567HJ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP6, 1.17x0.77
CASE 567HJ
ISSUE O
SCALE 4:1
A B
D
È
PIN A1
REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
DIM
A
A1
b
D
E
e
TOP VIEW
0.10 C
0.05 C
A1
SIDE VIEW
NOTE 3
b
0.05 C A B
0.03 C
C
SEATING
PLANE
e
C
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
B
e
A
1
XXMG
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
e/2
6X
MILLIMETERS
MIN
MAX
−−−
0.50
0.13
0.17
0.21
0.25
0.77 BSC
1.17 BSC
0.40 BSC
GENERIC
MARKING DIAGRAM*
A
6X
DATE 28 MAY 2013
2
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
0.40
PITCH
A1
0.40
PITCH
6X
0.23
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON89478E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP6, 1.17X0.77
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON89478E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. BASS.
DATE
28 MAY 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. O
Case Outline Number:
567HJ