]
PMAT0[3]/SCK0
GPIO 2, pin 11
-
PWM0 MAT3
SPI0 SCK
QEI0 PHB
CAN0 TXD
EXTBUS D24
P0[0]/PHB0/
TXDC0/D24
93[1]
GPIO 0, pin 0
VSS(IO)
94
ground for I/O
P0[1]/PHA0/
RXDC0/D25
95[1]
GPIO 0, pin 1
QEI 0 PHA
CAN0 RXD
EXTBUS D25
P0[2]/
CLK_OUT/
PMAT0[0]/D26
96[1]
GPIO 0, pin 2
CLK_OUT
PWM0 MAT0
EXTBUS D26
P0[3]/PMAT0[1]/ 97[1]
D27
GPIO 0, pin 3
-
PWM0 MAT1
EXTBUS D27
P3[0]/PMAT2[0]/ 98[1]
CS6
GPIO 3, pin 0
-
PWM2 MAT0
EXTBUS CS6
P3[1]/PMAT2[1]/ 99[1]
CS7
GPIO 3, pin 1
-
PWM2 MAT1
EXTBUS CS7
P2[12]/
PMAT0[4]/SDI0
100[1]
GPIO 2, pin 12
-
PWM0 MAT4
SPI0 SDI
P2[13]/
PMAT0[5]/
SDO0
101[1]
GPIO 2, pin 13
-
PWM0 MAT5
SPI0 SDO
P0[4]/PMAT0[2]/ 102[1]
D28
GPIO 0, pin 4
-
PWM0 MAT2
EXTBUS D28
P0[5]/PMAT0[3]/ 103[1]
D29
GPIO 0, pin 5
-
PWM0 MAT3
EXTBUS D29
VDD(IO)
104
3.3 V power supply for I/O
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
9 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
Table 3.
LQFP144 pin assignment …continued
Pin name
Pin
Description
Default function
Function 1
Function 2
Function 3
P0[6]/
PMAT0[4]/D30
105[1]
GPIO 0, pin 6
-
PWM0 MAT4
EXTBUS D30
P0[7]/
PMAT0[5]/D31
106[1]
GPIO 0, pin 7
-
PWM0 MAT5
EXTBUS D31
VDDA(ADC3V3)
107
3.3 V power supply for ADC
JTAGSEL
108[1]
TAP controller select input; LOW-level selects the ARM debug mode; HIGH-level selects
boundary scan; pulled up internally.
n.c.
109
not connected to a function, must be tied to 3.3 V power supply for ADC VDDA(ADC3V3).
VREFP
110[2]
HIGH reference for ADC
VREFN
111[2]
LOW reference for ADC
P0[8]/IN1[0]/TX
DL0/A20
112[3]
GPIO 0, pin 8
ADC1 IN0
LIN0/UART TXD
EXTBUS A20
P0[9]/IN1[1]/
RXDL0/A21
113[3]
GPIO 0, pin 9
ADC1 IN1
LIN0/UART RXD
EXTBUS A21
P0[10]/IN1[2]/
PMAT1[0]/A8
114[3]
GPIO 0, pin 10
ADC1 IN2
PWM1 MAT0
EXTBUS A8
P0[11]/IN1[3]/
PMAT1[1]/A9
115[3]
GPIO 0, pin 11
ADC1 IN3
PWM1 MAT1
EXTBUS A9
P2[14]/SDA1/
116[1]
PCAP0[0]/BLS0
GPIO 2, pin 14
I2C1 SDA
PWM0 CAP0
EXTBUS BLS0
P2[15]/SCL1/
117[1]
PCAP0[1]/BLS1
GPIO 2, pin 15
I2C1 SCL
PWM0 CAP1
EXTBUS BLS1
TIMER3 MAT0
PWM2 MAT2
-
P3[2]/MAT3[0]/
PMAT2[2]
118[1]
GPIO 3, pin 2
VSS(IO)
119
ground for I/O
P3[3]/MAT3[1]/
PMAT2[3]
120[1]
GPIO 3, pin 3
TIMER3 MAT1
PWM2 MAT3
-
P0[12]/IN1[4]/
PMAT1[2]/A10
121[3]
GPIO 0, pin 12
ADC1 IN4
PWM1 MAT2
EXTBUS A10
P0[13]/IN1[5]/
PMAT1[3]/A11
122[3]
GPIO 0, pin 13
ADC1 IN5
PWM1 MAT3
EXTBUS A11
P0[14]/IN1[6]/
PMAT1[4]/A12
123[3]
GPIO 0, pin 14
ADC1 IN6
PWM1 MAT4
EXTBUS A12
P0[15]/IN1[7]/
PMAT1[5]/A13
124[3]
GPIO 0, pin 15
ADC1 IN7
PWM1 MAT5
EXTBUS A13
P0[16]IN2[0]/
TXD0/A22
125[3]
GPIO 0, pin 16
ADC2 IN0
UART0 TXD
EXTBUS A22
P0[17]/IN2[1]/
RXD0/A23
126[3]
GPIO 0, pin 17
ADC2 IN1
UART0 RXD
EXTBUS A23
VDD(CORE)
127
1.8 V power supply for digital core
VSS(CORE)
128
ground for digital core
P2[16]/TXD1/
PCAP0[2]/BLS2
129[1]
GPIO 2, pin 16
UART1 TXD
PWM0 CAP2
EXTBUS BLS2
P2[17]/RXD1/
130[1]
PCAP1[0]/BLS3
GPIO 2, pin 17
UART1 RXD
PWM1 CAP0
EXTBUS BLS3
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
Table 3.
LQFP144 pin assignment …continued
Pin name
Pin
Description
Default function
Function 1
Function 2
Function 3
VDD(IO)
131
3.3 V power supply for I/O
P0[18]/IN2[2]/
PMAT2[0]/A14
132[3]
GPIO 0, pin 18
ADC2 IN2
PWM2 MAT0
EXTBUS A14
P0[19]/IN2[3]/
PMAT2[1]/A15
133[3]
GPIO 0, pin 19
ADC2 IN3
PWM2 MAT1
EXTBUS A15
P3[4]/MAT3[2]/
PMAT2[4]/
TXDC1
134[1]
GPIO 3, pin 4
TIMER3 MAT2
PWM2 MAT4
CAN1 TXD
P3[5]/MAT3[3]/
PMAT2[5]/
RXDC1
135[1]
GPIO 3, pin 5
TIMER3 MAT3
PWM2 MAT5
CAN1 RXD
P2[18]/SCS2[1]/ 136[1]
PCAP1[1]/D16
GPIO 2, pin 18
SPI2 SCS1
PWM1 CAP1
EXTBUS D16
P2[19]/SCS2[0]/ 137[1]
PCAP1[2]/D17
GPIO 2, pin 19
SPI2 SCS0
PWM1 CAP2
EXTBUS D17
P0[20]/IN2[4]/
PMAT2[2]/A16
138[3]
GPIO 0, pin 20
ADC2 IN4
PWM2 MAT2
EXTBUS A16
P0[21]/IN2[5]/
PMAT2[3]/A17
139[3]
GPIO 0, pin 21
ADC2 IN5
PWM2 MAT3
EXTBUS A17
P0[22]/IN2[6]/
PMAT2[4]/A18
140[3]
GPIO 0, pin 22
ADC2 IN6
PWM2 MAT4
EXTBUS A18
VSS(IO)
141
ground for I/O
P0[23]/IN2[7]/
PMAT2[5]/A19
142[3]
GPIO 0, pin 23
ADC2 IN7
PWM2 MAT5
EXTBUS A19
P2[20]/
PCAP2[0]/D18
143[1]
GPIO 2, pin 20
SPI2 SDO
PWM2 CAP0
EXTBUS D18
TDI
144[1]
IEEE 1149.1 data in, pulled up internally
[1]
Bidirectional pad; analog port; plain input; 3-state output; slew rate control; 5V tolerant; TTL with hysteresis; programmable pull-up /
pull-down / repeater.
[2]
Analog pad; analog I/O
[3]
Analog pad.
6. Functional description
6.1 Architectural overview
The LPC2917/2919/01 consists of:
• An ARM968E-S processor with real-time emulation support
• An AMBA multi-layer Advanced High-performance Bus (AHB) for interfacing to the
on-chip memory controllers
• Two DTL buses (an universal NXP interface) for interfacing to the interrupt controller
and the Power, Clock and Reset Control cluster (also called subsystem).
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Product data sheet
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
• Three ARM Peripheral Buses (APB - a compatible superset of ARM's AMBA
advanced peripheral bus) for connection to on-chip peripherals clustered in
subsystems.
• One ARM Peripheral Bus for event router and system control.
The LPC2917/2919/01 configures the ARM968E-S processor in little-endian byte order.
All peripherals run at their own clock frequency to optimize the total system power
consumption. The AHB2APB bridge used in the subsystems contains a write-ahead buffer
one transaction deep. This implies that when the ARM968E-S issues a buffered write
action to a register located on the APB side of the bridge, it continues even though the
actual write may not yet have taken place. Completion of a second write to the same
subsystem will not be executed until the first write is finished.
6.2 ARM968E-S processor
The ARM968E-S is a general purpose 32-bit RISC processor, which offers high
performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed Complex
Instruction Set Computers (CISC). This simplicity results in a high instruction throughput
and impressive real-time interrupt response from a small and cost-effective controller
core.
Amongst the most compelling features of the ARM968E-S are:
• Separate directly connected instruction and data Tightly Coupled Memory (TCM)
interfaces
• Write buffers for the AHB and TCM buses
• Enhanced 16 × 32 multiplier capable of single-cycle MAC operations and 16-bit fixedpoint DSP instructions to accelerate signal-processing algorithms and applications.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. The ARM968E-S is based on the ARMv5TE five-stage pipeline
architecture. Typically, in a three-stage pipeline architecture, while one instruction is being
executed its successor is being decoded and a third instruction is being fetched from
memory. In the five-stage pipeline additional stages are added for memory access and
write-back cycles.
The ARM968E-S processor also employs a unique architectural strategy known as
THUMB, which makes it ideally suited to high-volume applications with memory
restrictions or to applications where code density is an issue.
The key idea behind THUMB is that of a super-reduced instruction set. Essentially, the
ARM968E-S processor has two instruction sets:
• Standard 32-bit ARMv5TE set
• 16-bit THUMB set
The THUMB set's 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM's performance advantage over a
traditional 16-bit controller using 16-bit registers. This is possible because THUMB code
operates on the same 32-bit register set as ARM code.
LPC2917_19_01_3
Product data sheet
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12 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
THUMB code can provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM controller connected to a 16-bit memory system.
The ARM968E-S processor is described in detail in the ARM968E-S data sheet Ref. 2.
6.3 On-chip flash memory system
The LPC2917/2919/01 includes a 512 kB or 768 kB flash memory system. This memory
can be used for both code and data storage. Programming of the flash memory can be
accomplished via the flash memory controller or JTAG.
The flash controller also supports a 16 kB, byte-accessible on-chip EEPROM integrated
on the LPC2917/2919/01.
6.4 On-chip static RAM
In addition to the two 16 kB TCMs the LPC2917/2919/01 includes two static RAM
memories: one of 32 kB and one of 16 kB. Both may be used for code and/or data
storage.
In addition, 8 kB SRAM for the ETB can be used as static memory for code and data
storage. However, DMA access to this memory region is not supported.
LPC2917_19_01_3
Product data sheet
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xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx
xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x
LPC2917/2919/01
PCR/VIC control
0xFFFF FFFF
0xFFFF F000
0xFFFF C000
VIC
reserved
CGU1
0xFFFF A000
PMU
0xFFFF 9000
0xFFFF 8000
PCR/VIC
subsystem
DMA interface to TCM
reserved
RGU
CGU0
0xE00E 0000
0xE008 6000
reserved
reserved
0xE008 4000
0xE010 0000
I2C1
0xE008 3000
0xE00E 0000
I2C0
0xE008 2000
CAN1
0xE008 1000
CAN0
0xE008 0000
reserved
0xE00C 0000
peripherals #6
MSCSS
subsystem
0xE00A 0000
peripheral subsystem #4
reserved
0xE00C 3000
ADC1
peripheral subsystem #2
0xE00C 2000
reserved
reserved
0xE00C 0000
MSCSS timer1
peripheral subsystem #0
MSCSS timer0
reserved
remappable to
shadow area
0x2020 4000
0x2020 0000
2 GB
0x2008 0000
0x2000 0000
512 kB on-chip flash
0x0040 0000
reserved
no physical
memory
1 GB
16 kB DTCM
ITCM/DTCM
memory
16 MB external static memory bank 0
reserved
0xE004 B000
GPIO0
0xE004 A000
SPI2
0xE004 9000
SPI1
0xE004 8000
SPI0
0xE004 7000
UART1
0xE004 6000
UART0
0xE004 5000
TIMER3
0xE004 4000
TIMER2
0xE004 3000
0x4300 0000
TIMER1
0xE004 2000
0x4200 0000
TIMER0
0xE004 1000
0x4100 0000
WDT
0xE004 0000
0xE002 0000
0xE000 0000
0x8000 8000
peripherals #2
peripheral
subsystem
0x8000 0000
0x6000 0000
0x4000 0000
0x2020 4000
14 of 86
© NXP B.V. 2009. All rights reserved.
0x2000 0000
0x0000 4000
Fig 3.
0xE004 C000
GPIO1
on-chip flash
reserved
0x0000 0000
GPIO2
external static memory banks 7 to 2
16 MB external static memory bank 1
reserved
0xE004 0000
0x6000 4000
0x2000 0000
0x0040 4000
GPIO3
reserved
0x200C 0000
0x0080 0000
16 kB AHB SRAM
SMA controller
768 kB on-chip flash
0xE006 0000
512 MB shadow area
16 kB ITCM
LPC2917/2919/01 memory map
ITCM/DTCM
0 GB
0x0000 0000
0xE004 E000
0xE004 D000
0xE002 0000
peripherals #0
general
subsystem
reserved
event router
0xE000 2000
0xE000 2000
SCU
0xE000 1000
CFID
0xE000 0000
002aad963
ARM9 microcontroller with CAN and LIN
reserved
flash
memory
reserved
0x8000 C000
32 kB AHB SRAM
flash controller
0xE006 0000
0xE008 0000
LPC2917/01; LPC2919/01
Rev. 03 — 9 December 2009
ADC2
0xE00C 1000
0xE008 7000
0xE014 0000
PWM2
0xE00C 4000
0xE008 8000
CAN AF regs
peripherals #4
networking
subsystem
DMA controller
PWM3
PWM0
0xE008 9000
CAN common regs
0xE018 3000
CAN ID LUT
0xE00C 8000
0xE00C 5000
LIN0
0xE018 0000
peripheral subsystem #6
PWM1
0xE008 A000
0xF000 0000
8 kB ETB SRAM
0xE00C 9000
0xE00C 6000
LIN1
0xE018 2000
reserved
0xE00C 7000
0xE008 B000
0xF080 0000
ETB control
reserved
quadrature encoder
0xE00C A000
0xE00A 0000
reserved
6.5 Memory map
0xFFFF B000
reserved
0xFFFF FFFF
0xFFFF 8000
NXP Semiconductors
LPC2917_19_01_3
Product data sheet
4 GB
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
6.6 Reset, debug, test, and power description
6.6.1 Reset and power-up behavior
The LPC2917/2919/01 contains external reset input and internal power-up reset circuits.
This ensures that a reset is extended internally until the oscillators and flash have reached
a stable state. See Section 8 for trip levels of the internal power-up reset circuit1. See
Section 9 for characteristics of the several start-up and initialization times. Table 4 shows
the reset pin.
Table 4.
Reset pin
Symbol
Direction
Description
RST
IN
external reset input, active LOW; pulled up internally
At activation of the RST pin the JTAGSEL pin is sensed as logic LOW. If this is the case
the LPC2917/2919/01 is assumed to be connected to debug hardware, and internal
circuits re-program the source for the BASE_SYS_CLK to be the crystal oscillator instead
of the Low-Power Ring Oscillator (LP_OSC). This is required because the clock rate when
running at LP_OSC speed is too low for the external debugging environment.
6.6.2 Reset strategy
The LPC2917/2919/01 contains a central module, the Reset Generator Unit (RGU) in the
Power, Clock and Reset Subsystem (PCRSS), which controls all internal reset signals
towards the peripheral modules. The RGU provides individual reset control as well as the
monitoring functions needed for tracing a reset back to source.
6.6.3 IEEE 1149.1 interface pins (JTAG boundary-scan test)
The LPC2917/2919/01 contains boundary-scan test logic according to IEEE 1149.1, also
referred to in this document as Joint Test Action Group (JTAG). The boundary-scan test
pins can be used to connect a debugger probe for the embedded ARM processor. Pin
JTAGSEL selects between boundary-scan mode and debug mode. Table 5 shows the
boundary- scan test pins.
Table 5.
1.
IEEE 1149.1 boundary-scan test and debug interface
Symbol
Description
JTAGSEL
TAP controller select input. LOW level selects ARM debug mode and HIGH level
selects boundary scan and flash programming; pulled up internally
TRST
test reset input; pulled up internally (active LOW)
TMS
test mode select input; pulled up internally
TDI
test data input, pulled up internally
TDO
test data output
TCK
test clock input
Only for 1.8 V power sources
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15 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
6.6.3.1
ETM/ETB
The ETM provides real-time trace capability for deeply embedded processor cores. It
outputs information about processor execution to a trace buffer. A software debugger
allows configuration of the ETM using a JTAG interface and displays the trace information
that has been captured in a format that a user can easily understand. The ETB stores
trace data produced by the ETM.
The ETM/ETB module has the following features:
•
•
•
•
•
Closely tracks the instructions that the ARM core is executing.
On-chip trace data storage (ETB).
All registers are programmed through JTAG interface.
Does not consume power when trace is not being used.
THUMB/Java instruction set support.
6.6.4 Power supply pins
Table 6 shows the power supply pins.
Table 6.
Power supply pins
Symbol
Description
VDD(CORE)
digital core supply 1.8 V
VSS(CORE)
digital core ground (digital core, ADC1/2)
VDD(IO)
I/O pins supply 3.3 V
VSS(IO)
I/O pins ground
VDD(OSC)
oscillator and PLL supply
VSS(OSC)
oscillator ground
VDDA(ADC3V3)
ADC1 and ADC2 3.3 V supply
VSS(PLL)
PLL ground
6.7 Clocking strategy
6.7.1 Clock architecture
The LPC2917/2919/01 contains several different internal clock areas. Peripherals like
Timers, SPI, UART, CAN and LIN have their own individual clock sources called base
clocks. All base clocks are generated by the Clock Generator Unit (CGU0). They may be
unrelated in frequency and phase and can have different clock sources within the CGU.
The system clock for the CPU and AHB Bus infrastructure has its own base clock. This
means most peripherals are clocked independently from the system clock. See Figure 4
for an overview of the clock areas within the device.
Within each clock area there may be multiple branch clocks, which offers very flexible
control for power-management purposes. All branch clocks are outputs of the Power
Management Unit (PMU) and can be controlled independently. Branch clocks derived
from the same base clock are synchronous in frequency and phase. See Section 6.15 for
more details of clock and power control within the device.
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16 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
Two of the base clocks generated by the CGU0 are used as input into a second,
dedicated CGU (CGU1). The CGU1 uses its own PLL and fractional divider to generate
the base clock for an independent clock output.
BA SE_ICLK0_CLK
BASE_SYS_CLK
BASE_OUT_CLK
BASE_ICLK1_CLK
CPU
CLOCK
OUT
branch
clock
CGU1
AHB MULTILAYER MATRIX
AHB TO APB BRIDGES
VIC
BASE_IVNSS_CLK
networking subsystem
GPDMA
branch
clocks
FLASH/SRAM/SMC
CAN0/1
branch
clocks
general subsytem
GLOBAL
ACCEPTANCE
FILTER
LIN0/1
SYSTEM CONTROL
EVENT ROUTER
CFID
I2C0/1
BASE_PCR_CLK
peripheral subsystem
power control subsystem
branch
clock
GPIO0/1/2/3
BASE_TMR_CLK
RESET/CLOCK
GENERATION AND
POWER
MANAGEMENT
BASE_MSCSS_CLK
TIMER 0/1/2/3
BASE_SPI_CLK
modulation and sampling
control subsystem
SPI0/1/2
BASE_UART_CLK
TIMER0/1 MTMR
UART0/1
BASE_SAFE_CLK
WDT
branch
clocks
PWM0/1/2/3
QEI
BASE_ADC_CLK
CGU0
ADC1/2
branch
clocks
002aad962
Fig 4.
LPC2917/2919/01 block diagram, overview of clock areas
LPC2917_19_01_3
Product data sheet
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17 of 86
LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
6.7.2 Base clock and branch clock relationship
Table 7 and Table 8 contain an overview of all the base blocks in the LPC2917/2919/01
and their derived branch clocks. In relevant cases more detailed information can be found
in the specific subsystem description. Some branch clocks have special protection since
they clock vital system parts of the device and should (for example) not be switched off.
See Section 6.15.5 for more details of how to control the individual branch clocks.
Table 7.
CGU0 generated base clock and branch clock overview
Base clock
Branch clock name
Parts of the device clocked
by this branch clock
Remark
BASE_SAFE_CLK
CLK_SAFE
watchdog timer
[1]
BASE_SYS_CLK
CLK_SYS_CPU
ARM968E-S and TCMs
CLK_SYS_SYS
AHB bus infrastructure
CLK_SYS_PCRSS
AHB side of bridge in PCRSS
CLK_SYS_FMC
Flash-Memory Controller
CLK_SYS_RAM0
Embedded SRAM Controller 0
(32 kB)
CLK_SYS_RAM1
Embedded SRAM Controller 1
(16 kB)
CLK_SYS_SMC
External Static-Memory
Controller
CLK_SYS_GESS
General Subsystem
CLK_SYS_VIC
Vectored Interrupt Controller
CLK_SYS_PESS
Peripheral Subsystem
CLK_SYS_GPIO0
GPIO bank 0
CLK_SYS_GPIO1
GPIO bank 1
CLK_SYS_GPIO2
GPIO bank 2
CLK_SYS_GPIO3
GPIO bank 3
CLK_SYS_IVNSS_A
AHB side of bridge of IVNSS
CLK_SYS_MSCSS_A
AHB side of bridge of MSCSS
CLK_SYS_DMA
GPDMA
BASE_PCR_CLK
CLK_PCR_SLOW
PCRSS, CGU, RGU and PMU
logic clock
BASE_IVNSS_CLK
CLK_IVNSS_APB
APB side of the IVNSS
CLK_IVNSS_CANCA
CAN controller Acceptance
Filter
CLK_IVNSS_CANC0
CAN channel 0
CLK_IVNSS_CANC1
CAN channel 1
CLK_IVNSS_I2C0
I2C0
CLK_IVNSS_I2C1
I2C1
CLK_IVNSS_LIN0
LIN channel 0
CLK_IVNSS_LIN1
LIN channel 1
LPC2917_19_01_3
Product data sheet
[2] [4]
[1], [3]
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
18 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
Table 7.
CGU0 generated base clock and branch clock overview …continued
Base clock
Branch clock name
Parts of the device clocked
by this branch clock
BASE_MSCSS_CLK
CLK_MSCSS_APB
APB side of the MSCSS
CLK_MSCSS_MTMR0
Timer 0 in the MSCSS
CLK_MSCSS_MTMR1
Timer 1 in the MSCSS
CLK_MSCSS_PWM0
PWM 0
CLK_MSCSS_PWM1
PWM 1
CLK_MSCSS_PWM2
PWM 2
CLK_MSCSS_PWM3
PWM 3
Remark
CLK_MSCSS_ADC1_APB APB side of ADC 1
CLK_MSCSS_ADC2_APB APB side of ADC 2
CLK_MSCSS_QEI
Quadrature encoder
CLK_UART0
UART 0 interface clock
CLK_UART1
UART 1 interface clock
BASE_ICLK0_CLK
-
CGU1 input clock
BASE_SPI_CLK
CLK_SPI0
SPI 0 interface clock
CLK_SPI1
SPI 1 interface clock
CLK_SPI2
SPI 2 interface clock
CLK_TMR0
Timer 0 clock for counter part
CLK_TMR1
Timer 1 clock for counter part
CLK_TMR2
Timer 2 clock for counter part
CLK_TMR3
Timer 3 clock for counter part
CLK_ADC1
Control of ADC 1, capture
sample result
CLK_ADC2
Control of ADC 2, capture
sample result
reserved
-
-
BASE_ICLK1_CLK
-
CGU1 input clock
BASE_UART_CLK
BASE_TMR_CLK
BASE_ADC_CLK
[1]
This clock is always on (cannot be switched off for system safety reasons)
[2]
In the peripheral subsystem parts of the Timers, watchdog timer, SPI and UART have their own clock
source. See Section 6.12 for details.
[3]
In the Power Clock and Reset Control subsystem parts of the CGU, RGU, and PMU have their own clock
source. See Section 6.15 for details.
[4]
The clock should remain activated when system wake-up on timer or UART is required.
Table 8.
CGU1 base clock and branch clock overview
Base clock
Branch clock name
Parts of the device clocked by this
branch clock
BASE_OUT_CLK
CLK_OUT_CLK
clockout pin
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19 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
6.8 Flash memory controller
The flash memory has a 128-bit wide data interface and the flash controller offers two
128-bit buffer lines to improve system performance. The flash has to be programmed
initially via JTAG. In-system programming must be supported by the bootloader.
In-application programming is possible. Flash memory contents can be protected by
disabling JTAG access. Suspension of burning or erasing is not supported.
The Flash Memory Controller (FMC) interfaces to the embedded flash memory for two
tasks:
• Memory data transfer
• Memory configuration via triggering, programming, and erasing
The key features are:
•
•
•
•
Programming by CPU via AHB
Programming by external programmer via JTAG
JTAG access protection
Burn-finished and erase-finished interrupt
6.8.1 Functional description
After reset, flash initialization is started, which takes tinit time (see Section 9). During this
initialization, flash access is not possible and AHB transfers to flash are stalled, blocking
the AHB bus.
During flash initialization, the index sector is read to identify the status of the JTAG access
protection and sector security. If JTAG access protection is active, the flash is not
accessible via JTAG. In this case, ARM debug facilities are disabled and flash-memory
contents cannot be read. If sector security is active, only the unsecured sections can be
read.
Flash can be read synchronously or asynchronously to the system clock. In synchronous
operation, the flash goes into standby after returning the read data. Started reads cannot
be stopped, and speculative reading and dual buffering are therefore not supported.
With asynchronous reading, transfer of the address to the flash and of read data from the
flash is done asynchronously, giving the fastest possible response time. Started reads can
be stopped, so speculative reading and dual buffering are supported.
Buffering is offered because the flash has a 128-bit wide data interface while the AHB
interface has only 32 bits. With buffering a buffer line holds the complete 128-bit flash
word, from which four words can be read. Without buffering every AHB data port read
starts a flash read. A flash read is a slow process compared to the minimum AHB cycle
time, so with buffering the average read time is reduced. This can improve system
performance.
With single buffering, the most recently read flash word remains available until the next
flash read. When an AHB data-port read transfer requires data from the same flash word
as the previous read transfer, no new flash read is done and the read data is given without
wait cycles.
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When an AHB data port read transfer requires data from a different flash word to that
involved in the previous read transfer, a new flash read is done and wait states are given
until the new read data is available.
With dual buffering, a secondary buffer line is used, the output of the flash being
considered as the primary buffer. On a primary buffer, hit data can be copied to the
secondary buffer line, which allows the flash to start a speculative read of the next flash
word.
Both buffer lines are invalidated after:
•
•
•
•
Initialization
Configuration-register access
Data-latch reading
Index-sector reading
The modes of operation are listed in Table 9.
Table 9.
Flash read modes
Synchronous timing
No buffer line
for single (non-linear) reads; one flash-word read per word read
Single buffer line
default mode of operation; most recently read flash word is kept until
another flash word is required
Asynchronous timing
No buffer line
one flash-word read per word read
Single buffer line
most recently read flash word is kept until another flash word is
required
Dual buffer line, single
speculative
on a buffer miss a flash read is done, followed by at most one
speculative read; optimized for execution of code with small loops
(less than eight words) from flash
Dual buffer line, always
speculative
most recently used flash word is copied into second buffer line; next
flash-word read is started; highest performance for linear reads
6.8.2 Pin description
The flash memory controller has no external pins. However, the flash can be programmed
via the JTAG pins, see Section 6.6.3.
6.8.3 Clock description
The flash memory controller is clocked by CLK_SYS_FMC, see Section 6.7.2.
6.8.4 Flash layout
The ARM processor can program the flash for ISP (In-System Programming) and IAP (InApplication Programming). Note that the flash always has to be programmed by ‘flash
words’ of 128 bits (four 32-bit AHB bus words, hence 16 bytes).
The flash memory is organized into eight ‘small’ sectors of 8 kB each and up to 11 ‘large’
sectors of 64 kB each. The number of large sectors depends on the device type. A sector
must be erased before data can be written to it. The flash memory also has sector-wise
protection. Writing occurs per page which consists of 4096 bits (32 flash words). A small
sector contains 16 pages; a large sector contains 128 pages.
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Table 10 gives an overview of the flash-sector base addresses.
Table 10.
Flash sector overview
Sector number
Sector size (kB)
Sector base address
11
8
0x2000 0000
12
8
0x2000 2000
13
8
0x2000 4000
14
8
0x2000 6000
15
8
0x2000 8000
16
8
0x2000 A000
17
8
0x2000 C000
18
8
0x2000 E000
0
64
0x2001 0000
1
64
0x2002 0000
2
64
0x2003 0000
3
64
0x2004 0000
4
64
0x2005 0000
5
64
0x2006 0000
6
64
0x2007 0000
7[1]
64
0x2008 0000
8[1]
64
0x2009 0000
9[1]
64
0x200A 0000
10[1]
64
0x200B 0000
[1]
Availability of sector 15 to sector 18 depends on device type, see Section 3 “Ordering information”.
The index sector is a special sector in which the JTAG access protection and sector
security are located. The address space becomes visible by setting the FS_ISS bit and
overlaps the regular flash sector’s address space.
Note that the index sector cannot be erased, and that access to it has to be performed via
code outside the flash.
6.8.5 Flash bridge wait-states
To eliminate the delay associated with synchronizing flash-read data, a predefined
number of wait-states must be programmed. These depend on flash-memory response
time and system clock period. The minimum wait-states value can be calculated with the
following formulas:
Synchronous reading:
t acc ( clk )
WST > ------------------ – 1
tt
(1)
tclk ( sys )
Asynchronous reading:
t acc ( addr )
WST > ---------------------- – 1
t tclk ( sys )
(2)
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Remark: If the programmed number of wait-states is more than three, flash-data reading
cannot be performed at full speed (i.e. with zero wait-states at the AHB bus) if speculative
reading is active.
6.8.6 EEPROM
EEPROM is a non-volatile memory mostly used for storing relatively small amounts of
data, for example for storing settings. It contains one 16 kB memory block and is
byte-programmable and byte-erasable.
The EEPROM can be accessed only through the flash controller.
6.9 External static memory controller
The LPC2917/2919/01 contains an external Static Memory Controller (SMC) which
provides an interface for external (off-chip) memory devices.
Key features are:
• Supports static memory-mapped devices including RAM, ROM, flash, burst ROM and
external I/O devices.
•
•
•
•
•
•
•
•
•
•
Asynchronous page-mode read operation in non-clocked memory subsystems.
Asynchronous burst-mode read access to burst-mode ROM devices.
Independent configuration for up to eight banks, each up to 16 MB.
Programmable bus-turnaround (idle) cycles (one to 16).
Programmable read and write wait states (up to 32), for static RAM devices.
Programmable initial and subsequent burst-read wait state for burst-ROM devices.
Programmable write protection.
Programmable burst-mode operation.
Programmable external data width: 8 bits, 16 bits or 32 bits.
Programmable read-byte lane enable control.
6.9.1 Description
The SMC simultaneously supports up to eight independently configurable memory banks.
Each memory bank can be 8 bits, 16 bits or 32 bits wide and is capable of supporting
SRAM, ROM, burst-ROM memory, or external I/O devices.
A separate chip select output is available for each bank. The chip select lines are
configurable to be active HIGH or LOW. Memory-bank selection is controlled by memory
addressing. Table 11 shows how the 32-bit system address is mapped to the external bus
memory base addresses, chip selects, and bank internal addresses.
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Table 11.
External memory-bank address bit description
32-bit
system
address bit
field
Symbol
Description
31 to 29
BA[2:0]
external static-memory base address (three most significant bits);
the base address can be found in the memory map; see Ref. 1. This
field contains ‘010’ when addressing an external memory bank.
28 to 26
CS[2:0]
chip select address space for eight memory banks; see Ref. 1.
25 and 24
-
always ‘00’; other values are ‘mirrors’ of the 16 MB bank address.
23 to 0
A[23:0]
16 MB memory banks address space
Table 12.
External static-memory controller banks
CS[2:0]
Bank
000
bank 0
001
bank 1
010
bank 2
011
bank 3
100
bank 4
101
bank 5
110
bank 6
111
bank 7
6.9.2 Pin description
The external static-memory controller module in the LPC2917/2919/01 has the following
pins, which are combined with other functions on the port pins of the LPC2917/2919/01.
Table 13 shows the external memory controller pins.
Table 13.
External memory controller pins
Symbol
Direction
Description
EXTBUS CSx
OUT
memory-bank x select, x runs from 0 to 7
EXTBUS BLSy
OUT
byte-lane select input y, y runs from 0 to 3
EXTBUS WE
OUT
write enable (active LOW)
EXTBUS OE
OUT
output enable (active LOW)
EXTBUS A[23:0] OUT
address bus
EXTBUS D[31:0] IN/OUT
data bus
6.9.3 Clock description
The External Static-Memory Controller is clocked by CLK_SYS_SMC, see Section 6.7.2.
6.9.4 External memory timing diagrams
A timing diagram for reading from external memory is shown in Figure 5. The relationship
between the wait-state settings is indicated with arrows.
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CLK(SYS)
CS
OE
A
D
WST1
WSTOEN
002aae704
WSTOEN = 3, WST1 = 6
Fig 5.
Reading from external memory
A timing diagram for writing to external memory is shown In Figure 6. The relationship
between wait-state settings is indicated with arrows.
CLK(SYS)
CS
WE/BLS(1)
BLS
A
D
WST2
WSTWEN
002aae705
WSTWEN = 3, WST2 = 7
(1) BLS has the same timing as WE in configurations that use the byte lane enable signals to connect
to write enable (8 bit devices).
Fig 6.
Writing to external memory
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Usage of the idle/turn-around time (IDCY) is demonstrated In Figure 7. Extra wait states
are added between a read and a write cycle in the same external memory device.
CLK(SYS)
CS
WE
OE
A
D
WST1
WSTOEN
WST2
IDCY
WSTWEN
002aae706
WSTOEN = 2, WSTWEN = 4, WST1 = 6, WST2 = 4, IDCY = 5
Fig 7.
Reading/writing external memory
Address pins on the device are shared with other functions. When connecting external
memories, check that the I/O pin is programmed for the correct function. Control of these
settings is handled by the SCU.
6.10 DMA controller
The DMA controller allows peripheral-to memory, memory-to-peripheral,
peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream
provides unidirectional serial DMA transfers for a single source and destination. For
example, a bidirectional port requires one stream for transmit and one for receives. The
source and destination areas can each be either a memory region or a peripheral, and
can be accessed through the same AHB master or one area by each master.
The DMA controls eight DMA channels with hardware prioritization. The DMA controller
interfaces to the system via two AHB bus masters, each with a full 32-bit data bus width.
DMA operations may be set up for 8-bit, 16-bit, and 32-bit data widths, and can be either
big-endian or little-endian. Incrementing or non-incrementing addressing for source and
destination are supported, as well as programmable DMA burst size. Scatter or gather
DMA is supported through the use of linked lists. This means that the source and
destination areas do not have to occupy contiguous areas of memory.
6.10.1 DMA support for peripherals
The GPDMA supports the following peripherals: SPI0/1/2 and UART0/1. The GPDMA can
access both embedded SRAM blocks (16 kB and 32 kB), both TCMs, external static
memory, and flash memory.
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6.10.2 Clock description
The DMA controller is clocked by CLK_SYS_DMA derived from BASE_SYS_CLK, see
Section 6.7.2.
6.11 General subsystem
6.11.1 General subsystem clock description
The general subsystem is clocked by CLK_SYS_GESS, see Section 6.7.2.
6.11.2 Chip and feature identification
The Chip/Feature ID (CFID) module contains registers which show and control the
functionality of the chip. It contains an ID to identify the silicon and also registers
containing information about the features enabled or disabled on the chip.
The key features are:
• Identification of product
• Identification of features enabled
The CFID has no external pins.
6.11.3 System Control Unit (SCU)
The system control unit contains system-related functions.The key feature is configuration
of the I/O port-pins multiplexer. It defines the function of each I/O pin of the
LPC2917/2919/01. The I/O pin configuration should be consistent with peripheral function
usage.
The SCU has no external pins.
6.11.4 Event router
The event router provides bus-controlled routing of input events to the vectored interrupt
controller for use as interrupt or wake-up signals.
Key features:
• Up to 19 level-sensitive external interrupt pins, including the receive pins of SPI, CAN,
LIN, and UART, as well as the I2C-bus SCL pins plus three internal event sources.
• Input events can be used as interrupt source either directly or latched
(edge-detected).
•
•
•
•
•
Direct events disappear when the event becomes inactive.
Latched events remain active until they are explicitly cleared.
Programmable input level and edge polarity.
Event detection maskable.
Event detection is fully asynchronous, so no clock is required.
The event router allows the event source to be defined, its polarity and activation type to
be selected and the interrupt to be masked or enabled. The event router can be used to
start a clock on an external event.
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The vectored interrupt-controller inputs are active HIGH.
6.11.4.1 Pin description
The event router module in the LPC2917/2919/01 is connected to the pins listed below.
The pins are combined with other functions on the port pins of the LPC2917/2919/01.
Table 14 shows the pins connected to the event router, and also the corresponding bit
position in the event-router registers and the default polarity.
Table 14.
Event-router pin connections
Symbol
Direction
Description
Default polarity
EXTINT 7 - 0
IN
external interrupt input 7 - 0
1
CAN0 RXD
IN
CAN0 receive data input wake-up
0
CAN1 RXD
IN
CAN1 receive data input wake-up
0
I2C0_SCL
IN
I2C0 SCL clock input
0
I2C1_SCL
IN
I2C1 SCL clock input
0
LIN0 RXD
IN
LIN0 receive data input wake-up
0
LIN1 RXD
IN
LIN1 receive data input wake-up
0
SPI0 SDI
IN
SPI0 receive data input
0
SPI1 SDI
IN
SPI1 receive data input
0
SPI2 SDI
IN
SPI2 receive data input
0
UART0 RXD
IN
UART0 receive data input
0
UART1 RXD
IN
UART1 receive data input
0
-
na
CAN interrupt (internal)
1
-
na
VIC FIQ (internal)
1
-
na
VIC IRQ (internal)
1
6.12 Peripheral subsystem
6.12.1 Peripheral subsystem clock description
The peripheral subsystem is clocked by a number of different clocks:
•
•
•
•
•
CLK_SYS_PESS
CLK_UART0/1
CLK_SPI0/1/2
CLK_TMR0/1/2/3
CLK_SAFE see Section 6.7.2
6.12.2 Watchdog timer
The purpose of the watchdog timer is to reset the ARM9 processor within a reasonable
amount of time if the processor enters an error state. The watchdog generates a system
reset if the user program fails to trigger it correctly within a predetermined amount of time.
Key features:
• Internal chip reset if not periodically triggered
• Timer counter register runs on always-on safe clock
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•
•
•
•
6.12.2.1
Optional interrupt generation on watchdog time-out
Debug mode with disabling of reset
Watchdog control register change-protected with key
Programmable 32-bit watchdog timer period with programmable 32-bit prescaler.
Functional description
The watchdog timer consists of a 32-bit counter with a 32-bit prescaler.
The watchdog should be programmed with a time-out value and then periodically
restarted. When the watchdog times out, it generates a reset through the RGU.
To generate watchdog interrupts in watchdog debug mode the interrupt has to be enabled
via the interrupt enable register. A watchdog-overflow interrupt can be cleared by writing
to the clear-interrupt register.
Another way to prevent resets during debug mode is via the Pause feature of the
watchdog timer. The watchdog is stalled when the ARM9 is in debug mode and the
PAUSE_ENABLE bit in the watchdog timer control register is set.
The Watchdog Reset output is fed to the Reset Generator Unit (RGU). The RGU contains
a reset source register to identify the reset source when the device has gone through a
reset. See Section 6.15.4.
6.12.2.2
Clock description
The watchdog timer is clocked by two different clocks; CLK_SYS_PESS and CLK_SAFE,
see Section 6.7.2. The register interface towards the system bus is clocked by
CLK_SYS_PESS. The timer and prescale counters are clocked by CLK_SAFE which is
always on.
6.12.3 Timer
The LPC2917/2919/01 contains six identical timers: four in the peripheral subsystem and
two in the Modulation and Sampling Control SubSystem (MSCSS) located at different
peripheral base addresses. This section describes the four timers in the peripheral
subsystem. Each timer has four capture inputs and/or match outputs. Connection to
device pins depends on the configuration programmed into the port function-select
registers. The two timers located in the MSCSS have no external capture or match pins,
but the memory map is identical, see Section 6.14.6. One of these timers has an external
input for a pause function.
The key features are:
• 32-bit timer/counter with programmable 32-bit prescaler
• Up to four 32-bit capture channels per timer. These take a snapshot of the timer value
when an external signal connected to the TIMERx CAPn input changes state. A
capture event may also optionally generate an interrupt
• Four 32-bit match registers per timer that allow:
– Continuous operation with optional interrupt generation on match
– Stop timer on match with optional interrupt generation
– Reset timer on match with optional interrupt generation
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• Up to four external outputs per timer corresponding to match registers, with the
following capabilities:
– Set LOW on match
– Set HIGH on match
– Toggle on match
– Do nothing on match
• Pause input pin (MSCSS timers only)
The timers are designed to count cycles of the clock and optionally generate interrupts or
perform other actions at specified timer values, based on four match registers. They also
include capture inputs to trap the timer value when an input signal changes state,
optionally generating an interrupt. The core function of the timers consists of a 32 bit
prescale counter triggering the 32 bit timer counter. Both counters run on clock
CLK_TMRx (x runs from 0 to 3) and all time references are related to the period of this
clock. Note that each timer has its individual clock source within the Peripheral
SubSystem. In the Modulation and Sampling SubSystem each timer also has its own
individual clock source. See section Section 6.15.5 for information on generation of these
clocks.
6.12.3.1
Pin description
The four timers in the peripheral subsystem of the LPC2917/2919/01 have the pins
described below. The two timers in the modulation and sampling subsystem have no
external pins except for the pause pin on MSCSS timer 1. See Section 6.14.6 for a
description of these timers and their associated pins. The timer pins are combined with
other functions on the port pins of the LPC2917/2919/01, see Section 6.11.3. Table
Table 15 shows the timer pins (x runs from 0 to 3).
Table 15.
6.12.3.2
Timer pins
Symbol
Pin name
Direction
Description
TIMERx CAP[0]
CAPx[0]
IN
TIMER x capture input 0
TIMERx CAP[1]
CAPx[1]
IN
TIMER x capture input 1
TIMERx CAP[2]
CAPx[2]
IN
TIMER x capture input 2
TIMERx CAP[3]
CAPx[3]
IN
TIMER x capture input 3
TIMERx MAT[0]
MATx[0]
OUT
TIMER x match output 0
TIMERx MAT[1]
MATx[1]
OUT
TIMER x match output 1
TIMERx MAT[2]
MATx[2]
OUT
TIMER x match output 2
TIMERx MAT[3]
MATx[3]
OUT
TIMER x match output 3
Clock description
The timer modules are clocked by two different clocks; CLK_SYS_PESS and CLK_TMRx
(x = 0-3), see Section 6.7.2. Note that each timer has its own CLK_TMRx branch clock for
power management. The frequency of all these clocks is identical as they are derived
from the same base clock BASE_CLK_TMR. The register interface towards the system
bus is clocked by CLK_SYS_PESS. The timer and prescale counters are clocked by
CLK_TMRx.
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6.12.4 UARTs
The LPC2917/2919/01 contains two identical UARTs located at different peripheral base
addresses. The key features are:
•
•
•
•
•
16-byte receive and transmit FIFOs.
Register locations conform to 550 industry standard.
Receiver FIFO trigger points at 1 byte, 4 bytes, 8 bytes and 14 bytes.
Built-in baud rate generator.
Support for RS-485/9-bit mode allows both software address detection and automatic
address detection using 9-bit mode.
The UART is commonly used to implement a serial interface such as RS232. The
LPC2917/2919/01 contains two industry-standard 550 UARTs with 16-byte transmit and
receive FIFOs, but they can also be put into 450 mode without FIFOs.
6.12.4.1
Pin description
The UART pins are combined with other functions on the port pins of the
LPC2917/2919/01. Table 16 shows the UART pins (x runs from 0 to 1).
Table 16.
6.12.4.2
UART pins
Symbol
Pin name
Direction
Description
UARTx TXD
TXDx
OUT
UART channel x transmit data output
UARTx RXD
RXDx
IN
UART channel x receive data input
Clock description
The UART modules are clocked by two different clocks; CLK_SYS_PESS and
CLK_UARTx (x = 0-1), see Section 6.7.2. Note that each UART has its own CLK_UARTx
branch clock for power management. The frequency of all CLK_UARTx clocks is identical
since they are derived from the same base clock BASE_CLK_UART. The register
interface towards the system bus is clocked by CLK_SYS_PESS. The baud generator is
clocked by the CLK_UARTx.
6.12.5 Serial peripheral interface (SPI)
The LPC2917/2919/01 contains three Serial Peripheral Interface modules (SPIs) to allow
synchronous serial communication with slave or master peripherals.
The key features are:
•
•
•
•
Master or slave operation
Each SPI supports up to four slaves in sequential multi-slave operation
Supports timer-triggered operation
Programmable clock bit rate and prescale based on SPI source clock
(BASE_SPI_CLK), independent of system clock
• Separate transmit and receive FIFO memory buffers; 16 bits wide, 32 locations deep
• Programmable choice of interface operation: Motorola SPI or Texas Instruments
Synchronous Serial Interfaces
• Programmable data-frame size from 4 to 16 bits
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•
•
•
•
Independent masking of transmit FIFO, receive FIFO and receive overrun interrupts
Serial clock-rate master mode: fserial_clk ≤ fclk(SPI)/2
Serial clock-rate slave mode: fserial_clk = fclk(SPI)/4
Internal loopback test mode
The SPI module can operate in:
• Master mode:
– Normal transmission mode
– Sequential slave mode
• Slave mode
6.12.5.1
Functional description
The SPI module is a master or slave interface for synchronous serial communication with
peripheral devices that have either Motorola SPI or Texas Instruments Synchronous
Serial Interfaces.
The SPI module performs serial-to-parallel conversion on data received from a peripheral
device. The transmit and receive paths are buffered with FIFO memories (16 bits wide ×
32 words deep). Serial data is transmitted on pins SDOx and received on pins SDIx.
The SPI module includes a programmable bit-rate clock divider and prescaler to generate
the SPI serial clock from the input clock CLK_SPIx.
The SPI module’s operating mode, frame format, and word size are programmed through
the SLVn_SETTINGS registers.
A single combined interrupt request SPI_INTREQ output is asserted if any of the
interrupts are asserted and unmasked.
Depending on the operating mode selected, the SPI SCS outputs operate as an
active-HIGH frame synchronization output for Texas Instruments synchronous serial
frame format or an active LOW chip select for SPI.
Each data frame is between four and 16 bits long, depending on the size of words
programmed, and is transmitted starting with the MSB.
6.12.5.2
Pin description
The SPI pins are combined with other functions on the port pins of the LPC2917/2919/01,
see Section 6.11.3. Table 17 shows the SPI pins (x runs from 0 to 2; y runs from 0 to 3).
Table 17.
SPI pins
Symbol
Pin name
Direction
Description
SPIx SCSy
SCSx[y]
IN/OUT
SPIx chip select[1][2]
SPIx SCK
SCKx
IN/OUT
SPIx clock[1]
SPIx SDI
SDIx
IN
SPIx data input
SPIx SDO
SDOx
OUT
SPIx data output
[1]
Direction of SPIx SCS and SPIx SCK pins depends on master or slave mode. These pins are output in
master mode, input in slave mode.
[2]
In slave mode there is only one chip select input pin, SPIx SCS0. The other chip selects have no function in
slave mode.
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6.12.5.3
Clock description
The SPI modules are clocked by two different clocks; CLK_SYS_PESS and CLK_SPIx
(x = 0, 1, 2), see Section 6.7.2. Note that each SPI has its own CLK_SPIx branch clock for
power management. The frequency of all clocks CLK_SPIx is identical as they are derived
from the same base clock BASE_CLK_SPI. The register interface towards the system bus
is clocked by CLK_SYS_PESS. The serial-clock rate divisor is clocked by CLK_SPIx.
The SPI clock frequency can be controlled by the CGU. In master mode the SPI clock
frequency (CLK_SPIx) must be set to at least twice the SPI serial clock rate on the
interface. In slave mode CLK_SPIx must be set to four times the SPI serial clock rate on
the interface.
6.12.6 General-purpose I/O
The LPC2917/2919/01 contains four general-purpose I/O ports located at different
peripheral base addresses. All I/O pins are bidirectional, and the direction can be
programmed individually. The I/O pad behavior depends on the configuration
programmed in the port function-select registers.
The key features are:
•
•
•
•
6.12.6.1
General-purpose parallel inputs and outputs
Direction control of individual bits
Synchronized input sampling for stable input-data values
All I/O defaults to input at reset to avoid any possible bus conflicts
Functional description
The general-purpose I/O provides individual control over each bidirectional port pin. There
are two registers to control I/O direction and output level. The inputs are synchronized to
achieve stable read-levels.
To generate an open-drain output, set the bit in the output register to the desired value.
Use the direction register to control the signal. When set to output, the output driver
actively drives the value on the output: when set to input the signal floats and can be
pulled up internally or externally.
6.12.6.2
Pin description
The five GPIO ports in the LPC2917/2919/01 have the pins listed below. The GPIO pins
are combined with other functions on the port pins of the LPC2917/2919/01. Table 18
shows the GPIO pins.
Table 18.
GPIO pins
Symbol
Pin name
Direction
Description
GPIO0 pin[31:0]
P0[31:0]
IN/OUT
GPIO port x pins 31 to 0
GPIO1 pin[31:0]
P1[31:0]
IN/OUT
GPIO port x pins 31 to 0
GPIO2 pin[27:0]
P2[27:0]
IN/OUT
GPIO port x pins 27 to 0
GPIO3 pin[15:0]
P3[15:0]
IN/OUT
GPIO port x pins 15 to 0
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
6.12.6.3
Clock description
The GPIO modules are clocked by several clocks, all of which are derived from
BASE_SYS_CLK; CLK_SYS_PESS and CLK_SYS_GPIOx (x = 0, 1, 2, 3), see
Section 6.7.2. Note that each GPIO has its own CLK__SYS_GPIOx branch clock for
power management. The frequency of all clocks CLK_SYS_GPIOx is identical to
CLK_SYS_PESS since they are derived from the same base clock BASE_SYS_CLK.
6.13 Networking subsystem
6.13.1 CAN gateway
Controller Area Network (CAN) is the definition of a high-performance communication
protocol for serial data communication. The two CAN controllers in the LPC2917/2919/01
provide a full implementation of the CAN protocol according to the CAN specification
version 2.0B. The gateway concept is fully scalable with the number of CAN controllers,
and always operates together with a separate powerful and flexible hardware acceptance
filter.
The key features are:
•
•
•
•
•
•
•
•
6.13.1.1
Supports 11-bit as well as 29-bit identifiers
Double receive buffer and triple transmit buffer
Programmable error-warning limit and error counters with read/write access
Arbitration-lost capture and error-code capture with detailed bit position
Single-shot transmission (i.e. no re-transmission)
Listen-only mode (no acknowledge; no active error flags)
Reception of ‘own’ messages (self-reception request)
FullCAN mode for message reception
Global acceptance filter
The global acceptance filter provides look-up of received identifiers - called acceptance
filtering in CAN terminology - for all the CAN controllers. It includes a CAN ID look-up table
memory, in which software maintains one to five sections of identifiers. The CAN ID
look-up table memory is 2 kB large (512 words, each of 32 bits). It can contain up to 1024
standard frame identifiers or 512 extended frame identifiers or a mixture of both types. It is
also possible to define identifier groups for standard and extended message formats.
6.13.1.2
Pin description
The two CAN controllers in the LPC2917/2919/01 have the pins listed below. The CAN
pins are combined with other functions on the port pins of the LPC2917/2919/01. Table 19
shows the CAN pins (x runs from 0 to 1).
Table 19.
CAN pins
Symbol
Pin name
Direction
Description
CANx TXD
TXDC0/1
OUT
CAN channel x transmit data output
CANx RXD
RXDC0/1
IN
CAN channel x receive data input
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
6.13.2 LIN
The LPC2917/2919/01 contain two LIN 2.0 master controllers. These can be used as
dedicated LIN 2.0 master controllers with additional support for sync break generation and
with hardware implementation of the LIN protocol according to spec 2.0.
Remark: Both LIN channels can be also configured as UART channels.
The key features are:
•
•
•
•
•
•
•
•
•
•
6.13.2.1
Complete LIN 2.0 message handling and transfer
One interrupt per LIN message
Slave response time-out detection
Programmable sync-break length
Automatic sync-field and sync-break generation
Programmable inter-byte space
Hardware or software parity generation
Automatic checksum generation
Fault confinement
Fractional baud rate generator
Pin description
The two LIN 2.0 master controllers in the LPC2917/2919/01 have the pins listed below.
The LIN pins are combined with other functions on the port pins of the LPC2917/2919/01.
Table 20 shows the LIN pins. For more information see Ref. 1 subsection 3.43, LIN
master controller.
Table 20.
LIN controller pins
Symbol
Pin name
Direction
Description
LIN0/1 TXD
TXDL0/1
OUT
LIN channel 0/1 transmit data output
LIN0/1 RXD
RXDL0/1
IN
LIN channel 0/1 receive data input
6.13.3 I2C-bus serial I/O controllers
The LPC2917/2919/01 each contain two I2C-bus controllers.
The I2C-bus is bidirectional for inter-IC control using only two wires: a serial clock line
(SCL) and a serial data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or as a transmitter with
the capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus, and it can be
controlled by more than one bus master connected to it.
The main features if the I2C-bus interfaces are:
• I2C0 and I2C1 use standard I/O pins with bit rates of up to 400 kbit/s (Fast I2C-bus)
and do not support powering off of individual devices connected to the same bus
lines.
• Easy to configure as master, slave, or master/slave.
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
•
•
•
•
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• All I2C-bus controllers support multiple address recognition and a bus monitor mode.
6.13.3.1
Pin description
Table 21.
I2C-bus pins[1]
Symbol
Pin name
Direction
Description
I2C SCL0/1
SCL0/1
I/O
I2C clock input/output
I2C SDA0/1
SDA0/1
I/O
I2C data input/output
[1]
Note that the pins are not I2C-bus compliant open-drain pins.
6.14 Modulation and sampling control subsystem
The Modulation and Sampling Control Subsystem (MSCSS) in the LPC2917/2919/01
includes four Pulse-Width Modulators (PWMs), two 10-bit successive approximation
Analog-to-Digital Converters (ADCs) and two timers.
The key features of the MSCSS are:
• Two 10-bit, 400 ksamples/s, 8-channel ADCs with 3.3 V inputs and various triggerstart options
• Four 6-channel PWMs (Pulse-Width Modulators) with capture and trap functionality
• Two dedicated timers to schedule and synchronize the PWMs and ADCs
• Quadrature encoder interface
6.14.1 Functional description
The MSCSS contains Pulse-Width Modulators (PWMs), Analog-to-Digital Converters
(ADCs) and timers.
Figure 8 provides an overview of the MSCSS. An AHB-to-APB bus bridge takes care of
communication with the AHB system bus. Two internal timers are dedicated to this
subsystem. MSCSS timer 0 can be used to generate start pulses for the ADCs and the
first PWM. The second timer (MSCSS timer 1) is used to generate ‘carrier’ signals for the
PWMs. These carrier patterns can be used, for example, in applications requiring current
control. Several other trigger possibilities are provided for the ADCs (external, cascaded
or following a PWM). The capture inputs of both timers can also be used to capture the
start pulse of the ADCs.
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NXP Semiconductors
LPC2917/01; LPC2919/01
ARM9 microcontroller with CAN and LIN
The PWMs can be used to generate waveforms in which the frequency, duty cycle and
rising and falling edges can be controlled very precisely. Capture inputs are provided to
measure event phases compared to the main counter. Depending on the applications,
these inputs can be connected to digital sensor motor outputs or digital external signals.
Interrupt signals are generated on several events to closely interact with the CPU.
The ADCs can be used for any application needing accurate digitized data from analog
sources. To support applications like motor control, a mechanism to synchronize several
PWMs and ADCs is available (sync_in and sync_out).
Note that the PWMs run on the PWM clock and the ADCs on the ADC clock, see
Section 6.15.2.
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
AHB-TO-APB BRIDGE
MSCSS
IDX0
PHA0
PHB0
QEI
ADC1 EXT START
capture
start
ADC1 IN[7:0]
ADC1
MSCSS
TIMER0
ADC2 EXT START
start
ADC2 IN[7:0]
ADC2
start
PWM0 MAT[5:0]
PWM0
capture
carrier
synch
carrier
MSCSS
TIMER1
PWM1 MAT[5:0]
PWM1
PAUSE
carrier
synch
PWM2 MAT[5:0]
PWM2
carrier
synch
PWM3
PWM3 MAT[5:0]
PWM0 TRAP
PWM0 CAP[2:0]
PWM1 TRAP
PWM1 CAP[2:0]
PWM2 TRAP
PWM2 CAP[2:0]
PWM3 TRAP
PWM3 CAP[2:0]
002aad961
Fig 8.
Modulation and Sampling Control Subsystem (MSCSS) block diagram
LPC2917_19_01_3
Product data sheet
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Rev. 03 — 9 December 2009
38 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
6.14.2 Pin description
The pins of the LPC2917/2919/01 MSCSS associated with the two ADC modules are
described in Section 6.14.4.2. Pins connected to the four PWM modules are described in
Section 6.14.5.4, pins directly connected to the MSCSS timer 1 module are described in
Section 6.14.6.1, and pins connected to the quadrature encoder interface are described in
Section 6.14.7.1.
6.14.3 Clock description
The MSCSS is clocked from a number of different sources:
•
•
•
•
CLK_SYS_MSCSS_A clocks the AHB side of the AHB-to-APB bus bridge
CLK_MSCSS_APB clocks the subsystem APB bus
CLK_MSCSS_MTMR0/1 clocks the timers
CLK_MSCSS_PWM0..3 clocks the PWMs.
Each ADC has two clock areas; a APB part clocked by CLK_MSCSS_ADCx_APB (x = 1
or 2) and a control part for the analog section clocked by CLK_ADCx = 1 or 2), see
Section 6.7.2.
All clocks are derived from the BASE_MSCSS_CLK, except for CLK_SYS_MSCSS_A
which is derived form BASE_SYS_CLK, and the CLK_ADCx clocks which are derived
from BASE_CLK_ADC. If specific PWM or ADC modules are not used their corresponding
clocks can be switched off.
6.14.4 Analog-to-digital converter
The MSCSS in the LPC2917/2919/01 includes two 10-bit successive-approximation
analog-to-digital converters.
The key features of the ADC interface module are:
• ADC1 and ADC2: Eight analog inputs; time-multiplexed; measurement range up to
3.3 V
• External reference-level inputs
• 400 ksamples per second at 10-bit resolution up to 1500 ksamples per second at 2-bit
resolution
• Programmable resolution from 2-bit to 10-bit
• Single analog-to-digital conversion scan mode and continuous analog-to-digital
conversion scan mode
• Optional conversion on transition on external start input, timer capture/match signal,
PWM_sync or ‘previous’ ADC
• Converted digital values are stored in a register for each channel
• Optional compare condition to generate a ‘less than’ or an ‘equal to or greater than’
compare-value indication for each channel
• Power-down mode
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39 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
6.14.4.1
Functional description
The ADC block diagram, Figure 9, shows the basic architecture of each ADC. The ADC
functionality is divided into two major parts; one part running on the MSCSS Subsystem
clock, the other on the ADC clock. This split into two clock domains affects the behavior
from a system-level perspective. The actual analog-to-digital conversions take place in the
ADC clock domain, but system control takes place in the system clock domain.
A mechanism is provided to modify configuration of the ADC and control the moment at
which the updated configuration is transferred to the ADC domain.
The ADC clock is limited to 4.5 MHz maximum frequency and should always be lower
than or equal to the system clock frequency. To meet this constraint or to select the
desired lower sampling frequency, the clock generation unit provides a programmable
fractional system-clock divider dedicated to the ADC clock. Conversion rate is determined
by the ADC clock frequency divided by the number of resolution bits plus one. Accessing
ADC registers requires an enabled ADC clock, which is controllable via the clock
generation unit, see Section 6.15.2.
Each ADC has four start inputs. Note that start 0 and start 2 are captured in the system
clock domain while start 1 and start 3 are captured in the ADC domain. The start inputs
are connected at MSCSS level, see Figure 8 for details.
ADC clock
(up to 4.5 MHz)
(BASE_ADC_CLK)
APB clock
(BASE_MSCSS_CLK)
SYSTEM DOMAIN
ADC DOMAIN
3.3 V
ADC1
update
APB system bus
ADC
REGISTERS
IRQ scan
conversion data
configuration data
IRQ compare
3.3 V
ADC2
ADC
start 2
ADC1 IN[7:0]
ANALOG
MUX
ADC2 IN[7:0]
3.3 V IN
IRQ
ADC
start 0
Fig 9.
ADC
CONTROL
ANALOG
MUX
3.3 V IN
ADC
start 1
ADC
start 3
sync_out
002aad960
ADC block diagram
6.14.4.2
Pin description
The two ADC modules in the MSCSS have the pins described below. The ADCx input
pins are combined with other functions on the port pins of the LPC2917/2919/01. The
VREFN and VREFP pins are common for both ADCs. Table 22 shows the ADC pins.
LPC2917_19_01_3
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
Table 22.
Analog to digital converter pins
Symbol
Pin name
Direction
Description
ADC1/2 IN[7:0]
IN1/2[7:0]
IN
analog input for 3.3 V ADC1/2, channel 7 to
channel 0
ADCn_EXT_START CAP1[n]
IN
ADC external start-trigger input (n = 1 or 2)
VREFN
VREFN
IN
ADC LOW reference level
VREFP
VREFP
IN
ADC HIGH reference level
Remark: Note that the ADC1 and ADC2 accept an input voltage up to of 3.6 V (see
Table 33) on the ADC1/2 IN pins. If the ADC is not used, the pins are 5 V tolerant.
6.14.4.3
Clock description
The ADC modules are clocked from two different sources; CLK_MSCSS_ADCx_APB and
CLK_ADCx (x = 1 or 2), see Section 6.7.2. Note that each ADC has its own CLK_ADCx
and CLK_MSCSS_ADCx_APB branch clocks for power management. If an ADC is
unused both its CLK_MSCSS_ADCx_APB and CLK_ADCx can be switched off.
The frequency of all the CLK_MSCSS_ADCx_APB clocks is identical to
CLK_MSCSS_APB since they are derived from the same base clock
BASE_MSCSS_CLK. Likewise the frequency of all the CLK_ADCx clocks is identical
since they are derived from the same base clock BASE_ADC_CLK.
The register interface towards the system bus is clocked by CLK_MSCSS_ADCx_APB.
Control logic for the analog section of the ADC is clocked by CLK_ADCx, see also
Figure 9.
6.14.5 Pulse Width Modulator (PWM)
The MSCSS in the LPC2917/2919/01 includes four PWM modules with the following
features.
•
•
•
•
•
•
Six pulse-width modulated output signals
Double edge features (rising and falling edges programmed individually)
Optional interrupt generation on match (each edge)
Different operation modes: continuous or run-once
16-bit PWM counter and 16-bit prescale counter allow a large range of PWM periods
A protective mode (TRAP) holding the output in a software-controllable state and with
optional interrupt generation on a trap event
• Three capture registers and capture trigger pins with optional interrupt generation on
a capture event
• Interrupt generation on match event, capture event, PWM counter overflow or trap
event
• A burst mode mixing the external carrier signal with internally generated PWM
• Programmable sync-delay output to trigger other PWM modules (master/slave
behavior)
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41 of 86
LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
6.14.5.1
Functional description
The ability to provide flexible waveforms allows PWM blocks to be used in multiple
applications; e.g. dimmer/lamp control and fan control. Pulse-width modulation is the
preferred method for regulating power since no additional heat is generated, and it is
energy-efficient when compared with linear-regulating voltage control networks.
The PWM delivers the waveforms/pulses of the desired duty cycles and cycle periods. A
very basic application of these pulses can be in controlling the amount of power
transferred to a load. Since the duty cycle of the pulses can be controlled, the desired
amount of power can be transferred for a controlled duration. Two examples of such
applications are:
• Dimmer controller: The flexibility of providing waves of a desired duty cycle and cycle
period allows the PWM to control the amount of power to be transferred to the load.
The PWM functions as a dimmer controller in this application
• Motor controller: The PWM provides multi-phase outputs, and these outputs can be
controlled to have a certain pattern sequence. In this way the force/torque of the
motor can be adjusted as desired. This makes the PWM function as a motor drive.
sync_in
transfer_enable_in
APB DOMAIN
PWM DOMAIN
update
APB system bus
capture data
PWM
CONTROL
&
REGISTERS
IRQ pwm
IRQ capt_match
PWM counter value
config data
match outputs
PWM,
COUNTER,
PRESCALE
COUNTER
&
SHADOW
REGISTERS
IRQs
capture inputs
trap input
carrier inputs
transfer_enable_out
sync_out
002aad837
Fig 10. PWM block diagram
The PWM block diagram in Figure 10 shows the basic architecture of each PWM. PWM
functionality is split into two major parts, a APB domain and a PWM domain, both of which
run on clocks derived from the BASE_MSCSS_CLK. This split into two domains affects
behavior from a system-level perspective. The actual PWM and prescale counters are
located in the PWM domain but system control takes place in the APB domain.
LPC2917_19_01_3
Product data sheet
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Rev. 03 — 9 December 2009
42 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
The actual PWM consists of two counters; a 16-bit prescale counter and a 16-bit PWM
counter. The position of the rising and falling edges of the PWM outputs can be
programmed individually. The prescale counter allows high system bus frequencies to be
scaled down to lower PWM periods. Registers are available to capture the PWM counter
values on external events.
Note that in the Modulation and Sampling SubSystem, each PWM has its individual clock
source CLK_MSCSS_PWMx (x runs from 0 to 3). Both the prescale and the timer
counters within each PWM run on this clock CLK_MSCSS_PWMx, and all time references
are related to the period of this clock. See Section 6.15 for information on generation of
these clocks.
6.14.5.2
Synchronizing the PWM counters
A mechanism is included to synchronize the PWM period to other PWMs by providing a
sync input and a sync output with programmable delay. Several PWMs can be
synchronized using the trans_enable_in/trans_enable_out and sync_in/sync_out ports.
See Figure 8 for details of the connections of the PWM modules within the MSCSS in the
LPC2917/2919/01. PWM 0 can be master over PWM 1; PWM 1 can be master over
PWM 2, etc.
6.14.5.3
Master and slave mode
A PWM module can provide synchronization signals to other modules (also called Master
mode). The signal sync_out is a pulse of one clock cycle generated when the internal
PWM counter (re)starts. The signal trans_enable_out is a pulse synchronous to sync_out,
generated if a transfer from system registers to PWM shadow registers occurred when the
PWM counter restarted. A delay may be inserted between the counter start and
generation of trans_enable_out and sync_out.
A PWM module can use input signals trans_enable_in and sync_in to synchronize its
internal PWM counter and the transfer of shadow registers (Slave mode).
6.14.5.4
Pin description
Each of the four PWM modules in the MSCSS has the following pins. These are combined
with other functions on the port pins of the LPC2917/2919/01. Table 23 shows the PWM0
to PWM3 pins.
Table 23.
PWM pins
Symbol
Pin name
Direction
Description
PWMn CAP[0]
PCAPn[0]
IN
PWM n capture input 0
PWMn CAP[1]
PCAPn[1]
IN
PWM n capture input 1
PWMn CAP[2]
PCAPn[2]
IN
PWM n capture input 2
PWMn MAT[0]
PMATn[0]
OUT
PWM n match output 0
PWMn MAT[1]
PMATn[1]
OUT
PWM n match output 1
PWMn MAT[2]
PMATn[2]
OUT
PWM n match output 2
PWMn MAT[3]
PMATn[3]
OUT
PWM n match output 3
PWMn MAT[4]
PMATn[4]
OUT
PWM n match output 4
PWMn MAT[5]
PMATn[5]
OUT
PWM n match output 5
PWMn TRAP
TRAPn
IN
PWM n trap input
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43 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
6.14.5.5
Clock description
The PWM modules are clocked by CLK_MSCSS_PWMx (x = 0 - 3), see Section 6.7.2.
Note that each PWM has its own CLK_MSCSS_PWMx branch clock for power
management. The frequency of all these clocks is identical to CLK_MSCSS_APB since
they are derived from the same base clock BASE_MSCSS_CLK.
Also note that unlike the timer modules in the Peripheral SubSystem, the actual timer
counter registers of the PWM modules run at the same clock as the APB system interface
CLK_MSCSS_APB. This clock is independent of the AHB system clock.
If a PWM module is not used its CLK_MSCSS_PWMx branch clock can be switched off.
6.14.6 Timers in the MSCSS
The two timers in the MSCSS are functionally identical to the timers in the peripheral
subsystem, see Section 6.12.3. The features of the timers in the MSCSS are the same as
the timers in the peripheral subsystem, but the capture inputs and match outputs are not
available on the device pins. These signals are instead connected to the ADC and PWM
modules as outlined in the description of the MSCSS, see Section 6.14.1.
See section Section 6.12.3 for a functional description of the timers.
6.14.6.1
Pin description
MSCSS timer 0 has no external pins.
MSCSS timer 1 has a PAUSE pin available as external pin. The PAUSE pin is combined
with other functions on the port pins of the LPC2917/2919/01. Table 24 shows the MSCSS
timer 1 external pin.
Table 24.
6.14.6.2
MSCSS timer 1 pin
Symbol
Direction
Description
MSCSS PAUSE
IN
pause pin for MSCSS timer 1
Clock description
The Timer modules in the MSCSS are clocked by CLK_MSCSS_MTMRx (x = 0 to 1), see
Section 6.7.2. Note that each timer has its own CLK_MSCSS_MTMRx branch clock for
power management. The frequency of all these clocks is identical to CLK_MSCSS_APB
since they are derived from the same base clock BASE_MSCSS_CLK.
Note that, unlike the timer modules in the Peripheral SubSystem, the actual timer counter
registers run at the same clock as the APB system interface CLK_MSCSS_APB. This
clock is independent of the AHB system clock.
If a timer module is not used its CLK_MSCSS_MTMRx branch clock can be switched off.
6.14.7 Quadrature Encoder Interface (QEI)
A quadrature encoder, also known as a 2-channel incremental encoder, converts angular
displacement into two pulse signals. By monitoring both the number of pulses and the
relative phase of the two signals, the user can track the position, direction of rotation, and
velocity. In addition, a third channel, or index signal, can be used to reset the position
counter. The quadrature encoder interface decodes the digital pulses from a quadrature
encoder wheel to integrate position over time and determine direction of rotation. In
addition, the QEI can capture the velocity of the encoder wheel.
LPC2917_19_01_3
Product data sheet
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Rev. 03 — 9 December 2009
44 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
The QEI has the following features:
•
•
•
•
•
•
•
•
•
•
Tracks encoder position.
Increments/ decrements depending on direction.
Programmable for 2X or 4X position counting.
Velocity capture using built-in timer.
Velocity compare function with less than interrupt.
Uses 32-bit registers for position and velocity.
Three position compare registers with interrupts.
Index counter for revolution counting.
Index compare register with interrupts.
Can combine index and position interrupts to produce an interrupt for whole and
partial revolution displacement.
• Digital filter with programmable delays for encoder input signals.
• Can accept decoded signal inputs (clk and direction).
• Connected to APB.
6.14.7.1
Pin description
The QEI module in the MSCSS has the following pins. These are combined with other
functions on the port pins of the LPC2917/2919/01. Table 25 shows the QEI pins.
Table 25.
6.14.7.2
QEI pins
Symbol
Pin name
Direction
Description
QEI0 IDX
IDX0
IN
Index signal. Can be used to reset the position.
QEI0 PHA
PHA0
IN
Sensor signal. Corresponds to PHA in
quadrature mode and to direction in
clock/direction mode.
QEI0 PHB
PHB0
IN
Sensor signal. Corresponds to PHB in
quadrature mode and to clock signal in
clock/direction mode.
Clock description
The QEI module is clocked by CLK_MSCSS_QEI, see Section 6.7.2. The frequency of
this clock is identical to CLK_MSCSS_APB since they are derived from the same base
clock BASE_MSCSS_CLK.
If the QEI is not used its CLK_MSCSS_QEI branch clock can be switched off.
6.15 Power, clock and reset control subsystem
The Power, Clock, and Reset Control Subsystem (PCRSS) in the LPC2917/2919/01
includes the Clock Generator Units (CGU0 and CGU1), a Reset Generator Unit (RGU)
and a Power Management Unit (PMU).
Figure 11 provides an overview of the PCRSS. An AHB-to-DTL bridge provides
communication with the AHB system bus.
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CGU0
PMU
CGU1
PLL
EXTERNAL
OSCILLATOR
OUT6
OUT11
OUT
PLL
OUT0
OUT1
LOW POWER
RING
OSCILLATOR
FDIV[6:0]
branch
clocks
CLOCK
GATES
FDIV
OUT5
OUT7
OUT9
CGU0/1
REGISTERS
CLOCK
ENABLE
CONTROL
PMU
REGISTERS
AHB2DTL
BRIDGE
AHB
master
disable:
grant
request
wakeup_a
RGU
AHB_RST
RGU
REGISTERS
SCU_RST
RESET OUTPUT
DELAY LOGIC
POR
WARM_RST
COLD_RST
PCR_RST
RGU_RST
POR_RST
INPUT
DEGLITCH/
SYNC
RST (device pin)
reset from watchdog counter
002aae355
Fig 11. Power, Clock, and Reset control Sub System (PCRSS) block diagram
6.15.1 Clock description
The PCRSS is clocked by a number of different clocks. CLK_SYS_PCRSS clocks the
AHB side of the AHB to DTL bus bridge and CLK_PCR_SLOW clocks the CGU, RGU and
PMU internal logic, see Section 6.7.2. CLK_SYS_PCRSS is derived from
BASE_SYS_CLK, which can be switched off in low-power modes. CLK_PCR_SLOW is
derived from BASE_PCR_CLK and is always on in order to be able to wake up from
low-power modes.
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
6.15.2 Clock Generation Unit (CGU0)
The key features are:
•
•
•
•
•
•
•
•
•
•
Generation of 11 base clocks, selectable from several embedded clock sources.
Crystal oscillator with power-down.
Control PLL with power-down.
Very low-power ring oscillator, always on to provide a ‘safe clock’.
Seven fractional clock dividers with L/D division.
Individual source selector for each base clock, with glitch-free switching.
Autonomous clock-activity detection on every clock source.
Protection against switching to invalid or inactive clock sources.
Embedded frequency counter.
Register write-protection mechanism to prevent unintentional alteration of clocks.
Remark: Any clock-frequency adjustment has a direct impact on the timing of all on-board
peripherals.
6.15.2.1
Functional description
The clock generation unit provides 11 internal clock sources as described in Table 26.
Table 26.
CGU0 base clocks
Number Name
Frequency
(MHz) [1]
Description
0
BASE_SAFE_CLK
0.4
base safe clock (always on)
1
BASE_SYS_CLK
125
base system clock
2
BASE_PCR_CLK
0.4 [2]
base PCR subsystem clock
3
BASE_IVNSS_CLK
125
base IVNSS subsystem clock
4
BASE_MSCSS_CLK
125
base MSCSS subsystem clock
5
BASE_UART_CLK
125
base UART clock
6
BASE_ICLK0_CLK
125
base internal clock 0, for CGU1
7
BASE_SPI_CLK
50
base SPI clock
8
BASE_TMR_CLK
125
base timers clock
9
BASE_ADC_CLK
4.5
base ADCs clock
10
reserved
-
-
11
BASE_ICLK1_CLK
125
base internal clock 1, for CGU1
[1]
Maximum frequency that guarantees stable operation of the LPC2917/2919/01.
[2]
Fixed to low-power oscillator.
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ARM9 microcontroller with CAN and LIN
CLOCK GENERATION UNIT (CGU0)
OUT 0
BASE_SAFE_CLK
OUT 1
BASE_SYS_CLK
OUT 2
BASE_PCR_CLK
OUT 3
BASE_IVNSS_CLK
OUT 11
BASE_ICLK1_CLK
FDIV0
400 kHz LP_OSC
EXTERNAL
OSCILLATOR
PLL
clkout
clkout120
clkout240
FDIV1
FDIV6
FREQUENCY
MONITOR
CLOCK
DETECTION
AHB TO DTL BRIDGE
002aae147
Fig 12. Block diagram of the CGU0
For generation of these base clocks, the CGU consists of primary and secondary clock
generators and one output generator for each base clock.
There are two primary clock generators: a low-power ring oscillator (LP_OSC) and a
crystal oscillator. See Figure 12.
LP_OSC is the source for the BASE_PCR_CLK that clocks the CGU0 itself and for
BASE_SAFE_CLK that clocks a minimum of other logic in the device (like the watchdog
timer). To prevent the device from losing its clock source LP_OSC cannot be put into
power-down. The crystal oscillator can be used as source for high-frequency clocks or as
an external clock input if a crystal is not connected.
Secondary clock generators are a PLL and seven fractional dividers (FDIV0..6). The PLL
has three clock outputs: normal, 120° phase-shifted and 240° phase-shifted.
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Configuration of the CGU0: For every output generator generating the base clocks a
choice can be made from the primary and secondary clock generators according to
Figure 13.
LP_OSC
FDIV0:6
EXTERNAL
OSCILLATOR
PLL
clkout
clkout120
clkout240
OUTPUT
CONTROL
clock
outputs
002aad834
Fig 13. Structure of the clock generation scheme
Any output generator (except for BASE_SAFE_CLK and BASE_PCR_CLK) can be
connected to either a fractional divider (FDIV0..6) or to one of the outputs of the PLL or to
LP_OSC/crystal oscillator directly. BASE_SAFE_CLK and BASE_PCR_CLK can use only
LP_OSC as source.
The fractional dividers can be connected to one of the outputs of the PLL or directly to
LP_OSC/crystal Oscillator.
The PLL is connected to the crystal oscillator.
In this way every output generating the base clocks can be configured to get the required
clock. Multiple output generators can be connected to the same primary or secondary
clock source, and multiple secondary clock sources can be connected to the same PLL
output or primary clock source.
Invalid selections/programming - connecting the PLL to an FDIV or to one of the PLL
outputs itself for example - will be blocked by hardware. The control register will not be
written, the previous value will be kept, although all other fields will be written with new
data. This prevents clocks being blocked by incorrect programming.
Default Clock Sources: Every secondary clock generator or output generator is
connected to LP_OSC at reset. In this way the device runs at a low frequency after reset.
It is recommended to switch BASE_SYS_CLK to a high-frequency clock generator as one
of the first steps in the boot code after verifying that the high-frequency clock generator is
running.
Clock Activity Detection: Clocks that are inactive are automatically regarded as invalid,
and values of ‘CLK_SEL’ that would select those clocks are masked and not written to the
control registers. This is accomplished by adding a clock detector to every clock
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LPC2917/01; LPC2919/01
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generator. The RDET register keeps track of which clocks are active and inactive, and the
appropriate ‘CLK_SEL’ values are masked and unmasked accordingly. Each clock
detector can also generate interrupts at clock activation and deactivation so that the
system can be notified of a change in internal clock status.
Clock detection is done using a counter running at the BASE_PCR_CLK frequency. If no
positive clock edge occurs before the counter has 32 cycles of BASE_PCR_CLK the clock
is assumed to be inactive. As BASE_PCR_CLK is slower than any of the clocks to be
detected, normally only one BASE_PCR_CLK cycle is needed to detect activity. After
reset all clocks are assumed to be ‘non-present’, so the RDET status register will be
correct only after 32 BASE_PCR_CLK cycles.
Note that this mechanism cannot protect against a currently-selected clock going from
active to inactive state. Therefore an inactive clock may still be sent to the system under
special circumstances, although an interrupt can still be generated to notify the system.
Glitch-Free Switching: Provisions are included in the CGU to allow clocks to be
switched glitch-free, both at the output generator stage and also at secondary source
generators.
In the case of the PLL the clock will be stopped and held low for long enough to allow the
PLL to stabilize and lock before being re-enabled. For all non-PLL Generators the switch
will occur as quickly as possible, although there will always be a period when the clock is
held low due to synchronization requirements.
If the current clock is high and does not go low within 32 cycles of BASE_PCR_CLK it is
assumed to be inactive and is asynchronously forced low. This prevents deadlocks on the
interface.
6.15.2.2
PLL functional description
A block diagram of the PLL is shown in Figure 14. The input clock is fed directly to the
analog section. This block compares the phase and frequency of the inputs and generates
the main clock2. These clocks are either divided by 2 × P by the programmable post
divider to create the output clock, or sent directly to the output. The main output clock is
then divided by M by the programmable feedback divider to generate the feedback clock.
The output signal of the analog section is also monitored by the lock detector to signal
when the PLL has locked onto the input clock.
2.
Generation of the main clock is restricted by the frequency range of the PLL clock input. See Table 35, Dynamic characteristics.
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ARM9 microcontroller with CAN and LIN
PSEL bits
P23EN bit
input clock
/ 2PDIV
P23
CCO
clkout120
clkout240
clkout
bypass
direct
/ MDIV
clkout
002aad833
MSEL bits
Fig 14. PLL block diagram
Triple output phases: For applications that require multiple clock phases two additional
clock outputs can be enabled by setting register P23EN to logic 1, thus giving three clocks
with a 120° phase difference. In this mode all three clocks generated by the analog
section are sent to the output dividers. When the PLL has not yet achieved lock the
second and third phase output dividers run unsynchronized, which means that the phase
relation of the output clocks is unknown. When the PLL LOCK register is set the second
and third phase of the output dividers are synchronized to the main output clock CLKOUT
PLL, thus giving three clocks with a 120° phase difference.
Direct output mode: In normal operating mode (with DIRECT set to logic 0) the CCO
clock is divided by 2, 4, 8 or 16 depending on the value on the PSEL[1:0] input, giving an
output clock with a 50 % duty cycle. If a higher output frequency is needed the CCO clock
can be sent directly to the output by setting DIRECT to logic 1. Since the CCO does not
directly generate a 50 % duty cycle clock, the output clock duty cycle in this mode can
deviate from 50 %.
Power-down control: A Power-down mode has been incorporated to reduce power
consumption when the PLL clock is not needed. This is enabled by setting the PD control
register bit. In this mode the analog section of the PLL is turned off, the oscillator and the
phase-frequency detector are stopped and the dividers enter a reset state. While in
Power-down mode the LOCK output is low, indicating that the PLL is not in lock. When
Power-down mode is terminated by clearing the PD control-register bit the PLL resumes
normal operation, and makes the LOCK signal high once it has regained lock on the input
clock.
6.15.2.3
Pin description
The CGU0 module in the LPC2917/2919/01 has the pins listed in Table 27 below.
Table 27.
CGU0 pins
Symbol
Direction
Description
XOUT_OSC
OUT
Oscillator crystal output
XIN_OSC
IN
Oscillator crystal input or external clock input
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6.15.3 Clock generation for CLK_OUT (CGU1)
The CGU1 block is functionally identical to the CGU0 block and generates a dedicated
output clock. The CGU1 block uses its own PLL and fractional divider. The PLLs used in
CGU0 and CGU1 are identical (see Section 6.15.2.2).
The clock input to the CGU1 PLL is provided by one of two base clocks generated in the
CGU0: BASE_ICLK0_CLK or BASE_ICLK1_CLK. The base clock not used for the PLL
can be configured to drive the output clock directly.
CLOCK GENERATION UNIT
(CGU1)
OUT
BASE_ICLK0_CLK
BASE_ICLK1_CLK
clkout
clkout120
PLL
clkout240
BASE_OUT_CLK
FDIV0
AHB TO DTL BRIDGE
002aae266
Fig 15. Block diagram of the CGU1
6.15.3.1
Pin description
The CGU1 module in the LPC2917/2919/01 has the pins listed in Table 27 below.
Table 28.
CGU1 pins
Symbol
Direction
Description
CLK_OUT
OUT
clock output
6.15.4 Reset Generation Unit (RGU)
The RGU controls all internal resets.
The key features of the Reset Generation Unit (RGU) are:
• Reset controlled individually per subsystem
• Automatic reset stretching and release
• Monitor function to trace resets back to source
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• Register write-protection mechanism to prevent unintentional resets
6.15.4.1
Functional description
Each reset output is defined as a combination of reset input sources including the external
reset input pins and internal power-on reset, see Table 29. The first five resets listed in
this table form a sort of cascade to provide the multiple levels of impact that a reset may
have. The combined input sources are logically OR-ed together so that activating any of
the listed reset sources causes the output to go active.
Table 29.
6.15.4.2
Reset output configuration
Reset output
Reset source
Parts of the device reset when activated
POR_RST
power-on reset module
LP_OSC; is source for RGU_RST
RGU_RST
POR_RST, RST pin
RGU internal; is source for PCR_RST
PCR_RST
RGU_RST, WATCHDOG
PCR internal; is source for COLD_RST
COLD_RST
PCR_RST
parts with COLD_RST as reset source below
WARM_RST
COLD_RST
parts with WARM_RST as reset source below
SCU_RST
COLD_RST
SCU
CFID_RST
COLD_RST
CFID
FMC_RST
COLD_RST
embedded Flash-Memory Controller (FMC)
EMC_RST
COLD_RST
embedded SRAM-Memory Controller
SMC_RST
COLD_RST
external Static-Memory Controller (SMC)
GESS_A2A_RST
WARM_RST
GeSS AHB-to-APB bridge
PESS_A2A_RST
WARM_RST
PeSS AHB-to-APB bridge
GPIO_RST
WARM_RST
all GPIO modules
UART_RST
WARM_RST
all UART modules
TMR_RST
WARM_RST
all Timer modules in PeSS
SPI_RST
WARM_RST
all SPI modules
IVNSS_A2A_RST
WARM_RST
IVNSS AHB-to-APB bridge
IVNSS_CAN_RST
WARM_RST
all CAN modules including Acceptance filter
IVNSS_LIN_RST
WARM_RST
all LIN modules
MSCSS_A2A_RST
WARM_RST
MSCSS AHB to APB bridge
MSCSS_PWM_RST
WARM_RST
all PWM modules
MSCSS_ADC_RST
WARM_RST
all ADC modules
MSCSS_TMR_RST
WARM_RST
all Timer modules in MSCSS
I2C_RST
WARM_RST
all I2C modules
QEI_RST
WARM_RST
Quadrature encoder
DMA_RST
WARM_RST
GPDMA controller
VIC_RST
WARM_RST
Vectored Interrupt Controller (VIC)
AHB_RST
WARM_RST
CPU and AHB Bus infrastructure
Pin description
The RGU module in the LPC2917/2919/01 has the following pins. Table 30 shows the
RGU pins.
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
Table 30.
RGU pins
Symbol
Direction
Description
RST
IN
external reset input, Active LOW; pulled up internally
6.15.5 Power Management Unit (PMU)
This module enables software to actively control the system’s power consumption by
disabling clocks not required in a particular operating mode.
Using the base clocks from the CGU as input, the PMU generates branch clocks to the
rest of the LPC2917/2919/01. Output clocks branched from the same base clock are
phase- and frequency-related. These branch clocks can be individually controlled by
software programming.
The key features are:
•
•
•
•
•
•
•
6.15.5.1
Individual clock control for all LPC2917/2919/01 sub-modules
Activates sleeping clocks when a wake-up event is detected
Clocks can be individually disabled by software
Supports AHB master-disable protocol when AUTO mode is set
Disables wake-up of enabled clocks when Power-down mode is set
Activates wake-up of enabled clocks when a wake-up event is received
Status register is available to indicate if an input base clock can be safely switched off
(i.e. all branch clocks are disabled)
Functional description
The PMU controls all internal clocks coming out of the CGU0 for power-mode
management. With some exceptions, each branch clock can be switched on or off
individually under control of software register bits located in its individual configuration
register. Some branch clocks controlling vital parts of the device operate in a fixed mode.
Table 31 shows which mode- control bits are supported by each branch clock.
By programming the configuration register the user can control which clocks are switched
on or off, and which clocks are switched off when entering Power-down mode.
Note that the standby-wait-for-interrupt instructions of the ARM968E-S processor (putting
the ARM CPU into a low-power state) are not supported. Instead putting the ARM CPU
into power-down should be controlled by disabling the branch clock for the CPU.
Remark: For any disabled branch clocks to be re-activated their corresponding base
clocks must be running (controlled by CGU0).
Table 31 shows the relation between branch and base clocks, see also Section 6.7.1.
Every branch clock is related to one particular base clock: it is not possible to switch the
source of a branch clock in the PMU.
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LPC2917/01; LPC2919/01
ARM9 microcontroller with CAN and LIN
Table 31. Branch clock overview
Legend:
‘1’ Indicates that the related register bit is tied off to logic HIGH, all writes are ignored
‘0’ Indicates that the related register bit is tied off to logic LOW, all writes are ignored
‘+’ Indicates that the related register bit is readable and writable
Branch clock name
Base clock
WAKE-UP
AUTO
RUN
CLK_SAFE
BASE_SAFE_CLK
0
0
1
CLK_SYS_CPU
BASE_SYS_CLK
+
+
1
CLK_SYS
BASE_SYS_CLK
+
+
1
CLK_SYS_PCR
BASE_SYS_CLK
+
+
1
CLK_SYS_FMC
BASE_SYS_CLK
+
+
+
CLK_SYS_RAM0
BASE_SYS_CLK
+
+
+
CLK_SYS_RAM1
BASE_SYS_CLK
+
+
+
CLK_SYS_SMC
BASE_SYS_CLK
+
+
+
CLK_SYS_GESS
BASE_SYS_CLK
+
+
+
CLK_SYS_VIC
BASE_SYS_CLK
+
+
+
CLK_SYS_PESS
BASE_SYS_CLK
+
+
+
CLK_SYS_GPIO0
BASE_SYS_CLK
+
+
+
CLK_SYS_GPIO1
BASE_SYS_CLK
+
+
+
CLK_SYS_GPIO2
BASE_SYS_CLK
+
+
+
CLK_SYS_GPIO3
BASE_SYS_CLK
+
+
+
CLK_SYS_IVNSS_A
BASE_SYS_CLK
+
+
+
CLK_SYS_MSCSS_A
BASE_SYS_CLK
+
+
+
CLK_SYS_DMA
BASE_SYS_CLK
+
+
+
CLK_PCR_SLOW
BASE_PCR_CLK
+
+
1
CLK_IVNSS_APB
BASE_IVNSS_CLK
+
+
+
CLK_IVNSS_CANC0
BASE_IVNSS_CLK
+
+
+
CLK_IVNSS_CANC1
BASE_IVNSS_CLK
+
+
+
CLK_IVNSS_I2C0
BASE_IVNSS_CLK
+
+
+
CLK_IVNSS_I2C1
BASE_IVNSS_CLK
+
+
+
CLK_IVNSS_LIN0
BASE_IVNSS_CLK
+
+
+
CLK_IVNSS_LIN1
BASE_IVNSS_CLK
+
+
+
CLK_MSCSS_APB
BASE_MSCSS_CLK
+
+
+
CLK_MSCSS_MTMR0
BASE_MSCSS_CLK
+
+
+
CLK_MSCSS_MTMR1
BASE_MSCSS_CLK
+
+
+
CLK_MSCSS_PWM0
BASE_MSCSS_CLK
+
+
+
CLK_MSCSS_PWM1
BASE_MSCSS_CLK
+
+
+
CLK_MSCSS_PWM2
BASE_MSCSS_CLK
+
+
+
CLK_MSCSS_PWM3
BASE_MSCSS_CLK
+
+
+
CLK_MSCSS_ADC1_APB BASE_MSCSS_CLK
+
+
+
CLK_MSCSS_ADC2_APB BASE_MSCSS_CLK
+
+
+
CLK_MSCSS_QEI
+
+
+
BASE_MSCSS_CLK
LPC2917_19_01_3
Product data sheet
Implemented switch on/off
mechanism
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
Table 31. Branch clock overview …continued
Legend:
‘1’ Indicates that the related register bit is tied off to logic HIGH, all writes are ignored
‘0’ Indicates that the related register bit is tied off to logic LOW, all writes are ignored
‘+’ Indicates that the related register bit is readable and writable
Branch clock name
Base clock
Implemented switch on/off
mechanism
WAKE-UP
AUTO
RUN
CLK_OUT_CLK
BASE_OUT_CLK
+
+
+
CLK_UART0
BASE_UART_CLK
+
+
+
CLK_UART1
BASE_UART_CLK
+
+
+
CLK_SPI0
BASE_SPI_CLK
+
+
+
CLK_SPI1
BASE_SPI_CLK
+
+
+
CLK_SPI2
BASE_SPI_CLK
+
+
+
CLK_TMR0
BASE_TMR_CLK
+
+
+
CLK_TMR1
BASE_TMR_CLK
+
+
+
CLK_TMR2
BASE_TMR_CLK
+
+
+
CLK_TMR3
BASE_TMR_CLK
+
+
+
CLK_ADC1
BASE_ADC_CLK
+
+
+
CLK_ADC2
BASE_ADC_CLK
+
+
+
6.16 Vectored Interrupt Controller (VIC)
The LPC2917/2919/01 contains a very flexible and powerful Vectored Interrupt Controller
to interrupt the ARM processor on request.
The key features are:
•
•
•
•
•
•
Level-active interrupt request with programmable polarity.
56 interrupt-request inputs.
Software-interrupt request capability associated with each request input.
Interrupt request state can be observed before masking.
Software-programmable priority assignments to interrupt requests up to 15 levels.
Software-programmable routing of interrupt requests towards the ARM-processor
inputs IRQ and FIQ.
• Fast identification of interrupt requests through vector.
• Support for nesting of interrupt service routines.
6.16.1 Functional description
The Vectored Interrupt Controller routes incoming interrupt requests to the ARM
processor. The interrupt target is configured for each interrupt request input of the VIC.
The targets are defined as follows:
• Target 0 is ARM processor FIQ (fast interrupt service).
• Target 1 is ARM processor IRQ (standard interrupt service).
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Interrupt-request masking is performed individually per interrupt target by comparing the
priority level assigned to a specific interrupt request with a target-specific priority
threshold. The priority levels are defined as follows:
• Priority level 0 corresponds to ‘masked’ (i.e. interrupt requests with priority 0 never
lead to an interrupt).
• Priority 1 corresponds to the lowest priority.
• Priority 15 corresponds to the highest priority.
Software interrupt support is provided and can be supplied for:
• Testing RTOS (Real-Time Operating System) interrupt handling without using
device-specific interrupt service routines.
• Software emulation of an interrupt-requesting device, including interrupts.
6.16.2 Clock description
The VIC is clocked by CLK_SYS_VIC, see Section 6.7.2.
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ARM9 microcontroller with CAN and LIN
7. Limiting values
Table 32. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
-
1.5
W
Supply pins
[1]
Ptot
total power dissipation
VDD(CORE)
core supply voltage
−0.5
+2.0
V
VDD(OSC_PLL)
oscillator and PLL supply
voltage
−0.5
+2.0
V
VDDA(ADC3V3)
3.3 V ADC analog supply
voltage
−0.5
+4.6
V
VDD(IO)
input/output supply voltage
−0.5
+4.6
V
-
98
mA
-
98
mA
−0.5
+2.0
V
[3][4][5]
−0.5
VDD(IO) + 3.0
V
[4][5]
−0.5
VDDA(ADC3V3)
+ 0.5
V
−0.5
+3.6
V
−0.5
+3.6
V
-
35
mA
IDD
supply current
average value per supply
pin
[2]
ISS
ground current
average value per ground
pin
[2]
Input pins and I/O pins
VXIN_OSC
voltage on pin XIN_OSC
VI(IO)
I/O input voltage
VI(ADC)
ADC input voltage
VVREFP
voltage on pin VREFP
VVREFN
voltage on pin VREFN
II(ADC)
ADC input current
for ADC1/2: I/O port 0 pin 8
to pin 23.
[2]
average value per input pin
Output pins and I/O pins configured as output
IOHS
HIGH-level short-circuit
output current
drive HIGH, output shorted
to VSS(IO)
[6]
-
−33
mA
IOLS
LOW-level short-circuit
output current
drive LOW, output shorted
to VDD(IO)
[6]
-
+38
mA
General
Tstg
storage temperature
−65
+150
°C
Tamb
ambient temperature
−40
+85
°C
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ARM9 microcontroller with CAN and LIN
Table 32. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
electrostatic discharge
voltage
on all pins
Min
Max
Unit
−2000
+2000
V
−500
+500
V
−750
+750
V
ESD
VESD
human body model
charged device model
[7]
on corner pins
charged device model
[1]
Based on package heat transfer, not device power consumption.
[2]
Peak current must be limited at 25 times average current.
[3]
For I/O Port 0, the maximum input voltage is defined by VI(ADC).
[4]
Only when VDD(IO) is present.
[5]
Note that pull-up should be off. With pull-up do not exceed 3.6 V.
[6]
112 mA per VDD(IO) or VSS(IO) should not be exceeded.
[7]
Human-body model: discharging a 100 pF capacitor via a 10 kΩ series resistor.
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ARM9 microcontroller with CAN and LIN
8. Static characteristics
Table 33. Static characteristics
VDD(CORE) = VDD(OSC_PLL) ; VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; Tvj = -40 °C to +85 °C; all voltages are
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
1.71
1.80
1.89
V
-
75
-
mA
-
30
475
μA
2.7
-
3.6
V
-
0.5
3.25
μA
1.71
1.80
1.89
V
normal mode
-
-
1
mA
Power-down mode
-
-
2
μA
3.0
3.3
3.6
V
normal mode
-
-
1.9
mA
Power-down mode
-
-
4
μA
−0.5
-
+ 5.5
V
Supplies
Core supply
VDD(CORE)
core supply voltage
IDD(CORE)
core supply current
Device state after reset;
system clock at
125 MHz; Tamb = 85 °C;
executing code
while(1){} from flash.
[2]
all clocks off
I/O supply
VDD(IO)
input/output supply
voltage
IDD(IO)
I/O supply current
Power-down mode
Oscillator supply
VDD(OSC_PLL)
oscillator and PLL supply
voltage
IDD(OSC_PLL)
oscillator and PLL supply
current
Analog-to-digital converter supply
VDDA(ADC3V3)
3.3 V ADC analog supply
voltage
IDDA(ADC3V3)
3.3 V ADC analog supply
current
Input pins and I/O pins configured as input
VI
input voltage
all port pins and VDD(IO)
applied;
[3][4]
see Section 7
port 0 pins 8 to 23 when
ADC1/2 is used
[4]
VVREFP
all port pins and VDD(IO)
not applied
−0.5
-
+3.6
V
all other I/O pins, RST,
TRST, TDI, JTAGSEL,
TMS, TCK
−0.5
-
VDD(IO)
V
VIH
HIGH-level input voltage
all port pins, RST, TRST,
TDI, JTAGSEL, TMS,
TCK; see Figure 22
2.0
-
-
V
VIL
LOW-level input voltage
all port pins, RST, TRST,
TDI, JTAGSEL, TMS,
TCK; see Figure 21
-
-
0.8
V
Vhys
hysteresis voltage
0.4
-
-
V
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ARM9 microcontroller with CAN and LIN
Table 33. Static characteristics …continued
VDD(CORE) = VDD(OSC_PLL) ; VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; Tvj = -40 °C to +85 °C; all voltages are
measured with respect to ground; positive currents flow into the IC; unless otherwise specified.[1]
Symbol
Parameter
ILIH
Conditions
Min
Typ
Max
Unit
HIGH-level input leakage
current
-
-
1
μA
ILIL
LOW-level input leakage
current
-
-
1
μA
II(pd)
pull-down input current
all port pins, VI = 3.3 V;
VI = 5.5 V; see Figure 23
25
50
100
μA
II(pu)
pull-up input current
all port pins, RST, TRST,
TDI, JTAGSEL, TMS:
VI = 0 V; VI > 3.6 V is not
allowed; see Figure 24
−25
−50
−115
μA
Ci
input capacitance
-
3
8
pF
[5]
Output pins and I/O pins configured as output
VO
output voltage
0
-
VDD(IO)
V
VOH
HIGH-level output voltage IOH = −4 mA
VDD(IO) – 0.4
-
-
V
VOL
LOW-level output voltage
-
-
0.4
V
CL
load capacitance
-
-
25
pF
VXIN_OSC
voltage on pin XIN_OSC
0
-
1.8
V
Rs(xtal)
crystal series resistance
Cxtal = 10 pF;
Cext = 18 pF
-
-
160
Ω
Cxtal = 20 pF;
Cext = 39 pF
-
-
60
Ω
-
-
80
Ω
2
pF
IOL = 4 mA
Oscillator
fosc = 10 MHz to 15 MHz
fosc = 15 MHz to 20 MHz
[6]
[6]
Cxtal = 10 pF;
Cext = 18 pF
input capacitance
Ci
of XIN_OSC
[7]
-
Power-up reset
Vtrip(high)
high trip level voltage
[8]
1.1
1.4
1.6
V
Vtrip(low)
low trip level voltage
[8]
1.0
1.3
1.5
V
Vtrip(dif)
difference between high
and low trip level voltage
[8]
50
120
180
mV
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at Tamb = 85 °C on wafer
level. Cased products are tested at Tamb = 25 °C (final testing). Both pre-testing and final testing use correlated test conditions to cover
the specified temperature and power-supply voltage range.
[2]
Leakage current is exponential to temperature; worst-case value is at 85 °C Tvj. All clocks off. Analog modules and FLASH powered
down.
[3]
Not 5 V-tolerant when pull-up is on.
[4]
For I/O Port 0, the maximum input voltage is defined by VI(ADC).
[5]
For Port 0, pin 0 to pin 15 add maximum 1.5 pF for input capacitance to ADC. For Port 0, pin 16 to pin 31 add maximum 1.0 pF for input
capacitance to ADC.
[6]
Cxtal is crystal load capacitance and Cext are the two external load capacitors.
[7]
This parameter is not part of production testing or final testing, hence only a typical value is stated. Maximum and minimum values are
based on simulation results.
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
[8]
The power-up reset has a time filter: VDD(CORE) must be above Vtrip(high) for 2 μs before reset is de-asserted; VDD(CORE) must be below
Vtrip(low) for 11 μs before internal reset is asserted.
Table 34. ADC static characteristics
VDDA(ADC3V3) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 4.5 MHz.
Symbol
Parameter
Min
Typ
Max
Unit
VVREFN
voltage on pin VREFN
Conditions
0
-
VVREFP − 2
V
VVREFP
voltage on pin VREFP
VVREFN + 2 -
VDDA(ADC3V3)
V
Zi
input impedance
4.4
-
-
kΩ
VIA
analog input voltage
VVREFN
-
VVREFP
V
Cia
analog input capacitance
-
-
1
pF
-
±1
LSB
between VVREFN and
VVREFP
[1][2][3]
differential linearity error
ED
EL(adj)
integral non-linearity
[1][4]
-
-
±2
LSB
EO
offset error
[1][5]
-
-
±3
LSB
EG
gain error
[1][6]
-
-
±0.5
%
absolute error
[1][7]
-
-
±4
LSB
[8]
-
-
40
kΩ
ET
voltage source interface
resistance
Rvsi
[1]
Conditions: VSS(IO) = 0 V, VDDA(ADC3V3) = 3.3 V.
[2]
The ADC is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 17.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 17.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 17.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 17.
[7]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 17.
[8]
See Figure 16.
LPC2XXX
20 kΩ
ADC IN[y]
ADC IN[y]SAMPLE
3 pF
Rvsi
5 pF
VEXT
VSS(IO), VSS(CORE)
002aae280
Fig 16. Suggested ADC interface - LPC2917/2919/01 ADC1/2 IN[y] pin
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
offset
error
EO
gain
error
EG
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
offset error
EO
002aae703
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 17. ADC characteristics
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
8.1 Power consumption
002aae241
80
IDD(CORE)
(mA)
60
40
20
0
10
50
90
130
core frequency (MHz)
Conditions: Tamb = 25 °C; active mode entered executing code from flash; core voltage 1.8 V; all
peripherals enabled but not configured to run.
Fig 18. IDD(CORE) at different core frequencies (active mode)
002aae240
80
IDD(CORE)
(mA)
125 MHz
60
100 MHz
80 MHz
40
40 MHz
20
10 MHz
0
1.7
1.8
1.9
core voltage (V)
Conditions: Tamb = 25 °C; active mode entered executing code from flash; all peripherals enabled
but not configured to run.
Fig 19. IDD(CORE) at different core voltages VDD(CORE) (active mode)
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ARM9 microcontroller with CAN and LIN
002aae239
80
IDD(CORE)
(mA)
60
125 MHz
100 MHz
80 MHz
40
40 MHz
20
10 MHz
0
−40
−15
10
35
60
85
temperature (°C)
Conditions: active mode entered executing code from flash; core voltage 1.8 V; all peripherals
enabled but not configured to run.
Fig 20.
IDD(CORE) at different temperatures (active mode)
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LPC2917/01; LPC2919/01
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ARM9 microcontroller with CAN and LIN
8.2 Electrical pin characteristics
002aae689
500
VOL
(mV)
400
85 °C
25 °C
0 °C
−40 °C
300
200
100
0
1.0
2.0
3.0
4.0
5.0
6.0
IOL(mA)
VDD(IO) = 3.3 V.
Fig 21. Typical LOW-level output voltage versus LOW-level output current
002aae690
3.5
VOH
(V)
85 °C
25 °C
0 °C
−40 °C
3.0
2.5
2.0
1.0
2.0
3.0
4.0
5.0
6.0
IOH (mA)
VDD(IO) = 3.3 V.
Fig 22. Typical HIGH-level output voltage versus HIGH-level output current
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
002aae691
80
II(pd)
(μA)
70
VDD(IO) = 3.6 V
3.0 V
2.7 V
60
50
40
−40
−15
10
35
60
85
temperature (°C)
VI = 3.3 V.
Fig 23. Typical pull-down current versus temperature
002aae692
−20
II(pu)
(μA)
VDD(IO) = 2.7 V
−40
3.3 V
−60
3.6 V
−80
−100
−40
−15
10
35
60
85
temperature (°C)
VI = 0 V.
Fig 24. Typical pull-up current versus temperature
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
9. Dynamic characteristics
9.1 Dynamic characteristics: I/O pins, internal clock, oscillators, PLL, and
CAN
Table 35. Dynamic characteristics
VDD(CORE) = VDD(OSC_PLL); VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to
ground; positive currents flow into the IC; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
I/O pins
tTHL
HIGH to LOW transition CL = 30 pF
time
4
-
13.8
ns
tTLH
LOW to HIGH transition CL = 30 pF
time
4
-
13.8
ns
clock frequency
-
-
40
MHz
CLKOUT pin
fclk
on pin CLKOUT
Internal clock
fclk(sys)
system clock frequency
[2]
10
-
125
MHz
Tclk(sys)
system clock period
[2]
8
-
100
ns
0.36
0.4
0.42
MHz
-
6
-
μs
10
-
100
MHz
-
500
-
μs
10
-
25
MHz
10
-
160
MHz
156
-
320
MHz
Low-power ring oscillator
fref(RO)
RO reference
frequency
tstartup
start-up time
at maximum frequency
fi(osc)
oscillator input
frequency
maximum frequency is
the clock input of an
external clock source
applied to the XIN_OSC
pin
tstartup
start-up time
at maximum frequency
[3]
Oscillator
[3]
[4]
PLL
fi(PLL)
PLL input frequency
fo(PLL)
PLL output frequency
CCO; direct mode
ta(clk)
clock access time
-
-
63.4
ns
ta(A)
address access time
-
-
60.3
ns
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
Table 35. Dynamic characteristics …continued
VDD(CORE) = VDD(OSC_PLL); VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to
ground; positive currents flow into the IC; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
0.4
1
ns
Jitter specification for CAN
tjit(cc)(p-p)
cycle to cycle jitter
(peak-to-peak value)
[3]
on CAN TXDC pin
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at Tamb = 85 °C ambient
temperature on wafer level. Cased products are tested at Tamb = 25 °C (final testing). Both pre-testing and final testing use correlated
test conditions to cover the specified temperature and power supply voltage range.
[2]
See Table 26.
[3]
This parameter is not part of production testing or final testing, hence only a typical value is stated.
[4]
Oscillator start-up time depends on the quality of the crystal. For most crystals it takes about 1000 clock pulses until the clock is fully
stable.
002aae373
520
1.9 V
fref(RO)
(kHz)
1.8 V
1.7 V
510
500
490
480
−40
−15
10
35
60
85
temperature (°C)
Fig 25. Low-power ring oscillator thermal characteristics
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
9.2 Dynamic characteristics: I2C-bus interface
Table 36. Dynamic characteristic: I2C-bus pins
VDD(CORE) = VDD(OSC_PLL); VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to
ground; positive currents flow into the IC; unless otherwise specified[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
tf(o)
output fall time
VIH to VIL
20 + 0.1 × Cb[3]
-
-
ns
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at Tamb = 85 °C ambient
temperature on wafer level. Cased products are tested at Tamb = 25 °C (final testing). Both pre-testing and final testing use correlated
test conditions to cover the specified temperature and power supply voltage range.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
[3]
Bus capacitance Cb in pF, from 10 pF to 400 pF.
9.3 Dynamic characteristics: SPI
Table 37. Dynamic characteristics of SPI pins
VDD(CORE) = VDD(OSC_PLL) ; VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; VDDA(ADC5V0) = 3.0 V to 5.5 V;
Tvj = -40 °C to +85 °C; all voltages are measured with respect to ground; positive currents flow into the IC; unless otherwise
specified.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fSPI
SPI operating frequency
master operation
1⁄
65024fclk(SPI)
-
1⁄
2fclk(SPI)
MHz
slave operation
1⁄
65024fclk(SPI)
-
1⁄
4fclk(SPI)
MHz
Tamb = 25 °C;
measured in SPI
Master mode;
see Figure 26
-
11
-
tsu(SPI_MISO)
[1]
SPI_MISO set-up time
ns
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at Tamb = 85 °C ambient
temperature on wafer level. Cased products are tested at Tamb = 25 °C (final testing). Both pre-testing and final testing use correlated
test conditions to cover the specified temperature and power supply voltage range.
shifting edges
SCKn
sampling edges
SDOn
SDIn
tsu(SPI_MISO)
002aae695
Fig 26. SPI data input set-up time in SSP Master mode
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70 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
9.4 Dynamic characteristics: flash memory and EEPROM
Table 38. Flash characteristics
Tamb = -40 °C to +85 °C; VDD(CORE) = VDD(OSC_PLL); VDD(IO) = 2.7 V to 3.6 V;
VDDA(ADC3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to ground.
Symbol
Parameter
Nendu
endurance
Conditions
tret
retention time
Min
Typ
Max
Unit
10000
-
-
cycles
powered
10
-
-
years
unpowered
20
-
-
years
[1]
tprog
programming time
word
0.95
1
1.05
ms
ter
erase time
global
95
100
105
ms
sector
95
100
105
ms
tinit
initialization time
-
-
150
μs
twr(pg)
page write time
0.95
1
1.05
ms
tfl(BIST)
flash word BIST time
-
38
70
ns
ta(clk)
clock access time
-
-
63.4
ns
ta(A)
address access time
-
-
60.3
ns
[1]
Number of program/erase cycles.
Table 39. EEPROM characteristics
Tamb = -40 °C to +85 °C; VDD(CORE) = VDD(OSC_PLL); VDD(IO) = 2.7 V to 3.6 V;
VDDA(ADC3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to ground.
Symbol
Parameter
fclk
Nendu
tret
retention time
Conditions
Min
Typ
Max
Unit
clock frequency
200
375
400
kHz
endurance
100000
500000
-
cycles
10
-
-
years
powered
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9.5 Dynamic characteristics: external static memory
Table 40. External static memory interface dynamic characteristics
VDD(CORE) = VDD(OSC_PLL); VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to
ground.[1]
Symbol
Parameter
Min
Typ
Max Unit
TCLCL
clock cycle time
Conditions
8
-
100
ta(R)int
internal read access time
-
-
20.5 ns
ta(W)int
internal write access time
-
-
24.9 ns
ns
Read cycle parameters
tCSLAV
CS LOW to address valid
time
−5
−2.5
-
ns
tOELAV
OE LOW to address valid
time
−5 − WSTOEN × TCLCL
−2.5 − WSTOEN × TCLCL
-
ns
tCSLOEL
CS LOW to OE LOW time
-
0 + WSTOEN × TCLCL
-
ns
tsu(DQ)
data input /output set-up
time
11
16
22
ns
th(D)
data input hold time
0
2.5
5
ns
tCSHOEH
CS HIGH to OE HIGH time
-
0
-
ns
tBLSLBLSH BLS LOW to BLS HIGH time
-
(WST1 − WSTOEN +1) × TCLCL
ns
tOELOEH
OE LOW to OE HIGH time
-
(WST1 − WSTOEN +1) × TCLCL
ns
tBLSLAV
BLS LOW to address valid
time
-
0 + WSTOEN × TCLCL
-
ns
-
0
-
ns
-
(WSTWEN + 0.5) × TCLCL -
ns
-
WSTWEN × TCLCL
ns
Write cycle parameters
tCSHBLSH
CS HIGH to BLS HIGH time
tCSLWEL
CS LOW to WE LOW time
[2]
[3]
tCSLBLSL
CS LOW to BLS LOW time
tWELDV
WE LOW to data valid time
-
(WSTWEN + 0.5) × TCLCL -
ns
tCSLDV
CS LOW to data valid time
−0.5
−0.1
ns
tWELWEH
WE LOW to WE HIGH time
-
(WST2 − WSTWEN +1) × TCLCL
ns
-
(WST2 - WSTWEN +2) ×
TCLCL
ns
tBLSLBLSH BLS LOW to BLS HIGH time
[4]
0.3
-
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at Tamb = 85 °C ambient
temperature on wafer level. Cased products are tested at Tamb = 25 °C (final testing). Both pre-testing and final testing use correlated
test conditions to cover the specified temperature and power supply voltage range.
[2]
When the byte lane select signals are used to connect the write enable input (8 bit devices), tCSHBLSH = −0.5 × TCLCL.
[3]
When the byte lane select signals are used to connect the write enable input (8 bit devices), tCSLBLSL = tCSLWEL.
[4]
For 16 and 32 bit devices.
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tCSLAV
tCSHOEH
CS
A
tsu(DQ)
th(D)
D
tCSLOEL
tOELAV, tBLSLAV
tOELOEH, tBLSLBLSH
OE/BLS
002aae687
Fig 27. External memory read access
tCSLDV
tCSHBLSH
CS
tBLSLBLSH
BLS
tCSLBLSL
tCSLWEL
tWELWEH
WE
tWELDV
A
tCSLDV
D
002aae688
Fig 28. External memory write access
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
9.6 Dynamic characteristics: ADC
Table 41. ADC dynamic characteristics
VDD(CORE) = VDD(OSC_PLL); VDD(IO) = 2.7 V to 3.6 V; VDDA(ADC3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to
ground.[1]
Symbol
Parameter
Conditions
fi(ADC)
ADC input frequency
fs(max)
maximum sampling rate
tconv
Min
Typ
Max
Unit
4
-
4.5
MHz
resolution 2 bit
-
-
1500
ksample/s
[2]
conversion time
fi(ADC) = 4.5 MHz;
fs = fi(ADC)/(n + 1) with
n = resolution
resolution 10 bit
-
-
400
ksample/s
In number of ADC
clock cycles
3
-
11
cycles
In number of bits
2
-
10
bits
[1]
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at Tamb = 85 °C ambient
temperature on wafer level. Cased products are tested at Tamb = 25 °C (final testing). Both pre-testing and final testing use correlated
test conditions to cover the specified temperature and power supply voltage range.
[2]
Duty cycle clock should be as close as possible to 50 %.
10. Application information
10.1 Operating frequency selection
The LPC2917/2919/01 is specified to operate at a maximum frequency of 125 MHz,
maximum temperature of 85 °C, and maximum core voltage of 1.89 V. Figure 29 and
Figure 30 show that the user can achieve higher operating frequencies for the
LPC2917/2919/01 by controlling the temperature and the core voltage accordingly.
002aae194
145
core
frequency
(MHz)
135
VDD(CORE) = 1.95 V
VDD(CORE) = 1.8 V
125
VDD(CORE) = 1.65 V
115
105
25
45
65
85
temperature (°C)
Fig 29. Core operating frequency versus temperature for different core voltages
LPC2917_19_01_3
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
002aae193
145
core
frequency
(MHz)
135
25 °C
45 °C
65 °C
85 °C
125
115
105
1.65
1.75
1.85
1.95
core voltage (V)
Fig 30. Core operating frequency versus core voltage for different temperatures
10.2 SPI signal forms
SCKn (CPOL = 0)
SCKn (CPOL = 1)
SDOn
MSB OUT
DATA VALID
LSB OUT
SDIn
MSB IN
DATA VALID
LSB IN
CPHA = 1
SDOn
MSB OUT
DATA VALID
LSB OUT
SDIn
MSB IN
DATA VALID
LSB IN
CPHA = 0
002aae693
Fig 31. SPI timing in master mode
LPC2917_19_01_3
Product data sheet
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
SCKn (CPOL = 0)
SCKn (CPOL = 1)
SDIn
MSB IN
DATA VALID
LSB IN
SDOn
MSB OUT
DATA VALID
LSB OUT
CPHA = 1
SDIn
MSB IN
DATA VALID
LSB IN
SDOn
MSB OUT
DATA VALID
LSB OUT
CPHA = 0
002aae694
Fig 32. SPI timing in slave mode
LPC2917_19_01_3
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NXP Semiconductors
LPC2917/01; LPC2919/01
ARM9 microcontroller with CAN and LIN
10.3 XIN_OSC input
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave
mode, a minimum of 200 mVrms is needed. For more details see the LPC29xx User
manual UM10316.
LPC29xx
XIN_OSC
Ci
100 pF
Cg
002aae730
Fig 33. Slave mode operation of the on-chip oscillator
10.4 XIN_OSC Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1 and Cx2, and Cx3 in
case of third overtone crystal usage, have a common ground plane. The external
components must also be connected to the ground plain. Loops must be made as small
as possible, in order to keep the noise coupled in via the PCB as small as possible. Also
parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen
smaller accordingly to the increase in parasitics of the PCB layout.
LPC2917_19_01_3
Product data sheet
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Rev. 03 — 9 December 2009
77 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
11. Package outline
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
SOT486-1
c
y
X
A
73
72
108
109
ZE
e
E HE
A A2
(A 3)
A1
θ
wM
Lp
bp
L
pin 1 index
detail X
37
144
1
36
v M A
ZD
wM
bp
e
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
20.1
19.9
0.5
HD
HE
22.15 22.15
21.85 21.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.08
Z D(1) Z E(1)
1.4
1.1
1.4
1.1
θ
o
7
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT486-1
136E23
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-03-14
03-02-20
Fig 34. Package outline SOT486-1 (LQFP144)
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Rev. 03 — 9 December 2009
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
12. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
12.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
12.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
12.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
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Rev. 03 — 9 December 2009
79 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
12.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 35) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 42 and 43
Table 42.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
≥ 350
< 350
< 2.5
235
220
≥ 2.5
220
220
Table 43.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 35.
LPC2917_19_01_3
Product data sheet
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80 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 35. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
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LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
13. Abbreviations
Table 44.
Abbreviations list
Abbreviation
Description
AHB
Advanced High-performance Bus
AMBA
Advanced Microcontroller Bus Architecture
APB
ARM Peripheral Bus
BCL
Buffer Control List
BDL
Buffer Descriptor List
BEL
Buffer Entry List
BIST
Built-In Self Test
CCO
Current Controlled Oscillator
CISC
Complex Instruction Set Computers
DMA
Direct Memory Access
DSP
Digital Signal Processing
DTL
Device Transaction Level
ETB
Embedded Trace Buffer
ETM
Embedded Trace Macrocell
FIQ
Fast Interrupt reQuest
GPDMA
General Purpose DMA
IRQ
Interrupt Request
LIN
Local Interconnect Network
MAC
Media Access Control
PLL
Phase-Locked Loop
RISC
Reduced Instruction Set Computer
SFSP
SCU Function Select Port x,y (use without the P if there are no x,y)
SCL
Slot Control List
UART
Universal Asynchronous Receiver Transmitter
14. References
[1]
UM10316 — LPC29xx user manual
[2]
ARM — ARM web site
[3]
ARM-SSP — ARM primecell synchronous serial port (PL022) technical reference
manual
[4]
CAN — ISO 11898-1: 2002 road vehicles - Controller Area Network (CAN) - part 1:
data link layer and physical signalling
[5]
LIN — LIN specification package, revision 2.0
LPC2917_19_01_3
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82 of 86
NXP Semiconductors
LPC2917/01; LPC2919/01
ARM9 microcontroller with CAN and LIN
15. Revision history
Table 45.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LPC2917_19_01_3
20091209
Product data sheet
-
LPC2917_19_01_2
LPC2917_19_01_2
20090617
Preliminary data sheet
-
LPC2917_19_01_1
LPC2917_19_01_1
20090112
Preliminary data sheet
-
-
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
83 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
LPC2917_19_01_3
Product data sheet
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Rev. 03 — 9 December 2009
84 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
18. Contents
1
2
3
3.1
4
5
5.1
5.2
5.2.1
5.2.2
6
6.1
6.2
6.3
6.4
6.5
6.6
6.6.1
6.6.2
6.6.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
General description . . . . . . . . . . . . . . . . . . . . . 5
LQFP144 pin assignment . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . 11
Architectural overview . . . . . . . . . . . . . . . . . . 11
ARM968E-S processor . . . . . . . . . . . . . . . . . . 12
On-chip flash memory system . . . . . . . . . . . . 13
On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 13
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Reset, debug, test, and power description . . . 15
Reset and power-up behavior . . . . . . . . . . . . 15
Reset strategy . . . . . . . . . . . . . . . . . . . . . . . . 15
IEEE 1149.1 interface pins
(JTAG boundary-scan test). . . . . . . . . . . . . . . 15
6.6.3.1
ETM/ETB . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.6.4
Power supply pins . . . . . . . . . . . . . . . . . . . . . 16
6.7
Clocking strategy . . . . . . . . . . . . . . . . . . . . . . 16
6.7.1
Clock architecture . . . . . . . . . . . . . . . . . . . . . . 16
6.7.2
Base clock and branch clock relationship. . . . 18
6.8
Flash memory controller . . . . . . . . . . . . . . . . . 20
6.8.1
Functional description. . . . . . . . . . . . . . . . . . . 20
6.8.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 21
6.8.3
Clock description . . . . . . . . . . . . . . . . . . . . . . 21
6.8.4
Flash layout . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.8.5
Flash bridge wait-states . . . . . . . . . . . . . . . . . 22
6.8.6
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.9
External static memory controller . . . . . . . . . . 23
6.9.1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.9.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 24
6.9.3
Clock description . . . . . . . . . . . . . . . . . . . . . . 24
6.9.4
External memory timing diagrams . . . . . . . . . 24
6.10
DMA controller . . . . . . . . . . . . . . . . . . . . . . . . 26
6.10.1
DMA support for peripherals. . . . . . . . . . . . . . 26
6.10.2
Clock description . . . . . . . . . . . . . . . . . . . . . . 27
6.11
General subsystem. . . . . . . . . . . . . . . . . . . . . 27
6.11.1
General subsystem clock description . . . . . . . 27
6.11.2
Chip and feature identification . . . . . . . . . . . . 27
6.11.3
System Control Unit (SCU). . . . . . . . . . . . . . . 27
6.11.4
Event router . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6.11.4.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 28
6.12
6.12.1
6.12.2
6.12.2.1
6.12.2.2
6.12.3
6.12.3.1
6.12.3.2
6.12.4
6.12.4.1
6.12.4.2
6.12.5
6.12.5.1
6.12.5.2
6.12.5.3
6.12.6
6.12.6.1
6.12.6.2
6.12.6.3
6.13
6.13.1
6.13.1.1
6.13.1.2
6.13.2
6.13.2.1
6.13.3
6.13.3.1
6.14
6.14.1
6.14.2
6.14.3
6.14.4
6.14.4.1
6.14.4.2
6.14.4.3
6.14.5
6.14.5.1
6.14.5.2
6.14.5.3
6.14.5.4
6.14.5.5
6.14.6
6.14.6.1
6.14.6.2
6.14.7
6.14.7.1
6.14.7.2
Peripheral subsystem . . . . . . . . . . . . . . . . . .
Peripheral subsystem clock description. . . . .
Watchdog timer . . . . . . . . . . . . . . . . . . . . . . .
Functional description . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
Serial peripheral interface (SPI). . . . . . . . . . .
Functional description . . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
General-purpose I/O . . . . . . . . . . . . . . . . . . .
Functional description . . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
Networking subsystem. . . . . . . . . . . . . . . . . .
CAN gateway . . . . . . . . . . . . . . . . . . . . . . . . .
Global acceptance filter . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
LIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
I2C-bus serial I/O controllers . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Modulation and sampling control
subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional description . . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
Analog-to-digital converter . . . . . . . . . . . . . . .
Functional description . . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
Pulse Width Modulator (PWM). . . . . . . . . . . .
Functional description . . . . . . . . . . . . . . . . . .
Synchronizing the PWM counters . . . . . . . . .
Master and slave mode . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
Timers in the MSCSS. . . . . . . . . . . . . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
Quadrature Encoder Interface (QEI) . . . . . . .
Pin description . . . . . . . . . . . . . . . . . . . . . . . .
Clock description . . . . . . . . . . . . . . . . . . . . . .
28
28
28
29
29
29
30
30
31
31
31
31
32
32
33
33
33
33
34
34
34
34
34
35
35
35
36
36
36
39
39
39
40
40
41
41
42
43
43
43
44
44
44
44
44
45
45
continued >>
LPC2917_19_01_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 9 December 2009
85 of 86
LPC2917/01; LPC2919/01
NXP Semiconductors
ARM9 microcontroller with CAN and LIN
6.15
Power, clock and reset control subsystem . . .
6.15.1
Clock description . . . . . . . . . . . . . . . . . . . . . .
6.15.2
Clock Generation Unit (CGU0) . . . . . . . . . . . .
6.15.2.1 Functional description. . . . . . . . . . . . . . . . . . .
6.15.2.2 PLL functional description . . . . . . . . . . . . . . .
6.15.2.3 Pin description . . . . . . . . . . . . . . . . . . . . . . . .
6.15.3
Clock generation for CLK_OUT (CGU1). . . . .
6.15.3.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . .
6.15.4
Reset Generation Unit (RGU). . . . . . . . . . . . .
6.15.4.1 Functional description. . . . . . . . . . . . . . . . . . .
6.15.4.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . .
6.15.5
Power Management Unit (PMU). . . . . . . . . . .
6.15.5.1 Functional description. . . . . . . . . . . . . . . . . . .
6.16
Vectored Interrupt Controller (VIC) . . . . . . . . .
6.16.1
Functional description. . . . . . . . . . . . . . . . . . .
6.16.2
Clock description . . . . . . . . . . . . . . . . . . . . . .
7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . .
8
Static characteristics. . . . . . . . . . . . . . . . . . . .
8.1
Power consumption . . . . . . . . . . . . . . . . . . . .
8.2
Electrical pin characteristics . . . . . . . . . . . . . .
9
Dynamic characteristics . . . . . . . . . . . . . . . . .
9.1
Dynamic characteristics:
I/O pins, internal clock, oscillators,
PLL, and CAN. . . . . . . . . . . . . . . . . . . . . . . . .
9.2
Dynamic characteristics: I2C-bus interface. . .
9.3
Dynamic characteristics: SPI . . . . . . . . . . . . .
9.4
Dynamic characteristics: flash memory and
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.5
Dynamic characteristics: external static
memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.6
Dynamic characteristics: ADC . . . . . . . . . . . .
10
Application information. . . . . . . . . . . . . . . . . .
10.1
Operating frequency selection . . . . . . . . . . . .
10.2
SPI signal forms . . . . . . . . . . . . . . . . . . . . . . .
10.3
XIN_OSC input . . . . . . . . . . . . . . . . . . . . . . . .
10.4
XIN_OSC Printed Circuit Board
(PCB) layout guidelines . . . . . . . . . . . . . . . . .
11
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
12
Soldering of SMD packages . . . . . . . . . . . . . .
12.1
Introduction to soldering . . . . . . . . . . . . . . . . .
12.2
Wave and reflow soldering . . . . . . . . . . . . . . .
12.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . .
12.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . .
13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .
14
References . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
16
Legal information. . . . . . . . . . . . . . . . . . . . . . .
16.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
45
46
47
47
50
51
52
52
52
53
53
54
54
56
56
57
58
60
64
66
68
16.2
16.3
16.4
17
18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
84
84
84
84
85
68
70
70
71
72
74
74
74
75
77
77
78
79
79
79
79
80
82
82
83
84
84
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 9 December 2009
Document identifier: LPC2917_19_01_3
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