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Datasheet
4-Channel White LED Driver
with Integrated FET for up to 40 LEDs
BD65D00MUV

●General Description
This IC is white LED driver IC with PWM step-up
DC/DC converter that can boost max 41V and current
driver that can drive max 100mA. The wide and
precision brightness can be controlled by external
PWM pulse. This IC has very accurate current drivers,
and it has few current errors between each strings. So,
it will be helpful to reduce brightness spots on the LCD
panel. Small package is suited for saving space.
It can respond to the application according to the
application to be abele to switch to external/internal
NchFET boosting.
PWM dimming(100Hz - 25kHz)Analog
Brightness Control
●Key Specifications
 Operating power supply voltage range:
6V to 27V
 LED maximum current:
100mA/ch
 Quiescent Current:
1.6μA (typ.)
 Operating temperature range:
-40℃ to +85℃
●Package
●Features
 High efficiency PWM step-up DC/DC converter
(fsw=typ 1.25MHz, 0.60MHz to 1.6MHz)
 High accuracy & good matching current drivers
4ch (MAX100mA/ch)
 Integrated 50V power Nch MOSFET
 Soft Start function
 Drive up to 10 LEDs in series,
4 strings in parallel
 Various safety functions
● Over-voltage protection
● External SBD open detect / Output
Short protection
● Over current limit
● CH Terminal open / GND short protect
● CH over voltage protect / LED short protect
● Thermal shutdown
● UVLO
● ISET short protection
W(typ.) x D(typ.) x H(Max.)
VQFN028V5050
5.00mm x 5.00mm x 1.00mm
Figure 1.
●Applications
All LCD equipments, Backlight of Notebook PC,
Amusement, net book, monitor, TV, Portable DVD
player, light source etc.
●Typical Application Circuit (4 parallel)
6V to 27V
Figure 2. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays
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BD65D00MUV
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Conditions
Terminal voltage 1
VMAX1
7
V
VDC, ISET, ABC, COMP, FSET, TEST,
FAULT, PREOUT, TRIN, SENSP
Terminal voltage 2
VMAX2
45
V
CH1 to CH4, LX, OVP
Terminal voltage 3
VMAX3
30.5
V
VIN, ENABLE
Terminal voltage 4
VMAX4
15
V
PWM
*1
mW
mW
Power dissipation 1
Pd1
380
Power dissipation 2
Pd2
880 *2
3264
*3
Power dissipation 3
Pd3
mW
Operating temperature range
Topr
-40 to +85
℃
Storage temperature range
Tstg
-55 to +150
℃
Reduced 3.0mW/ ℃ With Ta>25℃ when not mounted on a heat radiation Board.
1 layer (ROHM Standard board) has been mounted. Copper foil area 0mm2, When it’s used by more than Ta=25 ℃, it’s reduced by 7.0mW/ ℃.
4 layer (JEDEC Compliant board) has been mounted. Copper foil area 1.4layer 20.2mm2, Copper foil area 2 to 3layers 5505mm2,
When it’s used by more than Ta=25 ℃, it’s reduced by 26.1mW/℃.
∗Power dissipation is calculated by formula : (Storage temperature max - 25℃ )/θja (ex. Pd1=3.0mW/℃)
*1
*2
*3
●Recommended Operating Ratings (Ta=-40℃to +85℃)
Parameter
Power supply voltage
Symbol
Limits
Unit
Conditions
Min.
Typ.
Max.
VINL
6.0
12.0
27.0
V
Coil power supply
VIN
4.5
5
27.0
V
IC power supply
●Electrical Characteristics
(Unless otherwise specified, VIN=12V, Ta = +25℃)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
[General]
Quiescent Current
Iq
-
1.6
4.4
µA
ENABLE=0V
Current Consumption
Idd
-
3.6
5.4
mA
OVP=0V,ISET=39kΩ
Max. Output Voltage
MOV
-
-
41
V
Under Voltage Lock Out
UVLO
-
3.7
4.1
V
Low Level Input Voltage
EnL
0.0
-
0.8
V
High Level Input Voltage 1
EnH
2.0
-
VIN
V
VIN falling edge
[ENABLE Terminal]
ENABLE Pull down resistor
EnR
100
300
500
kΩ
ENABLE =3V
ENIout
-
0
2
µA
ENABLE=0V
Low Level Input Voltage
PWML
0.0
-
0.8
V
High Level Input Voltage 2
PWMH
1.3
-
14.5
V
Output Current
[PWM Terminal]
PWM Pull down resistor
Output Current
PWMR
100
300
500
kΩ
PWM=3V
PWMIout
-
0
2
µA
PWM=0V
FFCR
-
-
3
kΩ
ENABLE=PWM=3V, OVP=2V
VREG
4.2
5.0
6.0
V
No load, VIN > 6V
[FAULT]
Nch RON
[Regulator]
VDC Voltage
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BD65D00MUV
●Electrical Characteristics - continued
(Unless otherwise specified, VIN=12V, Ta = +25℃)
Parameter
Symbol
Limits
Unit
Conditions
Min.
Typ.
Max.
VLED
0.64
0.80
0.96
V
Switching frequency accuracy
Fsw
1.00
1.25
1.50
MHz
Duty cycle limit
Duty
91.0
95.0
99.0
%
CH1-4=0.3V, FSET=56kΩ
LX Nch FET RON
RON
-
0.3
0.5
Ω
ILX=80mA
Ocp
1.5
2.5
-
A
*1
[Switching Regulator]
LED Control voltage
FSET=56kΩ
[Protection]
Over Current Limit
Over voltage limit Input
OVP
1.16
1.20
1.24
V
Detect voltage of OVP pin
OVPfault
0.02
0.05
0.08
V
Detect voltage of OVP pin
OVIL
-
0.1
1.0
µA
VSC
-15
0
+15
%
LED maximum current
ILMAX
-
-
100
mA
LED current accuracy
ILACCU
-
-
±5.0
%
LED current matching
ILMAT
-
-
3.0
%
LED current limiter
ILOCP
-
0
0.1
mA
Iset
-
0.733
-
V
ILACCU2
-
±3.0
-
%
Output Short Protect
OVP leak current
CH Terminal
Over Voltage Protect accuracy
[Current driver]
ISET voltage
LED current accuracy2
*1
VSC=8V
This is current driver’s
characteristics.
This IC may not output current
according to application.
ILED=60mA (39kΩ)
(Max LED current – Min LED
current)/ Ideal current (60mA)
ILED=60mA
Current limit value at ISET
Resistance 1kΩ setting
ILED=60mA, ABC=0.733V
This parameter is tested with DC measurement.
●Block Diagram
Sense
CurrentSense
Pin number 22pin
Figure 3. Block Diagram
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BD65D00MUV
●Pin Descriptions
Function
Terminal
diagram
PIN No.
PIN Name
IO
1
VDC
Out
Regulator output / Internal power-supply
2
TEST
In
TEST signal (Pull down 100kΩ within IC)
E
3
FSET
In
Resistor connection for frequency setting
A
4
ABC
In
PIN for Analog Brightness Control
C
5
GND
-
GND for Switching Regulator
B
6
COMP
Out
ERRAMP output
A
7
ISET
In
Resistor connection for LED current setting
A
8
CH4
In
Current driver sink for CH4
C
9
NC
-
-
-
10
CH3
In
Current driver sink for CH3
C
11
NC
-
-
-
12
CH2
In
Current driver sink for CH2
C
13
NC
-
-
-
14
CH1
In
Current driver sink for CH1
C
15
NC
-
-
-
16
GND
-
GND for Current Driver
B
C
17
FAULT
Out
Fault signal
C
18
PREOUT
Out
Signal output pin for internal switching Tr
A
19
TRIN
In
Gate terminal for switching Tr
A
20
SENSP
In
Source terminal for external switching Tr
A
21
PGND
-
PGND for switching Tr
D
22
LX
23
LX
Switching Tr drive terminal
F
24
NC
-
-
-
25
OVP
In
Detect input for SBD open and OVP
C
26
PWM
In
Input pin for current driver power ON/OFF
E
27
ENABLE
In
Pin for power ON/OFF or Power control
E
28
VIN
In
G
-
Thermal PAD
-
Battery input
Heat radiation PAD of back side
Connect to GND
Out
●Pin ESD Type
VDC
Figure 4. Pin ESD Type
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BD65D00MUV
●Typical Performance Curves
Figure 5. Quiescent Current
Figure 6. Current Consumption
Figure 8. Under Voltage Lock Out
Figure 7. VDC Voltage
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BD65D00MUV
Frequency (MHz)
●Typical Performance Curves
Figure 9. Fault RON
Figure 10. Switching Frequency
Figure 12. LX NcH RON
Figure 11. Max Duty
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BD65D00MUV
●Typical Performance Curves - continued
Figure 13. Over Current Limit
Figure 14. Over Voltage Protect
Figure 16. OVP Leak Current
Figure 15. Output Short Protect
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BD65D00MUV
●Typical Performance Curves - continued
Figure 18. LED Current vs. CH Voltage
Figure 17. CH Terminal OVP
Figure 19. ISET Voltage
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Figure 20. LED Current Matching
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BD65D00MUV
●Typical Performance Curves - continued
Figure 21. LED Open Time vs. Temp
Figure 22. LED Short Time vs. Temp
Figure 24. Efficiency 10LEDx4CH
ILED=60mA
Figure 23. Thermal Shut Down
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BD65D00MUV
●Typical Performance Curves - continued
Figure 26. LED Current vs. PWM Duty
PWM Freq=30kHz FSET=56kΩ
Figure 25. LED Current vs. PWM Duty
PWM Freq=200Hz FSET=56kΩ
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BD65D00MUV
●Application Example
Figure 27, Figure 28 and Figure 29 are Application examples. Recommended schematics and Layout are shown in page 29,
31.
12V to 27V(VINL)
10µF
10µH
VOUT
10 serial x 4 parallel (40pcs)
2.2µF/50V
2.2µF
LX
LX
VIN
FAULT
VDC
PREOUT
2.2MΩ
10Ω
OVP
TRIN
68kΩ
SENSP
BD65D00MUV
2.1V to VIN
RESET
ENABLE
CH1
PWM
CH2
PWM
CH3
fPWM=100Hz~25kHz
CH4
COMP
60mA
1kΩ
22nF
PGND
PGND GND
TEST FSET ABC
ISET
56kΩ 1nF
39kΩ
GND
PGND
Figure 27. BD65D00 Application example (4 parallel)
9V to 27V(VINL)
10µF
10µH
VOUT
10 serial x 3 parallel (30pcs)
2.2µF/50V
2.2µF
LX
LX
VIN
FAULT
VDC
PREOUT
2.2MΩ
10Ω
OVP
TRIN
68kΩ
SENSP
BD65D00MUV
2.1V to VIN
RESET
ENABLE
CH1
PWM
CH2
PWM
CH3
fPWM=100Hz~25kHz
CH4
COMP
1kΩ
60mA
22nF
PGND
PGND GND
TEST FSET ABC
ISET
56kΩ 1nF
39kΩ
GND
PGND
Figure 28. BD65D00 Application example (3 parallel)
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BD65D00MUV
6V to 27V(VINL)
10µF
10µH
VOUT
10 serial x 2 parallel (40pcs)
2.2µF/50V
2.2µF
LX
LX
VIN
FAULT
VDC
PREOUT
2.2MΩ
10Ω
OVP
TRIN
68kΩ
SENSP
BD65D00MUV
2.1V to VIN
RESET
ENABLE
CH1
PWM
CH2
CH3
PWM
fPWM=100Hz~25kHz
CH4
60mA
COMP
1kΩ
22nF
PGND
PGND GND
TEST FSET ABC
ISET
56kΩ 1nF
39kΩ
GND
PGND
Figure 29. BD65D00 Application example (2 parallel)
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Datasheet
BD65D00MUV
●Functional Descriptions
1) PWM current mode DC/DC converter
This detects the lowest voltage inside CH 1,2,3,4 pin voltage during power on. PWM duty is decided to be 0.8V and output
voltage is kept invariably. As for the input soft the PWM comparator as the feature of the PWM current mode, one is
overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that
controls the inductor current into Slope waveform to prevent sub harmonic oscillation. This output controls internal Nch Tr
via the RS latch. In the period where internal Nch Tr gate is ON, energy is accumulated in the external inductor, and in the
period where internal Nch Tr gate is OFF, energy is transferred to the output capacitor via external SBD.
This IC has many safety functions, and their detection signals stop switching operation at once.
2) Pulse skip control
This IC regulates the output voltage using an improved pulse-skip. In “pulse-skip” mode the error amplifier disables
“switching” of the power stages when it detects low output voltage and high input voltage. The oscillator halts and the
controller skip switching cycles. The error amplifier reactivates the oscillator and starts switching of the power stages again
when this IC detects low input voltage.
At light loads a conventional “pulse-skip” regulation mode is used. The “pulse-skip” regulation minimizes the operating
current because this IC does not switch continuously and hence the losses of the switching are reduced. When the error
amplifier disables “switching”, the load is also isolated from the input. This improved “pulse-skip” control is also referred to
as active-cycle control.
PWM
PWM
VOUT
VOUT
duty 20% @1.25MHz(typ)
LX
Pulse skip
LX
LED Current
LED current
60mA
Figure 30. Pulse-skip
3) Soft start
This IC has soft start function.
The soft start function prevents large coil current.
Rush current at turning on is prevented by the soft start function.
The soft start of this IC controls over-current setting hence peak is controlled. Therefore, before switching phenomenon (not
pulse-skip phenomenon) occurs, soft start (the phenomenon where-in current flows to the coil) will not start (stop).
Pulse-skip can release soft-start if the switching ON/OFF time is set.
After changing ENABLE pin, PWM pin from ‘L’ ‘H’, regulator (VDC) voltage increases. Soft start is effective within the
period 4.3ms when UVLO is detected and when it exceeds VDC=3.9V (typ.). Once soft start is finished, even if you change
PWM from ‘L’  ‘H’, soft start does not work.
ENABLE
ENABL
Max 1ms
Typ 4.3ms
PWM
UVLO
VDC
VDC
ON
OFF
T1
T2
OFF
Soft start
Soft Start
Soft Start Time=T1+T2=4.3ms typ.
PWM
UVLO
Pulse-skip
Max 1ms
ON
OFF
OFF
ON
OFF
ON
OFF
ON
Figure 31. Soft start
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BD65D00MUV
4) FAULT
When the error condition occurs, boost operating is stopped by the protection function avoiding error condition. “L” is
outputted from FAULT pin when an error occurs. After power-on, until soft start is released, around 4.3ms (typ.), protection
functions do not operate (except TSD).
When ENABLE pin is changed to ‘L’, even if output of Fault pin latches, it will still reset to the initial status.
(In pulse-skip state, while the switching is stopped, the mask time of the FAULT pin becomes longer since the soft start is
also stopped.) When using 3 parallel connection of LED in less than 4.3ms (typ.), the FAULT pin will output ”L” if the
process of the unused pin is not yet finished. Evaluate sufficiently the start up time when the connected capacitor between
COMP pin & GND starts up smoothly.
Object of protect function is as shown below.
- Over-voltage protection (OVP)
- Thermal shut down (OTP)
- Over current protect (OCP)
- Output short protect
- LED Short (Latch)
- LED Open (Latch)
ENABLE
‘L’
‘H’
PWM
‘L’
‘H’
VDC
FAULT
Protect
Typ4.3 ms
‘X’
‘L’
undetected
Mask
‘L’
‘L’
‘H’
‘X’
‘H’
Typ100µs
‘H’
‘L’
Latch
detected
undetected
function (OVP, OCP)
Protect
undetected
function (TSD)
detected
undetected
Protect
undetected
function (LED open, LED short)
Boost
Operation
off
normal
undetected
detected
boost stop
normal
off
normal
Figure 32. FAULT operating description
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BD65D00MUV
●Protection
PROTECTION TABLE
CASE
FAILURE
MODE
DETECTION
MODE
CH1 pin
CH2 to 4 Pin
VOUT
Adjustment
FAULT
Terminal
Normal Burning
DC/DC
feedbacks at CH2
to CH4
Adjust VF of LED
at CH2 to CH4 at
the biggest line
‘H’  ‘L’
(Latch)
Normal Burning
DC/DC
feedbacks at CH2
to CH4
Adjust VF of LED
at CH2 to CH4 at
the biggest line
‘H’  ‘L’
(Latch)
1
LED Short
( LED CH1 is
Short)
CH1 > VSC
LED current stop
and DC/DC
feedback doesn’t
return
2
LED OPEN
( LED CH1 is
Open)
CH1 < 0.2V(typ.)
and
OVP > 1.2V(typ.)
LED current stop
and DC/DC
feedback doesn’t
return
3
VOUT/LX GND
SHORT
OVP <
50mV(typ.)
FAULT change from ‘H’ to ‘L’, and
switching is stopped.
When OVP>50mV, FAULT return ‘H’
-
‘H’  ‘L’
4
Output LED
stack voltage
too high
OVP > 1.2V(typ.)
FAULT change from ’H’ to ’L ’, and
switching is stopped.
OVP<1.2V, FAULT returns to ’H ’ (does
not return when it occurs at the same
time with LED open)
-
‘H’  ‘L’
5
LX current too
high
OCP > 2.5A
or
OTP >
175°C(typ.)
FAULT change from ’H ’ to ’L ’, and
switching is stopped.
Fault pin does not returns to ’H ’
because IC shutdowns and when
ENABLE is from ’H ’ to L until ’H ’.
-
‘H’  ‘L’
▪ Over voltage protection (OVP)
When LED is separated it will result to output open and over step-up. When the built-in (external) Tr and OVP pin exceed
the absolute maximum rating, the built-in (external) Tr and IC will break down. Thus, OVP pin when more than the detect
voltage will turn into over voltage protection status turning off switching and stopping DC/DC.
After over voltage protection, as shown in Figure 33, the IC changes from activation into non-activation, and the output
voltage goes down slowly. And when the Feedback of CH1 isn’t returned, feedback takes place in CH2.
ENABLE, PWM
Hysteresis(typ 2.5%)
VOUT
OVP Signal
CH1 voltage
CH1 connection normal
open
CH2 connection
normal
Feedback
CH1
CH2
CH1 current 60mA
CH1
0mA
CH2 current 60mA
0mA
Figure 33. OVP operating description
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BD65D00MUV
The value shown in electrical characteristics is used here.
Over voltage limit
LED control voltage
LED terminal over voltage protect
min 1.16V typ 1.20V max 1.24V
min 0.64V typ 0.80V max 0.96V
min 6.80V typ 8.00 V max 9.20V
1.
Calculate the condition of the total value of LED VF.
Example) In the case of serial 8 LEDs with VF=2.9V (min), 3.2V (typ.), 3.5V (max) => 3.5V x 8=28V
2.
Then calculate the biggest value of output with the following formula.
The biggest value of output = the biggest value calculated in #1 + the biggest value of LED terminal voltage. (0.96V)
Example) The biggest value of output = 28V + 0.96V =28.96V
3.
Set the smallest value of over voltage larger than the biggest value of output.
If over voltage is closer to the total value of VF, it could be occurred to detect over voltage by ripple, noise, and so on.
It is recommended that some margins should be left on the difference between over voltage and the total value of VF.
This time around 6% margin is placed.
Example) Output largest value = 28.96V, the smallest value of over voltage = 28.96V x 1.06 = 30.70V
Ic over voltage limit min=1.16V, typ=1.20V, max=1.24V
typ = 30.70V×(1.20V/1.16V) = 31.76V
max = 31.76V×(1.26V/1.20V) = 33.35V
4.
Below shows how to adjust setting resistor value.
Please fix resistor high between OVP terminal and output and then set over voltage after changing resistor between
OVP terminal and GND. If this resistor value is decreased, output voltage will also decrease while PWM is turned OFF,
hence ripple of output voltage becomes larger and the sound/noise of output capacitor also increases.
Example) Selecting OVP resistor (R1 and R2).
▪ OVP resistor selection
(Example. 1) VF=3.5V max, serial = 7 LED
OVP = 1.2V, R1 = 2.2MΩ, R2 = 95.3kΩ
VOUT = 1.2 × (2.2MΩ + 95.3kΩ)/ 95.3kΩ = 28.90V
VOUT
(Example. 2) VF=3.5V max, serial = 8 LED
OVP = 1.2V, R1 = 2.2MΩ, R2 = 82kΩ
VOUT = 1.2 × (2.2MΩ + 82kΩ)/ 82kΩ = 33.40V
R1
OVP terminal
(Example. 3) VF=3.5V max, serial = 9 LED
OVP = 1.2V, R1 = 2.2MΩ, R2 = 73.2kΩ
VOUT = 1.2 × (2.2MΩ + 73.2kΩ)/ 73.2kΩ = 37.27V
R2
(Example. 4) VF=3.5V max, serial = 10 LED
OVP = 1.2V, R1 = 2.2MΩ, R2 = 68kΩ
VOUT = 1.2 × (2.2MΩ + 68kΩ)/ 68kΩ = 40.02V
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Datasheet
BD65D00MUV
▪Over Current Protection
Over current flows in current detect resistor that is connected between internal switching Tr source and PGND. When it
increases beyond detect voltage, over current protect operates. Over current protect prevents it becoming more than detect
voltage by reducing on Duty of switching Tr without stopping boosting operation.
Since the over current detector of this IC detects peak current, more than setting value of over current doesn’t flow.
If both PWM=H (boosting condition) and over current situation keep going during continuous 2ms, the IC shuts down. By
making ENABLE ’H’->’L’->‘H’, the IC activates again. The IC might shut down if boosting operation starts with slow speed of
power supply activation and also low voltage. Please operate after setting input voltage that is required for application.
ENABLE
Fault
PWM
reset
OCP
Over Current Protect
CH1 terminal
Internal reset
2ms
0V
Continuous 2ms(typ.)
FAULT terminal
Coil Current
Latch
▪ External SBD open detect / Output Short protection
If in case external SBD and DC/DC output (VOUT) connection is open, or VOUT is shorted in GND, there is a risk that coil
and the internal Tr might break down. Therefore, at such an error as OVP becoming 50mV (typ.) or below, turns off the
output Tr, and prevents the coil and the IC from being destructed.
And the IC changes from activation into non-activation, current does not flow to the coil (0mA).
▪ Thermal shut down
This IC has thermal shut down function.
The thermal shut down works at 175°C (typ.) or higher, and the IC changes from activation into non-activation.
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Datasheet
BD65D00MUV
●Operating of the Application Deficiency
1) When 1 LED or 1string OPEN during the operation
The LED string which became OPEN isn't lighting (e.g. CH1), but other LED strings are lighting.
As shown in Figure 34, when the strings in CH1 are open, CH1 pin become 0V. The lowest voltage is below 0.8V thus the
output will boost up to over voltage protection voltage. When over voltage protect is detected, open process starts. Once
OPEN, since the pin which is the object of the feedback is excluded, VOUT returns to normal voltage.
ENABLE, PW
VOUT
OVP
CH1 connection normal
CH 1
CH 2
open
CH2 connection
normal
CH1 voltage
CH1 ENABLE
100µs
Feedback
CH1
CH1 current 60mA
CH2 current
CH2
OFF
CH1
0mA
60mA
0mA
Figure 34. LED open protect
2)When LED short-circuited in multiple
All LED strings are lighted unless CH1 to 4 terminal voltage is more than 8V(typ.).
When it was more than 8V only the strings which short-circuited are turned off, LED current strings of other lines continue to
turn on normally. Short line (CH1) current is changed from 60mA to 0.05mA (typ.), so CH1 terminal don’t heat.
LED short
CH1terminal
CH2 terminal
CH 1
CH 2
0.8V
Typ 8V
CH1>CH2
0.8V
Vout
FeedBack
CH1
CH1 current
CH2 current
60mA
CH2
100μs(typ.)
0.05mA(typ.)
60mA
Figure 35. LED short protect
3)When Schottky diode remove
IC breakdown is prevented by stopping boost operation thru Schottky diode protection function (OVP pin <50mV).
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Datasheet
BD65D00MUV
●Control Signal Input Timing
Timing sequence1
Figure 36. shows the Power ON sequence. ENABLE and PWM signal from ‘L’ to ‘H’ after charging current (VIN ON). Power
OFF sequence, on the other hand, is turning OFF power supply (VIN) after ENABLE and PWM Signal turns from H to L.
LED IC Timing Sequence for PWM Control Turn-on
6.0 ~ 27V
VIN
VIN
0V
ENABLE 0 ~ 0.8V
ENABLE,
PWM
PWM
Min 0µs
2 ~ 5V
Min 0µs
1.3 ~5V
0 ~ 0.8V
*other signals are inputted after signals are turned on.
Power ON
Power OFF
Figure 36. Timing sequence1
LED IC Timing Sequence for PWM Control Turn-off
6.0 ~ 27V
VIN
Min 0µs
0V
2 ~ 5V
ENABLE
2 ~ 5V
0 ~ 0 .8V
Min 0µs
PWM
0 ~ 0.8V
*other signals are inputted after signals are turned off.
Timing sequence2
Figure 37. shows the Power ON sequence. Power Supply charge (VIN ON), ENABLE signals from L to H, then PWM signal
from L to H. Power OFF sequence, on the other hand, is turning OFF power supply (VIN)and ENABLE, PWM signal from H
to L.
LED IC Timing Sequence for PWM Control Turn-on
2 ~ 5V
VIN, ENABLE
ENABLE 0 ~ 0 .8V
VIN
PWM
0V
PWM
Power ON
Power OFF
Min 0µs
6.0 ~ 27V
Min 0µs
1.3 ~5V
0 ~ 0.8V
*other signals are inputted after signals are turned on.
Figure 37. Timing sequence2
LED IC Timing Sequence for PWM Control Turn-off
2 ~ 5V
ENABLE
Min 0µs 0 ~ 0.8V
6.0 ~ 27V
VIN
1 .3~5V
PWM
Min 0µs
0V
0 ~ 0.8V
*other signals are inputted after signals are turned off.
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Datasheet
BD65D00MUV
Timing sequence3
Figure 38.shows Power ON sequence. Power supply charge (VIN ON), PWM from L to H, then afterwards ENABLE signal
from L to H. Power OFF sequence is power supply (VIN) OFF, PWM signal from H to L then ENABLE signal from H to L.
LED IC Timing Sequence for PWM Control Turn-on
VIN, PWM
2 ~ 5V
PWM
ENABLE
0 ~ 0.8V
VIN
0V
ENABLE
Power ON
Power OFF
Min 0µs
6.0 ~ 27V
Min 0µs
1.3~5 V
0 ~ 0.8V
*other signals are inputted after signals are turned on.
Figure 38. Timing sequence3
LED IC Timing Sequence for PWM Control Tn
2 ~ 5V
PWM
Min 0µs 0 ~ 0.8V
4.2 ~ 27V
VIN
Min 0µs
2 ~ 5V
ENABLE
0V
0 ~ 0.8V
*other signals are inputted after signals are turned off.
VIN wake up speed
Min.
100µs
6.0 V
VIN
1
2
Figure 39. Control Signal timing
In case there is PWM OFF status (min: 10ms) during operation, ENABLE is reset (‘H’ to ‘L’) as shown in Figure 40.
If PWM stops and VOUT voltage is dropped, this IC will be in current limiter state when PWM starts (no soft start).
If soft start is not necessary, there is no need also to reset.
VIN
reset
ENABLE
Min 10ms
PWM
PWM
OFF
PWM
Figure 40. PWM stop and ENABLE turn “off”
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Datasheet
BD65D00MUV
●How to Activate
Pay attention to the following when activating.
• Regulator (VDC) is operated after ENABLE=H. Inner circuit is operated after releasing UVLO. When boosting after
releasing UVLO, soft start function is operated. Soft start circuit needs t15 (more than 5µs) such as Figure 41. Soft start is
operated during Tsoft time. Set PWM width “H” until soft start finishes.
VIN terminal
ENABLE terminal
VDC terminal
UVLO signal
PWM terminal
COMP terminal
detect
skip
Pulse-skip signal
t１５
tsoft
t１５
Soft Start
LX terminal
Stop to switching
Up to OCP value (0A to 2.5A)
Figure 41. Soft Start
Example: Time until soft start finishes at PWM frequency 25kHz and PWM=H time is 6µs
By soft start time typ 4.3ms
tsoft = 6µs - 5µs = 1µs
Soft start time / tsoft / PWM frequency = 4300µs / 1µs / 25kHz = 172ms
At dimming with PWM terminal (after soft start finishes)
t1
VIN
L[V]
H[V]
H[V]
t2
t4
t3
t5 t3
ENABLE
t6
VDC
t7
t8
t9
t14
t14
PWM
t11
t10
Figure 42. Timing Input (after soft start)
t1
t2
t3
t4
t5
t6
t7
t8
t9
t10
t11
t12
t13
t14
t15
H
L
Name
Power Supply Rise Time
Power Supply - ENABLE Rise Time
ENABLE Rise Time
ENABLE Fall Time
ENABLE Low Width
Power Supply - PWM Time
PWM Rise Time
PWM High Width
PWM Fall Time
PWM Low Width
PWM Cycle
ENABLE(H)->PWM(H) Time
ENABLE(L)->PWM(L) Time
PWM(L)->ENABLE(L) Time
Soft Start Set Up Time
Operation Voltage
No Operation Voltage
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Unit
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
V
V
Min.
100
0
0
0
50
0
0
5
0
5
40
0
0
0
5
4.2
-
Typ. Max.
100
100
100
100
5000 10000
12
27
4.2
TSZ02201-0G3G0C400220-1-2
7.Dec.2012 Rev.001
Datasheet
BD65D00MUV
●How to Select the Number of LED Strings of the Current Driver
In order to reduce the number of strings of current driver, open unnecessary CH1 to 4 pins for them not to be selected.
When using 2 strings, open the unnecessary 2 strings.
During VOUT wake up in an open state, VOUT boost up until OVP voltage. Once IC detect OVP, VOUT don’t boost up until
OVP from next start up. If ENABLE set to ‘L,’ IC resets CH4 status as shown Figure 43. Also during VOUT wake up, CH4
(open terminal) and CH1 are selected as shown Figure 44.
PWM
RESET
ENABLE
CH 1
CH 2
CH 3
OVP
Normal Voltage
VOUT
CH1~3
0.8V(typ.)
0V
CH4
0V
Figure 43. Select the number of CH1 strings
ENABLE
PWM
Soft start: typ 4.3ms
100µs(typ.)
Vout
Over Voltage Protect
Over voltage protect signal
Terminal select
(LED open protect)
Normal condition
Mask
“Unmask
CH1 Terminal
typ 0.8V
CH4 Terminal
open
Feedback terminal
CH1 Current 0mA
Stable
CH4
CH1
60mA
CH4 Current
0mA
Figure 44. Select the number of CH4 strings (wake up)
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Datasheet
BD65D00MUV
●Start Control (ENABLE) and LED Current Driver Selection (PWM)
This IC can control the IC system by ENABLE, and IC can power off compulsory by setting 0.8V or below. Also, It powers
on ENABLE is at more than 2.0V.
After it’s selected to ENABLE=H, When it is selected at PWM=H, LED current decided with ISET resistance flow.
Next, When it is selected at PWM=L, LED current stop to flow.
ENABLE
PWM
IC
0
0
Off
OFF
LED current
1
0
On
OFF
0
1
Off
OFF
1
1
On
Current decided with ISET
●LED Current Setting Range
Normal Current setting is done thru resistor (RISET) connected to voltage of ISET.
Setting of each LED current is given as shown below.
RISET = 2340/ILEDmax
Also, Normal current setting range is 30mA to 100mA. LED current becomes a leak current MAX 2µA at OFF setting.
ISET Normal current setting example
RISET
LED current
24kΩ (E24)
97.5mA
30kΩ (E24)
78.0mA
39kΩ (E24)
60.0mA
43kΩ (E24)
54.4mA
68kΩ (E24)
34.4mA
●Frequency Setting Range
Switching frequency can be set by connecting the resistor to FSET pin.
Also, Frequency setting range is 0.60MHz to 1.60MHz.
The below diagrams are the reference data that shows what happens when FSET terminal is connected to resister.
FSET frequency setting example
RFSET
Frequency
130kΩ (E96)
56kΩ (E24)
43kΩ (E24)
0.57MHz
1.25MHz
1.59MHz
Max Duty example
Max Duty[%]
Frequency
Min
Typ
Max
600MHz
96.0
1.25MHz
91.0 95.0 99.0
1.6MHz
92.0
-
Frequency
[MHz]
1.59
1.25
0.57
43 kΩ
56kΩ
130 kΩ
FSET[kΩ]
Min Duty example
Min Duty[%]
Frequency
Min
Typ
Max
1.25MHz
20
-
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Datasheet
BD65D00MUV
●PWM Dimming
Current driver PWM control is controlled by providing PWM signal to PWM port, as it is shown Figure 45.
The current set up with ISET is chosen as the H section of PWM and the current is off as the L section. Therefore, the
average LED current is increasing in proportion to duty cycle of PWM signal. This method that it lets internal circuit and
DC/DC to work, because it becomes to switch the driver, the current tolerance is a few when the PWM brightness is
adjusted, it makes it possible to brightness control until 5µs (Min 0.1% at 200Hz). And, don't use for the brightness control,
because effect of ISET changeover is big under 1µs ON time and under 1µs OFF time. Typical PWM frequency is 100Hz to
25kHz.
PWM
ON
OFF
LED current
ON
OFF
Coil current
ON
OFF
ON
IC’s active current
Figure 45. PWM sequence
●Analog Dimming
This IC controls LED current thru an analog input (ABC terminal).
LED current is determined thru the resistor connected to ISET.
Normal state is ABC voltage= typ 0.733V.
Decrease LED current to decrease ABC voltage and increase LED
current to increase ABC voltage.
ISET
Resistor driver
1.2V
ABC
DC Input
120.9kΩ
0.733V
180kΩ
+
-
In order to get the MAX value of LED current,
ISET
follow the setting range of LED current found in page 18.
39kΩ
Be careful that the setting LED current Max value is ABC voltage=0.733V (typ.).
ABC input range is 0.05V∼0.9V.
This dimming is effected by ISET tolerance.
Figure 46. Analog dimming application
When analog dimming is not used, connect capacitor to ABC terminal.
LED current increases until charging of the capacitor at the ABC terminal
is finished.
The resistor between 1.2V and ABC terminal is 120.9kΩ.
Take into consideration the charge time before deciding the capacitor value.
ISET
Resistor driver
1.2V
ABC
120.9kΩ
0.733V
180kΩ
+
-
ISET
39kΩ
Figure 47. PWM dimming application
ILED
[mA]
RISET=39kΩ
73.7mA
60mA
0.733V
0.9V
ABC[V]
Figure 48. ILED vs. ABC voltage
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Datasheet
BD65D00MUV
●Coil Selection
The DC/DC is designed by more than 4.7µH. When “L” value sets to a lower value, it is possibility that the specific
sub-harmonic oscillation of current mode DC / DC will be happened. Do not let “L” value to 3.3µH or below.
When “L” value increases, the phase margin of DC / DC becomes zero. Please enlarge the output capacitor value when
you increase “L” value. Make the resistor component smaller in order to increase the efficiency of DCR Inductor. Please
estimate Peak Current of Coil as shown in the examples below.
Peak Current calculation
<Estimate of the current value which is needed for the normal operation>
As over current detector of this IC is detected the peak current, it have to estimate peak current to flow to the coil by
operating condition.
- Inductance value of coil = L
In case of,
- Supply voltage of coil = VIn
- Switching frequency = fsw (Min=1.0MHz, Typ = 1.25MHz, Max = 1.5MHz)
- Output voltage = VOUT
- Total LED current = ILED
- Average current of coil = Iave
- Peak current of coil = Ipeak
- Cycle of Switching = T
- Efficiency = eff
(Please set up having margin)
- ON time of switching transistor = Ton
- ON Duty = D
The relation is shown below:
CCM: Ipeak = (VIn / L) × (1 / fsw) × (1-( VIn / VOUT)), DCM: Ipeak = (VIn / L) × Ton
Iave=( VOUT × IOUT / VIn) / eff
1/2
Ton=(Iave × (1- VIn / VOUT) × (1/fsw) × (L/ VIn) × 2)
Each current is calculated.
As peak current varies according to whether there is the direct current superposed, the next is decided.
CCM: (1- VIn / VOUT) × (1/fsw) < Ton  peak current = Ipeak /2 + Iave
DCM: (1- VIn / VOUT) × (1/fsw) > Ton  peak current = VIn / L × Ton
(Example 1)
In case of, VIn = 12V, L = 10µH, fsw = 1.25MHz, VOUT = 32V, ILED = 240mA, Efficiency = 88%
Iave = (32 × 240m / 12) / 88% = 0.7273A
Ton = (0.7273 × (1 - 12 / 32) × (1 / 1.25M) × (10µ / 12) × 2)1/2 = 0.78µs
(1- VIn / VOUT) × (1 / fsw) = 0.5µs < Ton(0.78µs)
CCM
Ipeak = (12 / 10µ) × (1 / 1.25M) × (1 - (12 / 32)) = 0.6A
Peak current = 0.6A / 2 + 0.727A = 1.027A
(Example 2)
In case of, VIn = 24.0V, L = 10µH, fsw = 1.25MHz, VOUT = 32V, ILED = 120mA, Efficiency = 88%
Iave = (32 × 120m / 24.0) / 88% = 0.1818A
Ton = (0.1818 × (1-24 / 32) × (1 / 1.25M) × (10µ / 24) × 2)1/2 = 0.17µs
DCM
(1- VIn / VOUT) × (1 / fsw)=0.20µs > Ton(0.17µs)
Ipeak = VIn / L x Ton = 24 / 10µ x 0.17µs = 0.42A
Peak current = 0. 42A
DCM/CCM calculation
Discontinuous Condition Mode (DCM) and Continuous Condition Mode (CCM) are calculated as following.
2
CCM:
L > VOUT × D × (1 - D) × T / (2 × ILED)
DCM:
L < VOUT × D × (1 - D)2 × T / (2 × ILED)
*D = 1- VIn / VOUT
(Example 1)
In case of, VIn = 7.0V, L = 10µH, fsw = 1.2MHz, VOUT = 32V, ILED = 240mA
VOUT × D × (1 - D)2 × T / (2 × ILED) = 32 × (1 – 7 / 32) × (7 / 32)2 × 1/(1.2 × 106) / (2 × 0.24) = 4.69µ < L(10µH)
 CCM
(Example 2)
In case of, VIn = 12.0V, L = 10µH, fsw = 1.2MHz, VOUT = 32V, ILED = 60mA
VOUT × D × (1 - D)2 × T / (2 × ILED) = 32 × (1 – 12 / 32) × (12 / 32)2 × 1/(1.2 × 106) / (2 × 0.12) = 15µ > L(10µH)
 DCM
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Datasheet
BD65D00MUV
●OUTPUT Capacitor Selection
Output Capacitor smoothly keeps output voltage and supplies LED current. Output Voltage consists of Charge (FET ON)
and Discharge (LED current). So Output voltage has Output ripple Voltage in every FET switching.
Output ripple voltage is calculated as following.
Output ripple Voltage
- Switching cycle = T
- Total LED current = ILED
- Switching ON duty = D
- Output ripple Voltage = Vripple
- Output Capacitor (real value) = Creal
- Output Capacitor = COUT
- Decreasing ratio of Capacitor = Cerror
(Capacitor value is decreased by Bias, so)
Creal = COUT × Cerror
Creal = ILED × (1-D) × T / Vripple
COUT = ILED × (1-D) × T / Vripple / Cerror
(Example 1)
In case of, VIN=12.0V, fsw = 1.2MHz, VOUT =32V, ILED =120mA, COUT = 8.8µF, Cerror = 50%
T = 1 / 1.2MHz
D = 1 – VIN / VOUT = 1 – 12/32
Vripple
= ILED × (1-D) × T / (COUT×Cerror) = 120mA × (12/32) / 1.2MHz / (8.8µF×0.5)
= 8.5mV
C out
Capa [ µF]
Creal
0V
35V
50V
Output voltage
Figure 49. Bias Characteristics of Capacitor
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Datasheet
BD65D00MUV
●The Separations of the IC Power Supply and Coil Power Supply
This IC can work in separating the power source in both IC power supply and coil power supply. With this application, it can
decrease IC power consumption, and can correspond to applied voltage exceeds IC rating 27V.
That application is shown in below Figure 50. The higher voltage source is applied to the power source of coil that is
connected from an adapter etc. Next, the IC power supply is connected with a different coil power supply. Under the
conditions for inputting from 4.5V to 5.5V into IC VIN, please follow the recommend design in Figure 50. It connects VIN
terminal and VDC terminal together at IC outside.
When the coil power supply is applied, there is no any problem even though IC power supply is the state of 0V. Although IC
power supply is set to 0V, pull-down resistance is arranged for the power off which cuts off the leak route from coil power
supply in IC inside, the leak route is cut off. And, there is no power on-off sequence of coil power supply and IC power
supply.
However, there’s an instance where the over current protection may be affected if the power supply was inputted last in the
coil because the ENABLE and PWM were inputted already and also because of under voltage that was detected before the
power supply stabilizes. Before it reaches the needed voltage in the applications to be used, turn OFF the ENABLE and
PWM input.
Separate VIN and Coil power supply
12V to 27V (VINL)
10µF
10µH
10 serial x 4 parallel (40pcs)
VOUT
2.2µF/50V
2.2µF
LX
LX
VIN
FAULT
VDC
PREO UT
2.2MΩ
10Ω
OVP
TRIN
68kΩ
SENSP
BD65D00MUV
2.1V to VIN
RESET
E NABLE
CH1
PWM
CH2
PW M
CH3
fPW M =100Hz~25kHz
CH4
COMP
60mA
1kΩ
22nF
PGND
PGND
GND
TEST
FSET
ABC
ISET
56kΩ 1nF
39kΩ
GND
PGND
Connect VIN and VDC terminals
6V to 32V(VINL)
10µF
4.5 to 5.5V
10µH
VOUT
10 serial x 4 parallel (40pcs)
2.2µF/50V
2.2µF
LX
LX
VIN
FAULT
VDC
PREO UT
2.2MΩ
10Ω
OVP
TRIN
68kΩ
SENSP
BD65D00MUV
2.1V to VIN
RESET
E NABLE
CH1
PWM
CH2
PW M
CH3
fPW M =100Hz~25kHz
CH4
COMP
60mA
1kΩ
22nF
PGND
PGND
GND
TEST
FSET
ABC
ISET
56kΩ 1nF
39kΩ
GND
PGND
Figure 50. Application at the time of power supply isolation
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Datasheet
BD65D00MUV
●PCB Layout
In order to make the most of the performance of this IC, its PCB layout is very important. Characteristics such as efficiency
and ripple and the likes change greatly with layout patterns, which please note carefully.
10V to 27V (VINL)
CIN
10µF
10µH
VOUT
SBD
2.2µF/50V
2.2µF
COUT1
LX
LX
10 serial x 4 parallel (40pcs)
CVDC1
VIN
FAULT
VDC
PREO UT
ROVP1
2.2MΩ
10Ω
OVP
TRIN
ROVP2
68kΩ
SENSP
BD65D00MUV
2.1V to VIN
RESET
E NABLE
CH1
PWM
CH2
PW M
CH3
fPW M =100Hz~25kHz
CH4
COMP
RCMP
1kΩ
22nF
CCMP
PGND
PGND
GND
TEST
FSET
ABC
ISET
56kΩ 1nF
RISET
GND
PGND
RFSET
CABC
Figure 51. Schematic
<Coil’s Input bypass capacitor CIN (10μF)>
Put input bypass capacitor CIN (10μF) as close as possible between coilL1 and PGND pin.
<Smoothing capacitor CVDC1(2.2µF) of the regulator>
Connect smoothing capacitor CVDC1(2.2μF) as close as possible between VDC pin and GND.
<Schottky barrier diode SBD>
Connect schottky barrier diode SBD as close as possible between coil1and LX pin.
<Output capacitor COUT1>
Connect output capacitor COUT1 between cathode of SBD and PGND.
Make both PGND sides of CVIN and COUT1 as close as possible.
<LED current setting resistor RISET(39kΩ)>>
Connect LED current setting resistor RISET(39kΩ) as close as possible between ISET pin and GND.
There is possibility to oscillate when capacity is added to ISET terminal, so pay attention that capacity isn’t added.
<Analog dimming pin smoothing capacitor CABC (1nF)>
Put analog dimming pin smoothing capacitor CABC (1nF) close to ABC pin and do not extend the wiring to prevent noise
increasing and also LED current waving.
<Frequency setting resistor(56KΩ)>
Put frequency setting resistor(56KΩ) as close as possible between FSET pin and GND.
<Over voltage limit setting resistor ROVP1(2.2MΩ) and ROVP2(68KΩ)
Put over voltage limit setting resistor ROVP1(2.2MΩ) and ROVP2(68KΩ) as close as possible to
OVP pin and do not extend the wiring to prevent noise increasing and also detecting over voltage protection in error.
<GMAMP setting resistor RCMP(1kΩ) and CCMP(1nF) for phase compensation >
Put GMAMP setting resistor RCMP(1KΩ) and CCMP(22nF) as close as possible to COMP pin and do not extend the
wiring to prevent noise increasing and also oscillating.
< GND and PGND connection>
GND is analog ground, and PGND is power ground. PGND might cause a lot of noise due to the coil current of PGND.
Try to connect with analog ground, after smoothing with input bypath capacitor CVIN and output capacitor COUT1.
<Heat radiation of back side PAD>
PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin (analog ground).
Moreover, connect ground plane of board using via as shown in the patterns of next page.
The efficiency of heat radiation improves according to the area of ground plane.
<Others>
When those pins are not connected directly near the chip, influence is give to the performance of BD65D00MUV, and
limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to reduce
electric power consumption and increase the entire efficiency.
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BD65D00MUV
●Recommended PCB Layout
L1
10µH
BD65D00MUV
CABC
1nF/10V
RCMP
1kΩ
100
Power
supply
+
6V to 27V
○
(VBAT)
D65D00
CIN
10µF/25V
○
RISET
39kΩ
CCMP
22nF/10V
SBD
R160-60
COUT1
2.2µF/50V
76
CVDC
2.2µF/10V
RFSET
56kΩ
Figure 52. TOP
ROVP1
2.2MΩ
ROVP2
75kΩ
Figure 53. BOTTOM
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Datasheet
BD65D00MUV
Figure 54. Top Copper trace layer
Figure 55. Middle1 Copper trace layer
Figure 56. Middle2 Copper trace layer
Figure 57. Bottom Copper trace layer
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Datasheet
BD65D00MUV
●Selection of External Parts
Recommended external parts are as shown below.
When to use other parts than these, select the following equivalent parts.
▪Coil
Value
Manufacturer
Product number
4.7μH
4.7μH
4.7μH
10µH
10µH
10µH
▪Capacitor
TDK
TOKO
TOKO
TDK
TOKO
TOKO
LTF5022T-4R7N2R0-LC
A915AY-4R7M
B1015AS-4R7M
LTF5022T-100M1R4-LC
A915AY-100M
B1047AS-100M
Value
Pressure
Manufacturer
Product number
25V
25V
50V
50V
50V
10V
50V
10V
10V
50V
MURATA
MURATA
TDK
MURATA
Panasonic
MURATA
MURATA
MURATA
MURATA
MURATA
GRM31CB31E106KA75
GRM319R61E475K
C3225JB1H225K
GRM31CB31H225K
ECJHVB1H225K
GRM188B31A225K
GRM188B31H104K
GRM188B31A104K
GRM155B31H223K
GRM155B11H471K
10µF
4.7μF
2.2μF
2.2µF
2.2µF
2.2µF
0.1µF
0.1µF
0.022µF
470pF
▪Resistor
Value
2.2MΩ
91kΩ
75kΩ
68kΩ
56kΩ
36kΩ
10kΩ
1kΩ
330Ω
▪SBD
Tolerance Manufacturer
±1.0%
±0.5%
±0.5%
±0.5%
±0.5%
±0.5%
±1.0%
±0.5%
±0.5%
Pressure
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
ROHM
Product number
MCR03PZPZFX2204
MCR03PZPZD9102
MCR03PZPZD7502
MCR03PZPZD6802
MCR03PZPZD5602
MCR03PZPZD3602
MCR03PZPZF103
MCR03PZPZD1002
MCR03PZPZD3300
Manufacturer
Product number
ROHM
RB160M-60
Pressure
Manufacturer
Product number
45V
45V
ROHM
ROHM
RTR020N05
RTR030N05
60V
MOS FET Nch
L
5.0
5.2
8.4
5.0
5.2
7.6
Size (mm)
W
H (Max.)
5.2
2.2
5.2
3.0
8.3
4.0
5.2
2.2
5.2
3.0
7.6
5.0
L
3.2
3.2
3.2
3.2
3.2
1.6
1.6
1.6
1.0
1.0
Size
W
1.6
1.6
2.5
1.6
1.6
0.8
0.8
0.8
0.5
0.5
H
1.6
0.85±0.1
2.0±0.2
1.6
0.85
0.8
0.8
0.8
0.5
0.5
L
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
Size (mm)
W
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
0.8
H
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
0.45
L
3.5
Size (mm)
W
H (Max.)
1.6
0.8
DC current
(mA)
DCR
(Ω)
2000
1870
3300
1400
1400
2700
0.073
0.045
0.038
0.140
0.140
0.053
Size (mm)
L
W
H (Max.)
2.8
2.8
2.9
2.9
1.0
1.0
ID(A)
Drive
voltage
(V)
2
3
2.5
2.5
The coil is the part that is most influential to efficiency. Select the coil whose direct current resistor (DCR) is small and
current - inductance characteristic is excellent. BD65D00 is designed for the inductance value of 10µH. Don’t use the
inductance value less than 3.3µH. Select a capacitor of ceramic type with excellent frequency and temperature
characteristics. Further, select Capacitor to be used with small direct current resistance.
●About Heat Loss
In heat design, operate the DC/DC converter in the following condition.
(The following temperature is a guarantee temperature, so consider the margin.)
1. Ambient temperature Ta must be less than 85℃.
2. The loss of IC must be less than dissipation Pd.
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Datasheet
BD65D00MUV
●Application Example
Nch FET using internal/external
This IC can be changed with the internal/external NchFET for switching to suit your application.
It is possible when the heat dispersion of a package of cases,such as light,LED current is used, and we use the external
NchFET.
1. External FET application
LED current: 60mA (ISET = 39kΩ)
LED: 15 LEDs in series, 4 strings in parallel
24V to 27V
10µF
10µH
VOUT
15serial x 4 parallel (60pcs)
2.2µF/50V
2.2µF
LX
LX
VIN
FAULT
VDC
PREOUT
2.2MΩ
10Ω
OVP
TRIN
47kΩ
SENSP
BD65D00MUV
2.1V to VIN
RESET
ENABLE
PWM
fPWM=100Hz~25kHz
PWM
CH1
CH2
COMP
CH3
1kΩ
CH4
22nF
PGND
PGND GND
TEST
FSET
ABC
ISET
60mA
39kΩ
56kΩ
GND
1nF
PGND
Figure 58. Application example of external FET
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BD65D00MUV
2. Analog Dimming and monitoring FAULT terminal
LED current: 60mA (ISET = 39kΩ)
LED: 10 LEDs in series, 4 strings in parallel
12V to 27V
3V
30kΩ
10µF
monitor
10µH
10 serial x 4 parallel (40pcs)
VOUT
2.2µF/50V
2.2µF
LX
LX
VIN
FA ULT
VDC
PREO UT
2.2MΩ
10Ω
OVP
TRIN
68kΩ
SENSP
BD65D00MUV
2.1V to VIN
RESET
E NABLE
CH1
PW M
CH2
PW M
CH3
CH4
COMP
60mA
1kΩ
22nF
PGND
PGND
GND
TEST
FSET
ABC
56kΩ 1nF
GND
ISET
39kΩ
PG ND
D/A
Figure 59. Application example of Analog dimming
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Datasheet
BD65D00MUV
●Operational Notes
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage (VIN), temperature range of operating conditions
(Topr), etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an
open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given
to take physical safety measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the
breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s
power supply terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.
At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the
capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus
determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to
the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention
to the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of
the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 175℃ (typ.) or higher, the thermal shutdown circuit operates and turns a switch
OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is
not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
(14) Selection of coil
Select the low DCR inductors to decrease power loss for DC/DC converter.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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Datasheet
BD65D00MUV
●Ordering Information
B
D
6
5
D
0
0
M
Part Number
U
V
-
E2
Package
MUV: VQFN028V5050
Packaging and forming specification
E2: Embossed tape and reel
●Marking Diagram
VQFN028V5050 (TOP VIEW)
Part Number Marking
D65D00
LOT Number
1PIN MARK
Figure 60. Marking Diagram
●Physical Dimension Tape and Reel Information
VQFN028V5050
<Tape and Reel information>
5.0±0.1
5.0±0.1
1.0MAX
2.7±0.1
1
7
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
8
2.7±0.1
28
0.4±0.1
2500pcs
(0.22)
0.02 +0.03
-0.02
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
22
14
21
1.0 0.5
15
+0.05
0.25 -0.04
1pin
(Unit : mm)
Reel
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
Figure 61. VQFN028V5050
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Datasheet
BD65D00MUV
●Revision History
Date
Revision
07.Dec.2012
001
Changes
New Release
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
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concerning such information.
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