Data Sheet

LPC122x
32-bit ARM Cortex-M0 microcontroller; up to 128 kB flash and
8 kB SRAM
Rev. 2 — 26 August 2011
Product data sheet
1. General description
The LPC122x extend NXP's 32-bit ARM microcontroller continuum and target a wide
range of industrial applications in the areas of factory and home automation. Benefitting
from the ARM Cortex-M0 Thumb instruction set, the LPC122x have up to 50 % higher
code density compared to common 8/16-bit microcontroller performing typical tasks. The
LPC122x also feature an optimized ROM-based divide library for Cortex-M0, which offers
several times the arithmetic performance of software-based libraries, as well as highly
deterministic cycle time combined with reduced flash code size. The ARM Cortex-M0
efficiency also helps the LPC122x achieve lower average power for similar applications.
The LPC122x operate at CPU frequencies of up to 45 MHz.They offer a wide range of
flash memory options, from 32 kB to 128 kB. The small 512-byte page erase of the flash
memory brings multiple design benefits, such as finer EEPROM emulation, boot-load
support from any serial interface and ease of in-field programming with reduced on-chip
RAM buffer requirements.
The peripheral complement of the LPC122x includes a 10-bit ADC, two comparators with
output feedback loop, two UARTs, one SSP/SPI interface, one I2C-bus interface with
Fast-mode Plus features, a Windowed Watchdog Timer, a DMA controller, a CRC engine,
four general purpose timers, a 32-bit RTC, a 1 % internal oscillator for baud rate
generation, and up to 55 General Purpose I/O (GPIO) pins.
2. Features and benefits
 Processor core
 ARM Cortex-M0 processor, running at frequencies of up to 45 MHz (one wait state
from flash) or 30 MHz (zero wait states from flash). The LPC122x have a high
score of over 45 in CoreMark CPU performance benchmark testing, equivalent to
1.51/MHz.
 ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).
 Serial Wire Debug (SWD).
 System tick timer.
 Memory
 Up to 8 kB SRAM.
 Up to 128 kB on-chip flash programming memory.
 In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
 Includes ROM-based 32-bit integer division routines.
 Clock generation unit
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller






LPC122X
Product data sheet
 Crystal oscillator with an operating range of 1 MHz to 25 MHz.
 12 MHz Internal RC (IRC) oscillator trimmed to 1 % accuracy that can optionally be
used as a system clock.
 PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
 Clock output function with divider that can reflect the system oscillator clock, IRC
clock, main clock, and Watchdog clock.
 Real-Time Clock (RTC).
Digital peripherals
 Micro DMA controller with 21 channels.
 CRC engine.
 Two UARTs with fractional baud rate generation and internal FIFO. One UART with
RS-485 and modem support and one standard UART with IrDA.
 SSP/SPI controller with FIFO and multi-protocol capabilities.
 I2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a
data rate of 1 Mbit/s with multiple address recognition and monitor mode. I2C-bus
pins have programmable glitch filter.
 Up to 55 General Purpose I/O (GPIO) pins with programmable pull-up resistor,
open-drain mode, programmable digital input glitch filter, and programmable input
inverter.
 Programmable output drive on all GPIO pins. Four pins support high-current output
drivers.
 All GPIO pins can be used as edge and level sensitive interrupt sources.
 Four general purpose counter/timers with four capture inputs and four match
outputs (32-bit timers) or two capture inputs and two match outputs (16-bit timers).
 Windowed WatchDog Timer (WWDT); IEC-60335 Class B certified.
Analog peripherals
 One 8-channel, 10-bit ADC.
 Two highly flexible analog comparators. Comparator outputs can be programmed
to trigger a timer match signal or can be used to emulate 555 timer behavior.
Power
 Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
 Processor wake-up from Deep-sleep mode via start logic using 12 port pins.
 Processor wake-up from Deep-power down and Deep-sleep modes via the RTC.
 Brownout detect with three separate thresholds each for interrupt and forced reset.
 Power-On Reset (POR).
 Integrated PMU (Power Management Unit).
Unique device serial number for identification.
3.3 V power supply.
Available as 64-pin and 48-pin LQFP package.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
2 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
3. Applications





eMetering
Lighting
Industrial networking
Alarm systems
White goods
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC1227FBD64/301 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC1226FBD64/301 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC1225FBD64/321 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC1225FBD64/301 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC1224FBD64/121 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC1224FBD64/101 LQFP64 LQFP64: plastic low profile quad flat package; 64 leads; body 10  10  1.4 mm SOT314-2
LPC1227FBD48/301 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
SOT313-2
LPC1226FBD48/301 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
SOT313-2
LPC1225FBD48/321 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
SOT313-2
LPC1225FBD48/301 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
SOT313-2
LPC1224FBD48/121 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
SOT313-2
LPC1224FBD48/101 LQFP48 LQFP48: plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
SOT313-2
LPC122X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
3 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
4.1 Ordering options
Table 2.
Ordering options for LPC122x
Type number
Flash
Total UART
SRAM
I2C/
FM+
SSP/
SPI
ADC
GPIO Package
channels
LPC1227
LPC1227FBD64/301 128 kB 8 kB
2
1
1
8
55
LQFP64
LPC1227FBD48/301 128 kB 8 kB
2
1
1
8
39
LQFP48
LPC1226
LPC1226FBD64/301 96 kB
8 kB
2
1
1
8
55
LQFP64
LPC1226FBD48/301 96 kB
8 kB
2
1
1
8
39
LQFP48
LPC1225FBD64/321 80 kB
8 kB
2
1
1
8
55
LQFP64
LPC1225FBD64/301 64 kB
8 kB
2
1
1
8
55
LQFP64
LPC1225FBD48/321 80 kB
8 kB
2
1
1
8
39
LQFP48
LPC1225FBD48/301 64 kB
8 kB
2
1
1
8
39
LQFP48
LPC1224FBD64/121 48 kB
4 kB
2
1
1
8
55
LQFP64
LPC1224FBD64/101 32 kB
4 kB
2
1
1
8
55
LQFP64
LPC1224FBD48/121 48 kB
4 kB
2
1
1
8
39
LQFP48
LPC1224FBD48/101 32 kB
4 kB
2
1
1
8
39
LQFP48
LPC1225
LPC1224
LPC122X
Product data sheet
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Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
4 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
5. Block diagram
XTALIN
XTALOUT
RESET
SWD
LPC122x
IRC, OSCILLATORS
CLOCK
GENERATION,
POWER CONTROL,
SYSTEM
FUNCTIONS
BOD
TEST/DEBUG
INTERFACE
POR
CLKOUT
clocks and controls
ARM
CORTEX-M0
32/48/64/80/
96/128 kB
FLASH
MICRO DMA
CONTROLLER
system
bus
master
4/8 kB
SRAM
slave
ROM
slave
slave
AHB-LITE BUS
slave
GPIO ports
SCK
SSEL
MISO
MOSI
RXD0
TXD0
HIGH-SPEED
GPIO
slave
AHB-APB
BRIDGE
slave
CRC
ENGINE
SSP/SPI
10-bit ADC
UART0 RS-485
AD[7:0]
ACMP0_I[3:0]
ACMP1_I[3:0]
ACMP0_O
ACMP1_O
VREF_CMP
COMPARATOR0/1
DTR0, DSR0, CTS0,
DCD0, RI0, RTS0
RXD1
TXD1
UART1
SCL
SDA
4 × MAT
4 × CAP
4 × MAT
4 × CAP
2 × MAT
2 × CAP
2 × MAT
2 × CAP
WINDOWED WDT
I2C
IOCONFIG
RTC
32-bit COUNTER/TIMER 0
RTCXOUT
32 kHz OSCILLATOR
32-bit COUNTER/TIMER 1
SYSTEM CONTROL
16-bit COUNTER/TIMER 0
MICRO DMA REGISTERS
RTCXIN
16-bit COUNTER/TIMER 1
Grey-shaded blocks represent peripherals
with connection to the micro DMA controller
002aaf269
Fig 1.
LPC122x block diagram
LPC122X
Product data sheet
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Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
5 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
6. Pinning information
49 R/PIO1_1
50 PIO1_2
51 PIO1_3/WAKEUP
52 PIO1_4
53 PIO1_5
54 PIO1_6
55 VSS
56 VDD(3V3)
57 RTCXOOUT
58 RTCXIN
59 PIO2_8
60 PIO2_9
61 PIO2_10
62 PIO2_11
63 VDD(IO)
64 VSSIO
6.1 Pinning
XTALIN
1
48 R/PIO1_0
XTALOUT
2
47 R/PIO0_31
VREF_CMP
3
46 R/PIO0_30
PIO0_19
4
45 PIO0_18
PIO0_20
5
44 PIO0_17
PIO0_21
6
43 PIO0_16
PIO0_22
7
42 PIO0_15
PIO0_23
8
PIO0_24
9
41 PIO0_14
LPC122x
40 RESET/PIO0_13
SWDIO/PIO0_25 10
39 PIO0_12(1)
SWCLK/PIO0_26 11
38 PIO0_11
PIO0_27(1) 12
37 PIO0_10
PIO2_3 32
PIO2_2 31
PIO2_1 30
PIO2_0 29
PIO0_9 28
PIO0_8 27
PIO0_7 26
PIO0_6 25
PIO0_5 24
PIO0_4 23
PIO0_3 22
PIO0_2 21
33 PIO2_4
PIO0_1 20
34 PIO2_5
PIO2_15 16
PIO0_0 19
35 PIO2_6
PIO2_14 15
PIO0_29(1) 18
36 PIO2_7
PIO2_13 14
PIO0_28(1) 17
PIO2_12 13
002aaf554
(1) High-current output driver.
Remark: For a full listing of all functions for each pin see Table 3.
Fig 2.
Pin configuration LQFP64 package
LPC122X
Product data sheet
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Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
6 of 61
LPC122x
NXP Semiconductors
37 R/PIO1_1
38 PIO1_2
39 PIO1_3/WAKEUP
40 PIO1_4
41 PIO1_5
42 PIO1_6
43 VSS
44 VDD(3V3)
45 RTCXOUT
46 RTCXIN
47 VDD(IO)
48 VSSIO
32-bit ARM Cortex-M0 microcontroller
XTALIN
1
36 R/PIO1_0
XTALOUT
2
35 R/PIO0_31
VREF_CMP
3
34 R/PIO0_30
PIO0_19
4
33 PIO0_18
PIO0_20
5
PIO0_21
6
PIO0_22
7
30 PIO0_15
PIO0_23
8
29 PIO0_14
PIO0_24
9
28 RESET/PIO0_13
32 PIO0_17
31 PIO0_16
LPC122x
PIO0_9 24
PIO0_8 23
PIO0_7 22
PIO0_6 21
PIO0_5 20
PIO0_4 19
PIO0_3 18
PIO0_2 17
25 PIO0_10
PIO0_1 16
26 PIO0_11
PIO0_27(1) 12
PIO0_0 15
SWCLK/PIO0_26 11
PIO0_29(1) 14
27 PIO0_12(1)
PIO0_28(1) 13
SWDIO/PIO0_25 10
002aaf724
(1) High-current output driver.
Remark: For a full listing of all functions for each pin see Table 3.
Fig 3.
Pin configuration LQFP48 package
LPC122X
Product data sheet
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Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
7 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
6.2 Pin description
All pins except the supply pins can have more than one function as shown in Table 3. The
pin function is selected through the pin’s IOCON register in the IOCONFIG block. The
multiplexed functions (see Table 4) include the counter/timer inputs and outputs, the
UART receive, transmit, and control functions, and the serial wire debug functions.
For each pin, the default function is listed first together with the pin’s reset state.
LPC122x pin description
Start Type Reset Description
logic
state
[1]
input
Pin LQFP64
Symbol
Pin LQFP48
Table 3.
PIO0_0 to PIO0_31
PIO0_0/RTS0
I/O
15 19
[2]
yes
[3]
PIO0_1/RXD0/
CT32B0_CAP0/
CT32B0_MAT0
PIO0_2/TXD0/
CT32B0_CAP1/
CT32B0_MAT1
PIO0_3/DTR0/
CT32B0_CAP2/
CT32B0_MAT2
PIO0_4/DSR0/
CT32B0_CAP3/
CT32B0_MAT3
PIO0_5/DCD0
16 20
[2]
yes
[3]
17 21
[2]
yes
[3]
18 22
[2]
yes
[3]
19 23
[2]
yes
[3]
20 24
[2]
yes
[3]
PIO0_6/RI0/
CT32B1_CAP0/
CT32B1_MAT0
LPC122X
Product data sheet
21 25
[2]
[3]
yes
Port 0 — Port 0 is a 32-bit I/O port with individual direction and
function controls for each bit. The operation of port 0 pins
depends on the function selected through the IOCONFIG
register block.
I/O
I; PU
PIO0_0 — General purpose digital input/output pin.
O
-
RTS0 — Request To Send output for UART0.
I/O
I; PU
PIO0_1 — General purpose digital input/output pin.
I
-
RXD0 — Receiver input for UART0.
I
-
CT32B0_CAP0 — Capture input, channel 0 for 32-bit timer 0.
O
-
CT32B0_MAT0 — Match output, channel 0 for 32-bit timer 0.
I/O
I; PU
PIO0_2 — General purpose digital input/output pin.
O
-
TXD0 — Transmitter output for UART0.
I
-
CT32B0_CAP1 — Capture input, channel 1 for 32-bit timer 0.
O
-
CT32B0_MAT1 — Match output, channel 1 for 32-bit timer 0.
I/O
I; PU
PIO0_3 — General purpose digital input/output pin.
O
-
DTR0 — Data Terminal Ready output for UART0.
I
-
CT32B0_CAP2 — Capture input, channel 2 for 32-bit timer 0.
O
-
CT32B0_MAT2 — Match output, channel 2 for 32-bit timer 0.
I/O
I; PU
PIO0_4 — General purpose digital input/output pin.
I
-
DSR0 — Data Set Ready input for UART0.
I
-
CT32B0_CAP3 — Capture input, channel 3 for 32-bit timer 0.
O
-
CT32B0_MAT3 — Match output, channel 3 for 32-bit timer 0.
I/O
I; PU
PIO0_5 — General purpose digital input/output pin.
I
-
DCD0 — Data Carrier Detect input for UART0.
I/O
I; PU
PIO0_6 — General purpose digital input/output pin.
I
-
RI0 — Ring Indicator input for UART0.
I
-
CT32B1_CAP0 — Capture input, channel 0 for 32-bit timer 1.
O
-
CT32B1_MAT0 — Match output, channel 0 for 32-bit timer 1.
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Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
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LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
LPC122x pin description …continued
PIO0_7/CTS0/
CT32B1_CAP1/
CT32B1_MAT1
22 26
PIO0_8/RXD1/
CT32B1_CAP2/
CT32B1_MAT2
PIO0_9/TXD1/
CT32B1_CAP3/
CT32B1_MAT3
PIO0_10/SCL
[2]
yes
[3]
23 27
[2]
yes
[3]
24 28
[2]
yes
[3]
25 37
PIO0_11/SDA/
CT16B0_CAP0/
CT16B0_MAT0
26 38
PIO0_12/CLKOUT/
CT16B0_CAP1/
CT16B0_MAT1
27 39
RESET/PIO0_13
Start Type Reset Description
logic
state
[1]
input
Pin LQFP64
Symbol
Pin LQFP48
Table 3.
28 40
[4]
[4]
[9]
[5]
yes
yes
no
I/O
I; PU
I
-
CTS0 — Clear To Send input for UART0.
I
-
CT32B1_CAP1 — Capture input, channel 1 for 32-bit timer 1.
O
-
CT32B1_MAT1 — Match output, channel 1 for 32-bit timer 1.
I/O
I; PU
PIO0_8 — General purpose digital input/output pin.
I
-
RXD1 — Receiver input for UART1.
I
-
CT32B1_CAP2 — Capture input, channel 2 for 32-bit timer 1.
O
-
CT32B1_MAT2 — Match output, channel 2 for 32-bit timer 1.
I/O
I; PU
PIO0_9 — General purpose digital input/output pin.
O
-
TXD1 — Transmitter output for UART1.
I
-
CT32B1_CAP3 — Capture input, channel 3 for 32-bit timer 1.
O
-
CT32B1_MAT3 — Match output, channel 3 for 32-bit timer 1.
I/O
I; IA
PIO0_10 — General purpose digital input/output pin.
I/O
-
SCL — I2C-bus clock input/output.
I/O
I; IA
PIO0_11 — General purpose digital input/output pin.
I/O
-
SDA — I2C-bus data input/output.
I
-
CT16B0_CAP0 — Capture input, channel 0 for 16-bit timer 0.
O
-
CT16B0_MAT0 — Match output, channel 0 for 16-bit timer 0.
I/O
I; PU
PIO0_12 — General purpose digital input/output pin. A LOW
level on this pin during reset starts the ISP command handler.
High-current output driver.
O
-
CLKOUT — Clock out pin.
I
-
CT16B0_CAP1 — Capture input, channel 1 for 16-bit timer 0.
O
-
CT16B0_MAT1 — Match output, channel 1 for 16-bit timer 0.
I
I; PU
RESET — External reset input: A LOW on this pin resets the
device, causing I/O ports and peripherals to take on their
default states, and processor execution to begin at address 0.
I/O
-
PIO0_13 — General purpose digital input/output pin.
no
I/O
I; PU
PIO0_14 — General purpose digital input/output pin.
I/O
-
SCK — Serial clock for SSP/SPI.
no
I/O
I; PU
PIO0_15 — General purpose digital input/output pin.
I/O
-
SSEL — Slave select for SSP/SPI.
I
-
CT16B1_CAP0 — Capture input, channel 0 for 16-bit timer 1.
no
[3]
PIO0_14/SCK
29 41
[2]
[3]
PIO0_15/SSEL/
CT16B1_CAP0/
CT16B1_MAT0
30 42
PIO0_16/MISO/
CT16B1_CAP1/
CT16B1_MAT1
31 43
LPC122X
Product data sheet
[2]
[3]
[2]
[3]
PIO0_7 — General purpose digital input/output pin.
no
O
-
CT16B1_MAT0 — Match output, channel 0 for 16-bit timer 1.
I/O
I; PU
PIO0_16 — General purpose digital input/output pin.
I/O
-
MISO — Master In Slave Out for SSP/SPI.
I
-
CT16B1_CAP1 — Capture input, channel 1 for 16-bit timer 1.
O
-
CT16B1_MAT1 — Match output, channel 1 for 16-bit timer 1.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
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LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
LPC122x pin description …continued
PIO0_17/MOSI
32 44
Start Type Reset Description
logic
state
[1]
input
Pin LQFP64
Symbol
Pin LQFP48
Table 3.
[2]
no
I/O
no
[3]
PIO0_18/SWCLK/
CT32B0_CAP0/
CT32B0_MAT0
33 45
PIO0_19/ACMP0_I0/
CT32B0_CAP1/
CT32B0_MAT1
4
PIO0_20/ACMP0_I1/
CT32B0_CAP2/
CT32B0_MAT2
5
PIO0_21/ACMP0_I2/
CT32B0_CAP3/
CT32B0_MAT3
6
PIO0_22/ACMP0_I3
7
[2]
[3]
4
[6]
no
[7]
5
[6]
no
[7]
6
[6]
no
[7]
7
[6]
no
[7]
PIO0_23/
ACMP1_I0/
CT32B1_CAP0/
CT32B1_MAT0
PIO0_24/ACMP1_I1/
CT32B1_CAP1/
CT32B1_MAT1
SWDIO/ACMP1_I2/
CT32B1_CAP2/
CT32B1_MAT2/
PIO0_25
SWCLK/ACMP1_I3/
CT32B1_CAP3/
CT32B1_MAT3/
PIO0_26
8
8
[6]
no
[7]
9
9
[6]
no
[7]
10 10
[6]
no
[7]
11 11
[6]
[7]
no
I; PU
PIO0_17 — General purpose digital input/output pin.
I/O
-
MOSI — Master Out Slave In for SSP/SPI.
I/O
I; PU
PIO0_18 — General purpose digital input/output pin.
I
-
SWCLK — Serial wire clock, alternate location.
I
-
CT32B0_CAP0 — Capture input, channel 0 for 32-bit timer 0.
O
-
CT32B0_MAT0 — Match output, channel 0 for 32-bit timer 0.
I/O
I; PU
PIO0_19 — General purpose digital input/output pin.
I
-
ACMP0_I0 — Input 0 for comparator 0.
I
-
CT32B0_CAP1 — Capture input, channel 1 for 32-bit timer 0.
O
-
CT32B0_MAT1 — Match output, channel 1 for 32-bit timer 0
I/O
I; PU
PIO0_20 — General purpose digital input/output pin.
I
-
ACMP0_I1 — Input 1 for comparator 0.
I
-
CT32B0_CAP2 — Capture input, channel 2 for 32-bit timer 0.
O
-
CT32B0_MAT2 — Match output, channel 2 for 32-bit timer 0.
I/O
I; PU
PIO0_21 — General purpose digital input/output pin.
I
-
ACMP0_I2 — Input 2 for comparator 0.
I
-
CT32B0_CAP3 — Capture input, channel 3 for 32-bit timer 0.
O
-
CT32B0_MAT3 — Match output, channel 3 for 32-bit timer 0.
I/O
I; PU
PIO0_22 — General purpose digital input/output pin.
I
-
ACMP0_I3 — Input 3 for comparator 0.
I/O
I; PU
PIO0_23 — General purpose digital input/output pin.
I
-
ACMP1_I0 — Input 0 for comparator 1.
I
-
CT32B1_CAP0 — Capture input, channel 0 for 32-bit timer 1.
O
-
CT32B1_MAT0 — Match output, channel 0 for 32-bit timer 1.
I/O
I; PU
PIO0_24 — General purpose digital input/output pin.
I
-
ACMP1_I1 — Input 1 for comparator 1.
I
-
CT32B1_CAP1 — Capture input, channel 1 for 32-bit timer 1.
O
-
CT32B1_MAT1 — Match output, channel 1 for 32-bit timer 1.
I/O
I; PU
SWDIO — Serial wire debug input/output, default location.
I
-
ACMP1_I2 — Input 2 for comparator 1.
I
-
CT32B1_CAP2 — Capture input, channel 2 for 32-bit timer 1.
O
-
CT32B1_MAT2 — Match output, channel 2 for 32-bit timer 1.
I/O
-
PIO0_25 — General purpose digital input/output pin.
I
I; PU
SWCLK — Serial wire clock, default location.
I
-
ACMP1_I3 — Input 3 for comparator 1.
I
-
CT32B1_CAP3 — Capture input, channel 3 or 32-bit timer 1.
O
-
CT32B1_MAT3 — Match output, channel 3 for 32-bit timer 1.
I/O
LPC122X
Product data sheet
PIO0_26 — General purpose digital input/output pin.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
10 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
LPC122x pin description …continued
PIO0_27/ACMP0_O
12 12
[9]
13 17
[9]
PIO0_28/ACMP1_O/
CT16B0_CAP0/
CT16B0_MAT0
PIO0_29/ROSC/
CT16B0_CAP1/
CT16B0_MAT1
R/PIO0_30/AD0
Start Type Reset Description
logic
state
[1]
input
Pin LQFP64
Symbol
Pin LQFP48
Table 3.
14 18
34 46
[9]
[6]
no
no
no
no
I/O
I; PU
PIO0_27 — General purpose digital input/output pin
(high-current output driver).
O
-
ACMP0_O — Output for comparator 0.
I/O
I; PU
PIO0_28 — General purpose digital input/output pin
(high-current output driver).
O
-
ACMP1_O — Output for comparator 1.
I
-
CT16B0_CAP0 — Capture input, channel 0 for 16-bit timer 0.
O
-
CT16B0_MAT0 — Match output, channel 0 for 16-bit timer 0.
I/O
I; PU
PIO0_29 — General purpose digital input/output pin
(high-current output driver).
I/O
-
ROSC — Relaxation oscillator for 555 timer applications.
I
-
CT16B0_CAP1 — Capture input, channel 1 for 16-bit timer 0.
O
-
CT16B0_MAT1 — Match output, channel 1 for 16-bit timer 0.
I
I; PU
R — Reserved. Configure for an alternate function in the
IOCONFIG block.
I/O
-
PIO0_30 — General purpose digital input/output pin.
I
-
AD0 — A/D converter, input 0.
I
I; PU
R — Reserved. Configure for an alternate function in the
IOCONFIG block.
I/O
-
PIO0_31 — General purpose digital input/output pin.
I
-
AD1 — A/D converter, input 1.
[3]
R/PIO0_31/AD1
35 47
[6]
no
[3]
PIO1_0 to PIO1_6
R/PIO1_0/AD2
I/O
36 48
[6]
no
Port 1 — Port 1 is a 32-bit I/O port with individual direction and
function controls for each bit. The operation of port 1 pins
depends on the function selected through the IOCONFIG
register block. Pins PIO1_7 through PIO1_31 are not available.
O
I; PU
R — Reserved. Configure for an alternate function in the
IOCONFIG block.
I/O
-
PIO1_0 — General purpose digital input/output pin.
I
-
AD2 — A/D converter, input 2.
I
I; PU
R — Reserved. Configure for an alternate function in the
IOCONFIG block.Do not pull this pin LOW at reset.
I/O
-
PIO1_1 — General purpose digital input/output pin.
I
-
AD3 — A/D converter, input 3.
I/O
I; PU
PIO1_2 — General purpose digital input/output pin.
I/O
-
SWDIO — Serial wire debug input/output, alternate location.
I
-
AD4 — A/D converter, input 4.
I/O
I; PU
PIO1_3 — General purpose digital input/output pin.
[3]
R/PIO1_1/AD3
37 49
[6]
no
[3]
PIO1_2/SWDIO/AD4
38 50
[6]
no
[3]
PIO1_3/AD5/WAKEUP 39 51
[8]
no
[3]
PIO1_4/AD6
40 52
[6]
[3]
LPC122X
Product data sheet
no
I
-
AD5 — A/D converter, input 5.
I
-
WAKEUP — Deep power-down mode wake-up pin.
I/O
I; PU
PIO1_4 — General purpose digital input/output pin.
I
-
AD6 — A/D converter, input 6.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
11 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
LPC122x pin description …continued
PIO1_5/AD7/
CT16B1_CAP0/
CT16B1_MAT0
41 53
PIO1_6/
CT16B1_CAP1/
CT16B1_MAT1
Start Type Reset Description
logic
state
[1]
input
Pin LQFP64
Symbol
Pin LQFP48
Table 3.
[6]
no
[3]
42 54
[2]
no
[3]
PIO2_0 to PIO2_15
PIO2_0/
CT16B0_CAP0/
CT16B0_MAT0/
RTS0
PIO2_1/
CT16B0_CAP1/
CT16B0_MAT1/RXD0
PIO2_2/
CT16B1_CAP0/
CT16B1_MAT0/TXD0
PIO2_3/
CT16B1_CAP1/
CT16B1_MAT1/DTR0
PIO2_4/
CT32B0_CAP0/
CT32B0_MAT0/CTS0
PIO2_5/
CT32B0_CAP1/
CT32B0_MAT1/RI0
LPC122X
Product data sheet
I/O
I; PU
I
-
AD7 — A/D converter, input 7.
I
-
CT16B1_CAP0 — Capture input, channel 0 for 16-bit timer 1.
O
-
CT16B1_MAT0 — Match output, channel 0 for 16-bit timer 1.
I/O
I; PU
PIO1_6 — General purpose digital input/output pin.
I
-
CT16B1_CAP1 — Capture input, channel 1 for 16-bit timer 1.
O
-
CT16B1_MAT1 — Match output, channel 1 for 16-bit timer 1.
I/O
-
29
[2]
no
[3]
-
30
[2]
no
[3]
-
31
[2]
no
[3]
-
32
[2]
no
[3]
-
33
[2]
no
[3]
-
34
[2]
[3]
no
PIO1_5 — General purpose digital input/output pin.
Port 2 — Port 2 is a 32-bit I/O port with individual direction and
function controls for each bit. The operation of port 2 pins
depends on the function selected through the IOCONFIG
register block. Pins PIO2_16 through PIO2_31 are not
available.
I/O
I; PU
PIO2_0 — General purpose digital input/output pin.
I
-
CT16B0_CAP0 — Capture input, channel 0 for 16-bit timer 0.
O
-
CT16B0_MAT0 — Match output, channel 0 for 16-bit timer 0.
O
-
RTS0 — Request To Send output for UART0.
I/O
I; PU
PIO2_1 — General purpose digital input/output pin.
I
-
CT16B0_CAP1 — Capture input, channel 1 for 16-bit timer 0.
O
-
CT16B0_MAT1 — Match output, channel 1 for 16-bit timer 0.
I
-
RXD0 — Receiver input for UART0.
I/O
I; PU
PIO2_2 — General purpose digital input/output pin.
I
-
CT16B1_CAP0 — Capture input, channel 0 for 16-bit timer 1.
O
-
CT16B1_MAT0 — Match output, channel 0 for 16-bit timer 1.
O
-
TXD0 — Transmitter output for UART0.
I/O
I; PU
PIO2_3 — General purpose digital input/output pin.
I
-
CT16B1_CAP1 — Capture input, channel 1 for 16-bit timer 1.
O
-
CT16B1_MAT1 — Match output, channel 1 for 16-bit timer 1.
O
-
DTR0 — Data Terminal Ready output for UART0.
I/O
I; PU
PIO2_4 — General purpose digital input/output pin.
I
-
CT32B0_CAP0 — Capture input, channel 0 for 32-bit timer 0.
O
-
CT32B0_MAT0 — Match output, channel 0 for 32-bit timer 0.
I
-
CTS0 — Clear To Send input for UART0.
I/O
I; PU
PIO2_5 — General purpose digital input/output pin.
I
-
CT32B0_CAP1 — Capture input, channel 1 for 32-bit timer 0.
O
-
CT32B0_MAT1 — Match output, channel 1 for 32-bit timer 0.
I
-
RI0 — Ring Indicator input for UART0.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
12 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Symbol
Pin LQFP64
LPC122x pin description …continued
Pin LQFP48
Table 3.
PIO2_6/
CT32B0_CAP2/
CT32B0_MAT2/DCD0
-
35
PIO2_7/
CT32B0_CAP3/
CT32B0_MAT3/DSR0
PIO2_8/
CT32B1_CAP0/
CT32B1_MAT0
Start Type Reset Description
logic
state
[1]
input
[2]
no
[3]
-
36
[2]
no
[3]
-
59
[2]
no
[3]
PIO2_9/
CT32B1_CAP1/
CT32B1_MAT1
-
PIO2_10/
CT32B1_CAP2/
CT32B1_MAT2/TXD1
-
PIO2_11/
CT32B1_CAP3/
CT32B1_MAT3/RXD1
-
PIO2_12/RXD1
-
60
[2]
no
[3]
61
[2]
no
[3]
62
[2]
no
[3]
13
[2]
PIO2_13/TXD1
-
14
-
15
[2]
PIO2_6 — General purpose digital input/output pin.
I
-
CT32B0_CAP2 — Capture input, channel 2 for 32-bit timer 0.
O
-
CT32B0_MAT2 — Match output, channel 2 for 32-bit timer 0.
I
-
DCD0 — Data Carrier Detect input for UART0.
I/O
I; PU
PIO2_7 — General purpose digital input/output pin.
I
-
CT32B0_CAP3 — Capture input, channel 3 for 32-bit timer 0.
O
-
CT32B0_MAT3 — Match output, channel 3 for 32-bit timer 0.
I
-
DSR0 — Data Set Ready input for UART0.
I/O
I; PU
PIO2_8 — General purpose digital input/output pin.
I
-
CT32B1_CAP0 — Capture input, channel 0 for 32-bit timer 1.
O
-
CT32B1_MAT0 — Match output, channel 0 for 32-bit timer 1.
I/O
I; PU
PIO2_9 — General purpose digital input/output pin.
I
-
CT32B1_CAP1 — Capture input, channel 1 for 32-bit timer 1.
O
-
CT32B1_MAT1 — Match output, channel 1 for 32-bit timer 1.
I/O
I; PU
PIO2_10 — General purpose digital input/output pin.
I
-
CT32B1_CAP2 — Capture input, channel 2 for 32-bit timer 1.
O
-
CT32B1_MAT2 — Match output, channel 2 for 32-bit timer 1.
O
-
TXD1 — Transmitter output for UART1.
I/O
I; PU
PIO2_11 — General purpose digital input/output pin.
I
-
CT32B1_CAP3 — Capture input, channel 3 for 32-bit timer 1.
O
-
CT32B1_MAT3 — Match output, channel 3 for 32-bit timer 1.
I
-
RXD1 — Receiver input for UART1.
I; PU
PIO2_12 — General purpose digital input/output pin.
I
-
RXD1 — Receiver input for UART1.
no
I/O
I; PU
PIO2_13 — General purpose digital input/output pin.
O
-
TXD1 — Transmitter output for UART1.
no
I/O
I; PU
PIO2_14 — General purpose digital input/output pin.
no
I/O
I; PU
PIO2_15 — General purpose digital input/output pin.
[3]
PIO2_14
I; PU
I/O
no
[3]
[2]
I/O
[3]
PIO2_15
-
16
[2]
[3]
46 58
[10]
-
I
-
Input to the 32 kHz oscillator circuit.
RTCXOUT
45 57
[10]
-
O
-
Output from the 32 kHz oscillator amplifier.
XTALIN
1
1
-
I
-
Input to the system oscillator circuit and internal clock
generator circuits.
XTALOUT
2
2
-
O
-
Output from the system oscillator amplifier.
VREF_CMP
3
3
-
I
-
Reference voltage for comparator.
RTCXIN
LPC122X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
13 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
LPC122x pin description …continued
VDD(IO)
47 63
-
I
-
Input/output supply voltage.
VDD(3V3)
44 56
-
I
-
3.3 V supply voltage to the internal regulator and the ADC. Also
used as the ADC reference voltage.
VSSIO
48 64
-
I
-
Ground.
VSS
43 55
-
I
-
Ground.
Pin LQFP64
Symbol
Pin LQFP48
Table 3.
Start Type Reset Description
logic
state
[1]
input
[1]
Pin state at reset for default function: I = Input; O = Output; PU = internal pull-up enabled; IA = inactive, no pull-up/down enabled.
[2]
3.3 V tolerant, digital I/O pin; default: pull-up enabled, no hysteresis.
[3]
If set to output, this normal-drive pin is in low mode by default.
[4]
I2C-bus pins; 5 V tolerant; open-drain; default: no pull-up/pull-down; no hysteresis.
[5]
3.3 V tolerant, digital I/O pin with RESET function; default: pull-up enabled, no hysteresis. An external pull-up resistor is required on this
pin for the Deep power-down mode.
[6]
3.3 V tolerant, digital I/O pin with analog function; default: pull-up enabled, no hysteresis.
[7]
If set to output, this normal-drive pin is in high mode by default.
[8]
3.3 V tolerant, digital I/O pin with analog function and WAKEUP function; default: pull-up enabled, no hysteresis.
[9]
3.3 V tolerant, high-drive digital I/O pin; default: pull-up enabled, no hysteresis.
[10] If the RTC is not used, RTCXIN and RTCXOUT can be left floating.
To enable a peripheral function, find the corresponding port pin, or select a port pin if the
function is multiplexed, and program the port pin’s IOCONFIG register to enable that
function. The primary SWD functions and RESET are the default functions on their pins
after reset.
Table 4.
LPC122X
Product data sheet
Pin multiplexing
Peripheral
Function
Type
Available on ports:
Analog comparators
ROSC
I/O
PIO0_29
-
-
ACMP0_I0
I
PIO0_19
-
-
ACMP0_I1
I
PIO0_20
-
-
ACMP0_I2
I
PIO0_21
-
-
ACMP0_I3
I
PIO0_22
-
-
ACMP0_O
O
PIO0_27
-
-
ACMP1_I0
I
PIO0_23
-
-
ACMP1_I1
I
PIO0_24
-
-
ACMP1_I2
I
PIO0_25
-
-
ACMP1_I3
I
PIO0_26
-
-
ACMP1_O
O
PIO0_28
-
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
14 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Table 4.
Peripheral
Function
Type
Available on ports:
ADC
AD0
I
PIO0_30
-
-
AD1
I
PIO0_31
-
-
AD2
I
PIO1_0
-
-
AD3
I
PIO1_1
-
-
AD4
I
PIO1_2
-
-
AD5
I
PIO1_3
-
-
AD6
I
PIO1_4
-
-
CT16B0
CT16B1
CT32B0
CT32B1
UART0
LPC122X
Product data sheet
Pin multiplexing
AD7
I
PIO1_5
-
-
CT16B0_CAP0
I
PIO0_11
PIO0_28
PIO2_0
CT16B0_CAP1
I
PIO0_12
PIO0_29
PIO2_1
CT16B0_MAT0
O
PIO0_11
PIO0_28
PIO2_0
CT16B0_MAT1
O
PIO0_12
PIO0_29
PIO2_1
CT16B1_CAP0
I
PIO0_15
PIO1_5
PIO2_2
CT16B1_CAP1
I
PIO0_16
PIO1_6
PIO2_3
CT16B1_MAT0
O
PIO0_15
PIO1_5
PIO2_2
CT16B1_MAT1
O
PIO0_16
PIO1_6
PIO2_3
CT32B0_CAP0
I
PIO0_1
PIO0_18
PIO2_4
CT32B0_CAP1
I
PIO0_2
PIO0_19
PIO2_5
CT32B0_CAP2
I
PIO0_3
PIO0_20
PIO2_6
CT32B0_CAP3
I
PIO0_4
PIO0_21
PIO2_7
CT32B0_MAT0
O
PIO0_1
PIO0_18
PIO2_4
CT32B0_MAT1
O
PIO0_2
PIO0_19
PIO2_5
CT32B0_MAT2
O
PIO0_3
PIO0_20
PIO2_6
CT32B0_MAT3
O
PIO0_4
PIO0_21
PIO2_7
CT32B1_CAP0
I
PIO0_6
PIO0_23
PIO2_8
CT32B1_CAP1
I
PIO0_7
PIO0_24
PIO2_9
CT32B1_CAP2
I
PIO0_8
PIO0_25
PIO2_10
CT32B1_CAP3
I
PIO0_9
PIO0_26
PIO2_11
CT32B1_MAT0
O
PIO0_6
PIO0_23
PIO2_8
CT32B1_MAT1
O
PIO0_7
PIO0_24
PIO2_9
CT32B1_MAT2
O
PIO0_8
PIO0_25
PIO2_10
CT32B1_MAT3
O
PIO0_9
PIO0_26
PIO2_11
RXD0
I
PIO0_1
PIO2_1
-
TXD0
O
PIO0_2
PIO2_2
-
CTS0
I
PIO0_7
PIO2_4
-
DCD0
I
PIO0_5
PIO2_6
-
DSR0
I
PIO0_4
PIO2_7
-
DTR0
O
PIO0_3
PIO2_3
-
RI0
I
PIO0_6
PIO2_5
-
RTS0
O
PIO0_0
PIO2_0
-
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
15 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Table 4.
Pin multiplexing
Peripheral
Function
Type
Available on ports:
UART1
RXD1
I
PIO0_8
PIO2_11
PIO2_12
TXD1
O
PIO0_9
PIO2_10
PIO2_13
SCK
I/O
PIO0_14
-
-
MISO
I/O
PIO0_16
-
-
MOSI
I/O
PIO0_17
-
-
SSEL
I/O
PIO0_15
-
-
I2C
SCL
I/O
PIO0_10
-
-
SDA
I/O
PIO0_11
-
-
SWD
SWCLK[1]
I
PIO0_18
PIO0_26
-
SWDIO[1]
I/O
PIO0_25
PIO1_2
-
Reset
RESET
I
PIO0_13
-
-
Clockout pin
CLKOUT
O
PIO0_12
-
-
SSP/SPI
[1]
After reset, the SWD functions are selected by default on pins PIO0_26 and PIO0_25.
7. Functional description
7.1 ARM Cortex-M0 processor
The ARM Cortex-M0 is a general purpose, 32-bit microprocessor, which offers high
performance and very low power consumption.
7.1.1 System tick timer
The ARM Cortex-M0 includes a System Tick timer (SYSTICK) that is intended to generate
a dedicated SYSTICK exception at a 10 ms interval.
7.2 On-chip flash program memory
The LPC122x contain up to 128 kB of on-chip flash memory.
7.3 On-chip SRAM
The LPC122x contain a total of up to 8 kB on-chip static RAM memory.
7.4 Memory map
The LPC122x incorporates several distinct memory regions, shown in the following
figures. Figure 4 shows the overall map of the entire address space from the user
program viewpoint following reset. The interrupt vector area supports address remapping.
The AHB peripheral area is 2 megabyte in size, and is divided to allow for up to 128
peripherals. The APB peripheral area is 512 kB in size and is divided to allow for up to 32
peripherals. Each peripheral of either type is allocated 16 kilobytes of space. This allows
simplifying the address decoding for each peripheral.
LPC122X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
16 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
AHB peripherals
0x5008 0000
LPC122x
4 GB
CRC
7
0xFFFF FFFF
3 - 6 reserved
reserved
0x5003 0000
0xE010 0000
private peripheral bus
0xE000 0000
reserved
0x5008 0000
AHB peripherals
2
GPIO PIO2
1
GPIO PIO1
0
GPIO PIO0
APB peripherals
0x5000 0000
reserved
0x4000 0000
reserved
0x1FFF 2000
8 kB boot ROM
0x1FFF 0000
reserved
0x1FFE 2000
8 kB custom ROM
0x5000 0000
0x4008 0000
21
comparator 0/1
20
RTC
19
micro DMA registers
18
system control
0x4004 8000
17
IOCONFIG
0x4004 4000
16
SSP
0x4004 0000
15
reserved
14
PMU
0x1FFE 0000
reserved
0x4005 4000
0x4005 0000
0x4004 C000
0x4003 C000
0x4003 8000
0x1FFC 4000
9 - 13 reserved
16 kB NXP library ROM
0x1FFC 0000
0x4002 4000
reserved
8
ADC
0x4002 0000
7
32-bit counter/timer 1
0x4001 C000
6
32-bit counter/timer 0
0x4001 8000
0x1000 0000
5
16-bit counter/timer 1
0x4001 4000
0x0002 0000
4
16-bit counter/timer 0
0x4001 0000
3
UART1
0x4000 C000
2
UART0
0x4000 8000
1
0
WDT
0x4000 4000
I2C-bus
0x4000 0000
0x1000 2000
8 kB SRAM (LPC1225/6/7)
4 kB SRAM (LPC1224)
0x1000 1000
reserved
128 kB on-chip flash (LPC1227/301)
96 kB on-chip flash (LPC1226/301)
80 kB on-chip flash (LPC1225/321)
64 kB on-chip flash (LPC1225/301)
48 kB on-chip flash (LPC1224/121)
Fig 4.
0x5001 0000
0x4005 8000
0x4008 0000
32 kB on-chip flash (LPC1224/101)
0 GB
0x5002 0000
22 - 31 reserved
APB peripherals
1 GB
0x5007 0000
0x0001 8000
0x0001 4000
0x0001 0000
0x0000 C000
0x0000 8000
0x0000 00C0
active interrupt vectors
0x0000 0000
0x0000 0000
002aaf270
LPC122x memory map
7.5 Nested Vectored Interrupt Controller (NVIC)
The Nested Vectored Interrupt Controller (NVIC) is an integral part of the Cortex-M0. The
tight coupling to the CPU allows for low interrupt latency and efficient processing of late
arriving interrupts.
7.5.1 Features
• Controls system exceptions and peripheral interrupts.
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• In the LPC122x, the NVIC supports 32 vectored interrupts. In addition, up to 12 of the
individual GPIO inputs are NVIC-vector capable.
• Four programmable interrupt priority levels with hardware priority level masking.
• Software interrupt generation.
• Non-maskable Interrupt (NMI) can be programmed to use any of the peripheral
interrupts. The NMI is not available on an external pin.
7.5.2 Interrupt sources
Each peripheral device has one interrupt line connected to the NVIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
Any GPIO pin (total of up to 55 pins) regardless of the selected function, can be
programmed to generate an interrupt on a level, a rising edge or falling edge, or both.
7.6 IOCONFIG block
The IOCONFIG block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on-chip peripherals.
Peripherals should be connected to the appropriate pins prior to being activated and prior
to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is
not mapped to a related pin should be considered undefined.
7.6.1 Features
•
•
•
•
•
Programmable pull-up resistor.
Programmable digital glitch filter.
Programmable input inverter.
Programmable drive current.
Programmable open-drain mode.
7.7 Micro DMA controller
The micro DMA controller enables memory-to-memory, memory-to-peripheral, and
peripheral-to-memory data transfers. The supported peripherals are: UART0 (transmit
and receive), UART1 (transmit and receive), SSP/SPI (transmit and receive), ADC, RTC,
32-bit counter/timer 0 (match output channels 0 and 1), 32-bit counter/timer 1 (match
output channels 0 and 1), 16-bit counter/timer 0 (match output channel 0), 16-bit
counter/timer 1 (match output channel 0), comparator 0, comparator 1, GPIO0 to GPIO2.
7.7.1 Features
• Single AHB-Lite master for transferring data using a 32-bit address bus and 32-bit
data bus.
• 21 DMA channels.
• Handshake signals and priority level programmable for each channel.
• Each priority level arbitrates using a fixed priority that is determined by the DMA
channel number.
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• Supports memory-to-memory, memory-to-peripheral, and peripheral-to-memory
transfers.
• Supports multiple DMA cycle types and multiple DMA transfer widths.
• Performs all DMA transfers using the single AHB-Lite burst type.
7.8 CRC engine
The Cyclic Redundancy Check (CRC) engine with programmable polynomial settings
supports several CRC standards commonly used. To save system power and bus
bandwidth, the CRC engine supports DMA transfers.
7.8.1 Features
• Supports three common polynomials CRC-CCITT, CRC-16, and CRC-32.
– CRC-CCITT: x16 + x12 + x5 + 1
– CRC-16: x16 + x15 + x2 + 1
– CRC-32: x32 + x26 + x23 + x22 + x16 + x12 + x11 + x10 + x8 + x7 + x5 + x4 + x2 + x + 1
• Bit order reverse and 1’s complement programmable setting for input data and CRC
sum.
• Programmable seed number setting.
• Supports CPU programmed I/O or DMA back-to-back transfer.
• Accept any size of data width per write: 8, 16 or 32-bit.
– 8-bit write: 1-cycle operation
– 16-bit write: 2-cycle operation (8-bit  2-cycle)
– 32-bit write: 4-cycle operation (8-bit  4-cycle)
7.9 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back as well as the current state of the port pins.
7.9.1 Features
• Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
• Direction control of individual bits.
• All I/O default to inputs after reset.
7.10 UARTs
The LPC122x contains two UARTs. UART0 supports full modem control and RS-485/9-bit
mode and allows both software address detection and automatic hardware address
detection using 9-bit mode.
The UARTs include a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
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7.10.1 Features
•
•
•
•
16-byte Receive and Transmit FIFOs.
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Auto-baud capabilities and FIFO control mechanism that enables software flow
control implementation.
• Support for RS-485/9-bit mode (UART0).
• Support for modem control (UART0).
7.11 SSP/SPI serial I/O controller
The LPC122x contain one SSP/SPI controller. The SSP/SPI controller is capable of
operation on a SSP, 4-wire SSI, or Microwire bus. It can interact with multiple masters and
slaves on the bus. Only a single master and a single slave can communicate on the bus
during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits
to 16 bits of data flowing from the master to the slave and from the slave to the master. In
practice, often only one of these data flows carries meaningful data.
7.11.1 Features
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses
•
•
•
•
Synchronous serial communication
Master or slave operation
8-frame FIFOs for both transmit and receive
4-bit to 16-bit frame
7.12 I2C-bus serial I/O controller
The LPC122x contain one I2C-bus controller.
The I2C-bus is bidirectional for inter-IC control using only two wires: a serial clock line
(SCL) and a serial data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be
controlled by more than one bus master connected to it.
7.12.1 Features
• The I2C-interface is a standard I2C-compliant bus interface with open-drain pins and
supports I2C Fast-mode Plus with bit rates of up to 1 Mbit/s.
• Programmable digital glitch filter providing a 60 ns to 1 s input filter.
• Easy to configure as master, slave, or master/slave.
• Programmable clocks allow versatile rate control.
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• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• The I2C-bus controller supports multiple address recognition and a bus monitor mode.
7.13 10-bit ADC
The LPC122x contains one ADC. It is a single 10-bit successive approximation ADC with
eight channels.
7.13.1 Features
•
•
•
•
•
•
•
•
10-bit successive approximation ADC.
Input multiplexing among 8 pins.
Power-down mode.
Measurement range 0 V to VDD(3V3).
10-bit conversion time of 257 kHz.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition of input pin or counter/timer match signal.
Individual result registers for each ADC channel to reduce interrupt overhead.
7.14 Comparator block
The comparator block consists of two analog comparators.
7.14.1 Features
• Up to six selectable external sources per comparator; fully configurable on either
positive or negative comparator input channels.
• BOD 0.9 V internal reference voltage selectable on both comparators; configurable on
either positive or negative comparator input channels.
• 32-stage voltage ladder internal reference voltage selectable on both comparators;
configurable on either positive or negative comparator input channels.
• Voltage ladder source voltage is selectable from an external pin or an internal 3.3 V
voltage rail if external power source is not available.
• Voltage ladder can be separately powered down for applications only requiring the
comparator function.
• Relaxation oscillator circuitry output for a feedback 555-style timer application.
• Common interrupt connected to NVIC.
• Comparator outputs selectable as synchronous or asynchronous.
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• Comparator outputs connect to two timers, allowing for the recording of comparison
event time stamps.
7.15 General purpose external event counter/timers
The LPC122x includes two 32-bit counter/timers and two 16-bit counter/timers. The
counter/timer is designed to count cycles of the system derived clock. It can optionally
generate interrupts or perform other actions at specified timer values, based on four
match registers. Each counter/timer also includes up to four capture inputs to trap the
timer value when an input signal transitions, optionally generating an interrupt.
7.15.1 Features
• A 32-bit/16-bit timer/counter with a programmable 32-bit/16-bit prescaler.
• Counter or timer operation.
• Up to four capture channels per timer, that can take a snapshot of the timer value
when an input signal transitions. A capture event may also generate an interrupt.
• Four match registers per timer that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
• The timer and prescaler may be configured to be cleared on a designated capture
event. This feature permits easy pulse width measurement by clearing the timer on
the leading edge of an input pulse and capturing the timer value on the trailing edge.
• Supports timed DMA requests.
7.16 Windowed WatchDog timer (WWDT)
The purpose of the watchdog is to reset the microcontroller within a windowed amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
7.16.1 Features
•
•
•
•
•
•
LPC122X
Product data sheet
Internally resets chip if not periodically reloaded.
Debug mode.
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
Safe operation: can be locked by software to be always on.
Flag to indicate watchdog reset.
Programmable 24-bit timer with internal prescaler.
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• Selectable time period from (Tcy(WDCLK)  256  4) to (Tcy(WDCLK)  224  4) in
multiples of Tcy(WDCLK)  4.
• The Watchdog Clock (WDCLK) source can be selected from the Internal RC oscillator
(IRC) or the Watchdog oscillator. This gives a wide range of potential timing choices of
Watchdog operation under different power reduction conditions. It also provides the
ability to run the WDT from an entirely internal source that is not dependent on an
external crystal and its associated components and wiring for increased reliability.
7.17 Real-time clock (RTC)
The RTC provides a basic alarm function or can be used as a long time base counter. The
RTC generates an interrupt after counting for a programmed number of cycles of the RTC
clock input.
7.17.1 Features
• Uses dedicated 32 kHz ultra low-power oscillator.
• Selectable clock inputs: RTC oscillator (1 Hz, delayed 1 Hz, or 1 kHz clock) or main
clock with programmable clock divider.
•
•
•
•
32-bit counter.
Programmable 32-bit match/compare register.
Software maskable interrupt when counter and compare registers are identical.
Generates wake-up from Deep-sleep and Deep power-down modes.
7.18 Clocking and power control
7.18.1 Crystal oscillators
The LPC122x include four independent oscillators. These are the system oscillator, the
Internal RC oscillator (IRC), the RTC 32 kHz oscillator (for the RTC only), and the
Watchdog oscillator. Except for the RTC oscillator, each oscillator can be used for more
than one purpose as required in a particular application.
Following reset, the LPC122x will operate from the Internal RC oscillator until switched by
software. This allows systems to operate without any external crystal and the bootloader
code to operate at a known frequency.
See Figure 5 for an overview of the LPC122x clock generation.
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main clock
CLOCK
DIVIDER
AHB clock 0
(system)
system clock
AHB clocks
1 to 31
(memories
and peripherals)
31
SYSAHBCLKCTRL[1:31]
(AHB clock enable)
3
CLOCK
DIVIDER
7
CLOCK
DIVIDER
peripheral clocks
(SSP, UART0, UART1)
peripheral clocks
(IOCONFIG glitch filter)
CLOCK
DIVIDER
IRC oscillator
RTC oscillator 1 Hz clock
RTC oscillator 1 Hz delayed clock
RTC oscillator 1 kHz clock
watchdog oscillator
MAINCLKSEL
(main clock select)
SYSTEM PLL
system oscillator
RTCOSCCTRL
IRC oscillator
system oscillator
watchdog oscillator
IRC oscillator
RTC
CLOCK
DIVIDER
CLKOUT pin
SYSPLLCLKSEL
CLKOUTUEN
(CLKOUT clock update enable)
IRC oscillator
WWDT
watchdog oscillator
WDCLKSEL
(WWDT clock select)
Fig 5.
002aaf271
LPC122x clocking generation block diagram
7.18.1.1
Internal RC oscillator
The IRC may be used as the clock source for the WDT, and/or as the clock that drives the
PLL and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC is
trimmed to 1 % accuracy over the entire voltage and temperature range.
Upon power-up or any chip reset, the LPC122x use the IRC as the clock source. Software
may later switch to one of the other available clock sources.
7.18.1.2
System oscillator
The system oscillator can be used as the clock source for the CPU, with or without using
the PLL.
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The system oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the
system PLL. The ARM processor clock frequency is referred to as CCLK elsewhere in this
document.
7.18.1.3
Watchdog oscillator
The watchdog oscillator can be used as a clock source that directly drives the CPU, the
watchdog timer, or the CLKOUT pin. The watchdog oscillator nominal frequency is
programmable between 7.8 kHz and 1.7 MHz. The frequency spread over processing and
temperature is 40 %.
7.18.2 System PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO).
The multiplier can be an integer value from 1 to 32. The CCO operates in the range of
156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within
its frequency range while the PLL is providing the desired output frequency. The output
divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. The PLL output
frequency must be lower than 100 MHz. Since the minimum output divider value is 2, it is
insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed
following a chip reset and may be enabled by software. The program must configure and
activate the PLL, wait for the PLL to lock, and then connect to the PLL as a clock source.
The PLL settling time is 100 s.
7.18.3 Clock output
The LPC122x features a clock output function that routes the IRC oscillator, the system
oscillator, the watchdog oscillator, or the main clock to an output pin.
7.18.4 Wake-up process
The LPC122x begin operation at power-up and when awakened from Deep power-down
mode by using the 12 MHz IRC oscillator as the clock source. This allows chip operation
to resume quickly. If the main oscillator or the PLL is needed by the application, software
will need to enable these features and wait for them to stabilize before they are used as a
clock source.
7.18.5 Power control
The LPC122x support a variety of power control features. There are three special modes
of processor power reduction: Sleep mode, Deep-sleep mode, and Deep power-down
mode. The CPU clock rate may also be controlled as needed by changing clock sources,
reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a
trade-off of power versus processing speed based on application requirements. In
addition, a register is provided for shutting down the clocks to individual on-chip
peripherals, allowing fine tuning of power consumption by eliminating all dynamic power
use in any peripherals that are not required for the application. Selected peripherals have
their own clock divider which provides even better power control.
7.18.5.1
Sleep mode
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence but re-enabling the clock to the ARM core.
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In Sleep mode, execution of instructions is suspended until either a reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and may generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
7.18.5.2
Deep-sleep mode
In Deep-sleep mode, the chip is in Sleep mode, and in addition all analog blocks are shut
down. As an exception, the user has the option to keep the watchdog oscillator and the
BOD circuit running for self-timed wake-up and BOD protection. Deep-sleep mode allows
for additional power savings.
The GPIO pins PIO0_0 to PIO0_11 (up to 12 pins total) and the RTC match interrupt can
serve as a wake-up input to the start logic to wake up the chip from Deep-sleep mode.
Unless the watchdog oscillator is selected to run in Deep-sleep mode, the clock source
should be switched to IRC before entering Deep-sleep mode, because the IRC can be
switched on and off glitch-free.
7.18.5.3
Deep power-down mode
In Deep power-down mode, power is shut off to the entire chip with the exception of the
Real Time Clock, the four general-purpose registers, and the WAKEUP pin. The LPC122x
can wake up from Deep power-down mode via the WAKEUP pin or the RTC match
interrupt.
When entering Deep power-down mode, an external pull-up resistor is required on the
WAKEUP pin to hold it HIGH. The RESET pin must also be held HIGH to prevent it from
floating while in Deep power-down mode.
7.19 System control
7.19.1 Start logic
The start logic connects external pins to corresponding interrupts in the NVIC. Each pin
shown in Table 3 as input to the start logic has an individual interrupt in the NVIC interrupt
vector table. The start logic pins can serve as external interrupt pins when the chip is
running. In addition, an input signal on the start logic pins can wake up the chip from
Deep-sleep mode when all clocks are shut down.
The start logic must be configured in the system configuration block and in the NVIC
before being used.
7.19.2 Reset
Reset has four sources on the LPC122x: the RESET pin, the Watchdog reset, power-on
reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt
trigger input pin. Assertion of chip reset by any source, once the operating voltage attains
a usable level, starts the IRC and initializes the flash controller.
When the internal Reset is removed, the processor begins executing at address 0, which
is initially the Reset vector mapped from the boot block. At that point, all of the processor
and peripheral registers have been initialized to predetermined values.
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An external pull-up resistor is required on the RESET pin if Deep power-down mode is
used.
7.19.3 Brownout detection
The LPC122x includes four levels for monitoring the voltage on the VDD(3V3) pin. If this
voltage falls below one of the four selected levels, the BOD asserts an interrupt signal to
the NVIC. This signal can be enabled for interrupt in the Interrupt Enable Register in the
NVIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading
a dedicated status register. An additional threshold level can be selected to cause a
forced reset of the chip.
7.19.4 Code security (Code Read Protection - CRP)
This feature of the LPC122x allows user to enable different levels of security in the system
so that access to the on-chip flash and use of the SWD and ISP can be restricted. When
needed, CRP is invoked by programming a specific pattern into a dedicated flash location.
IAP commands are not affected by the CRP.
There are three levels of Code Read Protection:
1. CRP1 disables access to chip via the SWD and allows partial flash update (excluding
flash sector 0) using a limited set of the ISP commands. This mode is useful when
CRP is required and flash field updates are needed but all sectors can not be erased.
2. CRP2 disables access to chip via the SWD and only allows full flash erase and
update using a reduced set of the ISP commands.
3. Running an application with level CRP3 selected fully disables any access to chip via
the SWD pins and the ISP. This mode effectively disables ISP override using PIO0_12
pin, too. It is up to the user’s application to provide (if needed) flash update
mechanism using IAP calls or call reinvoke ISP command to enable flash update via
UART0.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
In addition to the three CRP levels, sampling of pin PIO0_12 for valid user code can be
disabled.
7.19.5 APB interface
The APB peripherals are located on one APB bus.
7.19.6 AHB-Lite
The AHB-Lite connects the CPU bus of the ARM Cortex-M0 to the flash memory, the main
static RAM, and the Boot ROM.
7.19.7 External interrupt inputs
All GPIO pins can be level or edge sensitive interrupt inputs.
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7.20 Emulation and debugging
Debug functions are integrated into the ARM Cortex-M0. Serial wire debug is supported.
7.21 Integer division routines
The LPC122x contain performance-optimized integer division routines with support for up
to 32-bit width in the numerator and denominator. Routines for signed and unsigned
division and division with remainder are available. The integer division routines are
ROM-based to reduce code-size.
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8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
VDD(3V3)
supply voltage (3.3 V)
VDD(IO)
input/output supply voltage
VI
input voltage
on all digital pins
[2]
on pins PIO0_10
and PIO0_11
(I2C-bus pins)
IDD
supply current
Min
Max
Unit
3.0
3.6
V
3.0
3.6
V
0.5
+3.6
V
0
5.5
V
per supply pin
[3]
-
100
mA
[3]
-
100
mA
-
100
mA
65
+150
C
-
1.5
W
8000
+8000
V
ISS
ground current
per ground pin
Ilatch
I/O latch-up current
(0.5VDD) < VI <
(1.5VDD);
Tj < 125 C
[4]
Tstg
storage temperature
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
VESD
electrostatic discharge voltage
human body
model; all pins
[1]
[5]
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
The peak current is limited to 25 times the corresponding maximum current.
[4]
Dependent on package type.
[5]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
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Product data sheet
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32-bit ARM Cortex-M0 microcontroller
9. Thermal characteristics
9.1 Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
T j = T amb +  P D  R th  j – a  
(1)
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 6.
Thermal characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Rth(j-a)
thermal resistance from
junction to ambient
JEDEC test board; no
air flow
-
Rth(j-c)
Tj(max)
thermal resistance from
junction to case
Typ
Max
Unit
LQFP64 package
61
-
C/W
LQFP48 package
86
-
C/W
LQFP64 package
19
-
C/W
LQFP48 package
36
-
C/W
-
150
C
JEDEC test board
maximum junction
temperature
LPC122X
Product data sheet
-
-
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32-bit ARM Cortex-M0 microcontroller
10. Static characteristics
Table 7.
Static characteristics
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
VDD(IO)
input/output supply
voltage
on pin VDD(IO)
3.0
3.3
3.6
V
VDD(3V3)
supply voltage (3.3 V)
3.0
3.3
3.6
V
IDD
supply current
CCLK = 12 MHz
-
4.6
-
mA
CCLK = 24 MHz
-
9
-
mA
CCLK = 33 MHz
-
12.2
-
mA
CCLK = 12 MHz
-
6.6
-
mA
CCLK = 24 MHz
-
10.9
-
mA
CCLK = 33 MHz
-
14.1
-
mA
Active mode;
VDD(3V3) = 3.3 V;
Tamb = 25 C; code
while(1){}
executed from flash
all peripherals disabled:
all peripherals enabled:
Sleep mode;
VDD(3V3) = 3.3 V;
Tamb = 25 C;
all peripherals disabled
CCLK = 12 MHz
-
1.8
-
mA
CCLK = 24 MHz
-
3.3
-
mA
CCLK = 33 MHz
-
4.4
-
mA
Deep-sleep mode;
VDD(3V3) = 3.3 V;
Tamb = 25 C
-
30
-
A
Deep power-down mode;
VDD(3V3) = 3.3 V;
Tamb = 25 C
-
720
-
nA
Normal-drive output pins (Standard port pins, RESET)
IIL
LOW-level input
current
VI = 0 V;
-
-
100
nA
IIH
HIGH-level input
current
VI = VDD(IO);
-
-
100
nA
IOZ
OFF-state output
current
VO = 0 V; VO = VDD(IO);
-
-
100
nA
VI
input voltage
pin configured to provide a
digital function
0
-
VDD(IO)
V
VO
output voltage
output active
0
-
VDD(IO)
V
VIH
HIGH-level input
voltage
0.7VDD(IO)
-
-
V
LPC122X
Product data sheet
[2][3][4]
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32-bit ARM Cortex-M0 microcontroller
Table 7.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
VIL
LOW-level input
voltage
Vhys
hysteresis voltage
VOH
HIGH-level output
voltage
VOL
IOH
LOW-level output
voltage
HIGH-level output
current
Conditions
Min
Typ[1]
Max
Unit
-
-
0.3VDD(I
V
O)
-
0.4
-
V
low mode; IOH = 2 mA
VDD(IO) 
0.4
-
-
V
high mode; IOH = 4 mA
VDD(IO) 
0.4
-
-
V
low mode; IOL = 2 mA
-
-
0.4
V
high mode; IOL = 4 mA
0.4
low mode; VOH = VDD(IO) 
0.4 V
2
-
-
mA
high mode; VOH = VDD(IO) 
0.4 V
4
-
-
mA
low mode; VOL = 0.4 V
2
-
-
mA
IOL
LOW-level output
current
4
-
-
mA
IOHS
HIGH-level
short-circuit output
current
VOH = 0 V
[5]
-
-
45
mA
IOLS
LOW-level
short-circuit output
current
VOL = VDDA
[5]
-
-
50
mA
Ipu
pull-up current
VI = 0 V
50
80
100
A
high mode; VOL = 0.4 V
High-drive output pins (PIO0_27, PIO0_28, PIO0_29, PIO0_12)
IIL
LOW-level input
current
VI = 0 V;
-
-
100
nA
IIH
HIGH-level input
current
VI = VDD(IO);
-
-
100
nA
IOZ
OFF-state output
current
VO = 0 V; VO = VDD(IO);
-
-
100
nA
VI
input voltage
pin configured to provide a
digital function
0
-
VDD(IO)
V
0
-
VDD(IO)
V
0.7VDD(IO)
-
-
V
-
0.3VDD(IO)
-
-
-
-
V
VO
output voltage
VIH
HIGH-level input
voltage
VIL
LOW-level input
voltage
Vhys
hysteresis voltage
VOH
HIGH-level output
voltage
VOL
LPC122X
Product data sheet
LOW-level output
voltage
[2][3]
[4]
output active
-
low mode; IOH = 20 mA
VDD(IO) 
0.7
-
-
V
high mode; IOH = 28 mA
VDD(IO) 
0.7
-
-
V
low mode; IOL = 12 mA
-
-
0.4
V
high mode; IOL = 18 mA
-
-
0.4
V
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32-bit ARM Cortex-M0 microcontroller
Table 7.
Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
IOH
HIGH-level output
current
low mode; VOH = VDD(IO) 
0.7
20
-
-
mA
high mode; VOH = VDD(IO) 
0.7
28
-
-
mA
VOL = 0.4 V
12
-
-
mA
18
-
-
mA
-
-
50
80
100
A
LOW-level output
current
IOL
low mode
high mode
IOLS
LOW-level
short-circuit output
current
VOL = VDD
Ipu
pull-up current
VI = 0 V
I2C-bus
[5]
mA
pins (PIO0_10 and PIO0_11)
VIH
HIGH-level input
voltage
0.7VDD(IO)
-
-
V
VIL
LOW-level input
voltage
-
-
0.3VDD(I
V
Vhys
hysteresis voltage
-
0.05VDD(IO) -
V
VOL
LOW-level output
voltage
IOLS = 20 mA
-
-
0.4
V
ILI
input leakage current
VI = VDD(IO)
-
2
4
A
VI = 5 V
-
10
22
A
capacitance for each
I/O pin
on pins PIO0_10 and
PIO0_11
-
-
8
pF
Vi(xtal)
crystal input voltage
see Section 12.1
0
1.8
1.95
V
Vo(xtal)
crystal output voltage
0
1.8
1.95
V
Ci
O)
[6]
Oscillator pins
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2]
Including voltage on outputs in 3-state mode.
[3]
VDD(3V3) and VDD(IO) supply voltages must be present.
[4]
3-state outputs go into 3-state mode when VDD(IO) is grounded.
[5]
Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[6]
To VSS.
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32-bit ARM Cortex-M0 microcontroller
10.1 Peripheral power consumption
The supply current per peripheral is measured as the difference in supply current between
the peripheral block enabled and the peripheral block disabled in the SYSAHBCLKCFG
and PDRUNCFG (for analog blocks) registers. All other blocks are disabled in both
registers and no code is executed. Measured on a typical sample at Tamb = 25 C and
VDD(3V3) = 3.3 V.
Table 8.
Peripheral power consumption
Peripheral
Typical current consumption IDD in mA
Frequency
independent
24 MHz
12 MHz
system
oscillator + PLL
IRC + PLL
system
oscillator
IRC
IRC
0.29
-
-
-
-
PLL (PLL output
frequency = 24 MHz)
1.87
-
-
-
-
WDosc (WDosc output
frequency = 500 kHz)
0.25
-
-
-
-
BOD
0.06
-
-
-
-
Analog comparator 0/1
-
0.05
0.05
0.03
0.02
ADC
-
1.86
1.85
1.61
1.61
CRC engine
-
0.04
0.04
0.02
0.02
16-bit timer 0 (CT16B0)
-
0.09
0.09
0.04
0.04
16-bit timer 1 (CT16B1)
-
0.09
0.09
0.04
0.04
32-bit timer 0 (CT32B0)
-
0.08
0.08
0.04
0.04
32-bit timer 1 (CT32B1)
-
0.08
0.08
0.04
0.04
GPIO0
-
0.34
0.34
0.17
0.17
GPIO1
-
0.34
0.34
0.17
0.17
GPIO2
-
0.36
0.37
0.18
0.18
I2C
-
0.09
0.09
0.05
0.05
IOCON
-
0.09
0.10
0.05
0.05
RTC
-
0.10
0.10
0.05
0.05
SSP
-
0.30
0.29
0.15
0.15
UART0
-
0.52
0.51
0.26
0.26
UART1
-
0.52
0.51
0.26
0.26
DMA
-
0.18
0.18
0.09
0.09
WWDT
-
0.06
0.06
0.03
0.03
10.2 Power consumption
Power measurements in Active, Sleep, and Deep-sleep modes were performed under the
following conditions (see LPC122x user manual):
• Active mode: all GPIO pins set to input with external pull-up resistors.
• Sleep and Deep-sleep modes: all GPIO pins set to output driving LOW.
• Deep power-down mode: all GPIO pins set to input with external pull-up resistors.
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32-bit ARM Cortex-M0 microcontroller
002aag186
16
IDD
(mA)
33 MHz(2)
12
24 MHz(2)
8
12 MHz
4
(1)
4 MHz(3)
(3)
1 MHz
0
3
3.2
3.4
3.6
VDD(3V3) (V)
Conditions: Tamb = 25 C; active mode entered executing code while(1){} from flash; all
peripherals disabled in the SYSAHBCLKCTRL register; all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(3) System oscillator enabled; IRC and system PLL disabled.
Fig 6.
Active mode: Typical supply current IDD versus supply voltage VDD(3V3) for
different system clock frequencies (all peripherals disabled)
002aag023
16
IDD
(mA)
33 MHz(2)
12
24 MHz(2)
8
12 MHz(1)
4
4 MHz(3)
1 MHz(3)
0
-40
-15
10
35
60
85
temperature (°C)
Conditions: VDD(3V3) = 3.3 V; active mode entered executing code while(1){} from flash; all
peripherals disabled in the SYSAHBCLKCTRL register; all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(3) System oscillator enabled; IRC and system PLL disabled.
Fig 7.
LPC122X
Product data sheet
Active mode: Typical supply current IDD versus temperature for different system
clock frequencies (peripherals disabled)
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
002aag187
16
33 MHz(2)
IDD
(mA)
12
24 MHz
8
(2)
12 MHz(1)
4 MHz(3)
(3)
1 MHz
4
0
3
3.2
3.4
3.6
VDD(3V3) (V)
Conditions: Tamb = 25 C; active mode entered executing code while(1){} from flash; all
peripherals enabled in the SYSAHBCLKCTRL register.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(3) System oscillator enabled with external clock input; IRC and system PLL disabled.
Fig 8.
Active mode: Typical supply current IDD versus supply voltage VDD(3V3) for
different system clock frequencies (all peripherals enabled)
002aag024
16
33 MHz(2)
IDD
(mA)
24 MHz(2)
12
8
12 MHz(1)
4 MHz(3)
4
1 MHz(3)
0
-40
-15
10
35
60
85
temperature (°C)
Conditions: VDD(3V3) = 3.3 V; active mode entered executing code while(1){} from flash; all
peripherals enabled in the SYSAHBCLKCTRL register.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(3) System oscillator enabled with external clock input; IRC and system PLL disabled.
Fig 9.
LPC122X
Product data sheet
Active mode: Typical supply current IDD versus temperature for different system
clock frequencies (peripherals enabled)
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32-bit ARM Cortex-M0 microcontroller
002aag188
5
33 MHz
IDD
(mA)
(2)
4
24 MHz(2)
3
2
1
12 MHz
(1)
4 MHz(3)
1 MHz(3)
0
3.0
3.2
3.4
3.6
VDD(3V3) (V)
Conditions: VDD(3V3) = 3.3 V; sleep mode entered from flash; all peripherals disabled in the
SYSAHBCLKCTRL register (SYSAHBCLKCTRL = 0x1F); all peripheral clocks disabled; internal
pull-up resistors disabled; BOD disabled.
(1) System oscillator and system PLL disabled; IRC enabled.
(2) System oscillator and system PLL enabled; IRC disabled.
(3) System oscillator enabled with external clock input; IRC and system PLL disabled.
Fig 10. Sleep mode: Typical supply current IDD versus supply voltage VDD(3V3) for
different system clock frequencies
002aag190
50
IDD
(μA)
40
VDD(3V3) = 3.6 V
3.3 V
3.0 V
30
20
10
-40
-15
10
35
60
85
temperature (°C)
Conditions: BOD disabled; all oscillators and analog blocks disabled in the PDSLEEPCFG register
Fig 11. Deep-sleep mode: Typical supply current IDD versus temperature for different
supply voltages VDD(3V3)
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
002aag189
1.0
IDD
(μA)
0.9
0.8
VDD(3V3) = 3.6 V
3.3 V
3.0 V
0.7
0.6
-40
-15
10
35
60
85
temperature (°C)
Fig 12. Deep power-down mode: Typical supply current IDD versus temperature for
different supply voltages VDD(3V3)
10.3 Electrical pin characteristics
002aag175
3.6
VOH
(V)
3.2
low mode
-40 °C
+25 °C
+70 °C
+85 °C
low mode
-40 °C
+25 °C
+70 °C
+85 °C
2.8
2.4
2
0
16
32
48
IOH (mA)
Conditions: VDD(IO) = 3.3 V
Fig 13. High-drive pins: Typical HIGH-level output voltage VOH versus HIGH-level output
current IOH
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32-bit ARM Cortex-M0 microcontroller
002aag310
1.2
VOL
(V)
high mode
-40 °C
+25 °C
+70 °C
+85 °C
low mode
-40 °C
+25 °C
+70 °C
+85 °C
0.8
0.4
0
0
16
32
48
IOL (mA)
Conditions: VDD(IO) = 3.3 V
Fig 14. High-drive pins: Typical LOW-level output voltage VOL versus LOW-level output
current IOL
002aag180
0.8
VOL
(V)
-40 °C
+25 °C
+70 °C
+85 °C
0.6
0.4
0.2
0
0
12
24
36
48
IOL (mA)
Conditions: VDD(IO) = 3.3 V.
Fig 15. I2C-bus pins (high current sink): Typical LOW-level output voltage VOL versus
LOW-level output current IOL
LPC122X
Product data sheet
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LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
002aag181
1.2
VOL
(V)
-40 °C
+25 °C
+70 °C
+85 °C
low mode
high mode
-40 °C
+25 °C
+70 °C
+85 °C
0.8
0.4
0
0
4
8
12
16
IOL (mA)
Conditions: VDD(IO) = 3.3 V.
Fig 16. Normal-drive pins: Typical LOW-level output voltage VOL versus LOW-level output
current IOL
002aag182
3.4
high mode
VOH
(V)
3.0
-40 °C
+25 °C
+70 °C
+85 °C
low mode
-40 °C
+25 °C
+70 °C
+85 °C
2.6
2.2
1.8
0
4
8
12
16
IOH (mA)
Conditions: VDD(IO) = 3.3 V.
Fig 17. Normal-drive pins: Typical HIGH-level output voltage VOH versus HIGH-level
output source current IOH
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Product data sheet
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
002aag185
0
Ipu
(mA)
-20
-40
+85 °C
+70 °C
+25 °C
-40 °C
-60
-80
-100
0
1
2
3
VI (mA)
Conditions: VDD(IO) = 3.3 V.
Fig 18. Typical pull-up current Ipu versus input voltage VI
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Product data sheet
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
10.4 ADC characteristics
Table 9.
ADC static characteristics
Tamb = 40 C to +85 C unless otherwise specified; ADC frequency 9 MHz, VDD(3V3) = 3.0 V to
3.6 V.
Parameter
VIA
analog input voltage
0
-
VDD(3V3)
V
Cia
analog input capacitance
-
-
1
pF
ED
differential linearity error
[2][3][4]
-
-
1
LSB
integral non-linearity
[2][5]
-
-
 2.5
LSB
EO
offset error
[2][6]
-
-
1
LSB
EG
gain error
[2][7]
-
-
3
LSB
ET
absolute error
[2][8]
-
-
3
LSB
fc(ADC)
ADC conversion frequency
-
-
257
kHz
-
-
3.9
M
EL(adj)
Ri
Conditions
Min
Typ[1]
Symbol
input resistance
[9][10]
Max
Unit
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
[2]
Conditions: VSS = 0 V, VDD(3V3) = 3.3 V.
[3]
The ADC is monotonic, there are no missing codes.
[4]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width.
See Figure 19.
[5]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and
the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 19.
[6]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the
straight line which fits the ideal curve. See Figure 19.
[7]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer
curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 19.
[8]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer
curve of the non-calibrated ADC and the ideal transfer curve. See Figure 19.
[9]
Tamb = 25 C; maximum sampling frequency fs = 257 kHz and analog input capacitance Cia = 1 pF.
[10] Input resistance Ri depends on the sampling frequency fs: Ri = 1 / (fs  Cia).
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LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
offset
error
EO
gain
error
EG
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
offset error
EO
1 LSB =
VDD(3V3) − VSS
1024
002aae787
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 19. ADC characteristics
LPC122X
Product data sheet
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10.5 BOD static characteristics
Table 10. BOD static characteristics[1]
Tamb = 25 C.
Symbol
Parameter
Conditions
Vth
threshold voltage
interrupt level 1
Min
Typ
Max
Unit
assertion
-
2.25
-
V
de-assertion
-
2.39
-
V
assertion
-
2.54
-
V
de-assertion
-
2.67
-
V
assertion
-
2.83
-
V
de-assertion
-
2.93
-
V
assertion
-
2.04
-
V
de-assertion
-
2.18
-
V
interrupt level 2
interrupt level 3
reset level 1
reset level 2
assertion
-
2.34
-
V
de-assertion
-
2.47
-
V
assertion
-
2.62
-
V
de-assertion
-
2.76
-
V
reset level 3
[1]
LPC122X
Product data sheet
Interrupt levels are selected by writing the level value to the BOD control register BODCTRL, see LPC122x
user manual.
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11. Dynamic characteristics
11.1 Power-up ramp conditions
Table 11. Power-up characteristics
Tamb = 40 C to +85 C.
Symbol Parameter
tr
rise time
twait
wait time
VI
input voltage
Conditions
Min
at t = t1: 0 < VI 400 mV
[1]
[1][2]
at t = t1 on pin VDD
Typ
Max
Unit
0
-
500
ms
12
-
-
s
0
-
400
mV
[1]
See Figure 20.
[2]
The wait time specifies the time the power supply must be at levels below 400 mV before ramping up.
tr
VDD
400 mV
0
twait
t = t1
002aag001
Condition: 0 < VI 400 mV at start of power-up (t = t1)
Fig 20. Power-up ramp
LPC122X
Product data sheet
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11.2 Flash memory
Table 12. Dynamic characteristic: flash memory
Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.
Symbol
Parameter
Conditions
erase time
ter
programming
time
tprog
Nendu
endurance
tret
retention time
for one page (512 byte)
[1]
Min
Max
Unit
-
20
ms
for one sector (4 kB)
[1]
162
ms
for all sectors; mass
erase
[1]
-
20
ms
one word (4 bytes)
[1]
-
49
s
four sequential words
[1]
-
194
s
128 bytes (one row of 32
words)
[1]
-
765
s
[2]
20000
-
cycles
10
-
years
[1]
Erase and programming times are valid over the lifetime of the device (minimum 20000 cycles).
[2]
Number of program/erase cycles.
11.3 External clock
Table 13. Dynamic characteristic: external clock
Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.[1]
Min
Typ[2]
Max
Unit
oscillator frequency
1
-
25
MHz
Tcy(clk)
clock cycle time
40
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk)  0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk)  0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Symbol
Parameter
fosc
Conditions
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 21. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
LPC122X
Product data sheet
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11.4 Internal oscillators
Table 14. Dynamic characteristic: internal oscillators
Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc(RC)
internal RC oscillator frequency
-
11.88
12
12.12
MHz
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at nominal supply voltages.
002aag020
12.15
12 MHz + 1%
fosc(RC)
(MHz)
VDD = 3.6 V
3.3 V
3.0 V
12.05
11.95
12 MHz − 1%
11.85
−40
−15
10
35
60
85
temperature (°C)
Fig 22. Internal RC oscillator frequency versus temperature
Table 15.
Dynamic characteristics: Watchdog oscillator
Min
Typ[1]
Max
Unit
internal oscillator DIVSEL = 0x1F, FREQSEL = 0x1
frequency
in the WDTOSCCTRL register;
[2][3]
-
7.8
-
kHz
DIVSEL = 0x00, FREQSEL = 0xF
in the WDTOSCCTRL register
[2][3]
-
1700
-
kHz
Symbol Parameter
fosc(int)
LPC122X
Product data sheet
Conditions
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
[2]
The typical frequency spread over processing and temperature (Tamb = 40 C to +85 C) is 40 %.
[3]
See the LPC122x user manual.
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11.5 I2C-bus
Table 16. Dynamic characteristic: I2C-bus pins
Tamb = 40 C to +85 C.[1]
Symbol
Parameter
Conditions
Min
Max
Unit
fSCL
SCL clock frequency
Standard-mode
0
100
kHz
[3][4][5][6]
fall time
tf
Fast-mode
0
400
kHz
Fast-mode Plus
0
1
MHz
of both SDA and
SCL signals
-
300
ns
Fast-mode
20 + 0.1  Cb
300
ns
Fast-mode Plus
-
120
ns
Standard-mode
4.7
-
s
Fast-mode
1.3
-
s
Fast-mode Plus
0.5
-
s
Standard-mode
4.0
-
s
Standard-mode
tLOW
tHIGH
tHD;DAT
tSU;DAT
LOW period of the SCL clock
HIGH period of the SCL clock
[2][3][7]
data hold time
[8][9]
data set-up time
Fast-mode
0.6
-
s
Fast-mode Plus
0.26
-
s
Standard-mode
0
-
s
Fast-mode
0
-
s
Fast-mode Plus
0
-
s
Standard-mode
250
-
ns
Fast-mode
100
-
ns
Fast-mode Plus
50
-
ns
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge.
[3]
A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the VIH(min) of the SCL signal) to
bridge the undefined region of the falling edge of SCL.
[4]
Cb = total capacitance of one bus line in pF. If mixed with Hs-mode devices, faster fall times are allowed.
[5]
The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at
250 ns. This allows series protection resistors to be connected in between the SDA and the SCL pins and the SDA/SCL bus lines
without exceeding the maximum specified tf.
[6]
In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors are used, designers should
allow for this when considering bus timing.
[7]
The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than the maximum of tVD;DAT or
tVD;ACK by a transition time. This maximum must only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. If
the clock stretches the SCL, the data must be valid by the set-up time before it releases the clock.
[8]
tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in transmission and the
acknowledge.
[9]
A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT = 250 ns must then be met.
This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the
LOW period of the SCL signal, it must output the next data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the
Standard-mode I2C-bus specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.
LPC122X
Product data sheet
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tf
SDA
tSU;DAT
70 %
30 %
70 %
30 %
tHD;DAT
tf
70 %
30 %
SCL
tVD;DAT
tHIGH
70 %
30 %
70 %
30 %
70 %
30 %
tLOW
S
1 / fSCL
002aaf425
Fig 23. I2C-bus pins clock timing
LPC122X
Product data sheet
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12. Application information
12.1 XTAL input
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave
mode, a minimum of 200 mV(RMS) is needed.
LPC1xxx
XTALIN
Ci
100 pF
Cg
002aae788
Fig 24. Slave mode operation of the on-chip oscillator
12.2 XTAL Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1,Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
LPC122X
Product data sheet
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12.3 ElectroMagnetic Compatibility (EMC)
Radiated emission measurements according to the IEC61967-2 standard using the
TEM-cell method are shown for the LPC1227FBD64/301 in Table 17.
Table 17.
ElectroMagnetic Compatibility (EMC) for part LPC1227FBD64/301 (TEM-cell
method)
VDD = 3.3 V; Tamb = 25 C.
Parameter
Frequency band
System clock =
Unit
12 MHz
24 MHz
33 MHz
150 kHz - 30 MHz
4.2
3.8
6.4
dBV
30 MHz - 150 MHz
7.3
5.4
9
dBV
150 MHz - 1 GHz
16.4
20.1
23.4
dBV
-
M
L
L
-
4
6.6
dBV
Input clock: IRC (12 MHz)
maximum
peak level
IEC
level[1]
Input clock: crystal oscillator (12 MHz)
maximum
peak level
IEC level[1]
[1]
LPC122X
Product data sheet
150 kHz - 30 MHz
4.8
30 MHz - 150 MHz
6.9
5.6
10
dBV
150 MHz - 1 GHz
16.3
20.3
22.3
dBV
-
M
L
L
-
IEC levels refer to Appendix D in the IEC61967-2 Specification.
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13. Package outline
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
c
y
X
A
48
33
49
32
ZE
e
E HE
A
A2
(A 3)
A1
wM
θ
bp
pin 1 index
64
Lp
L
17
detail X
16
1
ZD
e
v M A
wM
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
10.1
9.9
0.5
HD
HE
12.15 12.15
11.85 11.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.12
0.1
Z D (1) Z E (1)
1.45
1.05
1.45
1.05
θ
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT314-2
136E10
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 25. Package outline SOT314-2 (LQFP64)
LPC122X
Product data sheet
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
c
y
X
36
25
A
37
24
ZE
e
E HE
A A2
(A 3)
A1
w M
θ
bp
pin 1 index
Lp
L
13
48
detail X
12
1
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
7.1
6.9
0.5
9.15
8.85
9.15
8.85
1
0.75
0.45
0.2
0.12
0.1
Z D (1) Z E (1)
θ
0.95
0.55
7o
o
0
0.95
0.55
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT313-2
136E05
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 26. Package outline SOT313-2 (LQFP48)
LPC122X
Product data sheet
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14. Soldering
Footprint information for reflow soldering of LQFP48 package
SOT313-2
Hx
Gx
P2
Hy
(0.125)
P1
Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1
P2
0.500
0.560
Ax
Ay
10.350 10.350
Bx
By
C
D1
D2
Gx
7.350
7.350
1.500
0.280
0.500
7.500
Gy
Hx
Hy
7.500 10.650 10.650
sot313-2_fr
Fig 27. Reflow soldering of the LQFP48 package
LPC122X
Product data sheet
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NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Footprint information for reflow soldering of LQFP64 package
SOT314-2
Hx
Gx
P2
Hy
(0.125)
P1
Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1
0.500
P2
Ax
Ay
Bx
By
0.560 13.300 13.300 10.300 10.300
C
D1
D2
1.500
0.280
0.400
Gx
Gy
Hx
Hy
10.500 10.500 13.550 13.550
sot314-2_fr
Fig 28. Reflow soldering of the LQFP64 package
LPC122X
Product data sheet
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15. Abbreviations
Table 18.
LPC122X
Product data sheet
Abbreviations
Acronym
Description
ADC
Analog-to-Digital-Converter
AHB
Advanced High-performance Bus
APB
Advanced Peripheral Bus
BOD
BrownOut Detection
CCITT
Comité Consultatif International Téléphonique et Télégraphique
CRC
Cyclic Redundancy Check
DMA
Direct Memory Access
FIFO
First-In-First-Out
GPIO
General Purpose Input/Output
I/O
Input/Output
IrDA
Infrared Data Association
IRC
Internal Resistor-Capacitor
JEDEC
Joint Electron Devices Engineering Council
PLL
Phase-Locked Loop
SPI
Serial Peripheral Interface
SSI
Serial Synchronous Interface
SSP
Synchronous Serial Port
UART
Universal Asynchronous Receiver/Transmitter
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16. Revision history
Table 19.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LPC122X v.2
20110826
Product data sheet
-
LPC122X v.1.2
Modifications:
LPC122X v.1.2
Modifications:
LPC122X v.1.1
Modifications:
LPC122X v.1
LPC122X
Product data sheet
•
•
•
•
•
•
•
•
•
Power consumption data updated in Table 7.
Power consumption graphs added in Section 10.2.
Electrical pin characteristics updated for all pins in Table 7 and Section 10.3.
Parameter Ri added to Table 9.
EMC data added (Section 12.3).
Parameter VI updated for I2C-bus pins in Table 5.
Section 11.1 “Power-up ramp conditions” added.
Data sheet status updated to Product Data Sheet.
SSP dynamic characteristics removed.
20110329
Objective data sheet
-
LPC122X v.1.1
•
Figure 2 “Pin configuration LQFP64 package”: Pin RTCXIN changed to 58 and pin
RTCXOUT changed to 57.
•
Table 3 “LPC122x pin description”: In column Pin LQFP64, pin RTCXIN changed to 58
and pin RTCXOUT changed to 57.
20110221
•
•
Objective data sheet
-
LPC122X v.1
Section 1 “General description”: Updated text.
Section 2 “Features and benefits”: Updated text.
20110214
Objective data sheet
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Rev. 2 — 26 August 2011
-
-
© NXP B.V. 2011. All rights reserved.
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17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
LPC122X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
58 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
LPC122X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
59 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
19. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.1.1
7.2
7.3
7.4
7.5
7.5.1
7.5.2
7.6
7.6.1
7.7
7.7.1
7.8
7.8.1
7.9
7.9.1
7.10
7.10.1
7.11
7.11.1
7.12
7.12.1
7.13
7.13.1
7.14
7.14.1
7.15
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8
Functional description . . . . . . . . . . . . . . . . . . 16
ARM Cortex-M0 processor . . . . . . . . . . . . . . . 16
System tick timer . . . . . . . . . . . . . . . . . . . . . . 16
On-chip flash program memory . . . . . . . . . . . 16
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 16
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 16
Nested Vectored Interrupt Controller (NVIC) . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 18
IOCONFIG block . . . . . . . . . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Micro DMA controller . . . . . . . . . . . . . . . . . . . 18
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
CRC engine . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Fast general purpose parallel I/O . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
SSP/SPI serial I/O controller . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
I2C-bus serial I/O controller . . . . . . . . . . . . . . 20
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Comparator block . . . . . . . . . . . . . . . . . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
General purpose external event
counter/timers . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.15.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.16
Windowed WatchDog timer (WWDT) . . . . . . . 22
7.16.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.17
Real-time clock (RTC) . . . . . . . . . . . . . . . . . . 23
7.17.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.18
Clocking and power control . . . . . . . . . . . . . . 23
7.18.1
Crystal oscillators . . . . . . . . . . . . . . . . . . . . . . 23
7.18.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 24
7.18.1.2 System oscillator . . . . . . . . . . . . . . . . . . . . . . 24
7.18.1.3 Watchdog oscillator . . . . . . . . . . . . . . . . . . . .
7.18.2
System PLL . . . . . . . . . . . . . . . . . . . . . . . . . .
7.18.3
Clock output . . . . . . . . . . . . . . . . . . . . . . . . . .
7.18.4
Wake-up process . . . . . . . . . . . . . . . . . . . . . .
7.18.5
Power control . . . . . . . . . . . . . . . . . . . . . . . . .
7.18.5.1 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . .
7.18.5.2 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . .
7.18.5.3 Deep power-down mode . . . . . . . . . . . . . . . .
7.19
System control . . . . . . . . . . . . . . . . . . . . . . . .
7.19.1
Start logic . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.19.2
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.19.3
Brownout detection . . . . . . . . . . . . . . . . . . . .
7.19.4
Code security (Code Read Protection - CRP)
7.19.5
APB interface . . . . . . . . . . . . . . . . . . . . . . . . .
7.19.6
AHB-Lite . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.19.7
External interrupt inputs . . . . . . . . . . . . . . . . .
7.20
Emulation and debugging . . . . . . . . . . . . . . .
7.21
Integer division routines . . . . . . . . . . . . . . . . .
8
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
9
Thermal characteristics . . . . . . . . . . . . . . . . .
9.1
Thermal characteristics . . . . . . . . . . . . . . . . .
10
Static characteristics . . . . . . . . . . . . . . . . . . .
10.1
Peripheral power consumption . . . . . . . . . . .
10.2
Power consumption . . . . . . . . . . . . . . . . . . .
10.3
Electrical pin characteristics. . . . . . . . . . . . . .
10.4
ADC characteristics . . . . . . . . . . . . . . . . . . . .
10.5
BOD static characteristics . . . . . . . . . . . . . . .
11
Dynamic characteristics. . . . . . . . . . . . . . . . .
11.1
Power-up ramp conditions . . . . . . . . . . . . . . .
11.2
Flash memory . . . . . . . . . . . . . . . . . . . . . . . .
11.3
External clock. . . . . . . . . . . . . . . . . . . . . . . . .
11.4
Internal oscillators . . . . . . . . . . . . . . . . . . . . .
11.5
I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
Application information . . . . . . . . . . . . . . . . .
12.1
XTAL input . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2
XTAL Printed Circuit Board (PCB) layout
guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3
ElectroMagnetic Compatibility (EMC) . . . . . .
13
Package outline. . . . . . . . . . . . . . . . . . . . . . . .
14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
16
Revision history . . . . . . . . . . . . . . . . . . . . . . .
17
Legal information . . . . . . . . . . . . . . . . . . . . . .
17.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
17.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
17.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
25
25
25
25
25
25
26
26
26
26
26
27
27
27
27
27
28
28
29
30
30
31
34
34
38
42
44
45
45
45
46
47
47
50
50
50
51
52
54
56
57
58
58
58
58
continued >>
LPC122X
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
60 of 61
LPC122x
NXP Semiconductors
32-bit ARM Cortex-M0 microcontroller
17.4
18
19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Contact information. . . . . . . . . . . . . . . . . . . . . 59
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 26 August 2011
Document identifier: LPC122X
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