150 MHz, 32-bit Cortex-M3 microcontrollers LPC1800

NXP 150 MHz, 32-bit
Cortex-M3™ microcontrollers
LPC1800
Fastest Cortex-M3 MCU, Largest SRAM,
High Speed USB
The LPC1800 series of low power, high-performance Cortex-M3 MCUs features frequencies up to
150 MHz and flexible Dual-Bank Flash for the highest reliability in-application re-programming.
Key features
4 150 MHz, 32-bit ARM Cortex-M3
4 Up to 1 MB Flash
4 Up to 200 KB SRAM
4 Memory Protection Unit (MPU)
4 Two High-speed USB 2.0 interfaces –
On-chip High-speed PHY
4 Ethernet MAC
4 LCD Interface
4 Quad-SPI Flash Interface
4 State Configurable Timer Subsystem
4 Up to 80 GPIO
Additional features
4 8-channel GPDMA controller
4 Two 8-channel 10-bit ADCs and 10-bit DAC
(400 K samples per second)
4 Motor Control PWM and Quadrature Encoder Interface
4 Four UARTs
4 Smart card interface
4 Two Fast-mode I2C
4 I2S interface
4 Two SSP/SPI
4 Temperature range: –40 ºC to +85 ºC
Lower power and high performance
The LPC1800 - designed using NXP’s ultra low-leakage 90 nm
process technology - is optimized for low power operation at
very low frequencies all the way through to 150 MHz maximum
performance from either Flash or RAM. This performance
provides maximum connectivity and bandwidth options for
a wide range of demanding applications including power
conversion, lighting, motor control and audio applications.
Large internal memory
The LPC1800 offers the industry’s largest on-chip SRAM for
a Cortex-M3 with up to 200 KB provided in multiple banks. A flexible dual-bank Flash architecture offers the highest
reliability in-application re-programming, and allows for
non-stop Flash operation.
Extensive peripheral set
The LPC1800 also features two new innovative peripherals:
a flexible quad-SPI interface and a State Configurable Timer
subsystem. The LPC1800 is the first microcontroller to provide
a seamless high-speed interface that will connect with virtually
all SPI and quad-SPI manufacturers. The LPC1800’s State
Configurable Timer Subsystem comprises of a timer array
with a state machine enabling complex functionality including
LPC1800 block diagram
event controlled PWM waveform generation, ADC
synchronization and dead time control. This timer
subsystem gives embedded designers increased
flexibility to create user-defined wave-forms and
control signals.
LPC1800
ARM CORTEX-M3
Up to 150 MHz
Additional peripherals available on the LPC1800
include two HS USB controllers, an on-chip HS PHY,
a 10/100T Ethernet controller with hardware enabled
TCP/IP checksum calculation, a high-resolution
color LCD controller, and AES decryption including
two 128-bit secure OTP memories for key storage.
Versions with AES encryption are available on
request.
Brownout
Detector
Up to 1 MB Dual Bank
Flash
Debug
Trace
MPU
Power
Control
Power-on
Reset
Up to 200 KB
System
Tick Timer
GPDMA
Clock
Control
Watchdog
Timer
32 KB ROM & 32-bit OTP
SYSTEM
MEMORY
CORE
SRAM
ROM
Bus System
For more information, please visit
www.nxp.com/microcontrollers
1 x UART,
3x
USART/SC
2x
USB 2.0
LCD
Controller
Timer
Subsystem
2x
SSP/SPI
Eternet
MAC
SDIO
4 x 32-bit
Timers
Motor Ctrl
PWM
Quad Enc
Interface
MOTOR CONTROL
OTP Key
Storage
2 x I 2C
Quad SPI
Interface
External
Mem Ctrl
RTC
I 2S
CAN 2.0B
GPIO
Alarm
Timer
INTERFACES
TIMERS
SERIAL INTERFACES
AES
Decryption
SECURITY
2 x 8 ch
10-bit ADC
10-bit
DAC
ANALOG
Selection guide
Type
Memory
FLASH
LPC1810
LCD
Ethernet
RAM
USB SPI Flash
Interface
136
State Config
Timer Subsys
• • ADC
I/O
pins
Ext bus
interface
2x 4-6ch 10b
17-64
8
Temp. range
options
Package
-40 to +85 °C LQFP144, TBGA100
LPC1812
512 (1x512)
104
• • 2x 4-6ch 10b
17-64
8
-40 to +85 °C LQFP144, TBGA100
LPC1813
512 (2x256)
104
• • 2x 4-6ch 10b
17-64
8
-40 to +85 °C LQFP144, TBGA100
LPC1815
768 (2x384)
136
• • 2x 4-6ch 10b
17-64
8
-40 to +85 °C LQFP144, TBGA100
LPC1817
1024 (2x512)
136
• • 2x 4-6ch 10b
17-64
8
-40 to +85 °C LQFP144, TBGA100
• • 2x 4-6ch 10b
17-64
8
-40 to +85 °C LQFP144, TBGA100
LPC1820
168
1
LPC1822
512 (1x512)
104
1
• • 2x 4-6ch 10b
17-64
8
-40 to +85 °C LQFP144, TBGA100
LPC1823
512 (2x256)
104
1
• • 2x 4-6ch 10b
17-64
8
-40 to +85 °C LQFP144, TBGA100
LPC1825
768 (2x384)
136
1
• • 2x 4-6ch 10b
17-64
8
-40 to +85 °C LQFP144, TBGA100
LPC1827
1024 (2x512)
136
1
• • 2x 4-6ch 10b
17-64
8
-40 to +85 °C LQFP144, TBGA100
200
• 2
• • 2x 8ch 10b
80
16-32
-40 to +85 °C LQFP208, BGA256, BGA180
LPC1833
512 (2x256)
136
• 2
• • 2x 8ch 10b
80
16-32
-40 to +85 °C LQFP208, BGA256, BGA180
LPC1837
1024 (2x512)
LPC1830
LPC1850
136
200
• • 2
• • 2x 8ch 10b
80
16-32
-40 to +85 °C LQFP208, BGA256, BGA180
• 2
• • 2x 8ch 10b
80
16-32
-40 to +85 °C LQFP208, BGA256, BGA180
LPC1853
512 (2x256)
136
• • 2
• • 2x 8ch 10b
80
16-32
-40 to +85 °C LQFP208, BGA256, BGA180
LPC1857
1024 (2x512)
136
• • 2
• • 2x 8ch 10b
80
16-32
-40 to +85 °C LQFP208, BGA256, BGA180
www.nxp.com
© 2010 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
Date of release: September 2010
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and
Document order number: 9397 750 17002
may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof
Printed in the Netherlands
does not convey nor imply any license under patent- or other industrial or intellectual property rights.
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