AP65450

AP65450
4A, 18V, 650kHz ADAPTIVE COT STEP-DOWN CONVERTER
Description
Pin Assignments
The AP65450 is an adaptive constant on-time mode synchronous
buck converter providing high efficiency, excellent transient response
and high DC output accuracy for low-voltage regulation in digital TV
and monitor.
( Top View )
The constant-on-time control scheme handles wide input/output
voltage ratios and provides low external component count. The
internal proprietary circuit enables the device to adopt both low
equivalent series resistance (ESR) output capacitors, such as
SP-CAP or POSCAP and ultra-low ESR ceramic capacitors.
EN
1
8
VIN
FB
2
7
BS
VREG5
3
6
SW
SS
4
5
GND
SO-8EP
The adaptive on-time control supports seamless transition between
continuous conduction mode (CCM) at higher load conditions and
discontinuous conduction mode (DCM) at lighter load conditions.
DCM allows AP65450 to maintain high efficiency at light load
conditions. The AP65450 also features programmable soft-start,
UVLO, OTP and OCP to protect the circuit.
This IC is available in SO-8EP package.
Features

Fixed Frequency Emulated Constant On-time Control



Good Stability Independent of the Output Capacitor ESR
Fast Load Transient Response
Synchronous Rectification: 65mΩ Internal High-side Switch and
36mΩ Internal Low-side Switch
Wide Input Voltage Range: 4.5V to 18V
Output Voltage Range: 0.76V to 6V
4A Continuous Output Current
650kHz Switching Frequency
Built-in Over Current Limit
Built-in Thermal Shutdown Protection
Programmable Soft-start
Pre-biased Start-up
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)










Notes:
Applications

Gaming Consoles







Flat Screen TV Sets and Monitors
Set-Top Boxes
Distributed power systems
Home Audio
Consumer Electronics
Network Systems
FPGA, DSP and ASIC Supplies
Green Electronics

1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
INPUT
VIN
12V
7
BST
8
IN
ON
OFF
1
EN
6
SW
L1
C5
0.1µF 1.5μH
AP65450
R1
8.25kΩ
R2
22.1kΩ
2
FB
C1
20μF
C4
8.2nF
4
SS
5
GND
3
VREG5
OUTPUT
VOUT
1.05V
C2
44μF
C3
1µF
Figure 1 Typical Application Circuit
AP65450
Document number: DS37135 Rev. 2-2
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AP65450
Pin Descriptions
Pin
Name
Pin Number
EN
1
Enable input. EN is a digital input that turns the regulator on or off. Drive EN high to turn on the regulator, drive it low
to turn off. Pull up with 100kΩ resistor for automatic startup.
FB
2
Feedback Input. FB senses the output voltage and regulates it. Drive FB with a resistive voltage divider connected to
it from the output voltage.
VREG5
3
Internal power supply output pin to connect an additional capacitor. Connect a 1μF (typical) capacitor as close as
possible to the VREG5 and GND. This pin is not active when EN is low.
SS
4
Soft-start control input pin. SS controls the soft start period. Connect a capacitor from SS to GND to set the soft-start
period.
GND
5
Ground pin is the main power ground for the switching circuit.
SW
6
Power Switching Output. SW is the switching node that supplies power to the output. Connect the output LC filter
from SW to the output load. Note that a capacitor is required from SW to BS to power the high-side switch.
BS
7
Bootstrap pin. A bootstrap capacitor is connected between the BS pin and SW pin. The voltage across the bootstrap
capacitor drives the internal high-side NMOS switch. A 0.1μF (typical) capacitor is required for proper operation
VIN
8
Supply input pin. A capacitor should be connected between the VIN pin and GND pin to keep the DC input voltage
constant.
EP
Function
SO-8EP
Connect the exposed thermal pad to GND on the PCB.
Functional Block Diagram
Figure 2 Functional Block Diagram
AP65450
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AP65450
Absolute Maximum Ratings (Note 4) (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
VIN
Supply Voltage
VREG5
VREG5 Pin Voltage
VSW
Switch Node Voltage
VBS
Bootstrap Voltage
VFB
Feedback Voltage
VEN
Enable/UVLO Voltage
VSS
Soft-start PIN
VGND
GND Pin Voltage
TST
Storage Temperature
TJ
Junction Temperature
TL
Lead Temperature
ESD Susceptibility (Note 5)
HBM
Human Body Model
MM
Machine Model
Notes:
Rating
-0.3 to 20
-0.3V to +6.0
-1.0 to VIN +0.3
-0.3 to VSW +6.0
-0.3V to +6.0
-0.3V to +6.0
-0.3V to +6.0
-0.3 to 0.3
-65 to +150
+160
+260
Unit
V
V
V
V
V
V
V
V
°C
°C
°C
2
200
kV
V
4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices.
Thermal Resistance (Note 6)
Note:
Symbol
Parameter
θJA
Junction to Ambient
SO-8EP
Rating
70
°C/W
Unit
θJC
Junction to Case
SO-8EP
30
°C/W
6. Test condition: SO-8: Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
Recommended Operating Conditions (Note 7) (@TA = +25°C, unless otherwise specified.)
Symbol
Note:
Min
Max
Unit
VIN
Supply Voltage
Parameter
4.5
18.0
V
TJ
Operating Junction Temperature Range
-40
+125
°C
TA
Operating Ambient Temperature Range
-40
+85
°C
7. The device function is not guaranteed outside of the recommended operating conditions.
AP65450
Document number: DS37135 Rev. 2-2
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AP65450
Electrical Characteristics
(@TA = +25°C, VIN = 12V, unless otherwise specified.)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
18
SUPPLY VOLTAGE (VIN PIN)
Input Voltage
Quiescent Current
Shutdown Supply Current
VIN
IQ
ISHDN
4.5
0.9
3.6
10
V
mA
μA
3.45
3.75
4.05
V
0.19
0.32
0.45
V
0.6
V
V
VFB=0.85V
VEN=0V
UNDER VOLTAGE LOCKOUT
UVLO Threshold
VUVLO
UVLO Hysteresis
VHYS
VIN Rising Test VREG5
Voltage
VIN Falling Test VREG5
Voltage
ENABLE (EN PIN)
EN High-level Input Voltage
EN Low-level Input Voltage
VENH
VENL
1.9
VOLTAGE REFERENCE (FB PIN)
Feedback Voltage
Feedback Bias Current
VFB
IFB
VOUT=1.05V
VFB=0.8V
0.753
-0.1
0.765
0
0.777
0.1
V
μA
4.7
5.1
5.5
V
60
mA
mV
20
mV
VREG5 OUTPUT
VREG5 Output Voltage
VVREG5
Source Current Capability
Load Regulation
Line Regulation
6.0V<VIN<18V
0<IVREG5<5mA
VIN=6V, VVREG5=4V
0<IVREG5<5mA
6.0V<VIN<18V
IVREG5=5mA
110
MOSFET
High-side Switch On-resistance
Low-side Switch On-resistance
RDSONH
RDSONL
Ω
Ω
0.075
0.036
CURRENT LIMIT
High Level Current Limit
ILIM-H
L=1.5μH
4.6
5.6
6.9
A
150
260
310
ns
ns
ON-TIME TIMER
On Time
Minimum Off Time
tON
tOFF-MIN
VIN=12V, VOUT=1.05V
VFB=0.7V
THERMAL SHUTDOWN
Thermal Shutdown
Thermal Shutdown Hysteresis
TOTSD
THYS
160
30
ºC
ºC
SOFT START (SS PIN)
Soft-start Source Current
Soft-start Discharge Current
AP65450
Document number: DS37135 Rev. 2-2
ISS-SOURCE
ISS-DISCHARGE
VSS=1.2V
VSS=0.5V
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4.2
0.1
6.0
0.2
7.8
μA
mA
November 2014
© Diodes Incorporated
AP65450
Typical Performance Characteristics (@TA = +25°C, VIN = 12V, VOUT = 3.3V, unless otherwise specified.)
85˚C
25˚C
-40˚C
85˚C
25˚C
-40˚C
VIN=18V
IO=10mA
VIN=12V
VIN=4.5V
AP65450
Document number: DS37135 Rev. 2-2
IO=1A
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AP65450
Typical Performance Characteristics (cont.) (@TA = +25°C, VIN = 12V, VOUT = 1.05V, unless otherwise specified.)
VO=3.3V
VO=1.05V
VO=5V
VO=1.8V
VO=3.3V
VO=2.5V
VO=1.8V
VO=1.5V
VO=1.05V
VO=1.2V
VO=5V
VO=2.5V
VO=3.3V
VO=5V
VO=3.3V
VO=2.5V
VO=1.05V
VO=1.8V
VO=1.5V
VO=1.2V
VO=1.05V
VO=1.2V
VO=1.5V
VO=1.8V
AP65450
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AP65450
Typical Performance Characteristics (cont.)
(@TA = +25°C, VIN = 12V, VOUT = 1.05V, L = 1.5µH, C1 = 20µF, C2 = 44µF, unless otherwise specified.)
Steady State Test 4A
Startup Through VIN No Load
Startup Through VIN 4A Load
VIN_AC (500mV/DIV)
VIN (12V/DIV)
VIN (12V/DIV)
VOUT (1V/DIV)
VOUT (1V/DIV)
IOUT (1A/DIV)
IOUT (4A/DIV)
SW (10V/DIV)
SW (10V/DIV)
VOUT_AC (50mV/DIV)
IOUT (4A/DIV)
SW (5V/DIV)
Time-1µs/div
Time-500µs/div
Time-500µs/div
Startup with VREG5 No Load
Shutdown Through VIN No load
Shutdown Through VIN 4A Load
VIN (12V/DIV)
VIN (12V/DIV)
VOUT (1V/DIV)
VOUT (1V/DIV)
IOUT (1A/DIV)
IOUT (4A/DIV)
EN (3V/DIV)
VREG5 (5V/DIV)
VOUT (500mV/DIV)
SW (10V/DIV)
SW (10V/DIV)
Time-1ms/div
Time-50ms/div
Time-200µs/div
Startup Through VEN No Load
Startup Through VEN 4A Load
Short Circuit Test
VEN (3V/DIV)
VEN (3V/DIV)
VOUT (1V/DIV)
VOUT (1V/DIV)
IOUT (1A/DIV)
IOUT (4A/DIV)
SW (10V/DIV)
SW (10V/DIV)
VOUT (500mV/DIV)
IOUT (2A/DIV)
Time-2ms/div
Time-2ms/div
Time-100µs/div
Shutdown Through VEN No load
Shutdown Through VEN 4A Load
Short Circuit Recovery
VEN (3V/DIV)
VEN (3V/DIV)
VOUT (500mV/DIV)
VOUT (1V/DIV)
IOUT (1A/DIV)
VOUT (1V/DIV)
IOUT (4A/DIV)
SW (10V/DIV)
IOUT (2A/DIV)
SW (10V/DIV)
Time-20ms/div
Time-20ms/div
Time-1ms/div
DCM Voltage Ripple (IO=30mA)
Voltage Ripple at Output (IO=4A)
Voltage Ripple at Input (IO=4A)
VIN_AC (100mV/DIV)
VOUT_AC (50mV/DIV)
VOUT_AC (20mV/DIV)
SW (5V/DIV)
SW (5V/DIV)
SW (5V/DIV)
Time-1µs/div
AP65450
Document number: DS37135 Rev. 2-2
Time-400ns/div
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Time-400ns/div
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AP65450
Application Information
Figure 3 Typical Application of AP65450
AP65450
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AP65450
Application Information (cont.)
Power Save Mode
The AP65450 is designed with Power Save Mode (PSM) at light load conditions for high efficiency. The AP65450 automatically reduces the
switching frequency and change the Ton time to Tmin-on time during a light load condition to get high efficiency and low output ripple. As the
output current decreases form heavy load condition, the inductor current decreases as well, eventually comes close to zero current, which is the
boundary between CCM and DCM. The low side MOSFET is turned off when the inductor current reaches zero level. The load is provided only by
output capacitor, when FB voltage is lower than 0.76V, the next cycle ON cycle is beginning. The on-time is the minimum on time that benefit for
decreasing VOUT ripple at light load condition. When the output current increases from light to heavy load, the switching frequency increases to
keep output voltage. The transition point to light load operation can be calculated using the following equation:
V  VOUT
ILOAD  IN
 TON
2L
TON is on-time
Enable
Above the ‘EN high-level input voltage’, the internal regulator is turned on and the quiescent current can be measured above this threshold. The
enable (EN) input allows the user to control turning on or off the regulator. To enable the AP65450, EN must be pulled above the ‘EN high-level
input voltage’ and to disable the AP65450, EN must be pulled below ‘EN low-level input voltage’.
In Figure 3, EN has a positive voltage through a 100KΩ pull-up to VIN. No supply input is required for EN.
Soft-start
The soft-start time of the AP65450 is programmable by selecting different CSS value. When the EN pin becomes high, the CSS is charged by a 6μA
current source, generating a ramp signal fed into non-inverting input of the error comparator. Reference voltage VREF or the internal soft-start
voltage SS whichever is smaller dominates the behavior of the non-inverting inputs of the error amplifier. Accordingly, the output voltage will
follow the SS signal and ramp up smoothly to its target level. The capacitor value required for a given soft-start ramp time can be expressed as:
C
 VFB
t SS  SS
ISS
Where CSS is the required capacitor between SS pin and GND, tSS is the desired soft-start time and VFB is the feedback voltage.
Over Current Protection (OCP)
Figure 4 shows the over current protection (OCP) scheme of AP65450. In each switching cycle, the inductor current is sensed by monitoring the
low-side MOSFET in the OFF period. When the voltage between GND pin and SW pin is smaller than the over current trip level, the OCP will be
triggered and the controller keeps the OFF state. A new switching cycle will begging when the measured voltage is larger than limit voltage.
The internal counter is incremented when OCP is triggered. After 16 sequential cycles, the internal OCL (Over Current Logic) threshold is set to a
lower level, reducing the available output current. When a switching cycle occurs where the switch current is below the lower OCL threshold, the
counter is reset and OCL limit is returned to higher value.
Because the RDS(ON) of MOSFET increases with temperature, VLimit has xppm/°C temperature coefficient to compensate this temperature
dependency of RDS(ON).
R
S
Q1
Q
-266mV
OC
COMPARATOR
Q2
Figure 4 Over Current Protection Scheme
Under Voltage Lockout
The AP65450 provides an under voltage lockout circuit to prevent it from undefined status when startup. The UVLO circuit shuts down the device
when VIN drops below 3.45V. The UVLO circuit has 320mV hysteresis, which means the device starts up again when V REG rise to 3.75V (nonlatch).
Thermal shutdown
If the junction temperature of the device reaches the thermal shutdown limit of 160°C, the AP65450 shuts itself off, and both HMOS and LMOS will
be turned off. The output is discharge with the internal transistor. When the junction cools to the required level (130°C nominal), the device
initiates soft-start as during a normal power-up cycle.
AP65450
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AP65450
Application Information (cont.)
Setting the Output Voltage
The output voltage can be adjusted from 1.000 to 5V using an external resistor divider. Table 1 shows a list of resistor selection for common
output voltages. Resistor R1 is selected based on a design tradeoff between efficiency and output voltage accuracy. For high values of R1
there is less current consumption in the feedback network. However the trade-off is output voltage accuracy due to the bias current in the error
amplifier. R1 can be determined by the following equation:
V

R1  R 2   OUT  1
0.765


Output Voltage (V)
1
1.05
1.2
1.5
1.8
2.5
3.3
5
R1 (kΩ)
6.81
8.25
12.7
21.5
30.1
49.9
73.2
124
R2 (kΩ)
22.1
22.1
22.1
22.1
22.1
22.1
22.1
22.1
Table 1 Resistor Selection for Common Output
Figure 5. Feedback Divider Network
Inductor
Calculating the inductor value is a critical factor in designing a buck converter. For most designs, the following equation can be used to calculate
the inductor value;
L
VOUT  (VIN  VOUT )
VIN  ΔIL  fSW
Where ΔIL is the inductor ripple current, and fSW is the buck converter switching frequency.
Choose the inductor ripple current to be 30% of the maximum load current. The maximum inductor peak current is calculated from:
IL(MAX)  ILOAD 
ΔIL
2
Peak current determines the required saturation current rating, which influences the size of the inductor. Saturating the inductor decreases the
converter efficiency while increasing the temperatures of the inductor and the internal MOSFETs. Hence choosing an inductor with appropriate
saturation current rating is important.
A 1µH to 3.3µH inductor with a DC current rating of at least 25% percent higher than the maximum load current is recommended for most
applications. For highest efficiency, the inductor’s DC resistance should be less than 100mΩ. Use a larger inductance for improved efficiency
under light load conditions.
The phase boost can be achieved by adding an additional feed forward capacitor (C7) in parallel with R1.
Output Voltage (V)
1
1.05
1.2
1.5
1.8
2.5
3.3
5
C7(pF)




5-22
5-22
5-22
5-22
L1(µH)
1.0-1.5
1.0-1.5
1.0-1.5
1.5
1.5
2.2
2.2
3.3
C8+C9(µF)
22-68
22-68
22-68
22-68
22-68
22-68
22-68
22-68
Table 2 Recommended Component Selection
AP65450
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AP65450
Application Information (cont.)
Input Capacitor
The input capacitor reduces the surge current drawn from the input supply and the switching noise from the device. The input capacitor has to
sustain the ripple current produced during the on time on the upper MOSFET. It must have a low ESR to minimize the losses.
The RMS current rating of the input capacitor is a critical parameter that must be higher than the RMS input current. As a rule of thumb, select an
input capacitor which has an RMs rating that is greater than half of the maximum load current.
Due to large dI/dt through the input capacitors, electrolytic or ceramics should be used. If a tantalum must be used, it must be surge protected.
Otherwise, capacitor failure could occur. For most applications, greater than 10µF ceramic capacitor is sufficient.
Output Capacitor
The output capacitor keeps the output voltage ripple small, ensures feedback loop stability and reduces the overshoot of the output voltage. The
output capacitor is a basic component for the fast response of the power supply. In fact, during load transient, for the first few microseconds it
supplies the current to the load. The converter recognizes the load transient and sets the duty cycle to maximum, but the current slope is limited
by the inductor value.
Maximum capacitance required can be calculated from the following equation:
ESR of the output capacitor dominates the output voltage ripple. The amount of ripple can be calculated from the equation below:
Vout capacitor  ΔIinductor * ESR
An output capacitor with ample capacitance and low ESR is the best option. For most applications, a 22µF to 68µF ceramic capacitor will be
sufficient.
ΔIinductor 2
)
2
Co 
2
(Δ V  Vout ) 2  Vout
L(I out 
Where ΔV is the maximum output voltage overshoot.
Bootstrap Capacitor
To ensure the proper operation, a ceramic capacitor must be connected between the VBST and SW pin. A 0.1µF ceramic capacitor is sufficient.
VREG5 Capacitor
To ensure the proper operation, a ceramic capacitor must be connected between the VREG5 and GND pin. A 1µF ceramic capacitor is sufficient.
.
PC Board Layout
1.
2.
3.
4.
5.
6.
7.
The AP65450 works at 4A load current, heat dissipation is a major concern in layout the PCB. A 2oz Copper in both top and bottom
layer is recommended.
Provide sufficient vias in the thermal exposed pad for heat dissipate to the bottom layer.
Provide sufficient vias in the Output capacitor GND side to dissipate heat to the bottom layer.
Make the bottom layer under the device as GND layer for heat dissipation. The GND layer should be as large as possible to provide
better thermal effect.
Make the Vin capacitors as close to the device as possible.
Make the VREG5 capacitor as close to the device as possible.
The thermal pad of the device should be soldered directly to the PCB exposed copper plane to work as a heatsink. The thermal vias in
the exposed copper plane increase the heat transfer to the bottom layer.
AP65450
Document number: DS37135 Rev. 2-2
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AP65450
Figure 6 PC Board Layout
Ordering Information
AP65450 XX - 13
Package
Packing
SP : SO-8EP
13 : Tape & Reel
Part Number
Package Code
Part Marking
AP65450SP-13
SP
SO-8EP
Quantity
Tape and Reel
Part Number Suffix
2500
-13
Marking Information
(1) SO-8EP
( Top View )
5
8
Logo
YY : Year : 08, 09,10~
WW : Week : 01~52; 52
represents 52 and 53 week
E : SO-8EP Blank SO-8
G : Green
X : Internal Code
AP65450
YY WW X X E
Part No
1
4
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(1)
SO-8EP
Exposed Pad
8
5
E1
1
H
4
F
b
Bottom View
E
9° (All sides)
N
7°
A
e
A1
D
AP65450
Document number: DS37135 Rev. 2-2
45°
Q
C
4° ± 3°
Gauge Plane
Seating Plane
E0
SO-8EP (SOP-8L-EP)
Dim Min Max Typ
A 1.40 1.50 1.45
A1 0.00 0.13
b 0.30 0.50 0.40
C 0.15 0.25 0.20
D 4.85 4.95 4.90
E 3.80 3.90 3.85
E0 3.85 3.95 3.90
E1 5.90 6.10 6.00
e
1.27
F 2.75 3.35 3.05
H 2.11 2.71 2.41
L 0.62 0.82 0.72
N
0.35
Q 0.60 0.70 0.65
All Dimensions in mm
L
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AP65450
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) SO-8EP
X2
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y1
Y2
X1
Value
(in mm)
1.270
0.802
3.502
4.612
1.505
2.613
6.500
Y
C
AP65450
Document number: DS37135 Rev. 2-2
X
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AP65450
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
AP65450
Document number: DS37135 Rev. 2-2
14 of 14
www.diodes.com
November 2014
© Diodes Incorporated
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