AP2142A/ AP2152A 0.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH WITH OUTPUT DISCHARGE Description Pin Assignments The AP2142A and AP2152A are dual channel current-limited ( Top View ) integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB standards and available with both polarities of GND 1 8 FLG1 IN 2 7 OUT1 EN1 3 6 OUT2 EN2 4 5 FLG2 enable input. The devices have fast short-circuit response time for improved overall system robustness, and have integrated output discharge function to ensure completely controlled discharging of the output voltage capacitor. They provide a complete protection solution for application SO-8 subject to heavy capacitive loads and the prospect of short circuit, and offer reverse current blocking, over-current, over-temperature and short-circuit protection, as well as controlled rise time and under- ( Top View ) voltage lockout functionality. A 7ms deglitch capability on the open- GND 1 8 FLG1 IN 2 7 OUT1 All devices are available in SO-8, MSOP-8EP and U-DFN3030-8 EN1 3 6 OUT2 packages. EN2 4 5 FLG2 drain flag output prevents false over-current reporting and does not require any external components. MSOP-8EP Features ( Top View ) Dual Channel Current-Limited Power Switch with Output Discharge Fast Short-Circuit Response Time: 2µs 0.7A Accurate Current Limiting Reverse Current Blocking 85mΩ On-Resistance Input Voltage Range: 2.7V – 5.5V Built-In Soft-Start with 0.6ms Typical Rise Time Short Circuit and Thermal Protection Fault Report (FLG) with Blanking Time (7ms typ) ESD protection: 2kV HBM, 300V MM Active High (AP2152A) or Active Low (AP2142A) Enable Ambient Temperature Range: -40°C to +85°C Applications SO-8, MSOP-8EP and DFN3030E-8 (Exposed Pad): Available LCD TVs & Monitors Set-Top-Boxes, Residential Gateways Laptops, Desktops, Servers, Printers, Docking Stations, HUBs Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) UL Recognized, File Number E322375 IEC60950-1 CB Scheme Certified Notes: 1 8 FLG1 IN 2 7 OUT1 EN1 3 6 OUT2 EN2 4 5 FLG2 U-DFN3030-8 in “Green” Molding Compound (No Br, Sb) GND 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 1 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Typical Applications Circuit AP 2152 A Enable Active High Power Supply 2 .7 V to 5 .5 V IN 10 k 1 uF 4.7uF* 1uF 4.7uF* 1 uF 10 k FLG 1 FLG 2 ON OFF Load OUT 1 EN 1 EN 2 OUT 2 Load GND Note: * USB 2.0 requires 120uF per hub Available Options Part Number Channel AP2142A AP2152A 2 2 Enable Pin (EN) Active Low Active High Current Limit (typ) 0.7A 0.7A Recommended Maximum Continuous Load Current 0.5A 0.5A Pin Descriptions Pin Number Pin Name SO-8 GND IN EN1 1 2 3 EN2 FLG2 OUT2 OUT1 FLG1 4 5 6 7 8 Exposed Pad - Function MSOP-8EP U-DFN3030-8 1 Ground 2 Voltage input pin 3 Switch 1 enable input, active low (AP2142A) or active high (AP2152A) Switch 2 enable input, active low (AP2142A) or active high (AP2152A) Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered Switch 2 voltage output pin Switch 1 voltage output pin Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered Exposed Pad: Exposed Pad It should be connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path. AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 4 5 6 7 8 2 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Functional Block Diagram A P2142A , A P2152A FLG 1 T h e rm a l S ense D e g litc h EN1 C u rre n t L im it D riv e r GND U VLO C u rre n t Sense OUT1 D is c h a rg e C o n tro l IN C u rre n t Sense D is c h a rg e C o n tro l U VLO FLG 2 C u rre n t L im it D riv e r EN2 OUT2 D e g litc h T h e rm a l S ense GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM ESD MM Parameter Human Body Model ESD Protection Machine Model ESD Protection Input Voltage VIN Unit kV V 6.5 V VOUT Output Voltage VIN +0.3 V VEN , VFLG Enable Voltage 6.5 V Internal Limited A 150 °C -65 to +150 °C Maximum Continuous Load Current ILOAD Maximum Junction Temperature TJ(MAX) Storage Temperature Range (Note 4) TST Note: Ratings 2 300 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C) Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max 2.7 5.5 V Output Current 0 500 mA VIH High-Level Input Voltage on EN or EN 2 VIN V VIL Low-Level Input Voltage on EN or EN TA Operating Ambient Temperature Range VIN Input Voltage IOUT AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 3 of 16 www.diodes.com Unit 0 0.8 V -40 +85 °C March 2013 © Diodes Incorporated AP2142A/ AP2152A Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.) Symbol Parameter VUVLO Input UVLO ISHDN Input Shutdown Current Input Quiescent Current, Dual IQ Test Conditions (Note 5) Min Typ Max 1.6 2.0 2.4 V Disabled, IOUT = 0 0.1 1 µA Enabled, IOUT = 0 115 180 µA 1 µA 0.01 0.1 µA 90 110 85 105 ILEAK Input Leakage Current Disabled, OUT grounded IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN VIN = 5V, IOUT = 0.5A, TA = +25°C RDS(ON) Switch On-Resistance SO-8 MSOP-8EP, U-DFN3030-8 VIN = 5V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C VIN = 3.3V, IOUT = 0.5A, TA = +25°C 135 SO-8 MSOP-8EP, U-DFN3030-8 110 130 105 125 VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C ILIMIT ILIMIT_G Unit mΩ 170 Over-Load Current Limit VIN = 5V, VOUT = 4V, CL = 4.7µF -40°C ≤ TA ≤ +85°C 0.55 0.7 0.85 A Ganged Over-Load Current Limit VIN = 5V, VOUT = 4V, OUT1 & OUT2 tied together, CL = 4.7µF 1.1 1.4 1.7 A -40°C ≤ TA ≤ +85°C Current Limiting Trigger Threshold Output Current Slew rate (<100A/s), CL = 4.7µF 1.0 A ITrig_G Ganged Current Limiting Trigger Threshold OUT1 & OUT2 tied together, Output Current Slew rate (<100A/s), CL = 4.7µF 1.0 A IOS Short-Circuit Current per Channel OUTx connected to ground, device enabled into short circuit, CL = 4.7µF 0.7 A IOS_G Ganged Short-Circuit Current OUT1 & OUT2 connected to ground, device enabled into short-circuit, CL = 4.7µF TSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (output shorted to ground) VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V EN Input Leakage VEN = 0V to 5.5V ITrig ISINK 1.4 1.7 2 A µs 0.8 2 V V 1 µA 0.5 1 µA CL = 1µF, RLOAD = 10Ω 0.6 1.5 ms CL = 1µF, RLOAD = 10Ω 0.05 0.3 ms Output Turn-On Delay Time CL = 100µF, RLOAD = 10Ω 0.2 0.5 ms ms Output Leakage Current Disabled, VOUT = 0V TR Output Turn-On Rise Time TF Output Turn-Off Fall Time TD(ON) TD(OFF) ILEAK-O 1.1 Output Turn-Off Delay Time CL = 100µF, RLOAD = 10Ω 0.1 0.3 RFLG FLG Output FET On-Resistance IFLG = 10mA 20 40 Ω IFOH FLG Off Current VFLG = 5V 0.01 1 µA TBlank FLG Blanking Time CL =4.7µF 7 15 ms 4 RDIS Discharge Resistance (Note 6) VIN = 5V, disabled, IOUT =1mA 100 Ω TSHDN Thermal Shutdown Threshold Enabled, RLOAD =1kΩ 140 C THYS Thermal Shutdown Hysteresis 25 C SO-8 (Note 7) 115 θJA Notes: Thermal Resistance Junction-to-Ambient MSOP-8EP (Note 8) U-DFN3030-8 (Note 8) 75 60 °C/W 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 6. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up / power-down when VIN < VUVLO). The discharge function offers a resistive discharge path for the external storage capacitor for limited time. 7. Test condition for SO-8: Device mounted on FR-4 substrate PCB with minimum recommended pad layout. 8. Test condition for MSOP-8EP and U-DFN3030-8: Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 4 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Typical Performance Characteristics VEN 50% TD(ON) TF TD(ON) 90% 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% VOUT 10% 90% 10% 90% 10% Figure 1 Voltage Waveforms: AP2142A (left), AP2152A (right) Figure 2 Response Time to Short Circuit Waveform All Enable Plots are for AP2152A Active High Turn-On Delay and Rise Time Turn-Off Delay and Fall Time EN 5V/div EN 5V/div Iin 500mA/div Iin 500mA/div CL=1µF TA= +25°C CL=1µF Vout 2V/div TA= +25°C RL=10Ω Vout 2V/div 500µs/div AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 RL=10Ω 500µs/div 5 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Typical Performance Characteristics (cont.) Turn-Off Delay and Fall Time Turn-On Delay and Rise Time EN 5V/div EN 5V/div Iin 500mA/div Iin 500mA/div CL=100F TA= +25°C RL=10Ω Vout 2V/div CL=100F Vout 2V/div TA= +25°C RL=10Ω 500µs/div 500µs/div Short Circuit Current, Device Enabled Into Short Inrush Current with Different Load Capacitance EN 5V/div EN 5V/div VIN=5V CL=100F TA= +25°C CL=1F CL=220F VIN=5V TA= +25°C RL=10Ω Iin 500mA/div Iout 500mA/div CL=470F 1ms/div 500µs/div 3 Ω Load Connected to Enabled Device 2 Ω Load Connected to Enabled Device VIN=5V VIN=5V TA= +25°C TA= +25°C CL=1F CL=1F FLG 2V/div FLG 2V/div Iout 500mA/div Iout 500mA/div 2ms/div 2ms/div AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 6 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Typical Performance Characteristics (cont.) Short Circuit with Blanking Time and Recovery Power On FLG 5V/div Vout 5V/div TA= +25°C CL=1F Iout 200mA/div FLG 5V/div RL=10Ω VIN=5V Vin 5V/div TA= +25°C CL=1F Iout 1A/div Vout 5V/div 20ms/div 1ms/div Power Off FLG 5V/div Device Enabled TA= +25°C CL=1F FLG 5V/div RL=10Ω Iout 200mA/div Iout 200mA/div Vin 5V/div EN 5V/div Vout 5V/div Vout 5V/div TA= +25°C CL=1F RL=10Ω 10ms/div 1ms/div Device Disabled UVLO Increasing FLG 5V/div TA= +25°C Iout 200mA/div Vin 2V/div CL=1F RL=10Ω Vout 5V/div EN 5V/div Iout 200mA/div Vout 5V/div TA= +25°C CL=1F RL=10Ω 1ms/div AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 1ms/div 7 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Typical Performance Characteristics (cont.) UVLO Decreasing UVLO Increasing (No Load) TA= +25°C CL=1F Vin 2V/div RL=10Ω Vin 2V/div Vout 5V/div Vout 5V/div Iout 200mA/div TA= +25°C CL=1F RL=0Ω 20ms/div 1ms/div UVLO Decreasing (No Load) Channel 1 Enabled and Shorted with Channel 2 Enabled VIN=5V TA= +25°C CL=1F Vin 2V/div RL=0Ω TA= +25°C CL=1F Vout1 5V/div FLG1 5V/div Vout2 5V/div Vout 5V/div FLG2 5V/div 20ms/div 5ms/div Channel 2 Enabled and Shorted with Channel 1 Enabled Channels 1 and 2 Enabled and Shorted Vout1 5V/div Vout1 5V/div FLG1 5V/div VIN=5V TA=25°C CL=1F Vout2 5V/div FLG1 5V/div Vout2 5V/div FLG2 5V/div FLG2 5V/div 5ms/div AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 5ms/div 8 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Typical Performance Characteristics (cont.) CL=100uF CL=100uF RL=10Ω RL=10Ω TA= +25°C TA= +25°C CL=1µF RL=10Ω TA= +25°C CL=1µF RL=10Ω TA= +25°C Vin=5.0V Vin=5.0V Vin=5.5V Vin=5.5V Vin=2.7V AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 Vin=2.7V 9 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Typical Performance Characteristics (cont.) Vin=3.3V Vin=3.3V Vin=5V CL=1uF Vin=5V UVLO Rising UVLO Falling VIN=5V VOUT=4V CL=1µF VIN=5V TA= +25°C CL=1µF TA= +25°C CL=1µF AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 10 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Application Information Power Supply Considerations A 0.1μF to 1μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 1μF ceramic capacitor improves the immunity of the device to short-circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2142A/AP2152A senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then gradually turning it on. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. The threshold for activating current limiting is 0.7A typical per channel. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2142A/AP2152A is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2142A/AP2152A is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: 2 PD = RDS(ON)× I Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA = Ambient temperature C RJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2142A/AP2152A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 11 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Application Information (cont.) Under-Voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Discharge Function The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of the output voltage when either no external output resistance or load resistance is present at the output. Host/Self-Powered HUBs Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports. This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2142A/AP2152A, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2142A/AP2152A also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2142A/AP2152A between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. Ordering Information Part Number Package Code Packaging AP21X2ASG-13 AP21X2AMPG-13 S MP SO-8 MSOP-8EP AP21X2AFGEG-7 FGE U-DFN3030-8 AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 7”/13” Tape and Reel Quantity Part Number Suffix 250/Tape & Reel -13 2500/Tape & Reel -13 3000/Tape & Reel 12 of 16 www.diodes.com -7 March 2013 © Diodes Incorporated AP2142A/ AP2152A Marking Information (1) SO-8 ( Top view ) 8 7 6 5 2 : 2 Channel YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code G : Green Logo Part Number 4 : Active Low 5 : Active High AP21X X A YY WW X X 1 (2) MSOP-8EP (3) U-DFN3030-8 2 3 4 ( Top View ) XX YW X XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Green Part Number Package Identification Code AP2142AFGEG-7 AP2152AFGEG-7 U-DFN3030-8 U-DFN3030-8 AA AB AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 13 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. 0.254 (1) Package Type: SO-8 E1 E Gauge Plane Seating Plane A1 L Detail ‘A’ 7°~9° h 45° Detail ‘A’ A2 A A3 b e SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm D (2) Package Type: MSOP-8EP D 4X 10 ° 0.25 D1 x E E2 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 L A3 c A2 A D E1 See Detail C (3) MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm Package Type: U-DFN3030-8 U-DFN3030-8 Type E Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 2.95 3.05 3.00 D2 2.15 2.35 2.25 E 2.95 3.05 3.00 e 0.65 E2 1.40 1.60 1.50 L 0.30 0.60 0.45 Z 0.40 All Dimensions in mm A A3 A1 D D2 L (x8) E E2 Z (x4) AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 e b (x8) 14 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: SO-8 X Dimensions X Y C1 C2 C1 Value (in mm) 0.60 1.55 5.4 1.27 C2 Y (2) Package Type: MSOP-8EP X C Y G Y2 Dimensions C G X X1 Y Y1 Y2 Y1 X1 (3) Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 Package Type: U-DFN3030-8 X (x8) C Y (x8) Y1 Dimensions C C1 X Y Y1 Y2 Y2 Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75 C1 AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 15 of 16 www.diodes.com March 2013 © Diodes Incorporated AP2142A/ AP2152A IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com AP2142A/ AP2152A Document number: DS32191 Rev. 3 - 2 16 of 16 www.diodes.com March 2013 © Diodes Incorporated