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VT-X700-E, VT-X700-L
High-speed automated X-ray CT
inspection system
Market Trends and Issues
Miniaturization
Lightweighting
Density
enhancement
The higher the engineering demands,
the greater the challenge in Jisso (surface mounting) design.
Compromised
solder joint
strength
Miniaturized
chips
Bottom surface
electrodes
(BGA or CSP)
Narrow pitches
Shield mounting
Enhanced need
of hidden
joint inspection
Solder joint reliability must be ensured
while overcoming various design constraints.
Omron's X-Ray Inspection System with 3D-CT Method
The 3D-CT method enables the inspection of indistinct
X-ray
camera
shapes which 2D or pseudo CT cannot detect.
2D method (transparent)
image
VT-X700 CT image
PCBs
X-ray source
No difference
from quality product
Clear difference
from quality product
Making the impossible in design a reality!
· Bottom surface
f
mounting
ti (P
(Partial
ti l mounting
ti e.g. on a BGA b
bottom
tt
iis now possible)
· Sufficient solder fillet shape is ensured even for hidden joints
· Enhanced application of packaged components
Pinpoint Inspection
The cross-sectional images of relevant inspection targets can be easily selected
3D-CT Method
from abundant camera-image libraries to ensure precise fault detection.
Quality
product
Cross-section image
CT image
Cross-section image
CT image
Wettability
defect
Enlarged view of rendered image
Full coverage
High-Output X-Ray Source
Component types
Normal
Inspection of large-thickness PCBs and power devices is possible by combining
a proprietary CT structuring technology with a high-output X-ray source.
CT image
Defect
CT image
Insufficient soldering
Through Hole Device
(THD)
Lifting
Lead components
Transistors, gull-wing type
(SOP • QFP)
Insufficient soldering
QFN
Insufficient soldering
Chips
IC chip
* 3D graphic image
Void
Power devices
(e.g. IGBT, MOS-FET)
: Imaging cross section
Compatibility with L-Sized
(610 mm × 610 mm) PCBs
* The 3D graphic images used in this catalog were created using VGStudio from Volume Graphics GmbH.
Compatible with large-sized PCBs such as those used
by network base stations.
High-speed
World's highest CT speed* thanks to our patent-approved technologies.
10% Reduction in Inspection
Tact Time (Internal Comparison)
New imaging system reduced inspection tact times by 10% compared
with conventional systems.
Enabled the complete inspection of all components
(almost impossible by visible light-based inspection).
* Based on an internal research conducted in January 2015.
Specifications
Hardware configuration/function specifications
Item
Description
Model
VT-X700-E
Inspected components
VT-X700-L
BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, Power devices
Inspected items
Openings, non-wet, solder amount, shifting, foreign object stuck, bridging, lead presence, etc. (selectable to suit detected item)
Imaging method
Imaging
specifications
3D-slice imaging using parallel CT
Resolution
10, 15, 20, 25 or 30 μm (selectable to suit detected item)
X-ray source
Micro-focus closed tube (130 kV)
X-ray detector
Size
Inspected
PCBs
Flat panel detector
M-size PCB (50 mm x 50 mm to 330 mm x 255 mm); thickness: 0.4 mm to 3.0 mm
PCB (50 mm x 50 mm to 610 mm x 610 mm); thickness: 0.6 mm to 7.0 mm
2.0 kg or lighter (with components mounted)
12.0 kg or lighter (with components mounted)
Weight
Top: 50 mm or shorter; bottom: 20 mm or shorter
Mounted component height
Warpage/Flexure
Dimensions
3.0 mm or less
2,180 (W) x 2,500 (D) x 1,720 (H) mm
Approx. 2,920 kg
Weight
Device
specifications
2.0 mm or less
1,550(W) x 1,650(D) x 1,620(H)mm
Approx. 5,250 kg
900±15 mm
PCB transfer height
Power supply voltage
Single phase, 200/210/220/230/240 VAC (± 10%), 50/60 Hz
3 phase, 200/210/220/230/240 VAC, 380/405/415/440 VAC (± 10%), 50/60 Hz
3.1 kVA
4.7 kVA
Rated power
X-ray leakage
Less than 0.5 μSv/h
Dimensions
VT-X700-E
* Contact Omron's sales representative for the VT-X700-L external dimensions.
This document provides information mainly for selecting suitable models. Please read the Instruction Sheet carefully for information that the
user must understand and accept before purchase, including information on warranty, limitations of liability, and precautions .
This product may cause interference if used in residential areas.
OMRON Corporation
INDUSTRIAL AUTOMATION COMPANY
INSPECTION SYSTEMS BUSINESS DIVISION
SALES DEPARTMENT
Shinagawa Front Bldg. Conference 7F
2-3-13 Kounan Minato-ku Tokyo
108-0075 JAPAN
TEL +81-3-6718-3550 FAX:+81-3-6718-3553
OMRON INDUSTRIAL AUTOMATION
(CHINA) CO., LTD.
F20,TowerA,NEO Building,6011ShennanAvenue,
Futian District, Shenzhen, Guangdong
518048, China
TEL: +86-755-8359-9028 FAX: +86-755-8359-9628
Cat. No. Q327-E1-04
Omron AOI Business Europe, Omron Europe B.V.
Zilverenberg 2, 5234 GM 's-Hertogenbosch, The Netherlands
TEL: +31 (0)736-481811 FAX: + 31 (0)736-481879
OMRON ELECTRONICS LLC
2895 Greenspoint Parkway, Suite 200
Hoffman Estates, IL 60169 U.S.A
TEL:+1-847-843-7900 FAX:+1-847-843-7787
Authorized Distributor:
OMRON ELECTRONICS KOREA CO.,LTD.
21F, KyoboTower B Wing, 465, Gangnam-daero,
Seocho-gu, Seoul, Korea 137-920
TEL: +82-2-3483-7789 FAX: +82-2-3483-7788
OMRON ASIA PACIFIC PTE LTD
438A Alexandra Road #05-05/08 (Lobby 2)
Alexandra Technopark Singapore 119967
TEL:+65-6835-3011 FAX:+65-6835-2711
Note: Specifications subject to change without notice
0416(1215)(O)
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