Data Sheet

LPC3141/3143
Low-cost, low-power ARM926EJ microcontrollers with USB
High-speed OTG, SD/MMC, and NAND flash controller
Rev. 1 — 4 June 2012
Product data sheet
1. General description
The NXP LPC3141/3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB
2.0 OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, four
channel 10-bit A/D, and a myriad of serial and parallel interfaces in a single chip targeted
at consumer, industrial, medical, and communication markets. To optimize system power
consumption, the LPC3141/3143 have multiple power domains and a very flexible Clock
Generation Unit (CGU) that provides dynamic clock gating and scaling.
2. Features and benefits
2.1 Key features
 CPU platform
 270 MHz, 32-bit ARM926EJ-S
 16 kB D-cache and 16 kB I-cache
 Memory Management Unit (MMU)
 Internal memory
 192 kB embedded SRAM
 External memory interface
 NAND flash controller with 8-bit ECC and AES decryption support (LPC3143 only)
 8/16-bit Multi-Port Memory Controller (MPMC): SDRAM and SRAM
 Security
 AES decryption engine (LPC3143 only)
 Secure one-time programmable memory for AES key storage and customer use
 128 bit unique ID per device for DRM schemes
 Communication and connectivity
 High-speed USB 2.0 (OTG, Host, Device) with on-chip PHY
 Two I2S interfaces
 Integrated master/slave SPI
 Two master/slave I2C-bus interfaces
 Fast UART
 Memory Card Interface (MCI): MMC/SD/SDIO/CE-ATA
 Four-channel 10-bit ADC
 Integrated 4/8/16-bit 6800/8080 compatible LCD interface
 System functions
 Dynamic clock gating and scaling
 Multiple power domains
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
 Selectable boot-up: SPI flash, NAND flash, SD/MMC cards, UART, or USB
 On the LPC3143 only: secure booting using an AES decryption engine from SPI
flash, NAND flash, SD/MMC cards, UART, or USB.
 DMA controller
 Four 32-bit timers
 Watchdog timer
 PWM module
 Master/slave PCM interface
 Random Number Generator (RNG)
 General Purpose I/O pins (GPIO)
 Flexible and versatile interrupt structure
 JTAG interface with boundary scan and ARM debug access
 Operating voltage and temperature
 Core voltage: 1.2 V
 I/O voltages: 1.8 V, 3.3 V
 Temperature: 40 C to +85 C
 TFBGA180 package: 12 x 12 mm, 0.8 mm pitch
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC3141FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12  12  0.8 mm SOT570-3
LPC3143FET180 TFBGA180 Plastic thin fine pitch ball grid array package, 180 balls, body 12  12  0.8 mm SOT570-3
3.1 Ordering options
Table 2.
Ordering options for LPC3141/3143
Type number
Core/bus Total
frequency SRAM
Security High-speed USB
engine
AES
10-bit
I2S/
ADC
I2C
channels
LPC3141FET180
270/
90 MHz
192 kB
no
Device/
Host/OTG
4
2 each yes
40 C to +85 C
LPC3143FET180
270/
90 MHz
192 kB
yes
Device/
Host/OTG
4
2 each yes
40 C to +85 C
LPC3141_43
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 June 2012
MCI
Temperature
SDHC/ range
SDIO/
CE-ATA
© NXP B.V. 2012. All rights reserved.
2 of 69
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
4. Block diagram
JTAG
interface
LPC3141/3143
ARM926EJ-S
INSTRUCTION
CACHE 16 kB
DATA
CACHE 16 kB
TEST/DEBUG
INTERFACE
master
master
DMA
CONTROLLER
USB 2.0
HIGH-SPEED
OTG
master
slave
master
slave
slave
INTERRUPT
CONTROLLER
ROM
slave
slave
96 kB ISRAM0
MPMC
slave
slave
MULTI-LAYER AHB MATRIX
96 kB ISRAM1
slave NAND CONTROLLER AES(1)
slave
MCI
SD/SDIO
BUFFER
slave
AHB TO
APB
BRIDGE 0/
ASYNC
APB slave group 0
slave
AHB TO
APB
BRIDGE 1/
ASYNC
slave
AHB TO
APB
BRIDGE 2/
ASYNC
slave
AHB TO
APB
BRIDGE 3/
ASYNC
slave
AHB TO
APB
BRIDGE 4/
SYNC
APB slave group 4
WDT
NAND REGISTERS
SYSTEM CONTROL
DMA REGISTERS
APB slave group 3
CGU
I2S0
IOCONFIG
I2S1
10-bit ADC
APB slave group 2
EVENT ROUTER
UART
RNG
LCD
OTP
SPI
APB slave group 1
TIMER 0/1/2/3
PCM
PWM
I2C0
(1)LPC3143 only
I2C1
002aae081
Fig 1.
LPC3141/3143 block diagram
LPC3141_43
Product data sheet
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Rev. 1 — 4 June 2012
© NXP B.V. 2012. All rights reserved.
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LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
5. Pinning information
5.1 Pinning
ball A1
index area
LPC3141/3143
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
002aae082
Transparent top view
Fig 2.
Table 3.
LPC3141/3143 pinning TFBGA180 package
Pin allocation table
Pin Symbol
Pin Symbol
Pin Symbol
Pin Symbol
Row A
1
EBI_D_10
2
EBI_A_1_CLE
3
EBI_D_9
4
mGPIO10
5
mGPIO7
6
mGPIO6
7
SPI_CS_OUT0
8
SPI_SCK
9
VPP
10
FFAST_IN
11
VSSI
12
ADC10B_GNDA
13
ADC10B_VDDA33
14
ADC10B_GPA1
-
-
-
-
Row B
1
EBI_D_8
2
VDDE_IOA
3
EBI_A_0_ALE
4
mNAND_RYBN2
5
mGPIO8
6
mGPIO5
7
SPI_MOSI
8
SPI_CS_IN
9
PWM_DATA
10
FFAST_OUT
11
GPIO3
12
VSSE_IOC
13
ADC10B_GPA2
14
ADC10B_GPA0
-
-
-
-
Row C
1
EBI_D_7
2
EBI_D_11
3
VSSE_IOA
4
VSSE_IOA
5
mGPIO9
6
VDDI
7
VSSI
8
SPI_MISO
9
VPP
10
I2C_SDA0
11
GPIO4
12
VDDI
13
VDDE_IOC
14
ADC10B_GPA3
-
-
-
-
2
EBI_D_6
3
EBI_D_13
4
mNAND_RYBN3
Row D
1
EBI_D_5
5
VDDE_IOC
6
VSSE_IOC
7
VDDE_IOC
8
VSSE_IOC
9
VSSE_IOC
10
I2C_SCL0
11
VDDA12
12
VSSI
13
BUF_TCK
14
BUF_TMS
-
-
-
-
LPC3141_43
Product data sheet
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Rev. 1 — 4 June 2012
© NXP B.V. 2012. All rights reserved.
4 of 69
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
Table 3.
Pin allocation table …continued
Pin Symbol
Pin Symbol
Pin Symbol
Pin Symbol
Row E
1
EBI_D_3
2
EBI_D_4
3
EBI_D_14
4
VSSE_IOA
5
VDDE_IOA
6
mNAND_RYBN0
7
mNAND_RYBN1
8
VDDE_IOC
9
VSSA12
10
VDDA12
11
ARM_TDO
12
I2C_SDA1
13
I2C_SCL1
14
I2STX_BCK1
-
-
-
-
EBI_D_2
2
EBI_D_1
3
EBI_D_15
4
VSSE_IOA
5
VDDE_IOA
10
SCAN_TDO
11
BUF_TRST_N
12
I2STX_DATA1
13
I2SRX_WS1
14
I2SRX_BCK1
-
-
-
-
2
EBI_D_0
3
EBI_D_12
4
VSSI
Row F
1
Row G
1
EBI_NCAS_BLOUT_0
5
VDDE_IOA
10
I2STX_WS1
11
VSSE_IOC
12
VDDE_IOC
13
SYSCLK_O
14
I2SRX_DATA1
-
-
-
-
EBI_DQM_0_NOE
2
EBI_NRAS_BLOUT_1
3
VDDI
4
VSSE_IOA
5
VDDE_IOA
10
GPIO12
11
GPIO19
12
CLK_256FS_O
13
GPIO11
14
RSTIN_N
-
-
-
-
2
EBI_NWE
3
NAND_NCS_1
4
CLOCK_OUT
Row H
1
Row J
1
NAND_NCS_0
5
USB_RREF
10
GPIO1
11
GPIO16
12
GPIO13
13
GPIO15
14
GPIO14
-
-
-
-
Row K
1
NAND_NCS_2
2
NAND_NCS_3
3
VSSE_IOA
4
USB_VSSA_REF
5
mLCD_DB_12
6
mLCD_DB_6
7
mLCD_DB_10
8
mLCD_CSB
9
TDI
10
GPIO0
11
VDDE_IOC
12
GPIO17
13
GPIO20
14
GPIO18
-
-
-
-
Row L
1
USB_VDDA12_PLL
2
USB_VBUS
3
USB_VSSA_TERM
4
VDDE_IOB
5
mLCD_DB_9
6
VSSI
7
VDDI
8
mLCD_E_RD
9
VSSE_IOC
10
VDDE_IOC
11
VSSI
12
VDDI
13
VSSE_IOC
14
GPIO2
-
-
-
-
Row M
1
USB_ID
2
USB_VDDA33_DRV
3
VSSE_IOB
4
VSSE_IOB
5
VDDE_IOB
6
VSSE_IOB
7
VDDE_IOB
8
VSSE_IOB
9
VDDE_IOB
10
I2SRX_DATA0
11
mI2STX_WS0
12
mI2STX_BCK0
13
mI2STX_DATA0
14
TCK
-
-
-
-
Row N
1
USB_GNDA
2
USB_DM
3
mLCD_DB_15
4
mLCD_DB_11
5
mLCD_DB_8
6
mLCD_DB_2
7
mLCD_DB_4
8
mLCD_DB_0
9
mLCD_RW_WR
10
I2SRX_BCK0
11
JTAGSEL
12
UART_TXD
13
mUART_CTS_N
14
mI2STX_CLK0
-
-
-
-
LPC3141_43
Product data sheet
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Rev. 1 — 4 June 2012
© NXP B.V. 2012. All rights reserved.
5 of 69
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
Table 3.
Pin allocation table …continued
Pin Symbol
Pin Symbol
Pin Symbol
Pin Symbol
Row P
1
USB_VDDA33
2
USB_DP
3
mLCD_DB_14
4
mLCD_DB_13
5
mLCD_DB_7
6
mLCD_DB_3
7
mLCD_DB_5
8
mLCD_RS
9
mLCD_DB_1
10
TMS
11
I2SRX_WS0
12
UART_RXD
13
TRST_N
14
mUART_RTS_N
-
-
-
-
Table 4.
Pin description
Pin names with prefix m are multiplexed pins. See Table 10 for pin function selection of multiplexed pins.
Pin name
BGA Digital Application
Ball I/O
function
level
[1]
Pin
Cell type Description
[3]
state
after
reset[2]
Clock Generation Unit (CGU)
FFAST_IN
A10
SUP1
AI
-
AIO2
12 MHz oscillator clock input.
FFAST_OUT
B10
SUP1
AO
-
AIO2
12 MHz oscillator clock output.
VDDA12
D11;
E10
SUP1
Supply
-
PS3
12 MHz oscillator/PLLs analog supply.
VSSA12
E9
-
Ground
-
CG1
12 MHz oscillator/PLLs analog ground.
RSTIN_N
H14
SUP3
DI
I:PU
DIO2
System Reset Input (active LOW).
CLK_256FS_O
H12
SUP3
DO
O
DIO1
Programmable clock output; fractionally
derived from CLK1024FS_BASE clock
domain. Generally used for external audio
codec master clock.
CLOCK_OUT
J4
SUP4
DO
O
DIO4
Programmable clock output; fractionally
derived from SYS_BASE clock domain.
SYSCLK_O[4]
G13
SUP3
DO
O
DIO1
Programmable clock output. Output one of
seven base/reference input clocks. No
fractional divider.
ADC10B_VDDA33
A13
SUP3
Supply
-
PS3
10-bit ADC analog supply.
ADC10B_GNDA
A12
-
Ground
-
CG1
10-bit ADC analog ground.
ADC10B_GPA0
B14
SUP3
AI
-
AIO1
10-bit ADC analog input.
ADC10B_GPA1
A14
SUP3
AI
-
AIO1
10-bit ADC analog input.
ADC10B_GPA2
B13
SUP3
AI
-
AIO1
10-bit ADC analog input.
ADC10B_GPA3
C14
SUP3
AI
-
AIO1
10-bit ADC analog input.
10-bit ADC
USB HS 2.0 OTG
USB_VBUS
L2
SUP5
AI
-
AIO3
USB supply detection line.
USB_ID
M1
SUP3
AI
-
AIO1
Indicates to the USB transceiver whether in
device (USB_ID HIGH) or host (USB_ID
LOW) mode (contains internal pull-up
resistor).
USB_RREF
J5
SUP3
AIO
-
AIO1
USB connection for external reference
resistor (12 k  1) to analog ground
supply.
USB_DP
P2
SUP3
AIO
-
AIO1
USB D+ connection with integrated 45 
termination resistor.
LPC3141_43
Product data sheet
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Rev. 1 — 4 June 2012
© NXP B.V. 2012. All rights reserved.
6 of 69
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
Table 4.
Pin description …continued
Pin names with prefix m are multiplexed pins. See Table 10 for pin function selection of multiplexed pins.
Pin name
BGA Digital Application
Ball I/O
function
level
[1]
Pin
Cell type Description
[3]
state
after
reset[2]
USB_DM
N2
SUP3
AIO
-
AIO1
USB D connection with integrated 45 
termination resistor.
USB_VDDA12_PLL
L1
SUP1
Supply
-
PS3
USB PLL supply.
USB_VDDA33_DRV
M2
SUP3
Supply
-
PS3
USB analog supply for driver.
USB_VDDA33
P1
SUP3
Supply
-
PS3
USB analog supply for PHY.
USB_VSSA_TERM
L3
-
Ground
-
CG1
USB analog ground for clean reference for
on chip termination resistors.
USB_GNDA
N1
-
Ground
-
CG1
USB analog ground.
USB_VSSA_REF
K4
-
Ground
-
CG1
USB analog ground for clean reference.
JTAGSEL
N11
SUP3
DI
I:PD
DIO1
JTAG selection. Controls output function of
SCAN_TDO and ARM_TDO signals. Must
be LOW during power-on reset.
TDI
K9
SUP3
DI
I:PU
DIO1
JTAG data input.
TRST_N
P13
SUP3
DI
I:PD
DIO1
JTAG TAP Controller Reset Input. Must be
LOW during power-on reset.
TCK
M14
SUP3
DI
I:PD
DIO1
JTAG clock input.
TMS
P10
SUP3
DI
I:PU
DIO1
JTAG mode select input.
SCAN_TDO
F10
SUP3
DO
O/Z
DIO1
JTAG TDO signal from scan TAP controller.
Pin state is controlled by JTAGSEL.
ARM_TDO
E11
SUP3
DO
O
DIO1
JTAG TPO signal from ARM926 TAP
controller.
BUF_TRST_N
F11
SUP3
DO
O
DIO1
Buffered TRST_N out signal. Used for
connecting an on board TAP controller
(FPGA, DSP, etc.).
BUF_TCK
D13
SUP3
DO
O
DIO1
Buffered TCK out signal. Used for connecting
an on board TAP controller (FPGA, DSP,
etc.).
BUF_TMS
D14
SUP3
DO
O
DIO1
Buffered TMS out signal. Used for
connecting an on board TAP controller
(FPGA, DSP, etc.).
mUART_CTS_N[4][5]
N13
SUP3
DI/GPIO
I
DIO1
UART clear to send (active LOW).
mUART_RTS_N[4][5]
P14
SUP3
DO/GPIO
O
DIO1
UART ready to send (active LOW).
UART_RXD[4]
P12
SUP3
DI/GPIO
I
DIO1
UART serial input.
UART_TXD[4]
N12
SUP3
DO/GPIO
O
DIO1
UART serial output.
JTAG
UART
I2C-bus master/slave interface
I2C_SDA0
C10
SUP3
DIO
I
IICD
I2C0-bus serial data line.
I2C_SCL0
D10
SUP3
DIO
I
IICC
I2C0-bus serial clock line.
I2C_SDA1[4]
E12
SUP3
DIO
O
DIO1
I2C1-bus serial data line.
I2C_SCL1[4]
E13
SUP3
DIO
O
DIO1
I2C1-bus serial clock line.
LPC3141_43
Product data sheet
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Rev. 1 — 4 June 2012
© NXP B.V. 2012. All rights reserved.
7 of 69
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
Table 4.
Pin description …continued
Pin names with prefix m are multiplexed pins. See Table 10 for pin function selection of multiplexed pins.
Pin name
BGA Digital Application
Ball I/O
function
level
[1]
Pin
Cell type Description
[3]
state
after
reset[2]
Serial Peripheral Interface (SPI)
SPI_CS_OUT0[4]
A7
SUP3
DO
O
DIO4
SPI chip select output (master).
SPI_SCK[4]
A8
SUP3
DIO
I
DIO4
SPI clock input (slave)/clock output (master).
SPI_MISO[4]
C8
SUP3
DIO
I
DIO4
SPI data input (master)/data output (slave).
SPI_MOSI[4]
B7
SUP3
DIO
I
DIO4
SPI data output (master)/data input (slave).
SPI_CS_IN[4]
B8
SUP3
DI
I
DIO4
SPI chip select input (slave).
VDDI
H3;
L7;
L12;
C12;
C6
SUP1
Supply
-
CS2
Digital core supply.
VSSI
A11;
C7;
D12;
G4;
L6;
L11
Ground
-
CG2
Digital core ground.
Digital power supply
Peripheral power supply
VDDE_IOA
B2;
E5;
F5;
G5;
H5
SUP4
Supply
-
PS1
Peripheral supply for NAND flash interface.
VDDE_IOB
L4;
M5;
M7;
M9
SUP8
Supply
-
PS1
Peripheral supply for SDRAM/LCD.
VDDE_IOC
C13; SUP3
D5;
D7;
E8;
G12;
L10;
K11
Supply
-
PS1
Peripheral supply.
VSSE_IOA
C3;
C4;
E4;
F4;
H4;
K3
-
Ground
-
PG1
-
VSSE_IOB
M3;
M4;
M6;
M8
-
Ground
-
PG1
-
LPC3141_43
Product data sheet
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Rev. 1 — 4 June 2012
© NXP B.V. 2012. All rights reserved.
8 of 69
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
Table 4.
Pin description …continued
Pin names with prefix m are multiplexed pins. See Table 10 for pin function selection of multiplexed pins.
Pin name
BGA Digital Application
Ball I/O
function
level
[1]
VSSE_IOC
Pin
Cell type Description
[3]
state
after
reset[2]
B12;
D6;
D8;
D9;
G11;
L9;
L13
-
Ground
-
PG1
-
mLCD_CSB[4]
K8
SUP8
DO
O
DIO4
LCD chip select (active LOW).
mLCD_E_RD[4]
L8
SUP8
DO
O
DIO4
LCD 6800 enable or 8080 read enable
(active HIGH).
mLCD_RS[4]
P8
SUP8
DO
O
DIO4
LCD instruction register (LOW)/data register
(HIGH) select.
mLCD_RW_WR[4]
N9
SUP8
DO
O
DIO4
LCD 6800 read/write select or 8080 write
enable (active HIGH).
mLCD_DB_0[4]
N8
SUP8
DIO
O
DIO4
LCD data 0.
mLCD_DB_1[4]
P9
SUP8
DIO
O
DIO4
LCD data 1.
mLCD_DB_2[4]
N6
SUP8
DIO
O
DIO4
LCD data 2.
mLCD_DB_3[4]
P6
SUP8
DIO
O
DIO4
LCD data 3.
mLCD_DB_4[4]
N7
SUP8
DIO
O
DIO4
LCD data 4.
mLCD_DB_5[4]
P7
SUP8
DIO
O
DIO4
LCD data 5.
mLCD_DB_6[4]
K6
SUP8
DIO
O
DIO4
LCD data 6.
mLCD_DB_7[4]
P5
SUP8
DIO
O
DIO4
LCD data 7.
mLCD_DB_8[4]
N5
SUP8
DIO
O
DIO4
LCD data 8/8-bit data 0.
mLCD_DB_9[4]
L5
SUP8
DIO
O
DIO4
LCD data 9/8-bit data 1.
mLCD_DB_10[4]
K7
SUP8
DIO
O
DIO4
LCD data 10/8-bit data 2.
mLCD_DB_11[4]
N4
SUP8
DIO
O
DIO4
LCD data 11/8-bit data 3.
mLCD_DB_12[4]
K5
SUP8
DIO
O
DIO4
LCD data 12/8-bit data 4/4-bit data 0.
mLCD_DB_13[4]
P4
SUP8
DIO
O
DIO4
LCD data 13/8-bit data 5/4-bit data 1/serial
clock output.
mLCD_DB_14[4]
P3
SUP8
DIO
O
DIO4
LCD data 14/8-bit data 6/4-bit data 2/serial
data input.
mLCD_DB_15[4]
N3
SUP8
DIO
O
DIO4
LCD data 15/8-bit data 7/4-bit data 3/serial
data output.
I2SRX_DATA0[4]
M10
SUP3
DI/GPIO
I
DIO1
I2S serial data receive input.
I2SRX_DATA1[4]
G14
SUP3
DI/GPIO
I
DIO1
I2S serial data receive input.
I2SRX_BCK0[4]
N10
SUP3
DIO/GPIO
I
DIO1
I2S bit clock.
I2SRX_BCK1[4]
F14
SUP3
DIO/GPIO
I
DIO1
I2S bit clock.
I2SRX_WS0[4]
P11
SUP3
DIO/GPIO
I
DIO1
I2S word select.
I2SRX_WS1[4]
F13
SUP3
DIO/GPIO
I
DIO1
I2S word select.
LCD interface
I2S/digital audio input
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NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
Table 4.
Pin description …continued
Pin names with prefix m are multiplexed pins. See Table 10 for pin function selection of multiplexed pins.
Pin name
BGA Digital Application
Ball I/O
function
level
[1]
Pin
Cell type Description
[3]
state
after
reset[2]
I2S/digital audio output
mI2STX_DATA0[4]
M13
SUP3
DO/GPIO
O
DIO1
I2S serial data transmit output.
mI2STX_BCK0[4]
M12
SUP3
DO/GPIO
O
DIO1
I2S bit clock.
mI2STX_WS0[4]
M11
SUP3
DO/GPIO
O
DIO1
I2S word select.
mI2STX_CLK0[4]
N14
SUP3
DO/GPIO
O
DIO1
I2S serial clock.
I2STX_DATA1[4]
F12
SUP3
DO/GPIO
O
DIO1
I2S serial data transmit output.
I2STX_BCK1[4]
E14
SUP3
DO/GPIO
O
DIO1
I2S bit clock.
I2STX_WS1[4]
G10
SUP3
DO/GPIO
O
DIO1
I2S word select.
General Purpose IO (GPIO)
GPIO0[7]
K10
SUP3
GPIO
I:PD
DIO1
General Purpose IO pin 0 (mode pin 0).
GPIO1[7]
J10
SUP3
GPIO
I:PD
DIO1
General Purpose IO pin 1 (mode pin 1).
GPIO2[7]
L14
SUP3
GPIO
I
DIO1
General Purpose IO pin 2 (mode pin 2).
GPIO3
B11
SUP3
GPIO
I
DIO1
General Purpose IO pin 3.
GPIO4
C11
SUP3
GPI
I
DIO1
General Purpose input pin 4.
mGPIO5[4]
B6
SUP3
GPIO
I
DIO4
General Purpose IO pin 5.
mGPIO6[4]
A6
SUP3
GPIO
I
DIO4
General Purpose IO pin 6.
mGPIO7[4]
A5
SUP3
GPIO
I
DIO4
General Purpose IO pin 7.
mGPIO8[4]
B5
SUP3
GPIO
I
DIO4
General Purpose IO pin 8.
mGPIO9[4]
C5
SUP3
GPIO
I
DIO4
General Purpose IO pin 9.
mGPIO10[4]
A4
SUP3
GPIO
I
DIO4
General Purpose IO pin 10.
GPIO11
H13
SUP3
GPIO
I
DIO1
General Purpose IO pin 11.
GPIO12
H10
SUP3
GPIO
I
DIO1
General Purpose IO pin 12.
GPIO13
J12
SUP3
GPIO
I
DIO1
General Purpose IO pin 13.
GPIO14
J14
SUP3
GPIO
I
DIO1
General Purpose IO pin 14.
GPIO15
J13
SUP3
GPIO
I
DIO1
General Purpose IO pin 15.
GPIO16
J11
SUP3
GPIO
I
DIO1
General Purpose IO pin 16.
GPIO17
K12
SUP3
GPIO
I
DIO1
General Purpose IO pin 17.
GPIO18
K14
SUP3
GPIO
I
DIO1
General Purpose IO pin 18.
GPIO19
H11
SUP3
GPIO
I
DIO1
General Purpose IO pin 19.
GPIO20
K13
SUP3
GPIO
I
DIO1
General Purpose IO pin 20.
External Bus Interface (EBI)/NAND flash controller
EBI_A_0_ALE[4]
B3
SUP4
DO
O
DIO4
EBI address latch enable.
EBI_A_1_CLE[4]
A2
SUP4
DO
O
DIO4
EBI command latch enable.
EBI_D_0[4]
G2
SUP4
DIO
I
DIO4
EBI data I/O 0.
EBI_D_1[4]
F2
SUP4
DIO
I
DIO4
EBI data I/O 1.
EBI_D_2[4]
F1
SUP4
DIO
I
DIO4
EBI data I/O 2.
EBI_D_3[4]
E1
SUP4
DIO
I
DIO4
EBI data I/O 3.
EBI_D_4[4]
E2
SUP4
DIO
I
DIO4
EBI data I/O 4.
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Low-cost, low-power ARM926EJ microcontrollers
Table 4.
Pin description …continued
Pin names with prefix m are multiplexed pins. See Table 10 for pin function selection of multiplexed pins.
Pin name
BGA Digital Application
Ball I/O
function
level
[1]
Pin
Cell type Description
[3]
state
after
reset[2]
EBI_D_5[4]
D1
SUP4
DIO
I
DIO4
EBI data I/O 5.
EBI_D_6[4]
D2
SUP4
DIO
I
DIO4
EBI data I/O 6.
EBI_D_7[4]
C1
SUP4
DIO
I
DIO4
EBI data I/O 7.
EBI_D_8[4]
B1
SUP4
DIO
I
DIO4
EBI data I/O 8.
EBI_D_9[4]
A3
SUP4
DIO
I
DIO4
EBI data I/O 9.
EBI_D_10[4]
A1
SUP4
DIO
I
DIO4
EBI data I/O 10.
EBI_D_11[4]
C2
SUP4
DIO
I
DIO4
EBI data I/O 11.
EBI_D_12[4]
G3
SUP4
DIO
I
DIO4
EBI data I/O 12.
EBI_D_13[4]
D3
SUP4
DIO
I
DIO4
EBI data I/O 13.
EBI_D_14[4]
E3
SUP4
DIO
I
DIO4
EBI data I/O 14.
EBI_D_15[4]
F3
SUP4
DIO
I
DIO4
EBI data I/O 15.
EBI_DQM_0_NOE[4]
H1
SUP4
DO
O
DIO4
NAND read enable (active LOW).
EBI_NWE[4]
J2
SUP4
DO
O
DIO4
NAND write enable (active LOW).
NAND_NCS_0[4]
J1
SUP4
DO
O
DIO4
NAND chip enable 0.
NAND_NCS_1[4]
J3
SUP4
DO
O
DIO4
NAND chip enable 1.
NAND_NCS_2[4]
K1
SUP4
DO
O
DIO4
NAND chip enable 2.
NAND_NCS_3[4]
K2
SUP4
DO
O
DIO4
NAND chip enable 3.
mNAND_RYBN0[4]
E6
SUP4
DI
I
DIO4
NAND ready/busy 0.
mNAND_RYBN1[4]
E7
SUP4
DI
I
DIO4
NAND ready/busy 1.
mNAND_RYBN2[4]
B4
SUP4
DI
I
DIO4
NAND ready/busy 2.
mNAND_RYBN3[4]
D4
SUP4
DI
I
DIO4
NAND ready/busy 3.
EBI_NCAS_BLOUT_0[4]
G1
SUP4
DO
O
DIO4
EBI lower lane byte select (7:0).
EBI_NRAS_BLOUT_1[4]
H2
SUP4
DO
O
DIO4
EBI upper lane byte select (15:8).
Secure one-time programmable memory
VPP[6]
A9;
C9
SUP1/
SUP3
Supply
-
PS3
Supply for polyfuse programming.
SUP3
DO/GPIO
O
DIO1
PWM output.
Pulse Width Modulation (PWM)
PWM_DATA[4]
B9
[1]
Digital IO levels are explained in Table 5.
[2]
I = input; I:PU = input with internal weak pull-up; I:PD = input with internal weak pull-down; O = output.
[3]
Cell types are explained in Table 6.
[4]
Pin can be configured as GPIO pin in the IOCONFIG block.
[5]
The UART flow control lines (mUART_CTS_N and mUART_RTS_N) are multiplexed. This means that if these balls are not required for
UART flow control, they can be selected to be used for alternative functions: SPI chip select signals (SPI_CS_OUT1 and
SPI_CS_OUT2).
[6]
The polyfuses get unintentionally burned at random if VPP is powered to 2.3 V or greater before the VDDI is powered up to minimum
nominal voltage. This will destroy the sample because randomly blowing security fuses will lock the sample and also can corrupt the
AES key. For this reason it is recommended that VPP be powered by SUP1 at power on.
[7]
To ensure that GPIO0, GPIO1 and GPIO2 pins come up as inputs, pins TRST_N and JTAGSEL must be LOW at power-on reset, see
UM10362 JTAG chapter for details.
LPC3141_43
Product data sheet
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Rev. 1 — 4 June 2012
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Low-cost, low-power ARM926EJ microcontrollers
Table 5.
Supply domains
Supply
domain
Voltage range
Related supply pins
SUP1
1.0 V to 1.3 V
VDDI, VDDA12, USB_VDDA12_PLL, Digital core supply
VPP (OTP read)
SUP3
2.7 V to 3.6 V
VDDE_IOC, ADC10B_VDDA33,
Peripheral supply
USB_VDDA33_DRV, USB_VDDA33,
VPP (during OTP write)
SUP4
1.65 V to 1.95 V (in 1.8 V
mode)
2.5 V to 3.6 V (in 3.3 V mode)
VDDE_IOA
Peripheral supply for NAND flash
interface
SUP5
4.5 V to 5.5 V
USB_VBUS
USB VBUS voltage
SUP8
1.65 V to 1.95 V (in 1.8 V
mode)
2.5 V to 3.6 V (in 3.3 V mode)
VDDE_IOB
Peripheral supply for
SDRAM/SRAM/bus-based LCD [1]
[1]
Description
When the SDRAM is used, the supply voltage of the NAND flash, SDRAM, and the LCD interface must be the same, i.e. SUP4 and
SUP8 should be connected to the same rail. (See also Section 6.28.3.)
Table 6:
I/O pads
Cell type
Pad type
Function
Description
DIO1
bspts3chp
Digital input/output
Bidirectional 3.3 V; 3-state output; 3 ns slew rate control; plain input;
CMOS with hysteresis; programmable pull-up, pull-down, repeater
DIO2
bpts5pcph
Digital input/output
Bidirectional 5 V; plain input; 3-state output; CMOS with programmable
hysteresis; programmable pull-up, pull-down, repeater
DIO4
mem1
Digital input/output
bsptz40pchp
Bidirectional 1.8 V or 3.3 V; plain input; 3-state output; programmable
hysteresis; programmable pull-up, pull-down, repeater
IICC
iic3m4scl
Digital input/output
I2C-bus; clock signal
IICD
iic3mvsda
Digital input/output
I2C-bus; data signal
AIO1
apio3v3
Analog input/output Analog input/output; protection to external 3.3 V supply rail
AIO2
apio
Analog input/output Analog input/output
AIO3
apiot5v
Analog input/output Analog input/output; 5 V tolerant pad-based ESD protection
CS1
vddco
Core supply
-
CS2
vddi
Core supply
-
PS1
vdde3v3
Peripheral supply
-
PS2
vdde
Peripheral supply
-
PS3
vddco3v3
Analog power
supply
-
CG1
vssco
Core ground
-
CG2
vssis
Core ground
-
PG1
vsse
Peripheral ground
-
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Low-cost, low-power ARM926EJ microcontrollers
6. Functional description
6.1 ARM926EJ-S
The processor embedded in the chip is the ARM926EJ-S. It is a member of the ARM9
family of general-purpose microprocessors. The ARM926EJ-S is intended for
multi-tasking applications where full memory management, high performance, and low
power are important.
This module has the following features:
• ARM926EJ-S processor core which uses a five-stage pipeline consisting of fetch,
decode, execute, memory and write stages. The processor supports both the 32-bit
ARM and 16-bit Thumb instruction sets, which allows a trade off between high
performance and high code density. The ARM926EJ-S also executes an extended
ARMv5TE instruction set which includes support for Java byte code execution.
• Contains an AMBA BIU for both data accesses and instruction fetches.
• Memory Management Unit (MMU).
• 16 kB instruction and 16 kB data separate cache memories with an 8 word line length.
The caches are organized using Harvard architecture.
• Little endian is supported.
• The ARM926EJ-S processor supports the ARM debug architecture and includes logic
to assist in both hardware and software debugging.
• Supports dynamic clock gating for power reduction.
• The processor core clock can be set equal to the AHB bus clock or to an integer
number times the AHB bus clock. The processor can be switched dynamically
between these settings.
• ARM stall support.
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6.2 Memory map
LPC3141/3143
4 GB
0xFFFF FFFF
reserved
2 GB
0x8000 0000
reserved
APB4 domain
NAND flash/AES buffer(1)
0x7000 0000
reserved
0x6000 0000
reserved
0x4000 0000
external SDRAM bank 0
0x3000 0000
0x2004 0000
external SRAM bank 1
reserved
USB OTG
reserved
APB1 domain
APB0 domain
0x1600 0200
0x1600 0180
0x2000 0000
I2SRX_0
I2STX_1
0x1900 1000
I2STX_0
0x1600 0080
0x1800 0000
I2S system config
reserved
APB2 domain
0x1700 9000
MPMC configuration registers
reserved
I2SRX_1
0x1800 0900
MCI/SD/SDIO
APB2 domain
0x1600 0280
APB3 domain
0x1900 0000
reserved
APB3 domain
reserved
0x2002 0000
external SRAM bank 0
0x1700 8000
0x1700 0000
0x1600 0000
reserved
shadow area
0 GB
0x1500 3000
SPI
0x1500 2000
UART
0x1500 1000
reserved
0x1500 0800
LCD
0x1500 0400
PCM
0x1500 0000
0x1300 B000
0x1300 A400
I2C0
0x1300 A000
0x1300 B000
PWM
0x1300 9000
timer 3
0x1300 8C00
timer 2
0x1300 8800
timer 1
0x1300 8400
0x1300 8000
APB1 domain
0x1300 0000
0x1200 0000
timer 0
0x1300 8000
RNG
0x1300 6000
OTP
0x1300 5000
0x1105 8000
CGU
0x1300 4000
0x1104 0000
IOCONFIG
0x1300 3000
SysCReg
0x1300 2800
reserved
96 kB ISRAM0
0x1600 0000
I2C1
0x1202 0000
96 kB ISRAM1
0x1600 0100
0x1500 0000
reserved
128 kB ISROM
reserved
0x1700 1000
NAND flash controller 0x1700 0800
DMA
0x1700 0000
0x6000 1000
interrupt controller
APB4 domain
0x1700 8000
0x7000 0800
APB0 domain
0x1102 8000
WDT
0x1300 2400
0x0000 1000
ADC10B
0x1300 2000
0x0000 0000
event router
0x1300 0000
002aae307
(1) LPC3143 only.
Fig 3.
LPC3141/3143 memory map
6.3 JTAG
The Joint Test Action Group (JTAG) interface allows the incorporation of the
LPC3141/3143 in a JTAG scan chain.
This module has the following features:
LPC3141_43
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• ARM926 debug access
• Boundary scan
• The ARM926 debug access can be permanently disabled through JTAG security bits
in the One-Time Programmable memory (OTP) block.
6.4 NAND flash controller
The NAND flash controller is used as a dedicated interface to NAND flash devices.
Figure 4 shows a block diagram of the NAND flash controller module. The heart of the
module is formed by a controller block that controls the flow of data from/to the AHB bus
through the NAND flash controller block to/from the (external) NAND flash. An Error
Correction Code (ECC) module allows for hardware error correction for support of
Multi-Level Cell (MLC) NAND flash devices. The NAND flash controller is connected to
the AES block to support secure (encrypted) code execution (see Section 6.21).
Before data is written from the buffer to the NAND flash, optionally it is first protected by
an error correction code generated by the ECC module. After data is read from the NAND
flash, the error correction module corrects errors, and/or the AES decryption module can
decrypt data.
AHB MULTI-LAYER MATRIX
BUFFER
CONTROLLER
AES
DECODER(1)
DMA transfer request
ECC
ENCODER/
DECODER
NAND INTERFACE
002aae083
(1) AES decoder available on LPC3143 only.
Fig 4. Block diagram of the NAND flash controller
This module has the following features:
• Dedicated NAND flash interface with hardware controlled read and write accesses.
• Wear leveling support with 516-byte mode.
• Software controlled command and address transfers to support wide range of flash
devices.
• Software control mode where the ARM is directly master of the flash device.
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Product data sheet
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Low-cost, low-power ARM926EJ microcontrollers
•
•
•
•
•
•
Support for 8-bit and 16-bit flash devices.
Support for any page size from 0.5 kB upwards.
Programmable NAND flash timing parameters.
Support for up to 4 NAND devices.
Hardware AES decryption (LPC3143 only).
Error Correction Module (ECC) for MLC NAND flash support:
– Reed-Solomon error correction encoding and decoding.
– Uses Reed-Solomon code words with 9-bit symbols over GF(2 9), a total codeword
length of 469 symbols, including 10 parity symbols, giving a minimum Hamming
distance of 11.
– Up to 8 symbol errors can be corrected per codeword.
– Error correction can be turned on and off to match the demands of the application.
– Parity generator for error correction encoding.
– Wear leveling information can be integrated into protected data.
– Interrupts generated after completion of error correction task with three interrupt
registers.
– Error correction statistics distributed to ARM using interrupt scheme.
– Interface is compatible with the ARM External Bus Interface (EBI).
6.5 Multi-Port Memory Controller (MPMC)
The multi-port memory controller supports the interface to different memory types, for
example:
• SDRAM
• Low-power SDRAM
• Static memory interface
This module has the following features:
• Dynamic memory interface support including SDRAM, JEDEC low-power SDRAM.
• Address line supporting up to 128 MB (two 64Mx8 devices connected to a single chip
select) of dynamic memory.
• The MPMC has two AHB interfaces:
a. an interface for accessing external memory.
b. a separate control interface to program the MPMC. This enables the MPMC
registers to be situated in memory with other system peripheral registers.
• Low transaction latency.
• Read and write buffers to reduce latency and to improve performance, particularly for
un-cached processors.
• Static memory features include:
– asynchronous page mode read
– programmable wait states
– bus turnaround delay
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– output enable and write enable delays
– extended wait
• One chip select for synchronous memory and two chip selects for static memory
devices.
•
•
•
•
•
•
Power-saving modes.
Dynamic memory self-refresh mode supported.
Controller support for 2 k, 4 k, and 8 k row address synchronous memory parts.
Support for all AHB burst types.
Little and big endian support.
Support for the External Bus Interface (EBI) that enables the memory controller pads
to be shared.
6.6 External Bus Interface (EBI)
The EBI module acts as multiplexer with arbitration between the NAND flash and the
SDRAM/SRAM memory modules connected externally through the MPMC.
The main purpose for using the EBI module is to save external pins. However only data
and address pins are multiplexed. Control signals towards and from the external memory
devices are not multiplexed.
Table 7.
Memory map of the external SRAM/SDRAM memory modules
Module
Maximum address space
Data width
Device size
External SRAM0
0x2000 0000
0x2000 FFFF
8 bit
64 kB
0x2000 0000
0x2001 FFFF
16 bit
128 kB
0x2002 0000
0x2002 FFFF
8 bit
64 kB
External SRAM1
0x2002 0000
0x2003 FFFF
16 bit
128 kB
External SDRAM0 0x3000 0000
0x37FF FFFF
16 bit
128 MB
6.7 Internal Static ROM (ISROM)
The internal static ROM is used to store the boot code of the LPC3141/3143. After a reset,
the ARM processor will start its code execution from this memory.
The LPC3143 ROM memory has the following features:
• Supports secure booting from SPI flash, NAND flash, SD/SDHC/MMC cards, UART,
and USB (DFU class) interfaces.
• Supports SHA1 hash checking on the boot image.
• Supports non-secure boot from UART and USB (DFU class) interfaces during
development. Once AES key is programmed in OTP, only secure boot is allowed
through UART and USB.
• Supports secure booting from managed NAND devices such as moviNAND, iNAND,
eMMC-NAND and eSD-NAND using SD/MMC boot mode.
• Contains pre-defined MMU table (16 kB) for simple systems.
LPC3141_43
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Rev. 1 — 4 June 2012
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17 of 69
LPC3141/3143
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Low-cost, low-power ARM926EJ microcontrollers
The LPC3141 ROM memory has the following features:
• Supports booting from SPI flash, NAND flash, SD/SDHC/MMC cards, UART, and
USB (DFU class) interfaces.
• Supports option to perform CRC32 checking on the boot image.
• Contains pre-defined MMU table (16 kB) for simple systems.
• Supports booting from managed NAND devices such as movi-NAND, iNAND,
eMMC-NAND and eSD-NAND using SD/MMC boot mode.
The boot ROM determines the boot mode based on reset state of GPIO0, GPIO1, and
GPIO2 pins. To ensure that GPIO0, GPIO1 and GPIO2 pins come up as inputs, pins
TRST_N and JTAGSEL must be LOW during power-on reset (see UM10362 JTAG
chapter for details). Table 8 shows the various boot modes supported on the
LPC3141/3143:
Table 8.
LPC3141/3143 boot modes
Boot mode
GPIO0 GPIO1 GPIO2 Description
NAND
0
0
0
Boots from NAND flash. If proper image is not found,
boot ROM will switch to DFU boot mode.
SPI
0
0
1
Boot from SPI NOR flash connected to SPI_CS_OUT0. If
proper image is not found, boot ROM will switch to DFU
boot mode.
DFU
0
1
0
Device boots via USB using DFU class specification.
SD/MMC
0
1
1
Boot ROM searches all the partitions on the
SD/MMC/SDHC/MMC+/eMMC/eSD card for boot image.
If partition table is missing, it will start searching from
sector 0. A valid image is said to be found if a valid image
header is found, followed by a valid image. If a proper
image is not found, boot ROM will switch to DFU boot
mode.
Reserved 0
1
0
0
Reserved for testing.
NOR flash
1
0
1
Boot from parallel NOR flash connected to
EBI_NSTCS_1.[1]
UART
1
1
0
Boot ROM tries to download boot image from UART
((115200 - 8 - n -1) assuming 12 MHz FFAST clock).
Test
1
1
1
Boot ROM is testing ISRAM using memory pattern test.
Switches to UART boot mode on receiving three ASCI
dots ("...") on UART.
[1]
For security reasons this mode is disabled when JTAG security feature is used.
6.8 Internal RAM memory
The ISRAM (Internal Static RAM Memory) controller module is used as controller between
the AHB bus and the internal RAM memory. The internal RAM memory can be used as
working memory for the ARM processor and as temporary storage to execute the code
that is loaded by boot ROM from external devices such as SPI flash, NAND flash, and
SD/MMC cards.
This module has the following features:
• Capacity of 192 kB
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• Implemented as two independent 96 kB memory banks
6.9 Memory Card Interface (MCI)
The MCI controller interface can be used to access memory cards according to the
Secure Digital (SD) and Multi-Media Card (MMC) standards. The host controller can be
used to interface to small form factor expansion cards compliant to the SDIO card
standard as well. Finally, the MCI supports CE-ATA 1.1 compliant hard disk drives.
This module has the following features:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
One 8-bit wide interface.
Supports high-speed SD, versions 1.01, 1.10 and 2.0.
Supports SDIO version 1.10.
Supports MMCplus, MMCmobile and MMCmicro cards based on MMC 4.1.
Supports SDHC memory cards.
CRC generation and checking.
Supports 1/4-bit SD cards.
Card detection and write protection.
FIFO buffers of 16 byte deep.
Host pull-up control.
SDIO suspend and resume.
1 to 65 535 byte blocks.
Suspend and resume operations.
SDIO read-wait.
Individual clock and power ON/OFF features to each card.
Maximum clock speed of 52 MHz (MMC 4.1).
Supports CE-ATA 1.1.
Supports 1-bit, 4-bit, and 8-bit MMC cards and CE-ATA devices.
6.10 High-speed Universal Serial Bus 2.0 On-The-Go (OTG)
The USB OTG module allows the LPC3141/3143 to connect directly to a USB host such
as a PC (in device mode) or to a USB device in host mode. In addition, the LPC3141/3143
has a special, built-in mode in which it enumerates as a Device Firmware Upgrade (DFU)
class, and which allows for a (factory) download of the device firmware through USB.
This module has the following features:
•
•
•
•
•
•
LPC3141_43
Product data sheet
Complies with Universal Serial Bus specification 2.0.
Complies with USB On-The-Go supplement.
Complies with Enhanced Host Controller Interface Specification.
Supports auto USB 2.0 mode discovery.
Supports all high-speed USB-compliant peripherals.
Supports all full-speed USB-compliant peripherals.
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• Supports software Host Negotiation Protocol (HNP) and Session Request Protocol
(SRP) for OTG peripherals.
• Contains UTMI+ compliant transceiver (PHY).
• Supports interrupts.
• This module has its own, integrated DMA engine.
6.11 DMA controller
The DMA controller can perform DMA transfers on the AHB without using the CPU.
This module has the following features:
• Supported transfer types:
Memory to memory copy
– Memory can be copied from the source address to the destination address with a
specified length, while incrementing the address for both the source and
destination.
Memory to peripheral
– Data is transferred from incrementing memory to a fixed address of a peripheral.
The flow is controlled by the peripheral.
Peripheral to memory
– Data is transferred from a fixed address of a peripheral to incrementing memory.
The flow is controlled by the peripheral.
• Supports single data transfers for all transfer types.
• Supports burst transfers for memory to memory transfers. A burst always consists of
multiples of 4 (32 bit) words.
• The DMA controller has 12 channels.
• Scatter-gather is used to gather data located at different areas of memory. Two
channels are needed per scatter-gather action.
• Supports byte, half-word, and word transfers and correctly aligns them over the AHB
bus.
• Compatible with ARM flow control for single requests, last single requests, terminal
count info, and DMA clearing.
• Supports swapping endian property of the transported data.
Table 9:
Peripherals that support DMA
Peripheral name
Supported transfer types
NAND flash controller/AES decryption
LPC3141_43
Product data sheet
engine[1]
Memory to memory
SPI
Memory to peripheral and peripheral to memory
MCI
Memory to peripheral and peripheral to memory
LCD interface
Memory to peripheral
UART
Memory to peripheral and peripheral to memory
I2C0/1-bus interfaces
Memory to peripheral and peripheral to memory
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Table 9:
Peripherals that support DMA …continued
Peripheral name
Supported transfer types
I2S0/1 receive
Peripheral to Memory
I2S0/1 transmit
Memory to peripheral
PCM interface
Memory to peripheral and peripheral to memory
[1]
AES decryption engine is available on LPC3143 only.
6.12 Interrupt controller
The interrupt controller collects interrupt requests from multiple devices, masks interrupt
requests, and forwards the combined requests to the processor. The interrupt controller
also provides facilities to identify the interrupt requesting devices to be served.
This module has the following features:
• The interrupt controller decodes all the interrupt requests issued by the on-chip
peripherals.
• Two interrupt lines (Fast Interrupt Request (FIQ), Interrupt Request (IRQ)) to the ARM
core. The ARM core supports two distinct levels of priority on all interrupt sources,
FIQ for high priority interrupts and IRQ for normal priority interrupts.
•
•
•
•
•
Software interrupt request capability associated with each request input.
Visibility of interrupts request state before masking.
Support for nesting of interrupt service routines.
Interrupts routed to IRQ and to FIQ are vectored.
Level interrupt support.
The following blocks can generate interrupts:
•
•
•
•
•
•
•
•
•
•
•
•
•
NAND flash controller
USB 2.0 HS OTG
Event router
10 bit ADC
UART
LCD interface
MCI
SPI
I2C0-bus and I2C1-bus controllers
Timer 0, timer 1, timer 2, and timer 3
I2S transmit: I2STX_0 and I2STX_1
I2S receive: I2SRX_0 and I2SRX_1
DMA
6.13 Multi-layer AHB
The multi-layer AHB is an interconnection scheme based on the AHB protocol that
enables parallel access paths between multiple masters and slaves in a system.
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Multiple masters can have access to different slaves at the same time.
Figure 5 gives an overview of the multi-layer AHB configuration in the LPC3141/3143.
AHB masters and slaves are numbered according to their AHB port number.
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master 0
ARM
926EJ-S
1
D-CACHE
DMA
I-CACHE
Low-cost, low-power ARM926EJ microcontrollers
USB-OTG
AHB
MASTER
2
3
slave
0
AHB-APB
BRIDGE 0
0
1
EVENT ROUTER
1
AHB-APB
BRIDGE 1
0
1
TIMER 0
2
AHB-APB
BRIDGE 2
3
AHB-APB
BRIDGE 3
4
AHB-APB
BRIDGE 4
0
1
LCD
0
6
7
6
OTP
3
TIMER 3
5
4
IOCONFIG
CGU
4
5
6
PWM
I2C0
I2C1
3
UART
SPI
I2S0/1
0
DMA REGISTERS
5
SYSTEM CONTROL
RNG
TIMER 2
2
3
WDT
2
TIMER 1
PCM
2
10-bit ADC
1
NAND REGISTERS
INTERRUPT CONTROLLER
NAND CONTROLLER AES(1)
BUFFER
7
8
9
10
11
12
13
MCI SD/SDIO
USB HIGH-SPEED OTG
ISRAM 0
ISRAM 1
ISROM
MPMC CONFIG
MPMC CONTROLLER
MULTI-LAYER AHB MATRIX
= master/slave connection supported by matrix
002aae080
(1) AES is available for LPC3143 only.
Fig 5.
LPC3141/3143 multi-layer AHB matrix connections
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This module has the following features:
• Supports all combinations of 32-bit masters and slaves (fully connected interconnect
matrix).
• Round-Robin priority mechanism for bus arbitration: all masters have the same
priority and get bus access in their natural order.
• Four devices on a master port (listed in their natural order for bus arbitration):
– DMA
– ARM926 instruction port
– ARM926 data port
– USB OTG
• Devices on a slave port (some ports are shared between multiple devices):
– AHB to APB bridge 0
– AHB to APB bridge 1
– AHB to APB bridge 2
– AHB to APB bridge 3
– AHB to APB bridge 4
– Interrupt controller
– NAND flash controller
– MCI SD/SDIO
– USB 2.0 HS OTG
– 96 kB ISRAM
– 96 kB ISRAM
– 128 kB ROM
– MPMC (Multi-Purpose Memory Controller)
6.14 APB bridge
The APB bridge is a bus bridge between AMBA Advanced High-performance Bus (AHB)
and the ARM Peripheral Bus (APB) interface.
The module supports two different architectures:
• Single-clock architecture, synchronous bridge. The same clock is used at the AHB
side and at the APB side of the bridge. The AHB-to-APB4 bridge uses this
architecture.
• Dual-clock architecture, asynchronous bridge. Different clocks are used at the AHB
side and at the APB side of the bridge. The AHB-to-APB0, AHB-to-APB1,
AHB-to-APB2, and AHB-to-APB3 bridges use this architecture.
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6.15 Clock Generation Unit (CGU)
The clock generation unit generates all clock signals in the system and controls the reset
signals for all modules. The structure of the CGU is shown in Figure 6. Each output clock
generated by the CGU belongs to one of the domains. Each clock domain is fed by a
single base clock that originates from one of the available clock sources. Within a clock
domain, fractional dividers are available to divide the base clock to a lower frequency.
Within most clock domains, the output clocks are again grouped into one or more
subdomains. All output clocks within one subdomain are either all generated by the same
fractional divider or they are connected directly to the base clock. Therefore all output
clocks within one subdomain have the same frequency and all output clocks within one
clock domain are synchronous because they originate from the same base clock.
The CGU reference clock is generated by the external crystal. Furthermore the CGU has
several Phase Locked Loop (PLL) circuits to generate clock signals that can be used for
system clocks and/or audio clocks. All clock sources, except the output of the PLLs, can
be used as reference input for the PLLs.
This module has the following features:
• Advanced features to optimize the system for low power:
– All output clocks can be disabled individually for flexible power optimization.
– Some modules have automatic clock gating: they are only active when (bus)
access to the module is required.
– Variable clock scaling for automatic power optimization of the AHB bus (high clock
frequency when the bus is active, low clock frequency when the bus is idle).
– Clock wake-up feature: module clocks can be programmed to be activated
automatically on the basis of an event detected by the event router (see also
Section 6.19). For example, all clocks (including the core/bus clocks) are off and
activated automatically when a button is pressed.
• Supports five clock sources:
– Reference clock generated by the oscillator with an external crystal.
– Pins I2SRX_BCK0, I2SRX_WS0, I2SRX_BCK1 and I2SRX_WS1 are used to input
external clock signals (used for generating audio frequencies in I2SRX slave
mode, see also Section 6.4).
• Supports two PLLs:
– System PLL generates programmable system clock frequency from its reference
input.
– I2S/Audio PLL generates programmable audio clock frequency (typically 256  fs)
from its reference input.
Remark: Both the System PLL and the I2S/Audio PLL generate their frequencies
based on their (individual) reference clocks. The reference clocks can be
programmed to the oscillator clock or one of the external clock signals.
• Highly flexible switchbox to distribute the signals from the clock sources to the module
clocks.
– Each clock generated by the CGU is derived from one of the base clocks and
optionally divided by a fractional divider.
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– Each base clock can be programmed to have any one of the clock sources as an
input clock.
– Fractional dividers can be used to divide a base clock by a fractional number to a
lower clock frequency.
– Fractional dividers support clock stretching to obtain a (near) 50% duty cycle
output clock.
• Register interface to reset all modules under software control.
• Based on the input of the Watchdog timer (see also Section 6.16), the CGU can
generate a system-wide reset in the case of a system stall.
clock resources
subdomain clocks
BASE
EXTERNAL
CRYSTAL
clock outputs
FRACTIONAL
DIVIDER 0
OSCILLATOR
FRACTIONAL
DIVIDER m
I2SRX_BCK0
I2SRX_WS0
I2SRX_BCK1
I2SRX_WS1
SYSTEM
PLL
CLOCK DOMAIN 0
to modules
I2S/AUDIO
PLL
CLOCK DOMAIN n
SWITCHBOX
002aae916
The LPC3141/3143 has 11 clock domains (n = 11). The number of fractional dividers m depends on the clock domain.
Fig 6. CGU block diagram
6.16 Watchdog Timer (WDT)
The watchdog timer can be used to generate a system reset if there is a CPU/software
crash. In addition the watchdog timer can be used as an ordinary timer. Figure 7 shows
how the watchdog timer module is connected in the system.
This module has the following features:
• In the event of a software or hardware failure, generates a chip-wide reset request
when its programmed time-out period has expired (output m1).
• Watchdog counter can be reset by a periodical software trigger.
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• After a reset, a register will indicate whether a reset has occurred because of a
watchdog generated reset.
• Watchdog timer can also be used as a normal timer in addition to the watchdog
functionality (output m0).
m0
EVENT ROUTER
m1
CGU
WDT
APB
INTERRUPT
CONTROLLER
FIQ
IRQ
reset
002aae086
Fig 7. Block diagram of the Watchdog Timer
6.17 Input/Output Configuration module (IOCONFIG)
The General Purpose Input/Output (GPIO) pins can be controlled through the register
interface provided by the IOCONFIG module. Next to several dedicated GPIO pins, most
digital IO pins can also be used as GPIO if they are not required for their normal,
dedicated function.
This module has the following features:
• Provides control for the digital pins that can double as GPIO (next to their normal
function). The pinning list in Table 4 indicates which pins can double as GPIO.
• Each controlled pin can be configured for 4 operational modes:
– Normal operation (i.e. controlled by a function block)
– Driven LOW
– Driven HIGH
– High impedance/input
• A GPIO pin can be observed (read) in any mode.
• The register interface provides ‘set’ and ‘clear’ access methods for choosing the
operational mode.
6.18 10-bit Analog-to-Digital Converter (ADC10B)
This module is a 10-bit successive approximation ADC with an input multiplexer to allow
for multiple analog signals on its input. A common use of this module is to read out
multiple keys on one input from a resistor network.
This module has the following features:
• Four analog input channels, selected by an analog multiplexer.
• Programmable ADC resolution from 2 bit to 10 bit.
• The maximum conversion rate is 400 kSamples/s for 10 bit resolution and
1500 kSamples/s for 2 bit resolution.
• Single and continuous analog-to-digital conversion scan modes.
• Power-down mode.
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6.19 Event router
The event router extends the interrupt capability of the system by offering a flexible and
versatile way of generating interrupts. Combined with the wake-up functionality of the
CGU, it also offers a way to wake-up the system from suspend mode (with all clocks
deactivated).
interrupt 0
interrupt 1
APB
EVENT ROUTER
interrupt 2
INTERRUPT
CONTROLLER
interrupt 3
cgu wakeup
CGU
external pins
internal
input signals (GPIO configurable)
002aae087
Fig 8. Event router block diagram
The event router has four interrupt outputs connected to the interrupt controller and one
wake-up output connected to the CGU as shown in Figure 8. The output signals are
activated when an event (for instance a rising edge) is detected on one of the input
signals. The input signals of the event router are connected to relevant internal (control)
signals in the system or to external signals through pins of the LPC3141/3143.
This module has the following features:
• Provides programmable routing of input events to multiple outputs for use as
interrupts or wake up signals.
• Input events can come from internal signals or from the pins that can be used as
GPIO.
•
•
•
•
•
•
•
•
•
Inputs can be used either directly or latched (edge detected) as an event source.
The active level (polarity) of the input signal for triggering events is programmable.
Direct events will disappear when the input becomes inactive.
Latched events will remain active until they are explicitly cleared.
Each input can be masked globally for all inputs at once.
Each input can be masked for each output individually.
Event detect status can be read for each output separately.
Event detection is fully asynchronous (no active clock required).
Module can be used to generate a system wake-up from suspend mode.
Remark: All pins that can be used as GPIO are connected to the event router (see
Figure 8). Note that they can be used to trigger events when in normal functional mode or
in GPIO mode.
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6.20 Random number generator
The Random Number Generator (RNG) generates true random numbers for use in
advanced security and Digital Rights Management (DRM) related schemes. These
schemes rely upon truly random, i.e. completely unpredictable numbers.
This module has the following features:
• True random number generator.
• The random number register does not rely on any kind of reset.
• The generators are free running in order to ensure randomness and security.
6.21 AES decryption (LPC3143 only)
This module can be used for data decryption using the AES algorithm. The AES module
has the following features:
•
•
•
•
AES-128: 128 bit key, 128 bit data.
CBC mode over blocks of 512 bytes.
Each block of 512 bytes uses the same initial value.
AES can be turned on and off.
6.22 Secure One-Time Programmable memory (OTP)
The Secure One-Time Programmable Memory can be used for storing non-volatile
information like serial number, security bits, etc. It consists of a polyfuse array, embedded
data registers, and control registers. One of the main features of the OTP is storing a
security key and a unique ID.
This module has the following features:
• 512-bit one-time programmable memory.
– 128 bits are used for an unique ID which is pre-programmed in the wafer fab.
– 40 bits are used for security and other features which are programmed at the
customer production line.
– 184 bits are available for customer use.
– 32 bits are used for USB product ID and vendor ID by bootROM in DFU mode.
– 128 bits are used for secure key used by BootROM to load secure images.1
•
•
•
•
Programmable at the customer production line.
Random read access via sixteen 32-bit registers.
Flexible read protection mechanism to hide security related data.
Flexible write protection mechanism.
6.23 Serial Peripheral Interface (SPI)
The SPI module is used for synchronous serial data communication with other devices
which support the SPI/SSI protocol. Examples of the devices that this SPI module can
communicate with are memories, camera and WiFi-g.
1.
On the LPC3141 secure boot is not supported hence these bits are also available for customer use.
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The SPI/SSI-bus is a 5-wire interface, and it is suitable for low, medium, and high data
rate transfers.
This module has the following features:
• Supports Motorola SPI frame format with a word size of 8/16 bits.
• Texas Instruments SSI (Synchronous Serial Interface) frame format with a word size
of 4 bit to 16 bit.
•
•
•
•
•
•
•
•
Receive FIFO and transmit FIFO of 64 half-words each.
Serial clock rate master mode maximum 45 MHz.
Serial clock rate slave mode maximum 25 MHz.
Support for single data access DMA.
Full-duplex operation.
Supports up to three slaves.
Supports maskable interrupts.
Supports DMA transfers.
6.24 Universal Asynchronous Receiver Transmitter (UART)
The UART module supports the industry standard serial interface.
This module has the following features:
•
•
•
•
•
•
•
•
•
•
•
•
Programmable baud rate with a maximum of 1049 kBd.
Programmable data length (5 bit to 8 bit).
Implements only asynchronous UART.
Transmit break character length indication.
Programmable 1 to 2 stops bits in transmission.
Odd/Even/Force parity check/generation.
Frame error, overrun error and break detection.
Automatic hardware flow control.
Independent control of transmit, receive, line status, data set interrupts, and FIFOs.
SIR-IrDA encoder/decoder (from 2400 to 115 kBd).
Supports maskable interrupts.
Supports DMA transfers.
6.25 Pulse Code Modulation (PCM) interface
The PCM interface supports the PCM and IOM interfaces.
This module has the following features:
• Four-wire serial interface.
• Can function in both Master and Slave modes.
• Supports:
– PCM: Pulse code modulation. Single clocking physical format.
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– MP PCM: Multi-Protocol PCM. Configurable directional per slot.
– IOM-2: Extended ISDN-Oriented modular. Double clocking physical format.
•
•
•
•
Twelve 8-bit slots in a frame with enabling control per slot.
Internal frame clock generation in master mode.
Receive and transmit DMA handshaking using a request/clear protocol.
Interrupt generation per frame.
PCM (Pulse Code Modulation) is a very common method used for transmitting analog
data in digital format. Most common applications of PCM are Digital audio as in Audio CD
and computers, digital telephony and digital videos.
The IOM (ISDN Oriented Modular) interface is primarily used to interconnect
telecommunications ICs providing ISDN compatibility. It delivers a symmetrical full-duplex
communication link containing user data, control/programming lines, and status channels.
6.26 LCD interface
The dedicated LCD interface contains logic to interface to a 6800 (Motorola) or a 8080
(Intel) compatible LCD controller which support 4/8/16 bit modes. This module also
supports a serial interface mode. The speed of the interface can be adjusted in software to
match the speed of the connected LCD display.
This module has the following features:
• 4/8/16 bit parallel interface mode: 6800-series, 8080-series.
• Serial interface mode.
• Supports multiple frequencies for the 6800/8080 bus to support high- and low-speed
controllers.
• Supports polling the busy flag from LCD controller to off-load the CPU from polling.
• Contains a 16 byte FIFO for sending control and data information to the LCD
controller.
• Supports maskable interrupts.
• Supports DMA transfers.
6.27 I2C-bus master/slave interface
The LPC3141/3143 contains two I2C master/slave interfaces.
This module has the following features:
• I2C0 interface: The I2C0-bus interface is a standard I2C-compliant bus interface with
open-drain pins. This interface supports functions described in the I2C-bus
specification for speeds up to 400 kHz. This includes multi-master operation and
allows powering off this device in a working system while leaving the I2C-bus
functional.
• I2C1 interface: The I2C1-bus interface uses standard I/O pins and is intended for use
with a single-master I2C-bus and does not support powering off this device. Standard
I/Os also do not support multi-master I2C implementations.
• Supports normal mode (100 kHz SCL).
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• Fast mode (400 kHz SCLwith 24 MHz APB clock; 325 kHz with12 MHz APB clock;
175 kHz with 6 MHz APB clock).
• Interrupt support.
• Supports DMA transfers (single).
• Four modes of operation:
– Master transmitter
– Master receiver
– Slave transmitter
– Slave receiver
6.28 LCD/NAND flash/SDRAM multiplexing
The LPC3141/3143 contains a rich set of specialized hardware interfaces, but the TFBGA
package does not contain enough pins to allow the use of all signals of all interfaces
simultaneously. Therefore a pin-multiplexing scheme is created, which allows the
selection of the right interface for the application.
Pin multiplexing is enabled between the following interfaces:
•
•
•
•
between the dedicated LCD interface and the external bus interface
between the NAND flash controller and the memory card interface
between UART and SPI
between I2STX_0 output and the PCM interface
The pin interface multiplexing is subdivided into five categories: storage, video, audio,
NAND flash, and UART related pin multiplexing. Each category supports several modes,
which can be selected by programming the corresponding registers in the SysCReg.
6.28.1 Pin connections
Table 10.
Pin descriptions of multiplexed pins
Pin Name
Default Signal Alternate Signal Description
Video related pin multiplexing
mLCD_CSB
LCD_CSB
EBI_NSTCS_0
mLCD_DB_1
LCD_DB_1
EBI_NSTCS_1
LCD_CSB — LCD chip select for external LCD controller.
EBI_NSTCS_0 — EBI static memory chip select 0.
LCD_DB_1 — LCD bidirectional data line 1.
EBI_NSTCS_1 — EBI static memory chip select 1.
mLCD_DB_0
LCD_DB_0
EBI_CLKOUT
LCD_DB_0 — LCD bidirectional data line 0.
EBI_CLKOUT — EBI SDRAM clock signal.
mLCD_E_RD
LCD_E_RD
EBI_CKE
LCD_E_RD — LCD enable/read signal.
EBI_CKE — EBI SDRAM clock enable.
mLCD_RS
LCD_RS
EBI_NDYCS
LCD_RS — LCD register select signal.
EBI_NDYCS — EBI SDRAM chip select.
mLCD_RW_WR LCD_RW_WR
EBI_DQM_1
LCD_RW_WR — LCD read write/write signal.
EBI_DQM_1 — EBI SDRAM data mask output 1.
mLCD_DB_2
LCD_DB_2
EBI_A_2
LCD_DB_2 — LCD bidirectional data line 2.
EBI_A_2 — EBI address line 2.
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Table 10.
Pin descriptions of multiplexed pins …continued
Pin Name
Default Signal Alternate Signal Description
mLCD_DB_3
LCD_DB_3
EBI_A_3
LCD_DB_3 — LCD bidirectional data line 3.
EBI_A_3 — EBI address line 3.
mLCD_DB_4
LCD_DB_4
EBI_A_4
LCD_DB_4 — LCD bidirectional data line 4.
EBI_A_4 — EBI address line 4.
mLCD_DB_5
LCD_DB_5
EBI_A_5
LCD_DB_5 — LCD bidirectional data line 5.
EBI_A_5 — EBI address line 5.
mLCD_DB_6
LCD_DB_6
EBI_A_6
mLCD_DB_7
LCD_DB_7
EBI_A_7
LCD_DB_6 — LCD bidirectional data line 6.
EBI_A_6 — EBI address line 6.
LCD_DB_7 — LCD bidirectional data line 7.
EBI_A_7 — EBI address line 7.
mLCD_DB_8
LCD_DB_8
EBI_A_8
LCD_DB_8 — LCD bidirectional data line 8.
EBI_A_8 — EBI address line 8.
mLCD_DB_9
LCD_DB_9
EBI_A_9
LCD_DB_9 — LCD bidirectional data line 9.
EBI_A_9 — EBI address line 9.
mLCD_DB_10
LCD_DB_10
EBI_A_10
mLCD_DB_11
LCD_DB_11
EBI_A_11
LCD_DB_10 — LCD bidirectional data line 10.
EBI_A_10 — EBI address line 10.
LCD_DB_11 — LCD bidirectional data line 11.
EBI_A_11 — EBI address line 11.
mLCD_DB_12
LCD_DB_12
EBI_A_12
LCD_DB_12 — LCD bidirectional data line 12.
EBI_A_12 — EBI address line 12.
mLCD_DB_13
LCD_DB_13
EBI_A_13
LCD_DB_13 — LCD bidirectional data line 13.
EBI_A_13 — EBI address line 13.
mLCD_DB_14
LCD_DB_14
EBI_A_14
mLCD_DB_15
LCD_DB_15
EBI_A_15
LCD_DB_14 — LCD bidirectional data line 14.
EBI_A_14 — EBI address line 14.
LCD_DB_15 — LCD bidirectional data line 15.
EBI_A_15 — EBI address line 15.
Storage related pin multiplexing
mGPIO5
GPIO5
MCI_CLK
GPIO5 — General Purpose I/O pin 5.
MCI_CLK — MCI card clock.
mGPIO6
GPIO6
MCI_CMD
GPIO_6 — General Purpose I/O pin 6.
MCI_CMD — MCI card command input/output.
mGPIO7
GPIO7
MCI_DAT_0
GPIO7 — General Purpose I/O pin 7.
MCI_DAT_0 — MCI card data input/output line 0.
mGPIO8
GPIO8
MCI_DAT_1
mGPIO9
GPIO9
MCI_DAT_2
GPIO8 — General Purpose I/O pin 8.
MCI_DAT_1 — MCI card data input/output line 1.
GPIO9 — General Purpose I/O pin 9.
MCI_DAT_2 — MCI card data input/output line 2.
mGPIO10
GPIO10
MCI_DAT_3
GPIO10 — General Purpose I/O pin 10.
MCI_DAT_3 — MCI card data input/output line 3.
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Table 10.
Pin descriptions of multiplexed pins …continued
Pin Name
Default Signal Alternate Signal Description
NAND related pin multiplexing
mNAND_RYBN0 NAND_RYBN0 MCI_DAT_4
NAND_RYBN0 — NAND flash controller Read/Not busy signal 0.
MCI_DAT_4 — MCI card data input/output line 4.
mNAND_RYBN1 NAND_RYBN1 MCI_DAT_5
NAND_RYBN1 — NAND flash controller Read/Not busy signal 1.
MCI_DAT_5 — MCI card data input/output line 5.
mNAND_RYBN2 NAND_RYBN2 MCI_DAT_6
NAND_RYBN2 — NAND flash controller Read/Not busy signal 2
MCI_DAT_6 — MCI card data input/output line 6.
mNAND_RYBN3 NAND_RYBN3 MCI_DAT_7
NAND_RYBN3 — NAND flash controller Read/Not busy signal 3.
MCI_DAT_7 — MCI card data input/output line 7.
Audio related pin multiplexing
mI2STX_DATA0 I2STX_DATA0
PCM_DA
I2STX_DATA0 — I2S interface 0 transmit data signal.
PCM_DA — PCM serial data line A.
mI2STX_BCK0
I2STX_BCK0
PCM_FSC
mI2STX_WS0
I2STX_WS0
PCM_DCLK
I2STX_BCK0 — I2S interface 0 transmit bit clock signal.
PCM_FSC — PCM frame synchronization signal.
I2STX_WS0 — I2S interface 0 transmit word select signal.
PCM_DCLK — PCM data clock output.
mI2STX_CLK0
I2STX_CLK0
PCM_DB
I2STX_CLK0 — I2S interface 0 transmit clock signal.
PCM_DB — PCM serial data line B.
UART related pin multiplexing
mUART_CTS_N UART_CTS_N SPI_CS_OUT1
UART_CTS_N — UART modem control Clear-to-send signal.
SPI_CS_OUT1 — SPI chip select out for slave 1 (used in master
mode).
mUART_RTS_N UART_RTS_N SPI_CS_OUT2
UART_RTS_N — UART modem control Request-to-Send signal.
SPI_CS_OUT2 — SPI chip select out for slave 2 (used in master
mode).
6.28.2 Multiplexing between LCD and MPMC
The multiplexing between the LCD interface and MPMC allows for the following two
modes of operation:
• MPMC-mode: SDRAM and bus-based LCD or SRAM
• LCD-mode: Dedicated LCD interface
The external NAND flash is accessible in both modes.
The block diagram Figure 9 gives a high level overview of the modules in the chip that are
involved in the pin interface multiplexing between the EBI, NAND flash controller, MPMC,
and RAM-based LCD interface.
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LPC31xx
control
NAND_NCS_[0:3]
NAND_RYBN[0:3]
EBI_NCAS_BLOUT_0
EBI_NRAS_BLOUT_1
EBI_DQM_0_NOE
control
NAND
FLASH
INTERFACE
control
(ALE, CLE)
2
2
address
EBI_A_[1:0] 2
data
16
data
16
data
control
3
16
EBI_A_0_ALE
EBI_A_1_CLE
EBI_D_[15:0]
EBI
SUP4
MPMC
address
EBI_A_[15:2] 14
address 16
1
control
6
data
LCD_DB_[15:2]
14
LCD_DB_[15:2] (LCD mode)/
EBI_A_[15:2] (MPMC mode)
14
0
SYSCREG_MUX_LCD_EBI_SEL
register
(I/O multplexing)
LCD
mode
LCD
data
LCD_DB_[1:0],
control
1
6
6
0
SUP8
MPMC
mode
LCD_CSB/EBI_NSTCS_0
LCD_DB_1/EBI_NSTCS_1
LCD_DB_0/EBI_CLKOUT
LCD_E_RD/EBI_CKE
LCD_RS/EBI_NDYCS
LCD_RW_WR/EBI_DQM_1
002aae157
Fig 9.
Diagram of LCD and MPMC multiplexing
Figure 9 only shows the signals that are involved in pad-muxing, so not all interface
signals are visible.
The EBI unit between the NAND flash interface and the MPMC contains an arbiter that
determines which interface is muxed to the outside world. Both NAND flash and
SDRAM/SRAM initiate a request to the EBI unit. This request is granted using round-robin
arbitration (see Section 6.6).
6.28.3 Supply domains
As is shown in Figure 9 the EBI (NAND flash/MPMC-control/data) is connected to a
different supply domain than the LCD interface. The EBI control and address signals are
muxed with the LCD interface signals and are part of supply domain SUP8. The
SDRAM/SRAM data lines are shared with the NAND flash through the EBI and are part of
supply domain SUP4. Therefore the following rules apply for connecting memories:
1. SDRAM and bus-based LCD or SRAM: This is the MPMC mode. The supply voltage
for SDRAM/SRAM/bus-based LCD and NAND flash must be the same.The dedicated
LCD interface is not available in the MPMC mode.
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2. Dedicated LCD interface only: This is the LCD mode. The NAND flash supply voltage
(SUP4) can be different from the LCD supply voltage (SUP8).
6.29 Timer module
The LPC3141/3143 contains four fully independent timer modules, which can be used to
generate interrupts after a pre-set time interval has elapsed.
This module has the following features:
• Each timer is a 32 bit wide down-counter with selectable pre-scale. The pre-scaler
allows using either the module clock directly or the clock divided by 16 or 256.
• Two modes of operation:
– Free-running timer: The timer generates an interrupt when the counter reaches
zero. The timer wraps around to 0xFFFF FFFF and continues counting down.
– Periodic timer: The timer generates an interrupt when the counter reaches zero. It
reloads the value from a load register and continues counting down from that
value. An interrupt will be generated every time the counter reaches zero. This
effectively gives a repeated interrupt at a regular interval.
• At any time the current timer value can be read.
• At any time the value in the load register may be re-written, causing the timer to
restart.
6.30 Pulse Width Modulation (PWM) module
This PWM can be used to generate a pulse width modulated or a pulse density modulated
signal. With an external low pass filter, the module can be used to generate a low frequent
analog signal. A typical use of the output of the module is to control the backlight of an
LCD display.
This module has the following features:
• Supports Pulse Width Modulation (PWM) with software controlled duty cycle.
• Supports Pulse Density Modulation (PDM) with software controlled pulse density.
6.31 System control registers
The System Control Registers (SysCReg) module provides a register interface for some
of the high-level settings in the system such as multiplexers and mode settings. This is an
auxiliary module included in this overview for the sake of completeness.
6.32 I2S
The I2S receive/I2S transmit modules have the following features:
•
•
•
•
•
LPC3141_43
Product data sheet
Audio interface compatible with the I2S standard.
I2S receive block supports master mode and slave mode.
I2S transmit block supports master mode.
Supports LSB justified words of 16, 18, 20 and 24 bit.
Supports a configurable number of bit clock periods per word select period (up to 128
bit clock periods).
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6.32.1 I2S AHB interface
The I2S AHB interface has the following features:
•
•
•
•
•
Supports DMA transfers.
Transmit FIFO (I2S transmit) or receive FIFO (I2S receive) of 4 stereo samples.
Supports single 16 bit transfers to/from the left or right FIFO.
Supports single 24 bit transfers to/from the left or right FIFO.
Supports 32-bit interleaved transfers, with the lower 16 bits representing the left audio
sample, and the higher 16 bits representing the right audio sample.
• Supports two 16-bit audio samples combined in a 32-bit word (2 left or 2 right
samples) to reduce busload.
• Provides maskable interrupts for audio status.
(FIFO underrun/overrun/full/half_full/not empty for left and right channel separately).
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7. Limiting values
Table 11. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
All digital I/O pins
Vi
input voltage
0.5
-
+3.6
V
Vo
output voltage
0.5
-
+3.6
V
Io
output current
-
4
-
mA
VDDE_IOC = 3.3 V
Temperature values
Tj
junction temperature
Tstg
storage temperature
Tamb
ambient temperature
[2]
40
25
+125
C
65
-
+150
C
40
+25
+85
C
Electrostatic handling
VESD
[1]
electrostatic
discharge voltage
500
-
+500
V
machine model
100
-
+100
V
charged device
model
-
500
-
V
human body model
[3]
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Dependent on package type.
[3]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
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8. Static characteristics
Table 12: Static characteristics
Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
input/output supply
voltage
NAND flash controller
pads (SUP4) and LCD
interface (SUP8); 1.8 V
mode
1.65
1.8
1.95
V
NAND flash controller
pads (SUP4) and LCD
interface (SUP8); 3.3 V
mode
2.5
3.3
3.6
V
other peripherals
(SUP 3)
2.7
3.3
3.6
V
Supply pins
VDD(IO)
VDD(CORE)
core supply voltage
SUP1
1.1
1.2
1.3
V
VDD(OSC_PLL)
oscillator and PLL
supply voltage
on pin VDDA12; for
12 MHz oscillator
(SUP1)
1.0
1.2
1.3
V
VDD(ADC)
ADC supply voltage
on pin
ADC10B_VDDA33; for
10-bit ADC (SUP 3)
2.7
3.3
3.6
V
Vprog(pf)
polyfuse programming
voltage
on pin VPP; write
3.0
3.3
3.6
V
on pin VPP; read
1.1
-
1.3
V
bus supply voltage
on pin USB_VBUS
(SUP5)
-
5.0
-
V
on pin USB_VDDA33
(SUP 3)
3.0
3.3
3.6
V
on pin
USB_VDDA33_DRV
(SUP 3); driver
2.7
3.3
3.6
V
on pin
USB_VDDA12_PLL
(SUP1)
1.1
1.2
1.3
V
0
-
VDDE_IOC
V
VBUS
VDDA(USB)(3V3) USB analog supply
voltage (3.3 V)
VDDA(PLL)(1V2)
PLL analog supply
voltage (1.2 V)
Input pins and I/O pins configured as input
VI
input voltage
VIH
HIGH-level input
voltage
SUP3; SUP4; SUP8
0.7VDDE_IOx
(x = A, B, C)
-
-
V
VIL
LOW-level input
voltage
SUP3; SUP4; SUP8
-
-
0.3VDDE_IOx
(x = A, B, C)
V
Vhys
hysteresis voltage
SUP4; SUP8;
V
1.8 V mode
400
-
600
mV
3.3 V mode
550
-
850
mV
SUP3
0.1VDDE_IOC
-
-
V
IIL
LOW-level input
current
VI = 0 V; no pull-up
-
-
2.1
A
IIH
HIGH-level input
current
VI = VDD(IO); no
pull-down
-
-
3.9
A
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Table 12: Static characteristics …continued
Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
Ilatch
I/O latch-up current
(1.5VDD(IO)) < VI <
(1.5VDD(IO))
-
-
100
mA
Ipu
pull-up current
inputs with pull-up;
VI = 0;
SUP4; SUP8; 1.8 V
mode
[1]
47
65
103
A
SUP4; SUP8; 3.3 V
mode
[1]
45
50
101
A
29
50
76
A
SUP3
Ipd
pull-down current
inputs with pull-down;
VI = VDD(IO);
SUP4; SUP8;
1.8 V mode
[1]
49
75
110
A
SUP4; SUP8;
3.3 V mode
[1]
56
50
110
A
SUP3
[1]
25
50
68
A
-
-
VDD(IO)
V
1.8 V mode
VDD(IO)  0.36
-
-
V
3.3 V mode
VDD(IO)  0.32
-
-
V
SUP3; IOH = 6 mA
VDD(IO)  0.26
-
-
V
SUP3; IOH = 30 mA
VDD(IO)  0.38
-
-
V
Output pins and I/O pins configured as output
VO
output voltage
VOH
HIGH-level output
voltage
VOL
LOW-level output
voltage
SUP4; SUP8;
IOH = 6 mA:
SUP4; SUP8 outputs;
IOL = 4 mA
1.8 V mode
-
-
0.2
V
-
-
0.4
V
SUP3; IOL = 4 mA
-
-
0.4
V
VDD(IO) = 1.8 V;
VOH = VDD  0.4 V
1
-
-
mA
VDD(IO) = 3.3 V;
VOH = VDD  0.4 V
2.5
-
-
mA
VDD(IO) = 1.8 V;
VOL = 0.4 V
4.3
-
-
mA
VDD(IO) = 3.3 V;
VOL = 0.4 V
6.2
-
-
mA
-
-
0.064
A
3.3 V mode
IOH
IOL
HIGH-level output
current
LOW-level output
current
IOZ
OFF-state output
current
VO = 0 V; VO = VDD;
no pull-up/down
Zo
output impedance
VDD = VDDE_IOx
(x = A, B, C)
[1]
1.8 V mode
[1]
-
45
-

3.3 V mode
[1]
-
35
-

I2C0-bus pins
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Table 12: Static characteristics …continued
Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IOZ
OFF-state output
current
VO = 0 V; VO = VDD;
no pull-up/down
-
-
7.25
A
VIH
HIGH-level input
voltage
[1]
0.7VDDE_IOC
-
-
V
VIL
LOW-level input
voltage
[1]
-
-
0.3VDDE_IOC
V
Vhys
hysteresis voltage
VOL
LOW-level output
voltage
IOLS = 3 mA
ILI
input leakage current
VDDE voltage domain;
Tamb = 25 C
VDD voltage domain;
Tamb = 25 C
0.1VDDE_IOC
-
-
V
-
-
0.298
V
[1]
-
1.7
-
A
[1]
-
0.01
-
A
USB
VIC
common-mode input
voltage
Vi(dif)
[1]
high-speed mode
50
200
500
mV
full-speed/low-speed
mode
800
-
2500
mV
chirp mode
50
-
600
mV
100
400
1100
mV
differential input
voltage
The parameter values specified are simulated values.
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Table 13. ADC static characteristics
VDD(ADC) = 2.7 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
VIA
analog input voltage
Nres(ADC)
ADC resolution
ED
differential linearity error
EL(adj)
integral non-linearity
Verr(O)
offset error voltage
Conditions
Min
[1]
[1]
On pin ADC10B_GNDA.
[2]
Conditions: VSSA = 0 V on pin ADC10B_GNDA, VDD(ADC) = 3.3 V.
Typ
Max
Unit
0
-
VDD(ADC)
V
2
-
10
bit
[2][3][4]
-
-
1
LSB
[2][5]
-
-
1
LSB
20
-
+20
mV
[3]
The ADC is monotonic, there are no missing codes.
[4]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 10.
[5]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 10.
[6]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 10.
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offset
error
EO
gain
error
EG
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
offset error
EO
1 LSB =
VDD(ADC) - VSSA
1024
002aae752
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 10. ADC characteristics
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8.1 Power consumption
Table 14.
Symbol
Power consumption
Parameter
Standby power
IDD
P
Conditions
Min
Typ
Max
Unit
core; VDDI = 1.2 V
-
1.1
-
mA
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
-
0.175
-
mA
VDDE_IOA = 1.8 V
-
0.001
-
mA
VDDE_IOB = 1.8 V
-
0.0008
-
mA
VDDE_IOC = 3.3 v
-
0.065
-
mA
ADC10B_VDDA33 = 3.3 V
-
0
-
mA
USB_VDDA33 = 3.3 V
-
0
-
mA
USB_VDDA_DRV = 3.3 V
-
0
-
mA
Total for supply domains SUP1, SUP3, SUP4,
SUP8
-
1.75
-
mW
mode[1]
Supply current
Power dissipation
External SDRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); heavy SDRAM load power;
without dynamic clock scaling[2]
IDD
P
Supply current
Power dissipation
core; VDDI = 1.2 V
-
86
-
mA
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
-
1.61
-
mA
VDDE_IOA = 1.8 V
-
10.5
-
mA
VDDE_IOB = 1.8 V
-
5.8
-
mA
VDDE_IOC = 3.3 V
-
0.52
-
mA
ADC10B_VDDA33 = 3.3 V
-
0.0002
-
mA
USB_VDDA33 = 3.3 V
-
1.66
-
mA
USB_VDDA_DRV = 3.3 V
-
0.895
-
mA
Total for supply domains SUP1, SUP3, SUP4,
SUP8
-
144.6
-
mW
External SDRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); heavy SDRAM load power;
with dynamic clock scaling[2][3]
IDD
P
Supply current
Power dissipation
LPC3141_43
Product data sheet
core; VDDI = 1.2 V
-
67
-
mA
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
-
1.61
-
mA
VDDE_IOA = 1.8 V
-
10.5
-
mA
VDDE_IOB = 1.8 V
-
5.8
-
mA
VDDE_IOC = 3.3 V
-
0.52
-
mA
ADC10B_VDDA33 = 3.3 V
-
0.0002
-
mA
USB_VDDA33 = 3.3 V
-
1.66
-
mA
USB_VDDA_DRV = 3.3 V
-
0.895
-
mA
Total for supply domains SUP1, SUP3, SUP4,
SUP8
-
121.8
-
mW
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Table 14.
Symbol
Power consumption …continued
Parameter
Conditions
Min
Typ
Max
Unit
External SDRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); normal mode power; without
dynamic clock scaling[4]
IDD
P
Supply current
Power dissipation
core; VDDI = 1.2 V
-
36.1
-
mA
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
-
1.61
-
mA
VDDE_IOA = 1.8 V
-
3.79
-
mA
VDDE_IOB = 1.8 V
-
3.75
-
mA
VDDE_IOC = 3.3 V
-
0.67
-
mA
ADC10B_VDDA33 = 3.3 V
-
0.0002
-
mA
USB_VDDA33 = 3.3 V
-
1.66
-
mA
USB_VDDA_DRV = 3.3 V
-
0.895
-
mA
Total for supply domains SUP1, SUP3, SUP4,
SUP8
-
69.46
-
mW
External SDRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); normal mode power; with
dynamic clock scaling[3][4]
IDD
P
Supply current
Power dissipation
core; VDDI = 1.2 V
-
17.8
-
mA
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
-
1.61
-
mA
VDDE_IOA = 1.8 V
-
3.79
-
mA
VDDE_IOB = 1.8 V
-
3.75
-
mA
VDDE_IOC = 3.3 V
-
0.67
-
mA
ADC10B_VDDA33 = 3.3 V
-
0.0002
-
mA
USB_VDDA33 = 3.3 V
-
1.66
-
mA
USB_VDDA_DRV = 3.3 V
-
0.895
-
mA
Total for supply domains SUP1, SUP3, SUP4,
SUP8
-
47.5
-
mW
Internal SRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); normal mode power; without
dynamic clock scaling; MMU on[5]
IDD
P
Supply current
Power dissipation
LPC3141_43
Product data sheet
core; VDDI = 1.2 V
-
60.8
-
mA
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
-
2.1
-
mA
VDDE_IOA = 1.8 V
-
2.25
-
mA
VDDE_IOB = 1.8 V
-
0
-
mA
VDDE_IOC = 3.3 V
-
0.79
-
mA
ADC10B_VDDA33 = 3.3 V
-
0.0002
-
mA
USB_VDDA33 = 3.3 V
-
0.89
-
mA
USB_VDDA_DRV = 3.3 V
-
1.75
-
mA
Total for supply domains SUP1, SUP3, SUP4,
SUP8
-
90.86
-
mW
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Table 14.
Symbol
Power consumption …continued
Parameter
Conditions
Min
Typ
Max
Unit
Internal SRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); normal mode power; without
dynamic clock scaling; MMU off[6]
IDD
Supply current
P
Power dissipation
core; VDDI = 1.2 V
-
37.95
-
mA
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
-
2.1
-
mA
VDDE_IOA = 1.8 V
-
2.25
-
mA
VDDE_IOB = 1.8 V
-
0
-
mA
VDDE_IOC = 3.3 V
-
0.79
-
mA
ADC10B_VDDA33 = 3.3 V
-
0.0002
-
mA
USB_VDDA33 = 3.3 V
-
0.89
-
mA
USB_VDDA_DRV = 3.3 V
-
1.75
-
mA
Total for supply domains SUP1, SUP3, SUP4,
SUP8
-
63.44
-
mW
Internal SRAM based system (operating frequency 270 MHz (core)/ 90 MHz (bus)); normal mode power; with
dynamic clock scaling; MMU off[3][6]
IDD
Supply current
P
Power dissipation
core; VDDI = 1.2 V
-
17.8
-
mA
all other SUP1 supplies: VDDA12 = 1.2 V;
USB_VDDA12_PL = 1.2 V
-
2.1
-
mA
VDDE_IOA = 1.8 V
-
2.25
-
mA
VDDE_IOB = 1.8 V
-
0
-
mA
VDDE_IOC = 3.3 V
-
0.79
-
mA
ADC10B_VDDA33 = 3.3 V
-
0.0002
-
mA
USB_VDDA33 = 3.3 V
-
0.89
-
mA
USB_VDDA_DRV = 3.3 V
-
1.75
-
mA
Total for supply domains SUP1, SUP3, SUP4,
SUP8
-
39.26
-
mW
[1]
12 Mhz oscillator running; PLLs off; SYS_BASE and AHB_APB0_BASE Base domain clocks are enabled, driven by 12 Mhz oscillator;
all peripherals off; SUP4 buffers set to input w/PD; SUP8 and SUP3 buffers set to input w/repeater. Shutting off the 12 Mhz osc will
reduce power to 1.4 mW (requires a RSTIN_N to run again).
[2]
Running Linux with 100% load; all peripherals on; instruction and data caches on; MMU on.
[3]
Dynamic clock scaling active; hardware will automatically switch the SYSBASE clocks to a slow clock (180 / 64 = 2.81 MHz) during
times of bus inactivity. ARM926 and NAND flash clocks are not scaled for this test.
[4]
Running Linux idle at prompt; all peripherals on; instruction and data caches on; MMU on.
[5]
Running Dhrystone test (600 k/sec); UART and timers enabled; instruction and data caches on; MMU on.
[6]
Running Dhrystone test (121.83 k/sec); UART and timers enabled; instruction and data caches off; MMU off.
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9. Dynamic characteristics
9.1 LCD controller
9.1.1 Intel 8080 mode
Table 15. Dynamic characteristics: LCD controller in Intel 8080 mode
CL = 25 pF, Tamb = 40 C to +85 C, unless otherwise specified; VDD(IO) = 1.8 V and 3.3 V (SUP8).
Symbol
Parameter
tsu(A)
th(A)
Min
Typ
Max
Unit
address set-up time
-
1  LCDCLK
-
ns
address hold time
-
2  LCDCLK
-
ns
access cycle time
[1]
-
5  LCDCLK
-
ns
write enable pulse width
[1]
-
2  LCDCLK
-
ns
tw(en)R
read enable pulse width
[1]
-
2  LCDCLK
-
ns
tr
rise time
2
-
5
ns
tf
fall time
2
-
5
ns
td(QV)
data output valid delay time
-
1  LCDCLK
-
ns
tdis(Q)
data output disable time
-
2  LCDCLK
-
ns
tcy(a)
tw(en)W
[1]
Conditions
Timing is determined by the LCD Interface Control Register fields: INVERT_CS = 1; MI = 0; PS = 0;
INVERT_E_RD = 0. See the LPC314x user manual.
th(A)
mLCD_RS
mLCD_CSB
tcy(a)
tsu(A)
tw(en)R and tw(en)W
mLCD_RW_WR,
mLCD_E_RD
tf
tr
tsu(D)
th(D)
mLCD_DB[15:0] (16 bit mode),
mLCD_DB[15:8] (8 bit mode),
mLCD_DB[15:12] (4 bit mode)
read access
td(QV)
tdis(Q)
mLCD_DB[15:0] (16 bit mode),
mLCD_DB[15:8] (8 bit mode),
mLCD_DB[15:12] (4 bit mode)
write access
002aae207
Fig 11. LCD timing (Intel 8080 mode)
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9.1.2 Motorola 6800 mode
Table 16. Dynamic characteristics: LCD controller in Motorola 6800 mode
CL = 25 pF, Tamb = 40 C to +85 C, unless otherwise specified; VDD(IO) = 1.8 V and 3.3 V (SUP8).
Symbol
Parameter
tsu(A)
th(A)
Conditions
Min
Typ
Max
Unit
address set-up time
-
1  LCDCLK
-
ns
address hold time
-
2  LCDCLK
-
ns
-
5  LCDCLK
-
ns
2
-
5
ns
[1]
tcy(a)
access cycle time
tr
rise time
tf
fall time
2
-
5
ns
td(QV)
data output valid delay time
-
1  LCDCLK
-
ns
tdis(Q)
data output disable time
-
2  LCDCLK
-
ns
tw(en)
enable pulse width
read cycle
-
2  LCDCLK
-
ns
write cycle
-
2  LCDCLK
-
ns
[1]
Timing is derived from the LCD Interface Control Register fields: INVERT_CS = 1; MI = 1; PS = 0;
INVERT_E_RD = 0. See the LPC314x user manual.
mLCD_CSB
tcy(a)
tw(en)
mLCD_E_RD
tr
tf
th(A)
tsu(A)
mLCD_RS,
mLCD_RW_WR
tsu(D)
th(D)
mLCD_DB[15:0] (16 bit mode),
mLCD_DB[15:8] (8 bit mode),
mLCD_DB[15:12] (4 bit mode)
read access
td(QV)
mLCD_DB[15:0] (16 bit mode),
mLCD_DB[15:8] (8 bit mode),
mLCD_DB[15:12] (4 bit mode)
tdis(Q)
write access
002aae208
Fig 12. LCD timing (Motorola 6800 mode)
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9.1.3 Serial mode
Table 17. Dynamic characteristics: LCD controller serial mode
CL = 25 pF, Tamb = 40 C to +85 C, unless otherwise specified; VDD(IO) = 1.8 V and 3.3 V (SUP8).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tcy(clk)
clock cycle time
[1]
-
5  LCDCLK
-
ns
tw(clk)H
HIGH clock pulse width
[1]
-
3  LCDCLK
-
ns
tw(clk)L
LOW clock pulse width
[1]
-
2  LCDCLK
-
ns
tr
rise time
2
-
5
ns
tf
fall time
2
-
5
ns
tsu(A)
address set-up time
-
3  LCDCLK
-
ns
th(A)
address hold time
-
2  LCDCLK
-
ns
tsu(S)
chip select set-up time
-
3  LCDCLK
-
ns
th(S)
chip select hold time
-
1  LCDCLK
-
ns
td(QV)
data output valid delay time
-
1  LCDCLK -
ns
[1]
Timing is determined by the LCD Interface Control Register fields: PS = 1; SERIAL_CLK_SHIFT = 3;
SERIAL_READ_POS = 3. See the LPC314x user manual.
tsu(S)
th(S)
mLCD_CSB
tsu(A)
th(A)
mLCD_RS
Tcy(clk)
tw(clk)L
mLCD_DB13
(serial clock)
tw(clk)H
tf
tr
tsu(D)
th(D)
mLCD_DB14
(serial data in)
td(QV)
tdis(Q)
mLCD_DB15
(serial data out)
002aae209
Fig 13. LCD timing (serial mode)
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9.2 SRAM controller
Table 18. Dynamic characteristics: static external memory interface
CL = 25 pF, Tamb = 40 C to +85 C, unless otherwise specified; VDD(IO) = 1.8 V and 3.3 V (SUP8).
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
1.8
0
4
ns
Common to read and write cycles
tCSLAV
CS LOW to address valid
time
Read cycle parameters
tOELAV
OE LOW to address valid
time
[1][2]
-
0  WAITOEN  HCLK
-
ns
tBLSLAV
BLS LOW to address valid
time
[1][2]
-
0  WAITOEN  HCLK
-
ns
tCSLOEL
CS LOW to OE LOW time
[3][4]
-
0 + WAITOEN  HCLK
-
ns
tCSLBLSL
CS LOW to BLS LOW time
[1][5]
-
0 + WAITOEN  HCLK
-
ns
tOELOEH
OE LOW to OE HIGH time
[1][6][7]
-
(WAITRD  WAITOEN + 1)  HCLK
-
ns
-
(WAITRD  WAITOEN + 1)  HCLK
-
ns
[12]
tBLSLBLSH
BLS LOW to BLS HIGH time
[1][7]
[12]
tsu(D)
data input set-up time
9
-
-
ns
th(D)
data input hold time
-
0
-
ns
tCSHOEH
CS HIGH to OE HIGH time
3
0
-
ns
tCSHBLSH
CS HIGH to BLS HIGH time
-
0
-
ns
tOEHANV
OE HIGH to address invalid
time
10
-
-
ns
tBLSHANV
BLS HIGH to address invalid
time
-
1  HCLK
-
ns
Write cycle parameters
tCSLDV
-
-
9
ns
CS LOW to WE LOW time
[8][13]
-
(WAITWEN + 1)  HCLK
-
ns
tCSLBLSL
CS LOW to BLS LOW time
[9][13]
-
WAITWEN  HCLK
-
ns
tWELDV
WE LOW to data valid time
[10][13]
-
0  (WAITWEN + 1)  HCLK
-
ns
WE LOW to WE HIGH time
[7][8]
-
(WAITWR  WAITWEN + 1)  HCLK
-
ns
-
(WAITWR  WAITWEN + 3)  HCLK
-
ns
-
1  HCLK
-
ns
tCSLWEL
tWELWEH
CS LOW to data valid time
[13][14]
tBLSLBLSH
BLS LOW to BLS HIGH time
[11][13]
[14]
tWEHANV
WE HIGH to address invalid
time
tWEHDNV
WE HIGH to data invalid time
-
1  HCLK
-
ns
tBLSHANV
BLS HIGH to address invalid
time
-
1  HCLK
-
ns
tBLSHDNV
BLS HIGH to data invalid
time
-
1  HCLK
-
ns
[1]
Refer to the LPC314x user manual for the programming of WAITOEN and HCLK.
[2]
Only when WAITRD is  to WAITOEN, otherwise OE, CS, BLS and Address will change state about the same time.
[3]
WAITRD must  to WAITOEN for there to be any delay between CS active and OE active. The maximum delay is limited to (WAITRD *
HCLK).
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[4]
One HCLK cycle delay added when SYSCREG_MPMC_WAITREAD_DELAYx register bit 5 = 1.
[5]
WAITRD must  to WAITOEN for there to be any delay between CS active and BLS active. The maximum delay is limited to (WAITRD
* HCLK).
[6]
There is one less HCLK cycle when SYSCREG_MPMC_WAITREAD_DELAYx bit 5 = 1.
[7]
The MPMC will ensure a minimum of one HCLK for this parameter.
[8]
This formula applies when WAITWR is  WAITWEN. One HCLK cycle minimum.
[9]
This formula applies when WAITWR is  WAITWEN.
[10] This formula applies when WAITWR is  WAITWEN. Data valid minimum One HCLK cycle before WE goes active.
[11] This formula applies when WAITWR is  WAITWEN. Three HCLK cycles minimum.
[12] Refer to the LPC314x user manual UM10362 for the programming of WAITRD and HCLK.
[13] Refer to the LPC314x user manual UM10362 for the programming of WAITWEN and HCLK.
[14] Refer to the LPC314x user manual UM10362 for the programming of WAITWR and HCLK.
EBI_NSTCS_X
tCSLAV
EBI_A_[15:0]
tCSHOEH
tOELAV
EBI_DQM_0_NOE
tOELOEH
tCSLOEL
tOEHANV
tBLSLAV
tCSHBLSH
EBI_NCAS_BLOUT_0
EBI_NRAS_BLOUT_1
tBLSLBLSH
tCSLBLSL
tBLSHANV
EBI_D_[15:0]
th(DQ)
tsu(DQ)
002aae161
Fig 14. External memory read access to static memory
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EBI_NSTCS_X
tCSLAV
EBI_A_[15:0]
tBLSHANV
tCSLDV
tWEHANV
EBI_D_[15:0]
tWELWEH
tCSLWEL
tWEHDNV
tWELDV
tBLSHDNV
EBI_NWE
tBLSLBLSH
tCSLBLSL
EBI_NCAS_BLOUT_0
EBI_NRAS_BLOUT_1
002aae162
Fig 15. External memory write access to static memory
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9.3 SDRAM controller
Table 19. Dynamic characteristics of SDR SDRAM memory interface
Tamb = 40 C to +85 C, unless otherwise specified; VDD(IO) = 1.8 V and 3.3 V (SUP8).[1][2][3]
Symbol
Parameter
Conditions
[4]
Min
Typical
Max
Unit
-
80
90
MHz
foper
operating frequency
tCLCX
clock LOW time
-
5.55
-
ns
tCHCX
clock HIGH time
-
5.55
-
ns
-
-
3.6
ns
on pins
EBI_NRAS_BLOUT,
EBI_NCAS_BLOUT,
EBI_NWE,
EBI_NDYCS
-
-
3.6
ns
on pins EBI_DQM_1,
EBI_DQM_0_NOE
-
-
5
ns
0.13
-
3.6
ns
on pins
EBI_NRAS_BLOUT,
EBI_NCAS_BLOUT,
EBI_NWE,
EBI_NDYCS
0.1
-
3.6
ns
on pins EBI_DQM_1,
EBI_DQM_0_NOE
1.7
-
5
ns
-
5
ns
output delay time
td(o)
th(o)
output hold time
[5]
on pin EBI_CKE
[5]
on pin EBI_CKE
td(AV)
address valid delay
time
[5]
-
th(A)
address hold time
[5]
0.1
-
5
ns
td(QV)
data output valid
delay time
[5]
-
-
9
ns
th(Q)
data output hold time
[5]
4
-
10
ns
tQZ
data output
high-impedance time
-
-
<TCLCL
ns
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
All values valid for pads set to high slew rate. VDDE_IOA = VDDE_IOB = 1.8 0.15 V. VDDI = 1.2  0.1 V.
[3]
Refer to the LPC3141/3143 user manual for the programming of MPMCDynamicReadConfig and SYSCREG_MPMP_DELAYMODES
registers
[4]
foper = 1 / TCLCL
[5]
td(o), th(o), td(AV), th(A), td(QV), th(Q) times are dependent on MPMCDynamicReadConfig register value and
SYSCREG_MPMP_DELAYMODES register bits 11:6
[6]
tsu(D), th(D) times are dependent on SYSCREG_MPMP_DELAYMODES register bits 5:0
LPC3141_43
Product data sheet
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TCLCL
tCLCX
tCHCX
EBI_CLKOUT
td(o)
EBI_NRAS_BLOUT
EBI_NCAS_BLOUT
EBI_NWE
EBI_CKE
EBI_NDYCS
th(o)
READ
NOP
NOP
NOP
td(o)
READ
NOP
NOP
th(o)
EBI_DQMx
th(A)
EBI_A_[15:2]
BANK,
COLUMN
tsu(D) th(D)
EBI_D_[15:0]
DATA n
CAS
LATENCY = 2
DATA n+2
DATA n+1
DATA n+3
002aae121
EBI_CKE is HIGH.
Fig 16. SDRAM burst read timing
LPC3141_43
Product data sheet
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TCLCL
tCLCX
tCHCX
EBI_CLKOUT
td(o)
th(o)
EBI_CKE
td(o)
th(o)
ACTIVE
WRITE
EBI_DQMx
th(A)
EBI_A_[15:2]
td(AV)
BANK,
COLUMN
BANK,
ROW
EBI_D_[15:0]
DATA
td(QV)
th(Q)
002aae123
Fig 17. SDRAM bank activate and write timing
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Low-cost, low-power ARM926EJ microcontrollers
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EBI_NRAS_BLOUT
EBI_NCAS_BLOUT
EBI_NWE
EBI_CKE
EBI_NDYCS
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9.4 NAND flash memory controller
Table 20. Dynamic characteristics of the NAND Flash memory controller
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Typical
Unit
tREH
RE HIGH hold time
[1][2][3]
THCLK  (TREH)
ns
RE pulse width
[1][2][3]
THCLK  (TRP)
ns
tWH
WE HIGH hold time
[1][2][3]
THCLK  (TWH)
ns
tWP
WE pulse width
[1][2][3]
THCLK  (TWP)
ns
tCLS
CLE set-up time
[1][2][3]
THCLK  (TCLS)
ns
CLE hold time
[1][2][3]
THCLK  (TCLH)
ns
tALS
ALE set-up time
[1][2][3]
THCLK  (TALS)
ns
tALH
ALE hold time
[1][2][3]
THCLK  (TALH)
ns
tCS
CE set-up time
[1][2][3]
THCLK  (TCS)
ns
CE hold time
[1][2][3]
THCLK  (TCH)
ns
tRP
tCLH
tCH
[1]
THCLK = 1 / NANDFLASH_NAND_CLK, see LPC314x user manual.
[2]
See registers NandTiming1 and NandTiming2 in the LPC314x user manual.
[3]
Each timing parameter can be set from 7 nand_clk clock cycles to 1 nand_clk clock cycle. (A programmed
zero value is treated as a one).
mNAND_NCS
tCS
tCH
tWP tWH
EBI_NWE
EBI_A_1_CLE
tCLS
tCLH
EBI_A_0_ALE
tALS
tALH
tRP tREH
EBI_DQM_0_NOE
002aae353
Fig 18.
LPC3141_43
Product data sheet
NAND flash controller write and read timing
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9.5 Crystal oscillator
Table 21:
Dynamic characteristics: crystal oscillator
Symbol
Parameter
fosc
Conditions
Min
Typ
Max
Unit
oscillator frequency
10
12
25
MHz
clk
clock duty cycle
45
50
55
%
Cxtal
crystal capacitance
input; on pin
FFAST_IN
-
-
2
pF
output; on pin
FFAST_OUT
-
-
0.74
pF
tstartup
start-up time
-
500
-
s
Pdrive
drive power
100
-
500
µW
9.6 SPI
Table 22. Dynamic characteristics of SPI pins
Tamb = 40 C to +85 C for industrial applications
Symbol
Parameter
Min
Typ
Max
Unit
TSPICYC
SPI cycle time
22.2
-
-
ns
tSPICLKH
SPICLK HIGH time
11.09
-
11.14
ns
tSPICLKL
SPICLK LOW time
11.09
-
11.14
ns
tSPIQV
SPI data output valid time
-
-
14
ns
tSPIOH
SPI output data hold time
9.9
-
-
ns
SPI output data hold time
9.9
-
-
ns
SPI master
SPI slave
tSPIOH
Remark: Note that the signal names SCK, MISO, and MOSI correspond to signals on
pins SPI_SCK, SPI_MOSI, and SPI_MISO in the following SPI timing diagrams.
TSPICYC
tSPICLKH
tSPICLKL
SCK (CPOL = 0)
SCK (CPOL = 1)
tSPIOH
tSPIQV
DATA VALID
MOSI
DATA VALID
tSPIDSU
MISO
DATA VALID
tSPIDH
DATA VALID
002aad986
Fig 19.
LPC3141_43
Product data sheet
SPI master timing (CPHA = 1)
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TSPICYC
tSPICLKH
tSPICLKL
SCK (CPOL = 0)
SCK (CPOL = 1)
tSPIOH
tSPIQV
DATA VALID
MOSI
DATA VALID
tSPIDSU
MISO
DATA VALID
tSPIDH
DATA VALID
002aad987
Fig 20.
SPI master timing (CPHA = 0)
TSPICYC
tSPICLKH
tSPICLKL
tSPIDSU
tSPIDH
SCK (CPOL = 0)
SCK (CPOL = 1)
MOSI
DATA VALID
DATA VALID
tSPIOH
tSPIQV
MISO
DATA VALID
DATA VALID
002aad988
Fig 21.
LPC3141_43
Product data sheet
SPI slave timing (CPHA = 1)
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TSPICYC
tSPICLKH
tSPICLKL
SCK (CPOL = 0)
SCK (CPOL = 1)
tSPIDSU
MOSI
DATA VALID
tSPIDH
DATA VALID
tSPIQV
MISO
tSPIOH
DATA VALID
DATA VALID
002aad989
Fig 22.
SPI slave timing (CPHA = 0)
9.6.1 Texas Instruments synchronous serial mode (SSI mode)
Table 23. Dynamic characteristic: SPI interface (SSI mode)
Tamb = 40 C to +85 C; VDD(IO) (SUP3) over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
tsu(SPI_MISO)
SPI_MISO set-up time
Tamb = 25 C;
measured in
SPI Master
mode; see
Figure 23
-
11
-
ns
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
Remark: Note that the signal names SCK, MISO, and MOSI correspond to signals on
pins SPI_SCK, SPI_MOSI, and SPI_MISO in the following SPI timing diagram.
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Product data sheet
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shifting edges
SCK
sampling edges
MOSI
MISO
tsu(SPI_MISO)
002aad326
Fig 23. MISO line set-up time in SSI Master mode
9.7 10-bit ADC
Table 24:
Dynamic characteristics: 10-bit ADC
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fs
sampling frequency
10 bit resolution
400
-
-
kSamples/s
2 bit resolution
-
-
1500
kSamples/s
10 bit resolution
-
-
11
clock cycles
2 bit resolution
3
-
-
clock cycles
tconv
LPC3141_43
Product data sheet
conversion time
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LPC3141_43
Product data sheet
10. Application information
Table 25.
LCD panel connections
TFBGA pin #
Pin name
Reset function
(default)
LCD mode
Parallel
Serial
LCD panel data mapping
Control function
16 bit
8 bit
4 bit
6800
8080
mLCD_CSB/EBI_NSTCS_0
LCD_CSB
-
-
-
LCD_CSB
LCD_CSB
LCD_CSB
L8
mLCD_E_RD/EBI_CKE
LCD_E_RD
-
-
-
LCD_E
LCD_RD
-
P8
mLCD_RS/EBI_NDYCS
LCD_RS
-
-
-
LCD_RS
LCD_RS
LCD_RS
N9
mLCD_RW_WR/EBI_DQM_1
LCD_RW_WR
-
-
-
LCD_RW
LCD_WR
-
N8
mLCD_DB_0/EBI_CLKOUT
LCD_DB_0
LCD_DB_0
-
-
-
-
-
P9
mLCD_DB_1/EBI_NSTCS_1
LCD_DB_1
LCD_DB_1
-
-
-
-
-
N6
mLCD_DB_2/EBI_A_2
LCD_DB_2
LCD_DB_2
-
-
-
-
-
P6
mLCD_DB_3/EBI_A_3
LCD_DB_3
LCD_DB_3
-
-
-
-
-
N7
mLCD_DB_4/EBI_A_4
LCD_DB_4
LCD_DB_4
-
-
-
-
-
P7
mLCD_DB_5/EBI_A_5
LCD_DB_5
LCD_DB_5
-
-
-
-
-
K6
mLCD_DB_6/EBI_A_6
LCD_DB_6
LCD_DB_6
-
-
-
-
-
P5
mLCD_DB_7/EBI_A_7
LCD_DB_7
LCD_DB_7
-
-
-
-
-
mLCD_DB_8/EBI_A_8
LCD_DB_8
LCD_DB_8
LCD_DB_0
-
-
-
-
L5
mLCD_DB_9/EBI_A_9
LCD_DB_9
LCD_DB_9
LCD_DB_1
-
-
-
-
K7
mLCD_DB_10/EBI_A_10
LCD_DB_10
LCD_DB_10
LCD_DB_2
-
-
-
-
N4
mLCD_DB_11/EBI_A_11
LCD_DB_11
LCD_DB_11
LCD_DB_3
-
-
-
-
K5
mLCD_DB_12/EBI_A_12
LCD_DB_12
LCD_DB_12
LCD_DB_4
LCD_DB_0 -
-
-
P4
mLCD_DB_13/EBI_A_13
LCD_DB_13
LCD_DB_13
LCD_DB_5
LCD_DB_1 -
-
SER_CLK
P3
mLCD_DB_14/EBI_A_14
LCD_DB_14
LCD_DB_14
LCD_DB_6
LCD_DB_2 -
-
SER_DAT_IN
N3
mLCD_DB_15/EBI_A_15
LCD_DB_15
LCD_DB_15
LCD_DB_7
LCD_DB_3 -
-
SER_DAT_OUT
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K8
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
11. Marking
Table 26.
LPC3141_43
Product data sheet
LPC3141/3143 Marking
Line
Marking
Description
A
LPC3141/3143
BASIC_TYPE
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12. Package outline
TFBGA180: thin fine-pitch ball grid array package; 180 balls
SOT570-3
A
B
D
ball A1
index area
E
A2
A
A1
detail X
e1
e
1/2 e
∅v
∅w
b
M
M
C
C A B
C
y
y1 C
P
N
M
L
K
J
H
G
F
E
D
C
B
A
ball A1
index area
e
e2
1/2 e
1
2
3
4
5
6
7
8
9
10
11
12
13
X
14
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
max
nom
min
A
A1
A2
b
D
E
e
e1
e2
v
w
y
y1
1.20
1.06
0.95
0.40
0.35
0.30
0.80
0.71
0.65
0.50
0.45
0.40
12.1
12.0
11.9
12.1
12.0
11.9
0.8
10.4
10.4
0.15
0.05
0.12
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
08-07-09
10-04-15
SOT570-3
Fig 24. LPC3141/3143 TFBGA180 package outline
LPC3141_43
Product data sheet
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13. Abbreviations
Table 27.
LPC3141_43
Product data sheet
Abbreviations
Acronym
Description
A/D
Analog-to-Digital
ADC
Analog-to-Digital Converter
AES
Advanced Encryption Standard
AHB
Advanced High-performance Bus
AMBA
Advanced Microcontroller Bus Architecture
APB
ARM Peripheral Bus
ATA
Advanced Transport Architecture
BIU
Bus Interface Unit
CBC
Cipher Block Chaining
CE
Consumer Electronics
CGU
Clock Generation Unit
CRC
Cyclic Redundancy Check
DFU
Device Firmware Upgrade
DMA
Direct Memory Access
DRM
Digital Rights Management
DSP
Digital Signal Processing
EBI
External Bus Interface
ECC
Error Correction Code
EOP
End Of Packet
ESD
Electrostatic Discharge
FIFO
First In, First Out
FPGA
Field Programmable Gate Array
GF
Galois Field
IOCONFIG
Input Output Configuration
IOM
ISDN Oriented Modular
IrDA
Infrared Data Association
ISRAM
Internal Static RAM
ISROM
Internal Static ROM
JTAG
Joint Test Action Group
LSB
Least Significant Bit
MCI
Memory Card Interface
MCU
Microcontroller Unit
MMC
Multi-Media Card
MPMC
Multi-Port Memory Controller
OTG
On-The-Go
PCM
Pulse Code Modulation
PHY
Physical Layer
PLL
Phase Locked Loop
PWM
Pulse Width Modulation
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Table 27.
LPC3141_43
Product data sheet
Abbreviations …continued
Acronym
Description
RNG
Random Number Generator
ROM
Read-Only Memory
SD
Secure Digital
SDHC
Secure Digital High Capacity
SDIO
Secure Digital Input Output
SDR SDRAM
Single Data Rate Synchronous Dynamic Random Access Memory
SE0
Single Ended 0
SIR
Serial IrDA
SPI
Serial Peripheral Interface
SSI
Serial Synchronous Interface
SysCReg
System Control Registers
TAP
Test Access Port
TDO
Test Data Out
UART
Universal Asynchronous Receiver Transmitter
USB
Universal Serial Bus
UTMI
USB 2.0 Transceiver Macrocell Interface
WDT
WatchDog Timer
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14. Revision history
Table 28:
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LPC3141_43 v.1
20120604
Product data sheet
-
-
LPC3141_43
Product data sheet
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15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
LPC3141_43
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 June 2012
© NXP B.V. 2012. All rights reserved.
67 of 69
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
LPC3141_43
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 4 June 2012
© NXP B.V. 2012. All rights reserved.
68 of 69
LPC3141/3143
NXP Semiconductors
Low-cost, low-power ARM926EJ microcontrollers
17. Contents
1
2
2.1
3
3.1
4
5
5.1
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
6.13
6.14
6.15
6.16
6.17
6.18
6.19
6.20
6.21
6.22
6.23
6.24
6.25
6.26
6.27
6.28
6.28.1
6.28.2
6.28.3
6.29
6.30
6.31
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . 13
ARM926EJ-S . . . . . . . . . . . . . . . . . . . . . . . . . 13
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 14
JTAG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
NAND flash controller . . . . . . . . . . . . . . . . . . . 15
Multi-Port Memory Controller (MPMC) . . . . . . 16
External Bus Interface (EBI) . . . . . . . . . . . . . . 17
Internal Static ROM (ISROM) . . . . . . . . . . . . . 17
Internal RAM memory. . . . . . . . . . . . . . . . . . . 18
Memory Card Interface (MCI) . . . . . . . . . . . . . 19
High-speed Universal Serial Bus 2.0
On-The-Go (OTG) . . . . . . . . . . . . . . . . . . . . . 19
DMA controller . . . . . . . . . . . . . . . . . . . . . . . . 20
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 21
Multi-layer AHB . . . . . . . . . . . . . . . . . . . . . . . 21
APB bridge . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Clock Generation Unit (CGU) . . . . . . . . . . . . . 25
Watchdog Timer (WDT) . . . . . . . . . . . . . . . . . 26
Input/Output Configuration module
(IOCONFIG) . . . . . . . . . . . . . . . . . . . . . . . . . . 27
10-bit Analog-to-Digital Converter (ADC10B) . 27
Event router . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Random number generator . . . . . . . . . . . . . . 29
AES decryption (LPC3143 only) . . . . . . . . . . . 29
Secure One-Time Programmable memory
(OTP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Serial Peripheral Interface (SPI) . . . . . . . . . . . 29
Universal Asynchronous Receiver
Transmitter (UART). . . . . . . . . . . . . . . . . . . . . 30
Pulse Code Modulation (PCM) interface . . . . 30
LCD interface . . . . . . . . . . . . . . . . . . . . . . . . . 31
I2C-bus master/slave interface . . . . . . . . . . . . 31
LCD/NAND flash/SDRAM multiplexing . . . . . 32
Pin connections . . . . . . . . . . . . . . . . . . . . . . . 32
Multiplexing between LCD and MPMC . . . . . . 34
Supply domains . . . . . . . . . . . . . . . . . . . . . . . 35
Timer module . . . . . . . . . . . . . . . . . . . . . . . . . 36
Pulse Width Modulation (PWM) module . . . . . 36
System control registers . . . . . . . . . . . . . . . . . 36
6.32
6.32.1
7
8
8.1
9
9.1
9.1.1
9.1.2
9.1.3
9.2
9.3
9.4
9.5
9.6
9.6.1
9.7
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
I2S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2S AHB interface . . . . . . . . . . . . . . . . . . . . . .
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
Static characteristics . . . . . . . . . . . . . . . . . . .
Power consumption . . . . . . . . . . . . . . . . . . . .
Dynamic characteristics. . . . . . . . . . . . . . . . .
LCD controller . . . . . . . . . . . . . . . . . . . . . . . .
Intel 8080 mode . . . . . . . . . . . . . . . . . . . . . . .
Motorola 6800 mode . . . . . . . . . . . . . . . . . . .
Serial mode . . . . . . . . . . . . . . . . . . . . . . . . . .
SRAM controller. . . . . . . . . . . . . . . . . . . . . . .
SDRAM controller . . . . . . . . . . . . . . . . . . . . .
NAND flash memory controller . . . . . . . . . . .
Crystal oscillator. . . . . . . . . . . . . . . . . . . . . . .
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Texas Instruments synchronous serial
mode (SSI mode). . . . . . . . . . . . . . . . . . . . . .
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . .
Application information . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Legal information . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
36
37
38
39
44
47
47
47
48
49
50
53
56
57
57
59
60
61
62
63
64
66
67
67
67
67
68
68
69
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 June 2012
Document identifier: LPC3141_43
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