510AJ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WQFN10 2.6x2.6, 0.5P
CASE 510AJ−01
ISSUE A
SCALE 2:1
ÍÍÍ
ÍÍÍ
ÍÍÍ
D
L
A B
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
0.15 C
0.15 C
A3
DETAIL B
0.08 C
MOLD CMPD
DETAIL B
A1
C
SIDE VIEW
9X
DIM
A
A1
A3
b
D
E
e
L
L1
L2
ALTERNATE
CONSTRUCTIONS
A
NOTE 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
L
L1
PIN ONE
REFERENCE
DATE 27 MAR 2009
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
DETAIL A
5
L
4
XXXX
AAYW
G
6
1
9
XXXX
AA
Y
W
G
e
10
L2
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.60 BSC
2.60 BSC
0.50 BSC
0.45
0.55
0.00
0.15
0.55
0.65
10X
b
0.10 C A
0.05 C
BOTTOM VIEW
B
NOTE 3
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
2.90
1
10X
10X
0.50
PITCH
2.90
0.30
0.73
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98AON38696E
ON SEMICONDUCTOR STANDARD
http://onsemi.com
WQFN10 2.6X2.6, 0.5P
1
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON38696E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY J. FROHLICH.
11 FEB 2009
A
CORRECTED MARKING DIAGRAM INFORMATION. REQ. BY J. FROHLICH.
27 MAR 2009
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2009
March, 2009 − Rev. 01A
Case Outline Number:
510AJ
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