567HJ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP6, 1.17x0.77
CASE 567HJ
ISSUE O
SCALE 4:1
A B
D
È
PIN A1
REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
DIM
A
A1
b
D
E
e
TOP VIEW
0.10 C
0.05 C
A1
SIDE VIEW
NOTE 3
b
0.05 C A B
0.03 C
C
SEATING
PLANE
e
C
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
B
e
A
1
XXMG
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
e/2
6X
MILLIMETERS
MIN
MAX
−−−
0.50
0.13
0.17
0.21
0.25
0.77 BSC
1.17 BSC
0.40 BSC
GENERIC
MARKING DIAGRAM*
A
6X
DATE 28 MAY 2013
2
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
0.40
PITCH
A1
0.40
PITCH
6X
0.23
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON89478E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP6, 1.17X0.77
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON89478E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. BASS.
DATE
28 MAY 2013
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. O
Case Outline Number:
567HJ
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