Download

N EW
VT-X700, VT-X900
High speed automated X-ray CT inspection system
For
SEMICONDUCTOR
VT-X700, VT-X900
VT-X700
VT-X900
Omron‘s unique
Automated inspection capability ensures
process quality in a mass-production
environment by using Submicron CT imaging
with a variety of Metrology data.
Trends
• Downsizing package
• Higher density with stacked layer
• Variety of device combination (SiP)
Technology
Omron’s proven 3D-CT technology leads through
- Fast and Quantitative metrology
- Stable Imaging with Sub-Micron Magnification
- Recipe-based Automated Inspection
Traditional X-Ray analysis
Omron’s 3D rendering image
Variety of data output
100
95
90
85
80
Bump ID_19
Bump ID_20
Bump ID_17
Bump ID_18
Bump ID_15
Bump ID_16
Bump ID_13
Bump ID_14
Bump ID_11
Bump ID_12
Bump ID_9
Bump ID_7
Bump ID_8
Bump ID_6
Bump ID_4
Bump ID_5
Bump ID_10
Sharp image to both
top and bottom bumps
Bump ID_3
Bump ID_1
Doesn’t differentiate
between stacked bumps
Bump ID_2
75
Quantify the process condition
Automated Inspection and Metrology in mass production environment
Application
• Package on package (PoP)
• System in package (SiP)
• Flip Chip micro bump
• Micro-bump on Wafer
• Micro-bump on Lead Frame
• Build in mass-production condition
• Initial quality confirmation
after lot change over
• Monitor mass-production quality
• Root cause analysis of defects
Metrology
Global cloud
3D-CT delivers automated inspection and
output measurement results in parallel.
Realizing quantitative understanding without
destroying the sample, enables first article
inspection confirmation after lot change over
and facilitates the monitoring of production
equipment performance and the key metrics of
production. Stored data can be used for root
cause analysis, which can then be shared
globally for process improvement through the
cloud system.
Image figure in the factory
VT-X900
Equipment
Measurement
data
Analysis results
Automated Inspection
Omron uses its own algorithm and inspection logic to
measure the key features of the sample and compare it to the
Inspection image
quality standard. Any features found outside the standard are
indicated including a fault type. Defects found on Double
X-section image
X-Y Image
sided boards or stacked devices are identified by layer.
Inspection logic example
Non-Contact-Open Inspection
Solder wet fault and/or open fault is detected.
Bad
Vertical slice
Normal
Alignment Inspection
The joint area position shift fault of a solder bump on
the die and substrate is detected.
Bad
Vertical slice
X-Z Image
Y-Z Image
Normal
Defect Analysis
3D rendering images can be generated by
3D Analysis image
voxel data (3D volume data) output from system
(software option). Virtual slices enable
observing bump shape and defect condition
without destroying the sample.
Vertical Slice
Horizontal Slice
Specifications*
Hardware configuration/function specifications
Item
Description
Model
VT-X700-M
VT-X900
Parallel CT, 3D slice imaging
Imaging method
Imaging resolution
Max. Inspection area
Imaging
device
Source
0.3, 0.5, 0.7, 1.0, 2.0, 3.0 μm
330 mm x 255 mm
330 mm x 330 mm
110 kV closed tube
110 kV open tube
5M pixels flat panel detector
4M pixels I.I. camera
1,550(W) x 1,650(D) x 1,620(H) mm
2,271(W) x 1,707(D) x 1,889(H) mm
Approx. 2,900 kg
Approx. 3,300 kg
Rated voltage
Single phase 200/210/220/230/240 VAC (±10%)
Single phase 200/208/220/230/240 VAC (±10%)
Rated power
2.9 kVA
6.0 kVA
Oil free air
0.4 to 0.6 MPa
0.4 to 0.6 MPa
X-Ray leakage
< 0.5 μSv/hr
< 0.5 μSv/hr
Detector
Dimension
Weight
Tool
specification
10, 15, 20, 25, 30 μm
CE, SEMI S2/S8, SECS/GEM, NFPA79, FDA
Standard
*The specification subject to change without notice.
Dimensions
VT-X700-M
VT-X900
1650
1707
2271
1650
1620
1889
1550
This document provides information mainly for selecting suitable models. Please read the Instruction Sheet carefully for information that the
user must understand and accept before purchase, including information on warranty, limitations of liability, and precautions .
This product may cause interference if used in residential areas.
OMRON Corporation
INDUSTRIAL AUTOMATION COMPANY
INSPECTION SYSTEMS BUSINESS DIVISION
SALES DEPARTMENT
Shinagawa Front Bldg. Conference 7F
2-3-13 Kounan Minato-ku Tokyo
108-0075 JAPAN
TEL +81-3-6718-3550 FAX:+81-3-6718-3553
Omron AOI Business Europe, Omron Europe B.V.
Zilverenberg 2, 5234 GM 's-Hertogenbosch, The Netherlands
TEL: +31 (0)736-481811 FAX: + 31 (0)736-481879
OMRON ELECTRONICS LLC
2895 Greenspoint Parkway, Suite 200
Hoffman Estates, IL 60169 U.S.A
TEL:+1-847-843-7900 FAX:+1-847-843-7787
Authorized Distributor:
OMRON ELECTRONICS KOREA CO.,LTD.
21F, KyoboTower B Wing, 465, Gangnam-daero,
Seocho-gu, Seoul, Korea 137-920
TEL: +82-2-3483-7789 FAX: +82-2-3483-7788
OMRON INDUSTRIAL AUTOMATION
(CHINA) CO., LTD.
F20,TowerA,NEO Building,6011ShennanAvenue,
OMRON ASIA PACIFIC PTE LTD
Futian District, Shenzhen, Guangdong
438A Alexandra Road #05-05/08 (Lobby 2)
518048, China
TEL: +86-755-8359-9028 FAX: +86-755-8359-9628 Alexandra Technopark Singapore 119967
TEL:+65-6835-3011 FAX:+65-6835-2711
C
Cat. No. Q326-E1-02
OMRON Corporation 2015 All Rights Reserved.
Note: Specifications subject to change without notice
0416(0215)(O)
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