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Datasheet
4-Channel White LED Driver
with Integrated FET for up to 24 LEDs
BD6586MUV
●General Description
BD6586MUV is white LED driver IC with PWM step-up
DC/DC converter that can boost max 24V and current
driver that can drive max 25mA. The wide and
precision brightness can be controlled by external
PWM pulse.
BD6586MUV has very accurate current drivers, and it
has few current errors between each strings. So, it will
be helpful to reduce brightness spots on the LCD.
Small package type is suited for saving space.
●Key Specifications
 Operating power supply voltage range: 2.7V to 5.5V
 LED maximum current:
25mA (Max.)
 Quiescent Current:
0.1μA (Typ.)
 Switching frequency:
1.0MHz(Typ.)
 Operating temperature range:
-40℃ to +85℃
●Package
●Features
■ High accuracy & good matching (±3.0%) current
drivers 4ch (MAX.25mA/ch)
■ 28V power Nch MOSFET
■ Soft Start
■ Drive up to 6 in series, 4 strings in parallel
■ Rich safety functions
▪ Over-voltage protection
▪ Output Short protection
▪ External SBD open detect
▪ Over current limit
▪ Thermal shutdown
▪ UVLO
W(Typ.) x D(Typ.) x H(Max.)
VQFN024V4040
4.00mm x 4.00mm x 1.00mm
Figure 1.
●Applications
All middle size LCD equipments backlight of Notebook
PC, portable DVD player, car navigation systems, etc.
●Typical Application Circuit
Battery
2.7V to 5.5V
4.7μF
4.7μH
6LED x 4Parallel
2.2μF
1μF
SW
TRSW
100Hz~1kHz
PWM
SW
VDET
VBAT
SW
EN2
LED1
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 20mA
Can be set up to each 10~25mA
24kΩ
Figure 2. Typical Application Circuit
(Power control PWM application)
○Product structure:Silicon monolithic integrated circuit
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Datasheet
BD6586MUV
●Absolute Maximum Ratings (Ta=25 ℃)
Parameter
Symbol
Terminal voltage 1
VMAX1
7
V
Terminal voltage 2
VMAX2
25
V
Condition
VBAT, EN1, EN2, TRSW,
PWM,TESTO, ISET, TEST
LED1, LED2, LED3, LED4,
Terminal voltage 3
VMAX3
30.5
V
SW
Terminal voltage 4
VMAX4
50.5
V
VDET
Power dissipation 1
Pd1
Ratings
Unit
500
*1
mW
*2
mW
Power dissipation 2
Pd2
780
Power dissipation 3
Pd3
1510 *3
mW
Operating temperature range
Topr
-40 to +85
℃
Storage temperature range
Tstg
-55 to +150
℃
*1
*2
*3
Reduced 4.0mW/ ℃ With Ta>25 ℃ when not mounted on a heat radiation Board.
1 layer (ROHM Standard board) has been mounted. Copper foil area 0mm2, When it’s used by more than Ta=25 ℃, it’s reduced by 6.2mW/ ℃.
4 layer (JEDEC Compliant board) has been mounted.
Copper foil area 1layer 6.28mm2, Copper foil area 2 to 4layers 5655.04mm2, When it’s used by more than Ta=25 ℃, it’s reduced by 12.1mW/ ℃.
●Recommended Operating Rating (Ta=-40 ℃ to +85 ℃)
Limits
Parameter
Symbol
Min.
Typ.
Power supply voltage
VBAT
2.7
3.6
●Electrical Characteristics
(Unless otherwise specified, VBAT=3.6V, Ta = +25 ℃)
Limits
Parameter
Symbol
Min.
Typ.
Max.
5.5
Max.
Unit
Condition
V
Unit
Condition
[EN1, EN2, PWM Terminal]
EN threshold voltage (Low)
VthL
0
-
0.4
V
EN threshold voltage (High)
VthH
1.4
-
5.5
V
Iin
-
8.3
16.0
µA
Input=2.5V
UVLO
2.05
2.35
2.65
V
VBAT falling edge
Quiescent Current
Iq
-
0.1
2.0
µA
EN1=EN2=PWM=0V
Current Consumption
Idd
-
2.2
4.6
mA
VDET=0V,ISET=24kΩ
LED Control voltage
EN terminal input current
[Under Voltage Lock Out]
Under Voltage Lock Out
[Switching Regulator]
VLED
0.4
0.5
0.6
V
Over Current Limit
Ocp
1.1
1.5
2.5
A
*1
SBD Open Protect
Sop
-
-
0.1
V
Detect voltage of VDET pin
Switching frequency
fSW
0.7
1.0
1.3
MHz
Duty cycle limit
Duty
91
95
99
%
LED1-4=0.3V
Ovl
25.0
25.5
26.0
V
LED1-4=0.3V
RSW
-
0.24
0.32
Ω
Isw=100mA
Over voltage limit
SW Transistor On Resistance
[Current driver]
LED maximum current
ILMAX
-
-
25
mA
LED current accuracy
ILACCU
-
-
±5
%
LED current matching
ILMAT
-
-
±3
%
Iset
0.5
0.6
0.7
V
ILOCP
35
60
90
mA
LEDOVP
10.0
11.5
13.0
V
ISET voltage
LED current limiter
LED Terminal
Over Voltage Protect
ILED=20mA
▪Each LED current/Average (LED1- 4)
▪ILED=20mA
Current limit value at ISET
resistance 4.7kΩ setting
LED1, 2, 3, 4=0.5V
EN1=EN2=PWM=2.5V
*1 This parameter is tested with DC measurement.
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Datasheet
BD6586MUV
●Pin Descriptions
In/Out
PIN number
1
VBAT
In
Battery input
G
2
EN1
In
Power control pin
A
3
EN2
In
Power control pin
A
4
GND
-
GND for DC/DC
B
5
PWM
In
PWM input pin for power ON/OFF only driver
A
6
ISET
In
Register connection for LED current setting
D
7
GND
-
GND for ISET Register
B
8
LED1
In
Current sink for LED1
C
9
LED2
In
Current sink for LED2
C
10
GND
-
GND for Current Driver
B
11
LED3
In
Current sink for LED3
C
12
LED4
In
Current sink for LED4
C
13
TEST
In
14
TESTO
Out
15
N.C.
-
16
SW
17
SW
18
19
20
Function
Terminal equivalent
circuit diagram
PIN Name
TEST input (Pull down 100kΩ to GND)
A
TEST output
D
No connect pin
E
Out
Switching Tr drive Pin
F
Out
Switching Tr drive Pin
F
SW
Out
Switching Tr drive Pin
F
VDET
In
Detect input for SBD open and OVP
C
N.C.
-
No connect pin
E
21
PGND
-
PGND for switching transistor
D
22
PGND
-
PGND for switching transistor
D
No connect pin
E
The gate of Switching Tr
Heat radiation PAD of back side
Connect to GND
D
23
N.C.
-
24
TRSW
Thermal
PAD
Out
-
-
-
●Pin ESD Type
VBAT
VBAT
PIN
PIN
PIN
PGND
GND
GND
B
A
C
VBAT
PIN
PIN
PIN
PGND
GND
D
E
F
PIN
GND PGND
G
Figure 3. Pin ESD Type
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Datasheet
BD6586MUV
●Block Diagram
Current
SENSE
Pin number 24pin
Figure 4. Block diagram
●Description of Functions
1) PWM current mode DC/DC converter
While BD6586MUV is power ON, the lowest voltage of LED1, 2, 3, 4 is detected, PWM duty is decided to be 0.5V
and output voltage is kept invariably. As for the inputs of the PWM comparator as the feature of the PWM current mode,
one is overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal
that controls the inductor current into Slope waveform to prevent sub harmonic oscillation. This output controls internal
Nch Tr via the RS latch. In the period where internal Nch Tr gate is ON, energy is accumulated in the external inductor,
and in the period where internal Nch Tr gate is OFF, energy is transferred to the output capacitor via external SBD.
BD6586MUV has many safety functions, and their detection signals stop switching operation at once.
2) Soft start
BD6586MUV has soft start function.
The soft start function prevents large coil current.
Rush current at turning on is prevented by the soft start function.
After EN1, EN2 are changed L H, soft start becomes effective for within 1ms and soft start doesn't become effective
even if EN1, EN2 are changed L H after that.
And, when the H section of PWM is within 1ms, soft start becomes invalid when PWM is input to H more than three times.
The invalid of the soft start can be canceled by making EN1, EN2, PWM  L.
And, a soft start function doesn't work after a protection function release.
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Datasheet
BD6586MUV
●Description of Functions - continued
3) External SBD open detect and over voltage protection
BD6586MUV has over boost protection by external SBD open and over voltage protection. It detects VDET voltage and is
stopped output Tr in abnormal condition. Details are as shown below.
▪ External SBD open detect
In the case of external SBD is not connected to IC, the coil or internal Tr may be destructed. Therefore, at such an error
as VOUT becoming 0.1V or below, the Under Detector shown in the figure works, and turns off the output Tr, and
prevents the coil and the IC from being destructed.
And the IC changes from activation into non-activation, and current does not flow to the coil (0mA).
▪ Over voltage protection
At such an error of output open as the output DC/DC and the LED is not connected to IC, the DC/DC will boost too much
and the VDET terminal exceed the absolute maximum ratings, and may destruct the IC. Therefore, when VDET becomes
sensing voltage or higher, the over voltage limit works, and turns off the output Tr, and the pressure up made stop.
At this moment, the IC changes from activation into non-activation, and the output voltage goes down slowly. And,
when the output voltage becomes the hysteresis of the over voltage limit or below, the output voltage pressure up to
sensing voltage once again and unless the application error is recovered, this operation is repeated.
4) Thermal shut down
BD6586MUV has thermal shut down function.
The thermal shut down works at 175°C or higher, and while holding the setting of EN1, EN2 control from the outside,
turns into non operation condition from operation condition. And at 175°C or below, the IC gets back to its normal
operation.
5) Over Current Limit
Over current flows the current detection resistor between switching transistor source and PGND, then the voltage of that
resistor turns more than detection voltage. Over current protection is operating and it is prevented from flowing more than
detection current by reducing ON duty of switching Tr without stopping boost.
As over current detector of BD6586MUV is detected peak current, current more than over current setting value does not
flow.
6) Under Voltage Lock Out(UVLO)
When VBAT declines in 2.35V (Typ.) from the condition of the power-on, DC/DC and a current driver are changed from a
state of movement to the condition at the time of the non-movement. And, it is returned in a state of movement when
VBAT is raised beyond 2.55V (Typ.).
●Operating of the Application Deficiency
1) When 1 LED or 1parallel OPEN during the operating the LED parallel which became OPEN isn't lighting, but other LED
parallel is lighting.
Then, Output boosts up to the over voltage protection voltage 25.5V because LED terminal can be 0V.
After the over voltage protection is detected, LED terminal of 0V isn’t cut from feedback loop.
Then, Output voltage will become normal voltage automatically.
2) When LED short-circuited in the plural
All LED continue to be turned on, unless LED terminal voltage become more than “LED terminal over voltage protection (11.5V)”.
When it was more than 11.5V, the line which short-circuited is only turned on, and LED current of other lines decrease or turn
off.
3) When Schottky diode came off
All LED aren't turned on.
Also, IC isn't destroyed because boost operating stops by the Schottky diode coming off protected function.
4) When an output capacitor short.
All LED aren't turned on.
And, an IC isn't destroyed because boost stops by the SBD open protection function.
But, big electric current occurs, and a coil or SBD is likely to destroy it because the route of the GND short circuit of the
power supply → coil → output capacitor occurs.
5) When the resistance to connect it to the ISET terminal short,
All LED aren't turned on.
Because LED current limit works, all current drivers stop, and DC/DC maintains boost under the state without load.
And, it is returned in a state of normality by canceling a state of short.
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Datasheet
BD6586MUV
●Start Control and Select Constant Current Driver
BD6586MUV can control the start conditions by EN1, 2 and PWM terminals, and sets 0.4V or below EN1, 2 terminals, so IC
can power off. EN1, 2 and PWM power on at more than 1.4V, constant current can select ON/OFF by the combination of
EN as shown below table.
When there is unused constant current driver, unused LED terminal is set “OPEN”.
Enable
Constant current driver
IC POWER
EN1
EN2
PWM
LED1
LED2
LED3
LED4
H
H
H
OFF
ON
ON
OFF
ON
L
H
H
OFF
ON
ON
ON
ON
H
L
H
ON
ON
ON
ON
ON
L
L
H
OFF
OFF
OFF
OFF
OFF
H
H
L
OFF
OFF
OFF
OFF
ON
L
H
L
OFF
OFF
OFF
OFF
ON
H
L
L
OFF
OFF
OFF
OFF
ON
L
L
L
OFF
OFF
OFF
OFF
OFF
●Control Signal Input Timing
2.7V
0V
Stable voltage
VBAT
1
○
PWM
3
○
VBAT
Min. 100µs
2
○
10kΩ
5V
PIN
EN1,2
300kΩ
DC/DC VOUT
GND
Figure 5. control Signal timing
Figure 6. Voltage with a control sign higher than VBAT
Example corresponding to application of conditions
In case you input control signs, such as EN1, EN2 and PWM in the condition that the standup of supply voltage (VBAT) is
not completed, be careful of the following point.
①Input each control signal after VBAT exceeds 2.7V.
②Please do not input each control sign until VBAT exceeds HI voltage of EN1, EN2 and PWM.
③When you input HI voltage to EN1, EN2 and PWM during the standup of VBAT, please give Min.100µs as the standup
time of VBAT from stable voltage to 2.7V.
There is no timing limitation at each input signal of EN1, EN2 and PWM.
If each control sign changes into a condition lower than VBAT in (1) and (2), it goes via the ESD custody diode by the side
of VBAT of each terminal. A power supply is supplied to VBAT and there is a possibility of malfunctioning. Moreover, when
the entrance current to the terminal exceeds 50mA, it has possibility to damage the LSI. In order to avoid this condition, as
shown in the above figure, please insert about 10kΩ in a signal line, and apply current qualification.
●LED Current Setting Range
LED current can set up Normal current by resistance value (RISET) connecting to ISET voltage.
Setting of each LED current is given as shown below.
Normal current = 20mA(24kΩ/RISET)
Also, Normal current setting range is 10mA to 25mA.
LED current becomes a leak current MAX 2µA at OFF setting.
ISET Normal current setting example
RISETH
LED current
RISETH
24kΩ (E24)
20mA
28kΩ (E96)
25.5 kΩ (E96)
18.8mA
30kΩ (E24)
27 kΩ (E12)
17.8mA
33kΩ (E6)
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LED current
17.1mA
16.0mA
14.5mA
TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
●Brightness Control
There are two dimming method is available, first method is analog dimming that apply analog voltage to ISETH terminal,
and second method is PWM control via digital dimming of EN1, EN2 PWM terminals or PWM. Because each method has
the different merit, please choose a suitable method for the application of use.
Refer to Figure 25 for the analog dimming.
Two techniques can be used as digital dimming by the PWM control. One is PWM control of current driver, the other is
PWM control of power control.
As these two characteristics are shown in the below, selects to PWM control process comply with application.
•Efficiency emphasis in the low brightness which has an influence with the battery life
•LED current dispersion emphasis in the PWM brightness control
 2) Power control PWM control
 1) Current driver PWM control
(Reference)
PWM regulation process
Efficiency of LED current 0.2mA
(PWM Duty=1%)
PWM frequency 200Hz
Low Duty
Current driver
60%
0.1%
Power control
94%
0.6%
1) Current driver PWM control is controlled by providing PWM signal to PWM terminal, as it is shown Figure 7.
The current set up with ISET is chosen as the H section of PWM and the current is off as the L section. Therefore, the
average LED current is increasing in proportion to duty cycle of PWM signal. This method that it lets internal circuit and
DC/DC to work, because it becomes to switch the driver, the current tolerance is a few when the PWM brightness is
adjusted, it makes it possible to brightness control until 20µs (MIN0.4% at 200Hz). And, don't use for the brightness
control, because effect of ISET changeover is big under 20µs ON time and under 20µs OFF time. There is no effect of
ON/OFF changeover at 0% and 100%, so there is no problem on use. Typical PWM frequency is 100Hz to 10kHz.
PWM
ON
OFF
LED current
ON
OFF
Coil current
ON
OFF
ON
IC’s active current
Figure 7. Current driver PWM control
2) Power control PWM control is controlled by providing PWM signal to EN1, EN2 as it is shown Figure 8. The current
setting set up with PWM logic is chosen as the H section and the current is off as the L section. Therefore, the average
LED current is increasing in proportion to duty cycle of EN1, EN2 signal. This method is, because IC can be power-off at
off-time, the consumption current can be suppress, and the high efficiency can be available, so it makes it possible to
brightness control until 50µs (MIN1% at 200Hz). And, don't use for the brightness control, because effect of power
ON/OFF time changeover is big under 50µs ON time and under 50µs OFF time. There is no effect of ON/OFF
changeover at 0% and 100%, so there is no problem on use. Typical PWM frequency is 100Hz to 1kHz.
EN1,EN2
ON
OFF
LED current
ON
OFF
Coil current
ON
OFF
IC’s active current
ON
OFF
Figure 8. Power control PWM control
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Datasheet
BD6586MUV
●The Separations of the IC Power Supply and Coil Power Supply
This IC can work in separating the power source in both IC power supply and coil power supply. With this application, it can
obtain that decrease of IC power consumption, and the applied voltage exceeds IC rating 5.5V.
That application is shown in below Figure 9. The higher voltage source is applied to the power source of coil that is
connected from an adapter etc. Next, the IC power supply is connected with a different coil power supply.
When the coil power supply is applied, it is no any problem even though IC power supply is the state of 0V. Although IC
power supply is set to 0V, pull-down resistance is arranged for the power off which cuts off the leak route from coil power
supply in IC inside, the leak route is cut off. And, there is no power on-off sequence of coil power supply and IC power
supply.
Other Power Supply
Battery
6V to 25V
4.7μF
2.7V to 5.5V
4.7μH
6LED x 4Parallel
2.2μF
SW
SW
TRSW
VBAT
SW
VDET
EN2
Power
ON/OFF
LED1
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND
GND
GND
GND
ISET
LED4
Each 20mA
24kΩ
Figure 9. Each battery and coil power supply
●The Coil Selection
The DC/DC is designed by more than 4.7µH. When L value sets to a lower value, it is possibility that the specific
sub-harmonic oscillation of current mode DC / DC will be happened.
Please do not let L value to 3.3µH or below.
And, L value increases, the phase margin of DC / DC becomes to zero. Please enlarge the output capacitor value when you
increase L value.
Example)
4.7µH
=
output capacitor
2.2µF/50V
1pcs
6.8µH
=
output capacitor
2.2µF/50V
2pcs
10µH
=
output capacitor
2.2µF/50V
3pcs
This value is just examples, please made sure the final judgment is under an enough evaluation.
●The Adjustment of the Switching Wave Form
A switching wave form between the coil and the switch terminal can be adjusted by connecting a capacitor to TRSW.
Switching noise can be restrained though efficiency is made to decrease by connecting a capacitor.
Decide capacity value after the enough evaluation when you adjust switching noise.
SW
SW
TRSW
TRSW PGND
PGND
Figure 10. The adjustment of the switching wave form
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Datasheet
BD6586MUV
●PCB Layout
In order to make the most of the performance of this IC, its layout pattern is very important. Characteristics such as
efficiency and ripple and the likes change greatly with layout patterns, which please note carefully.
to GND
to Power Supply
to Power Supply
CIN
L
COUT
SBD
19
VDET
20
N.C.
21
PGND
22
PGND
23
N.C.
24
TRSW
to Anode of LED
1
18
VBAT
SW
2
PWM
(100Hz~1000Hz)
CVBAT
17
Thermal Via
EN1
SW
16
3
BD6586MUV
EN2
4
LE D6
LE D5
LED 4
LED 3
SW
15
LE D2
GND
N.C.
Thermal Via
14
5
RISET
PWM
TEST0
6
13
ISET
12
LED4
11
LED3
10
GND
9
LED2
8
LED1
7
GND
TEST
to Anode of each LED
Figure 11. PCB Layout
Connect the input bypath capacitor CIN nearest to coil L and PGND, as shown in the upper diagram.
Ripple of a power supply is smoothed by CIN and connect stable voltage to VBAT terminal by the low resistance. Thereby,
the input voltage ripple of the IC can be reduced.
Connect CVBAT nearest to between the VBAT terminal and GND (4 pin) as shown in the upper diagram when you can't be
wired by the low resistance from CIN to VBAT pin
Connect schottky barrier diode SBD of the regulator nearest to between coil L and SW terminal.
And connect output capacitor COUT nearest to between CIN and GND pin. Thereby, the output voltage ripple of the IC can
be reduced.
GND terminal (4,7,10 pin) is connected inside the IC, and it is GND of the block except switching and a transistor.
A current drive performance may be restricted by influence of a noise, if PGND which is not smooth connected to GND.
A GND terminal is connected to the stable GND plane. And connect it to a GND plane after smoothing PGND by CIN and
COUT. GND and PGND are separated inside IC.
And connect it to a GND plane after smoothing PGND by CIN and COUT.
Connect the heat sink of IC to a GND plane through Thermal Via. And Connect with the largest possible pattern.
It is satisfactory even if it connects with the GND terminal of IC.
Connect LED current setting resistor RISET nearest to ISET pin. There is possibility to oscillate when capacity is added to
ISET terminal, so pay attention that capacity isn't added. And, RISET of GND side must be wired directly to GND(7pin) pin.
When those pins are not connected directly near the chip, influence is given to the performance of BD6586MUV, and may
limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to reduce
electric power consumption and increase the entire efficiency.
A layout pattern in consideration of these is shown in page 10.
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Datasheet
BD6586MUV
●Recommended PCB Layout Pattern
SBD
BD6586MUV
Coil
CIN
COUT
CVBAT RISET
Figure.10 Frontal surface <Top view>
Figure 12. Frontal surface <Top view>
Figure.11 Rear surface <Top view>
Figure 13. Rear surface <Top view>
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Datasheet
BD6586MUV
●Selection of External Parts
Recommended external parts are as shown below.
When to use other parts than these, select the following equivalent parts.
▪Coil
Value
4.7μH
4.7μH
4.7μH
4.7μH
10μH
4.7μH
10μH
▪Capacitor
Value
Manufacturer
Product number
TOKO
TOKO
TOKO
TDK
TDK
TDK
TDK
A915AY-4R7M
B1015AS-4R7M
A1101AS-4R7M
LTF5022T-4R7N2R0
LTF5022T-100M1R4
VLP6810T-4R7M1R6
VLP6810T-100M1R1
Pressure
Manufacturer
[ Power supply capacitor ]
4.7μF
25V
MURATA
4.7μF
25V
MURATA
1μF
10V
MURATA
4.7μF
10V
MURATA
[ Output capacitor ]
1μF
35V
MURATA
1μF
50V
MURATA
1μF
50V
MURATA
2.2μF
50V
MURATA
▪Resistor
Value
Tolerance
Manufacturer
[ Resistor for LED current decision
24kΩ
±0.5%
ROHM
▪SBD
Size
Horizontal
5.2
8.3
4.1
5.2
5.2
6.8
6.8
Vertical
5.2
8.4
4.1
5.0
5.0
6.3
6.3
Height (MAX)
3.0
4.0
1.2
2.2
2.2
1.0
1.0
Vertical
Size
Horizontal
Height
GRM319B31E475K
GRM21BR61E475K
GRM188B11A105K
GRM219B31A475K
3.2
2.0
1.6
2.0
1.6
1.25
0.8
1.25
GRM219B3YA105K
GRM31MB31H105K
GRM21BB31H105K
GRM31CB31H225K
2.0
3.2
2.0
3.2
1.25
1.6
1.25
1.6
Product number
Product number
<ISET pin> ]
MCR006YZPD243
Pressure
Manufacturer
Product number
60V
ROHM
RB160M-60
DC current
(mA)
DCR
(Ω)
1870
3300
1400
2000
1400
1600
1100
0.045
0.038
0.115
0.073
0.140
0.167
0.350
TC
Cap
Tolerance
0.85±0.1
1.25±0.1
0.8±0.1
0.85±0.1
B
X5R
B
B
+/-10%
+/-10%
+/-10%
+/-10%
0.85±0.1
1.15±0.1
1.25±0.1
1.6±0.2
B
B
B
B
+/-10%
+/-10%
+/-10%
+/-10%
Vertical
Size
Horizontal
Height
0.6
0.3
0.23±0.03
Vertical
3.5
Size
Horizontal
1.6
Height
0.8±0.1
The coil is the part that is most influential to efficiency. Select the coil whose direct current resistor (DCR) and current inductance characteristic is excellent. BD6586MUV is designed for the inductance value of 4.7µH. Don’t use the
inductance value less than 2.2µH. Select a capacitor of ceramic type with excellent frequency and temperature
characteristics.
Further, select Capacitor to be used with small direct current resistance, and pay sufficient attention to the layout pattern
shown in Page 10.
●Attention Point of PCB Layout
In PCB layout design, the wiring of power supply line should be low Impedance, and put the bypass capacitor if necessary.
Especially the wiring impedance must be lower around the DC/DC converter.
●About Heat Loss
In heat design, operate the DC/DC converter in the following condition.
(The following temperature is a guarantee temperature, so consider the margin.)
1. Periphery temperature Ta must be less than 85 ℃.
2. The loss of IC must be less than dissipation Pd.
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TSZ22111・15・001
11/20
TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
●Application Example
・LED current setting controlled ISET resistor.
19.6kΩ : 24.5mA
24kΩ : 20mA
30kΩ : 16mA
33kΩ : 14.5mA
・Brightness control
Please input PWM pulse from EN1, EN2 or PWM terminal.
Please refer electrical function page 7.
7 inch panel
s
Figure 14. 6 series×4 parallel, LED current 20mA setting
Power control PWM application
5inch panel
Battery
2.7V to 5.5V
4.7μF
4.7μH
6LED x 3Parallel
2.2μF
1μF
Power
ON/OFF
100Hz~10kHz
PWM
SW
TRSW
SW
VBAT
SW
VDET
EN2
LED1
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 20mA
Can be set up to each 10~25mA
24kΩ
Figure 15. 6 series×3 parallel, LED current 20mA setting
Current driver PWM application
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TSZ22111・15・001
12/20
TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
・LED current setting controlled ISET resistor.
19.6kΩ : 24.5mA
24kΩ : 20mA
30kΩ : 16mA
33kΩ : 14.5mA
・Brightness control
Please input PWM pulse from EN1, EN2 or PWM terminal.
Please refer electrical function page 7.
5 inch panel
Battery
2.7V to 5.5V
4.7μF
4.7μH
4LED x 4Parallel
2.2μF
1μF
SW
TRSW
SW
VBAT
SW
VDET
EN2
Power
ON/OFF
LED1
EN1
LED2
PWM
100Hz~10kHz
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 20mA
Can be set up to each 10~25mA
24kΩ
Figure 16. 4 series×4 parallel, LED current 20mA setting
Current driver PWM application
Battery
2.7V to 5.5V
4.7μF
4.7μH
5LED x 3Parallel
2.2μF
1μF
Power
ON/OFF
100Hz~10kHz
PWM
SW
TRSW
SW
VBAT
SW
VDET
EN2
LED1
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND
GND
GND
GND
ISET
LED4
Each 20mA
Can be set up to each 10~25mA
24kΩ
Figure 17. 5 series×3 parallel, LED current 20mA setting
Current driver PWM application
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/20
TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
・LED current setting controlled ISET resistor.
19.6kΩ : 24.5mA
24kΩ : 20mA
30kΩ : 16mA
33kΩ : 14.5mA
・Brightness control
Please input PWM pulse from EN1, EN2 or PWM terminal.
Please refer electrical function page 7.
Less than 5 inch panel
Battery
2.7V to 5.5V
4.7μF
4.7μH
6LED x 2Parallel
2.2μF
1μF
SW
TRSW
SW
VBAT
SW
VDET
EN2
Power
ON/OFF
LED1
EN1
LED2
PWM
100Hz~10kHz
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 20mA
Can be set up to each 10~25mA
24kΩ
Figure 18. 6 series×2 parallel, LED current 20mA setting
Current driver PWM application
Battery
2.7V to 5.5V
4.7μF
4.7μH
6LED x 2Parallel
2.2μF
1μF
SW
TRSW
100Hz~1kHz
PWM
SW
VBAT
SW
VDET
EN2
LED1
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 40mA
Can be set up to each 20~50mA
24kΩ
Figure 19. 6 series×2 parallel, LED current 40mA setting
Power control PWM application
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
14/20
TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
・LED current setting controlled ISET resistor.
19.6kΩ : 24.5mA
24kΩ : 20mA
30kΩ : 16mA
33kΩ : 14.5mA
・Brightness control
Please input PWM pulse from EN1, EN2 or PWM terminal.
Please refer electrical function page 7.
Less than 5 inch panel
Battery
2.7V to 5.5V
4.7μF
4.7μH
2LED x 3Parallel
2.2μF
1μF
Power
ON/OFF
100Hz~10kHz
PWM
SW
TRSW
SW
VBAT
SW
VDET
EN2
LED1
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 20mA
Can be set up to each 10~25mA
24kΩ
Figure 20. 2 series×3 parallel, LED current 20mA setting
Current driver PWM application
Battery
2.7V to 5.5V
4.7μF
4.7μH
6LED x 2Parallel
2.2μF
1μF
SW
TRSW
100Hz~1kHz
PWM
SW
VBAT
SW
VDET
EN2
LED1
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 40mA
Can be set up to each 20~50mA
24kΩ
Figure 21. 3 series×2 parallel, LED current 40mA setting
Power control PWM application
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
15/20
TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
・LED current setting controlled ISET resistor.
19.6kΩ : 24.5mA
24kΩ : 20mA
30kΩ : 16mA
33kΩ : 14.5mA
・Brightness control
Please input PWM pulse from EN1, EN2 or PWM terminal.
Please refer electrical function page 7.
For big current LED
Battery
2.7V to 5.5V
4.7μF
4.7μH
6LED x 1Parallel
2.2μF
1μF
Power
ON/OFF
100Hz~10kHz
PWM
SW
TRSW
SW
VDET
VBAT
SW
EN2
LED1
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 60mA
Can be set up to each 30~75mA
24kΩ
Figure 22. 6 series×1 parallel, LED current 60mA setting
Current driver PWM application
Battery
2.7V to 5.5V
4.7μF
4.7μH
6LED x 1Parallel
2.2μF
1μF
SW
TRSW
100Hz~1kHz
PWM
SW
VBAT
SW
VDET
EN2
LED1
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 80mA
Can be set up to each 40~100mA
24kΩ
Figure 23. 6 series×1 parallel, LED current 80mA setting
Power control PWM application
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
16/20
TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
・LED current setting controlled ISET resistor.
19.6kΩ : 24.5mA
24kΩ : 20mA
30kΩ : 16mA
33kΩ : 14.5mA
・Brightness control
Please input PWM pulse from EN1, EN2 or PWM terminal.
Please refer electrical function page 7.
For the application of 7V and more
Other Power Supply
Battery
6.0Vto25V
2.7V to 5.5V
1μF
4.7μF
4.7μH
6LED x 4Parallel
2.2μF
SW
SW
TRSW
VBAT
SW
VDET
EN2
Power
LED1
EN1
ON/OFF
LED2
PWM
LED3
TESTO
TEST
PGND PGND GND
GND
GND
ISET
LED4
Each 20mA
Can be set up to each 20~50mA
24kΩ
Figure 24. 6 series×4 parallel, LED current 20mA setting
Power control PWM application
●Analog Style Optical Application
Control LED current to charged D/A voltage.
Show application example and typ control.
Please decide final value after you evaluated application, characteristic.
Battery
2.7V to 5.5V
4.7μF
4.7μH
D/A
0.05V
0.2V
0.4V
0.5V
0.6V
0.7V
6LED x 4Parallel
2.2μF
1μF
SW
TRSW
SW
VBAT
SW
VD ET
EN2
Power
ON/OFF
LED1
LED current
19.4mA
14.4mA
7.7mA
4.4mA
1.0mA
0mA
EN1
LED2
PWM
LED3
TESTO
TEST
PGND PGND
GND
GND
GND
ISET
LED current =
LED4
Each 20mA
Can be set up to each 10~25mA
typ LED current =
470KΩ
24kΩ
ISET voltage ISET voltage -D/A
+
×800
470kΩ
24kΩ
0.6V
470kΩ
+
0.6V-D/A
24kΩ
×800
D/A
Figure 25. Analog style optical application
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TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
●Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating Condition
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At
the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to
be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the
constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 175°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed
at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the
LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(14) Selection of coil
Select the low DCR inductors to decrease power loss for DC/DC converter.
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TSZ22111・15・001
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TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
●Ordering Information
B
D
6
5
8
6
M
Part Number
U
V
-
E2
Package
MUV: VQFN024V4040
Packaging and forming specification
E2: Embossed tape and reel
●Marking Diagram
VQFN024V4040 (TOP VIEW)
Part Number Marking
D6586
LOT Number
1PIN MARK
●Physical Dimension Tape and Reel Information
VQFN024V4040
<Tape and Reel information>
4.0±0.1
4.0±0.1
1.0MAX
2.4±0.1
0.4±0.1
7
12
19
18
0.5
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
6
24
0.75
E2
2.4±0.1
1
2500pcs
(0.22)
+0.03
0.02 -0.02
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
13
+0.05
0.25 -0.04
1pin
(Unit : mm)
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Reel
19/20
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
Datasheet
BD6586MUV
●Revision History
Date
Revision
10.Dec.2012
001
Changes
New Release
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TSZ22111・15・001
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10.Dec.2012 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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