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Datasheet
Constant Current LED Driver
with 64 Dimming Steps for up to 4 LEDs
BD1754HFN
General Description
Key Specification
 Operating Power Supply Voltage Range:
2.7V to 5.5V
 Quiescent Current:
0.1μA (Typ)
 Operating Temperature Range:
-30°C to +85 °C
BD1754HFN is a multi-level brightness control LED
Driver that works as a constant current driver with 64
steps, so that the driving current can be adjusted finely.
BD1754HFN is best suited to turn ON LEDs that require
high-accuracy LED brightness control.
Package
W(Typ) x D(Typ) x H(Max)
Features
 Current Regulation for up to 4 Parallel LEDs
 Adjustable Constant Current with 64 Steps
 High Accuracy and Good Matching of each Current
Channel (0.5% Typ)
 Brightness Control Via Single-Line Digital Control
Interface (Uni-Port Interface Control = UPIC)
Applications
This driver can be used in various applications such as
mobile phones, portable game consoles and etc.
HSON8
2.90mm x 3.00mm x 0.60mm
Typical Application Circuit
Power Supply
L1
L2
L3
L4
IN
CIN
0.1µF
EN
BD1754HFN
ISET
RISET
GND
○Product structure:Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
120kΩ
(When ILED-max =32mA)
○This product has no designed protection against radioactive rays
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Datasheet
BD1754HFN
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Maximum Applied Voltage
Symbol
Rating
Unit
VMAX
7
V
Pd
0.63 (Note 1)
W
Operating Temperature Range
Topr
-30 to +85
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Power Dissipation
(Note 1) When mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm). Derate by 5.04 mW/°C for Ta higher than 25 °C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum
ratings.
Recommended Operating Conditions (Ta = -30°C to +85°C)
Parameter
Symbol
Operating Power Supply Voltage
Driver Pin Voltage Range
Rating
Unit
Min
Typ
Max
VIN
2.7
3.6
5.5
V
VDRV
0.2
-
VIN-1.4
V
Conditions
When Current driver power ON.
Electrical Characteristics (Unless otherwise specified, Ta = 25°C and VIN = 3.6V)
Parameter
Symbol
Limit
Min
Typ
Max
Unit
Conditions
Quiescent Current
IQ
-
0.1
1
μA
VEN=0V
Circuit Current
IDD
-
1.2
2.0
mA
Except LED current
ILED-MAX
29.76
32.0
34.24
mA
LED Current Accuracy
ILED-diff
-
-
7.0
%
LED Current Matching
ILED-match
-
0.5
3.0(Note 1)
%
RISET = 120kΩ
When current 16.5 mA setting
RISET = 120kΩ
When current 16.5 mA setting
RISET = 120kΩ
Low Threshold Voltage
VIL
-
-
0.4
V
High Threshold Voltage
VIH
1.4
-
-
V
‘H’ Level Input Current
IIH
-
0
2
μA
VEN=VIN
‘L’ Level Input Current
IIL
-2
0
-
μA
VEN=0V
EN ‘H’ Time
tHI
0.05
-
100
μsec
EN ‘L’ Time
tLO
0.3
-
100
μsec
EN OFF Time-Out
tOFF
1
-
-
msec
IN Supply -> EN Active Time
tVINON
1
-
-
msec
EN Stand-by -> VBAT OFF Time
tVINOFF
0
-
-
msec
[Current Driver]
Maximum Current
[Logic Controller]
(Note 1) The following formula is used for calculation:
ILED-match = {(IMAX - IMIN) / (IMAX + IMIN)} x 100
IMAX = The maximum current value from all channels
IMIN = The minimum current value from all channels
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Datasheet
BD1754HFN
Pin Description
ESD Diode
No.
Pin Name
In/
Out
For Power
For GND
1
EN
In
IN
GND
2
GND
-
IN
-
3
ISET
Out
IN
GND
Bias current
Functions
LED enable and Brightness control signal
Ground
4
IN
-
-
GND
Power supply voltage input
5
L1
Out
-
GND
Current sink for LED 1
6
L2
Out
-
GND
Current sink for LED 2
7
L3
Out
-
GND
Current sink for LED 3
8
L4
Out
-
GND
-
Thermal PAD
-
-
-
Current sink for LED 4
Heat radiation PAD of back side
Connect to GND
Block Diagram
L1
L2
L3
L4
IN
EN
UPIC
6
ISET
Current
DAC
GND
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Datasheet
BD1754HFN
IQ [µA]
Circuit Current: IDD [mA]
Typical Performance Curves
Ta= 85°C
Ta= 25°C
Ta= -30°C
Ta= -30, 25, 85 °C
Operating Power Supply Voltage: VIN [V]
Operating Power Supply Voltage: VIN [V]
Figure 2. Circuit Current vs Operating Power
Supply Voltage
ILED (L1) [mA]
LED OFF-Leakage Current [µA]
Figure 1. Circuit Current vs Operating Power Supply
Voltage (Stand-By)
Ta= -30, 25, 85 °C
Ta= -30, 25, 85 °C
L1 Terminal Voltage [V]
Operating Power Supply Voltage: VIN [V]
Figure 4. LED Output Current vs LED Pin Voltage
(VIN = 3.6 V, at 32 mA of LED Current)
Figure 3. LED OFF-Leakage Current vs Operating
Power Supply Voltage
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Datasheet
BD1754HFN
Ta= -30, 25, 85 °C
DNL (L1) [LSB]
ILED (L1) [mA]
Typical Performance Curves - continued
Ta= -30, 25, 85 °C
Operating Power Supply Voltage: VIN [V]
Code [dec]
Ta= -30, 25, 85 °C
L1-L4 Current Matching (%)
INL (L1) [LSB]
Figure 5. LED Output Current vs Operating Power Supply Voltage
(VIN = 3.6 V, at 32 mA of LED Current)
Ta= 85°C
Ta= -30°C
Ta= 25°C
Current State
Code [dec]
Figure 8. LED Current Relative Accuracy
(VIN= 3.6 V)
Figure 7. LED Current Characteristics
(VIN = 3.6 V, Integral Linearity Error)
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Figure 6. LED Current Characteristics
(VIN = 3.6 V, Differential Linearity Error)
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Datasheet
BD1754HFN
Typical Performance Curves - continued
ILED (L1) [mA]
Ta= 25°C
RISET [kΩ]
Figure 9. LED Current vs RISET
(VIN = 3.6 V, at the Maximum Current Setting)
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Datasheet
BD1754HFN
Application Information
1. Description of Operations
(1) UPIC (= Uni-Port Interface Control) interface
BD1754HFN has a single-line digital control interface (UPIC) that can control the power ON/OFF and LED current
value through the EN pin. The LED current decreases by one step depending on the number of rising edges. When
the minimum output current is reached (64 rising edges), the next rising edge changes the output current to the
maximum value at startup time. To maintain any output current, the EN pin must be kept at ‘H’ level. To power OFF,
the EN pin must be kept at ‘L’ level for more than 1msec.
tHI
tLO
tOFF
EN
(Internal)
State
OFF
ILED
C64
C63
C62
C62
C61
C60
C2
C1
C64
OFF
C63
MAX Current
MAX Current
OFF
OFF
MIN Current
Figure 10. Brightness Control Method
tHI
tLO
tOFF
EN
Figure 11. UPIC Interface
By the following sequence, UPIC can control the current driver for MAX current and OFF state only.
tOFF
tOFF
EN
(Internal)
State OFF
C64
ILED
OFF
C64
OFF
MAX
Current
MAX
Current
OFF
OFF
OFF
Figure 12. UPIC Interface Usage for MAX current or OFF Only
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BD1754HFN
(2) Current Driver
The MAX Current is determined by the ISET resistance and the following formula.
I LED  max mA  6.4  600 mV  / RISET k
The LED current state can be changed by the EN control signal. When the state is Cn, the output current (ILED) can be
obtained from the following formula (where, n indicates a state number).
I LED mA  I LED  max  n / 64
The table below shows an example of the LED current settings, when ISET resistance is 120 [kΩ].
C64
Output Current
[mA]
32.0
C48
Output Current
[mA]
24.0
C63
31.5
C47
C62
31.0
C61
30.5
C60
C59
RISET : 120[kΩ]
Output Current
[mA]
8.0
C32
Output Current
[mA]
16.0
23.5
C31
15.5
C15
7.5
C46
23.0
C30
15.0
C14
7.0
C45
22.5
C29
14.5
C13
6.5
30.0
C44
22.0
C28
14.0
C12
6.0
29.5
C43
21.5
C27
13.5
C11
5.5
C58
29.0
C42
21.0
C26
13.0
C10
5.0
C57
28.5
C41
20.5
C25
12.5
C9
4.5
C56
28.0
C40
20.0
C24
12.0
C8
4.0
C55
27.5
C39
19.5
C23
11.5
C7
3.5
C54
27.0
C38
19.0
C22
11.0
C6
3.0
C53
26.5
C37
18.5
C21
10.5
C5
2.5
C52
26.0
C36
18.0
C20
10.0
C4
2.0
C51
25.5
C35
17.5
C19
9.5
C3
1.5
C50
25.0
C34
17.0
C18
9.0
C2
1.0
C49
24.5
C33
16.5
C17
8.5
C1
0.5
State
State
State
State
C16
When the state is C64 (the maximum value), the output current value can be changed on the ISET resistance value as below.
State : C64
Total Output Current of the Four
Channels (mA)
ISET Resistance Value (kΩ)
Output Current per Channel (mA)
240
16.0
64.0
120
32.0
128.0
90
42.7
170.8
60
64.0
256.0
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Datasheet
BD1754HFN
2. Application Circuit Examples
(1) Circuit example when the power supply is separated
Power Supply2=5V
(Ex.)
On the assumption that VF is 3 V
Power Supply1
L1
L2
L3
The voltage value of L* pin must
be VIN-1.4 V at the maximum
when the LED is powered ON.
L4
(Maximum rating = 7.0 V)
IN
CIN
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
120kΩ
(When ILED-max=32mA)
GND
Figure 13. Circuit Example when the Power Supply is separated
This figure shows a circuit example when the power supply for IN and for LEDs is separated. Apply a voltage of VF
(threshold voltage value of a white LED) or higher to the LED. In this case, please note that when the LED is powered
ON, the voltage value of L* pin (each pin of L1 to L4) must be VIN-1.4 V at the maximum. If a voltage of higher than VIN-1.4
V is applied to L* pin, a desired current value cannot be obtained. Also, please pay attention to the voltage application
procedure at start-up. Be sure to power the current driver ON using the UPIC after applying power supply voltages to
the IN and the LED-anode pins. If the current driver is powered ON prior to applying power supply voltages to the LED,
a rush current occurs in the LED. Determine the resistance value with which the LED current value is maximized and
then connect such resistor between the ISET and the GND pins. The power ON/OFF and the brightness of the LEDs are
controlled through the EN pin in accordance with the UPIC format.
(2) Circuit example when using only two LEDs
Connect to the GND pin.
L1
L2
L3
L4
IN
CIN
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
GND
120kΩ
(When
ILED-max=32mA)
Figure 14. Circuit Example when using only Two LED’s
This figure shows a circuit example when none of L3 and L4 LED’s are used. Connect both of the unused L3 and L4
pins to the GND pin. Likewise, it is possible to make the L1 and/or the L2 pins unused, which allows the back lights to
be used with the one or three LED(s) turned ON. In all cases, connect the unused L* pin to the GND pin. Determine the
resistance value with which the LED current value is maximized and then connect such resistor between the ISET and
the GND pins. The power ON/OFF and the brightness of the LED’s are controlled through the EN pin in accordance
with the UPIC format.
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BD1754HFN
(3) Circuit example when the EN pin is powered ON at all times
L1
L2
L3
L4
IN
CIN
0.1µF
Rs
EN
UPIC
Cs
6
ISET
Current
DAC
RISET
GND
120kΩ
(When
ILED-max=32mA)
Figure 15. Circuit example when the EN Pin is Powered ON at all times
This figure shows a circuit example when the EN pin is powered ON at all times. To prevent a rush current from
occurring in the driver, it is necessary to apply voltage to the IN pin and the LEDs prior to powering the current driver
ON. Mount an RC filter between the IN and the EN pins to delay the EN pin rising against the power-supply voltage
rising. Determine the resistance value with which the LED current value is maximized and then connect such resistor
between the ISET and the GND pins.
(4) Circuit example when performing a PWM brightness control
L1
L2
L3
L4
IN
CIN
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
120kΩ
GND
1MΩ
PWM
Figure 16. Circuit example when performing a PWM brightness control
This figure shows a circuit example when performing a PWM brightness control. Through switching the ISET resistance
value by the PWM input signal, the LED current is outputted under a PWM mode. The EN signal is controlled by an
applied voltage level. In the circuit example shown above, the LED current value is changed to 3.43 mA in 0 % of the
PWM duty cycle, 17.72 mA in 50 % of that and 32 mA in 100 % of that.
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BD1754HFN
(5) Circuit example when driving a large current with only one LED powered ON.
ILED=128mA
L1
L2
L3
L4
IN
CIN
0.1µF
EN
UPIC
6
ISET
Current
DAC
RISET
GND
120kΩ
(When
ILED-max=32mA)
Figure 17. Circuit Example when Driving a Large Current with only one LED Powered ON.
This figure shows a circuit example when driving a large current through all of four channels with only one LED
powered ON. By shorting out all the LED driver pins, in the example of using 120 kΩ RISET, a current up to 128 mA (32
mA x 4) can be driven. In this example, the brightness can be adjusted in 64 gradations with 2 mA step (0.5 mA
step/channel x 4 channels). For higher current values, using 60 kΩ R ISET allows a current up to 256 mA to be driven
into one of the LEDs. The power ON/OFF and the brightness of the LEDs are controlled through the EN pin in
accordance with the UPIC format.
(6) Circuit example when making the eight LEDs available by connecting the two BD1754HFN drivers
ILED=32mA
L1
L2
L3
ILED=32mA
L4
L1
IN
CIN
L2
L3
L4
IN
0.1µF
CIN
0.1µF
EN
EN
UPIC
UPIC
6
6
ISET
Current
DAC
RISET
GND
ISET
Current
DAC
RISET
120kΩ
(When
GND
ILED-max=32mA)
120kΩ
(When
ILED-max=32mA)
Figure 18. Circuit Example when Making the Eight LEDs Available by Connecting the Two BD1754HFN Drivers
This figure shows a circuit example when making eight LEDs available by connecting two BD1754HFN drivers.
By connecting the control signals to the EN pins in parallel, the eight LED channels can be controlled concurrently.
This parallel connection scheme can increase the number of the LED channels further as necessary (such as twelve,
sixteen, or more). Determine the resistance value with which the LED current value is maximized and then connect
such resistor between the ISET and the GND pins. The power ON/OFF and the brightness of the LEDs are controlled
through the EN pin in accordance with the UPIC format.
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BD1754HFN
(7) Circuit example when connecting the two LEDs to each of the channels in series
Power Supply2=6.2V to 7V
(Ex.)
On the assumption that VF is 3 V
The voltage value of L* pin must
be VIN-1.4 V at the maximum
when the LED is powered ON.
Power Supply1
L1
L2
L3
L4
(Maximum rating = 7.0 V)
IN
0.1µF
EN
UPIC
6
ISET
Current
DAC
120kΩ
(When ILED-max=32mA)
GND
Figure 19. Circuit example when connecting the two LEDs to each of the channels in series
This figure shows a circuit example when making 8 (2 x 4) LEDs available by connecting two LEDs to each of the
channels in series. In this example, when VF is set to approx. 3 V in order to ensure the voltage to L1 through L4 pins,
it is necessary to apply a voltage of 6.2 V (3 V x 2 LEDs in series + 0.2 V of the minimum voltage value of the driver
pin) or higher to the LED anode pin as its power supply voltage. Pay attention that the voltage should not exceed the
7.0-V maximum rating of the L1 through L4 pins. Determine the resistance value with which the LED current value is
maximized and then connect such resistor between the ISET and the GND pins. The power ON/OFF and the
brightness of the LEDs are controlled through the EN pin in accordance with the UPIC format.
3. Selection of Components Externally Connected
<Capacitor>
Symbol
Recommended Value
CIN
<Resistor>
Symbol
Recommended Component
Manufacturer
0.1µF
GRM188B31H104KA92B
MURATA
Recommended Value
Recommended Component
Manufacturer
120kΩ
MCR10PZHZF1203
ROHM
RISET
Connect
CIN
input-bypass
capacitor in close proximity
between the IN and GND pins.
Connect the RISET resistor in
close proximity to the ISET pin.
L4
L3
L2
L1
EN
GND
ISET
IN
LED_PWR
CIN
4. Recommended PCB Layout
Design PCB pattern to provide low impedance for the wiring to the power supply line.
LED_PWR
Also, provide a bypass capacitor if needed.
RISET
CIN
RISET
EN
GND
IN
Figure 20. Layout Image of the Application Components (Top View)
EN
GND
IN
Figure 21. Surface (Top View)
<Heat radiation PAD of back side>
PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin.
Moreover, connect ground plane (GND) of board using via as shown in the patterns of next page.
The efficiency of heat radiation improves according to the area of ground plane (GND).
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BD1754HFN
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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BD1754HFN
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 22. Example of monolithic IC structure
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TSZ22111・15・001
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10.Dec.2015 Rev.002
Datasheet
BD1754HFN
Ordering Information
B
D
1
7
5
4
Part Number
H
F
N
Package
HFN: HSON8
-
TR
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
HSON8 (TOP VIEW)
Part Number Marking
BD1
LOT Number
7 5 4
1PIN MARK
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TSZ02201-0G3G0C200060-1-2
10.Dec.2015 Rev.002
Datasheet
BD1754HFN
Physical Dimension, Tape and Reel Information
Package Name
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
HSON8
16/17
TSZ02201-0G3G0C200060-1-2
10.Dec.2015 Rev.002
Datasheet
BD1754HFN
Revision History
Date
Revision
09.Nov.2012
10.Dec.2015
001
002
Changes
New Release
Applied the ROHM Standard Style and improved understandability.
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© 2012 ROHM Co., Ltd. All rights reserved.
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10.Dec.2015 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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