Data Sheet

UBA2017/UBA2017A
600 V fluorescent lamp driver with linear dimming function
Rev. 2 — 15 May 2012
Product data sheet
1. General description
The UBA2017/UBA2017A are high-voltage Integrated Circuits (IC) intended to drive
fluorescent lamps with filaments such as Tube Lamps (TL) and Compact Fluorescent
Lamps (CFL) in general lighting applications. The IC comprises a fluorescent lamp control
module, half-bridge driver and several protection mechanisms. The IC drives fluorescent
lamps using a half-bridge circuit made of two MOSFETs with a supply voltage of up to
600 V.
The UBA2017/UBA2017A are supplied by a start-up bleeder resistor and a dV/dt supply
from the half-bridge circuit, or any other auxiliary supply derived from the half-bridge. The
supply current of the IC is low. An internal clamp limits the supply voltage.
2. Features and benefits
 Half-bridge driver features:
 Integrated level-shifter for the high-side driver of the half-bridge
 Integrated bootstrap diode for the high-side driver supply of the half-bridge
 Independent non-overlap time
 Fluorescent lamp controller features:
 Linear dimming (UBA2017A only)
 EOL (End-Of-Life) detection (both symmetrical and asymmetrical)
 Adjustable preheat time
 Adjustable preheat current
 Adjustable fixed frequency preheat
 Lamp ignition failure detection
 Ignition detection of all lamps at multiple lamps with separate resonant tanks
 Second ignition attempt if first failed
 Constant output power independent of mains voltage variations
 Automatic restart after changing lamps
 Lamp current control
 Enable input
 Protection
 Hard switching/capacitive mode protection
 Half-bridge overcurrent (coil saturation) protection
 Lamp overvoltage (lamp removal) protection
 Temperature protection
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
3. Applications
 Intended for fluorescent lamp ballasts with either a UBA2017A dimmable or a
UBA2017 fixed output for AC mains voltages up to 390 V.
4. Ordering information
Table 1.
Ordering information
Type number
UBA2017T/N1
Package
Name
Description
Version
SO16
plastic small package outline package; 16 leads; body width 3.9 mm
SOT109-1
DIP16
plastic dual in-line package; 16 leads; (300 mil)
SOT38-4
UBA2017AT/N1
UBA2017P/N1
UBA2017AP/N1
Table 2.
Functional selection
Type
PFC
Dimmable
UBA2017P/T
no[1]
no
yes
UBA2017AP/AT
no[1]
yes
yes
[1]
Fixed frequency preheat
If you require PFC functionality, see the UBA2016A, UBA2015A and UBA2015.
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
2 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
5. Block diagram
7(03(5$785(
6(16(
4
6
ƒ&
5
ƒ&
6833/<
$1'
5()(5(1&(6
,5()
9''
P$
9
UHVWDUW
)6+%
(2/ 25
89/2
RQ!9
RII9
HQGRIOLIH
/(9(/
6+,)7(5
+,*+6,'(
*$7('5,9(
*++%
6++%
[
+$5'
6:,7&+,1*
&$3$&,7,9(
02'('(7(&7,21
—$
29H[WUD
9
9
121
29(5/$3
29
/2:6,'(
*$7('5,9(
9
)/825(6&(17
/$03
&21752//(5
LJQ
9)% 9
9)%ORZ
P9
9''
2&SUHKHDW
9
—$
6/+%
2&EXUQ
9
—$
*/+%
/$03
21
'(7(&7,21
7,0(5
),;('
)5(48(1&<
35(+($7
9&2
&37
3+(1
—$
9
,)% RYHUFXUUHQW
9
9
—$
—$
Nȍ
QRWEXUQ
9
9
9
—$
9
*1' —$
9
',0
&,)%
&)
DDD
(1) Pin 10 is not connected in the UBA2017P/T.
Fig 1.
Block diagram UBA2017
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
3 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
6. Pinning information
6.1 Pinning
SLHB
1
16 GHHB
SLHB
1
16 GHHB
IFB
2
15 FSHB
IFB
2
15 FSHB
EOL
3
14 SHHB
EOL
3
14 SHHB
VFB
4
13 GLHB
VFB
4
IREF
5
12 VDD
IREF
5
12 VDD
CIFB
6
11 GND
CIFB
6
11 GND
CF
7
10 DIM or n.c.
CF
7
10 DIM or n.c.
CPT
8
CPT
8
UBA2017
9 PH/EN
UBA2017
aaa-001477
Fig 2.
13 GLHB
9 PH/EN
aaa-001478
UBA2017T: pin 10 is n.c. (not connected).
UBA2017P: pin 10 is n.c. (not connected).
UBA2017AT: pin 10 is input pin DIM.
UBA2017AP: pin 10 is input pin DIM.
Pin configuration UBA2017T/UBA2017AT
(SO16)
Fig 3.
Pin configuration UBA2017P/UBA2017AP
(DIP16)
6.2 Pin description
Table 3.
Pin description
Symbol Pin
Description
UBA2017AT/AP UBA2017P/T
UBA2017
Product data sheet
SLHB
1
1
half-bridge (HB) low-side switch current sense input
IFB
2
2
lamp current feedback input
EOL
3
3
end-of-life sensing input
VFB
4
4
lamp voltage feedback input
IREF
5
5
reference current setting
CIFB
6
6
lamp current feedback compensation
CF
7
7
high frequency (HF) oscillator timing capacitor
CPT
8
8
preheat and fault timing capacitor
PH/EN
9
9
preheat frequency setting combined with enable
DIM
10
-
dimming function input (UBA2017AT/AP)
n.c.
-
10
UBA2017P/T
GND
11
11
ground
VDD
12
12
supply
GLHB
13
13
HB low-side switch gate driver output
SHHB
14
14
HB high-side source connection
FSHB
15
15
HB floating supply connection
GHHB
16
16
HB high-side switch gate driver output
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
4 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
7. Functional description
7.1 Introduction
The UBA2017/UBA2017A is an integrated circuit for electronically ballasted fluorescent
lamps. It provides a half-bridge controller/driver with all the necessary functions for correct
preheat, ignition and on-state operation of the lamp. Several protection mechanisms are
incorporated to ensure the safe operation of the fluorescent lamp or a shutdown of the
complete ballast under any abnormal operating conditions or lamp failure.
7.2 Half-bridge driver
The IC incorporates drivers for the half-bridge switches and all related circuits such as
non-overlap, high-voltage level shifter, bootstrap circuit for the floating supply and hard
switching and capacitive mode detection.
The UBA2017/UBA2017A is designed to drive a half-bridge inverter with an inductive
load. The load consists typically of an inductor with a resonant capacitor and a TL or CFL.
A basic half-bridge application circuit driving a TL is shown in Figure 4 which also shows a
typical IC supply configuration with a start-up bleeder resistor and a dV/dt supply.
VBUS
VDD
GHHB
SHHB
UBA2017
UBA2017A
FSHB
GLHB
GND
aaa-001479
Fig 4.
UBA2017
Product data sheet
Basic half-bridge and IC supply connection diagram
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
5 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
7.2.1 VDD supply
The UBA2017/UBA2017A is intended to be supplied by a start-up bleeder resistor
connected between the bus voltage VBUS and VDD and a dV/dt supply from the
half-bridge point at pin SHHB.
The IC starts up when the voltage at pin VDD rises above start-up voltage Vstartup(VDD) and
locks out (stops oscillating) when the voltage at pin VDD drops below stop voltage
Vstop(VDD). The hysteresis between the start and stop levels allows the IC to be supplied
by a buffer capacitor until the dV/dt supply is settled.
The UBA2017/UBA2017A has an internal VDD clamp. This is an internal active Zener (or
shunt regulator) that limits the voltage on the VDD supply pin to clamp voltage Vclamp(VDD).
No external Zener diode is needed in the dV/dt supply circuit if the maximum current of the
dV/dt supply minus the current consumption of the IC (mainly determined by the gate
drivers’ load) is below Iclamp(VDD).
7.2.2 Low- and high-side drivers
The low- and high-side drivers are identical. The output of each driver is connected to the
equivalent gate of an external power MOSFET. The high-side driver is supplied by the
bootstrap capacitor, which is charged from the VDD supply voltage via an internal diode
when the low-side power MOSFET is on. The low-side driver is directly supplied by the
VDD supply voltage.
7.2.3 Non-overlap
During each transition between the two states GLHB HIGH/GHHB LOW and
GLHB LOW/GHHB HIGH, GLHB and GHHB are both LOW for a fixed non-overlap time
tno to allow the half-bridge point to be charged or discharged by the load current
(assuming the load always has an inductive behavior), and enabling zero voltage
switching. See Figure 5.
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
6 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
tno
VCF
time
0
VSHHB + VVDD
VGHHB
VSHHB
time
VVDD
VGLHB
time
0
VBUS
VSHHB
time
0
001aam537
Fig 5.
Oscillator, driver and half-bridge voltages
7.3 Fluorescent lamp control
The IC incorporates all the regulation and control needed for the fluorescent lamp(s), such
as filament preheat, ignition frequency sweep, lamp voltage limitation, lamp current
control, dimming, end-of-life detection, overcurrent protection and hard switching limiting.
In the UBA2017/UBA2017A, seven different operating states can be distinguished. In
each state the IC acts in a specific way, as described in the next paragraphs. Figure 6
shows the possible transitions between the states with their conditions.
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
7 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
Power on
reset OR disable
GLHB AND
(reset OR disable)
Supply voltage definitions
reset = (VDD < Vrst(VDD))
restart = (VDD < Vrestart(VDD))
VDD low = (VDD < Vstop(VDD))
VDD high = (VDD > Vstartup(VDD))
Reset state
GLHB low
stop latch and ignition
attempt counter are reset
reset NOT(reset)
Stop state
GLHB low
GLHB AND
(VDD low
OR overtemp)
Standby state
GLHB high
Auto-restart
state
GLHB low
restart
Non oscillating states
(IC is off)
Low power consumption
GHHB and GPFC low
VDD high AND
enable AND
NOT(overtemp)
Oscillating states
(IC is on)
fast fault
Preheat state
EOL disabled
frequency is decreased
until HB preheat current or
the set value for the
preheat frequency
is reached
fault timeout
AND
(ignition attempts = 1)
Preheat time completed
fault timeout
AND
(ignition attempts = 2)
Ignition state
EOL disabled
frequency is decreased
as long as no lamp overvoltage
or HB overcurrent
is detected
f low OR
ignition detected
Burn state
ignition attempt counter is reset
fault timeout
EOL protection enabled
Frequency determined by lamp
current regulation loop
fault definitions:
overtemp = {set} T > Tth(act)otp
{reset} T < Tth(rel)otp
fast fault = over voltage extra OR
capacitive mode OR
(over current lamp AND f high) OR
coil saturation(1)
slow fault = CPT low OR
VFB low OR
over voltage OR
(over voltage end of life AND
NOT (deep dimming))(1) OR
coil saturation OR
hardswitching OR
asymetrical end of life(1)
the fault timer is started by slow fault and runs as
long as slow fault continues. NOT(slow fault) resets
the fault timer.
Other definitions:
enable = (VFFPRHT > Vth(en)(FFPRHT))
disable = NOT(enable)
ignition detected = (VIFB > Vth(lod)(IFB)) AND (VVFB < Vth(lod)(VFB))
(1)(BURN state only)
aaa-001480
Fig 6.
State diagram
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
8 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
7.3.1 Reset
When voltage on pin VDD is below the reset voltage Vrst(VDD), both gates of the half-bridge
driver are LOW. All internal latches are reset. When voltage on pin VDD rises above
Vrst(VDD), the IC enters the STANDBY state.
7.3.2 Standby
In the STANDBY state, the low-side gate driver is on (GLHB is HIGH). The floating supply
capacitor CFSHB is then charged. When the VDD voltage rises above Vstartup(VDD), the
Preheat state is entered.
7.3.3 Oscillating states (Preheat, Ignition and Burn)
The highest and lowest oscillation frequency can be set with capacitor CCF connected to
the CF pin. The oscillator is implemented in such a way that the lowest frequency fsw(low) is
the most accurate. In any oscillating state (Preheat, Ignition or Burn), when VDD voltage
drops below Vstop(VDD) or overtemperature is detected, the half-bridge stops oscillation
when GLHB is HIGH and enters the STANDBY state.
7.3.4 Preheat
The oscillating frequency starts at fsw(high) (see Figure 7 “Resonance curve application”
point A) and remains at that frequency until the voltages at pins CPT and VFB settle
above their pin short protection levels (VVFB > Vth(osp)(VFB) and VCPT > Vth(scp)(CPT)). The
half-bridge current or frequency is regulated when in the preheat state; see Figure 7
“Resonance curve application” point B.
Pin CIFB supplies a current Ich(CIFB) to the externally connected compensation network on
this pin and its voltage rises. This causes the switching frequency to decrease (pin CIFB is
the input for the voltage controlled oscillator). This causes an increase in half-bridge
current (assuming the switching frequency is higher than the load resonance frequency).
This current is measured via pin SLHB using a resistor connected between the source of
the low-side switch and ground. When the voltage on pin SLHB rises above the preheat
current control voltage Vcrtl(ph)SLHB, discharge current Idch(CIFB) replaces the charge current
to pin CIFB and the frequency is increased. When the voltage drops below Vth(ocp)SLHB,
current Ich(CIFB) from pin CIFB causes the frequency to decrease.
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
9 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
(1)V
lamp
(1)
(2)I
lamp
(2)
C
Vign
E
D
Ilamp(nominal)
B
A
H
fsw(reg)
fsw(low)
fsw(dim)
fsw(ign)
fsw(ph)
f
fsw(high)
001aan202
(1) Lamp voltage when lamp is off (not ignited yet).
(2) Lamp current when lamp is on.
Fig 7.
Resonance curve application
The preheat frequency can also be regulated via pin PH/EN. During preheat, the output
voltage of pin PH/EN is Vph(PH/EN). The output current that an external resistor Rext(PH/EN)
connected to this pin sinks is compared to 4⁄5 of the output current of the VCO (the current
at pin CF with no fault condition present and the capacitor at that pin being charged minus
the same current at fsw(low)). As long as the output current of the VCO is bigger the
frequency is being decreased (by charging pin CIFB with Ich(CIFB)). If the current through
the external resistor is larger, the frequency is increased (by discharging pin CIFB with
Idch(CIFB)).
Current and fixed frequency control mechanisms are active at the same time. For fixed
frequency preheat using pin PH/EN, the half-bridge current sense resistor connected to
pin SLHB should be small enough not the activate the current control mechanism. If
current controlled preheat is used, pin PH/EN should be left open (except for the open
collector or open drain that drives the enable function). The preheat time tto(ph) can be set
with capacitor CCPT on pin CPT.
7.3.5 Ignition
After the Preheat state the IC enters the Ignition state. During the Ignition state, the
switching frequency is decreased by charging pin CIFB with Ich(CIFB). This will result in
increasing lamp voltage until the lamp ignites (see point C in Figure 7 “Resonance curve
application”) and lamp-on or fsw(low) (lowest frequency) is detected. Lamp-on detection
occurs when the average absolute voltage on pin IFB is above lamp-on detection
threshold Vth(lod)(IFB) and the voltage on pin VFB is more than 50 % of each clock cycle
below the lamp-on detection threshold Vth(lod)(VFB) and after a delay td(lod).
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
10 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
If either saturation or overvoltage is triggered, it overrules the frequency sweep-down and
hold the frequency at the border where the fault appeared and start the fault timer. When
the fault time-out tto(fault) is reached the IC enters the Auto-restart state if it was the first
ignition attempt, otherwise it enters the Stop state; see Figure 6 “State diagram”.
7.3.6 Auto-restart
The Auto-restart state is entered after a fault time-out in the Ignition state during the first
ignition attempt. See Figure 6 “State diagram”. When the IC is in the Auto-restart state, it
draws supply current Irestart(VDD). This slowly discharges the buffer capacitor on pin VDD
until the voltage on this pin drops below Vrestart(VDD). The IC then enters the Standby state.
Here the VDD capacitor is charged again to start a second ignition attempt. The bleeder
current must be between standby current Istb(VDD) and Irestart(VDD). A time delay can be set
between the two ignition attempts with the capacitor at pin VDD to reduce stress on the
HB components.
7.3.7 Burn
In the Burn state, the lamp current regulation and all protection circuits are active.
7.3.7.1
Lamp current control and dimming
The AC lamp current is sensed by an external resistor connected to pin IFB. The resulting
AC voltage on pin IFB is internally Double-Side Rectified (DSR), and compared to a
reference level by an OTA. This reference level is determined by the internal reference
regulation level Vreg(ref) and the voltage on the DIM input (UBA2017A only), as shown in
Figure 8 “Lamp current control”.
Definition: the regulation voltage on pin IFB (Vreg(IFB)) is the level seen from outside the IC
to which the IC tries to regulate the average absolute voltage on pin IFB.
If the DIM input is not present or not connected or VDIM > Vreg(ref) then Vreg(IFB) is
Vreg(ref) + non-idealities from the OTA and the DSR else Vreg(IFB) = VDIM + non-idealities
from OTA and DSR.
The DIM input controls the lamp current set point (UBA2017A only). The DIM input level is
internally clamped to Vreg(ref). The lowest possible DIM input level is set by the bias current
on pin DIM Ibias(DIM) and the external resistance on the pin. If no dimming is required, pin
DIM can be left open or connected via a capacitor to ground. The internal current source
Ibias(DIM) will then charge the pin until it is internally clamped to Vreg(ref).
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
11 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
DOUBLE SIDE
RECTIFIER
Ilamp
OTA
VDD
gm(IFB)
CIFB
IFB
Cext(CIFB)
Rext(IFB)
Ri(IFB)
VOLTAGE
CONTROLLED
OSCILLATOR
VDD
VDD
Ibias(DIM)
DIM
Vreg(ref)
VDD
Ich(low)(CF)
VOLTAGE
CONTROLLED
CURRENT SOURCE
Vhigh(CF)
/2
CF
clock
aaa-001481
Cext(CF)
DIM input is only present in the UBA2017A
Fig 8.
Lamp current control
The output of the OTA is connected to pin CIFB. The external capacitor Cext(CIFB) is
charged and discharged according to the voltage on the OTA inputs and the
transconductance of the OTA, gm(IFB) according to the formula:
ICIFB = gm(IFB) × (VIFB − Vreg(IFB).
More components can be connected to pin CIFB to improve the response time and
stability of the lamp current control loop.
Pin CIFB is connected to the input of the VCO (Voltage Controlled Oscillator) that
determines the frequency of the IC. Pin CIFB voltage is inversely proportional to the
switching frequency. When the load is inductive, an increase in frequency decreases the
lamp current, and a decrease in frequency increases the lamp current. With the closed
loop for the lamp current in place, the IC will regulate to the required frequency for the
desired lamp current. So when the IC enters the Burn state it will go to either point D or H
shown in Figure 7 depending on the DIM input voltage or Vreg(ref).
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
12 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
However, the switching frequency can never go below fsw(low). If the regulation level is not
reached at fsw(low) the IC will stay at fsw(low) (point E in Figure 7).
7.3.7.2
Operation without lamp current control
To operate the lamp without current control the lamp current sense, pin IFB must be
connected to ground. The lamp now operates at the lowest frequency fsw(low) (point E in
Figure 7). Dimming is not supported in this case.
7.3.8 Stop state
When in the Stop state, the IC is off and all driver outputs are low. The IC will remain in the
Stop state until the voltage on pin VDD drops below Vrst(VDD) or it is disabled, in which
case it will go to the Reset state.
The sequence of events for entering the Stop state are shown in Figure 6 “State diagram”.
7.4 Enable and Disable
The enable function works via pin PH/EN. If this pin is pulled below the enable voltage
Ven(PH/EN), the IC goes into the Standby state (immediately if GLHB is high, otherwise it
will continue its normal clock cycle until GLHB is high and then go to the Standby state).
The external interface with pin PH/EN for the enable signal should be an open collector or
open drain type driver. To enable the IC, the open collector or open drain should be open
(high ohmic) to not disturb the fixed frequency preheat setting function of pin PH/EN.
In the Restart, Standby and Stop states, the standby pull-up current source Ipu(stb)(PH/EN)
will pull the voltage at pin PH/EN above Ven(PH/EN). In the Preheat, Ignition and Burn
states, the normal output voltage driver of the IC will pull the pin high. In those cases, the
external driver must draw a current Iclamp(PH/EN) from the pin to disable the IC.
7.5 Protection circuits
7.5.1 End-of-life rectifying lamp detection
If voltage on pin EOL is below low threshold voltage Vth(low)EOL or above Vth(high)EOL, the
fault timer will start.
A programmable end-of-life window is achieved by the internal bias current sink Ibias(EOL).
The effective relative size of the EOL window will decrease in line with the increasing
series resistance connected to pin EOL.
The end-of-life lamp rectifying detection is only active during the Burn state.
7.5.2 End-of-life overvoltage detection
This protection is intended to protect against symmetrical lamp aging. When in the Burn
state, the voltage on pin VFB exceeds the overvoltage end-of-life threshold voltage
Vth(oveol)(VFB) by more than 50 % of each switching cycle the fault timer will start.
Vth(oveol)(VFB) is related to the regulation voltage on pin IFB Vreg(IFB) that itself is dependent
on the voltage on pin DIM (see Section 7.3.7.1 “Lamp current control and dimming”)
according to the formula V th ( oveol ) ( VFB ) = a – b × V reg ( IFB ) :
Parameters a and b can be calculated from the Vth(oveol)(VFB) values given in Table 6.
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
13 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
The end-of-life overvoltage protection is only active during the Burn state and (for
UBA2017A) if the voltage at pin DIM is above the overvoltage end-of-life enable voltage
Ven(oveol)(DIM).
7.5.3 Capacitive mode detection
Under all normal operating conditions, the half-bridge switching frequency should be
higher than the load resonance frequency. The load then shows an inductive behavior in
that the load current Iload lags behind the half-bridge voltage VSHHB. If the amplitude and
the phase difference are large enough, the load current will charge any capacitance on pin
SHHB during the non-overlap time tno(LH), and discharge it during the other non-overlap
time tno(HL). As a result, the voltage across the switches is almost zero at the moment they
turn on. This is called zero voltage switching; see Figure 9 “Switching”. Zero voltage
switching provides the highest switching efficiency and the least Electromagnetic
Emission (EME).
Capacitive mode switching can occur when, due to any abnormal condition, the switching
frequency is below the load resonance frequency. This can happen when the lamp is
removed. The load current will then keep the backgate diode of the switch that is switched
off conducting during the non-overlap time, and if the other switch is turned on, a sudden
step of the half-bridge voltage to the other supply rail takes place (which causes huge
current spikes). Also cross conduction between the switches can occur during the reverse
recovery of the backgate diode. These effects put huge stress on the power switches.
To protect against capacitive mode switching, the IC monitors pin SHHB during the
non-overlap time tno(LH) between switching off the low-side switch and switching on of the
high-side switch. If a rise of VSHHB (dVSHHB/dt > Vth(cm)(SHHB)) during tno(LH) is not
detected, the IC will conclude that capacitive mode switching is occurring during the next
full cycle. If capacitive mode is detected longer than the fault activation delay time tdet(fault)
then the IC will enter the Stop state.
Capacitive mode detection is active in all oscillating states.
During ignition, a situation may occur where the amplitude of the load current is high and
the half-bridge is at the boundary of capacitive mode switching; see Figure 9 “Switching”.
The load current crosses zero during the non-overlap time. If the amplitude of the load
current is large enough, the IC might not detect capacitive mode because VSHHB did rise
before going down again. The backgate diode of one switch is conducting again when the
other switch switches on. Since this can only happen if the load current crosses zero
during the non-overlap time, the momentary value of the load current at the end of the
non-overlap time will be not so significant, and is not likely to damage the switches.
Depending on the topology used, the DC blocking capacitor might be charged via the
lamp(s) at the moment the lamp(s) ignite. This will cause a temporary DC current addition
to the load current that might be interpreted by the IC as capacitive mode switching. If this
happens, the DC blocking capacitor must be reduced or pre-charged.
7.5.4 Hard switching protection
The hard switching level Vstep(SHHB) step is measured via pin SHHB. The hard switching
level is determined by measuring the voltage step on pin SHHB on the rising edge of pin
GHHB; see Figure 9 “Switching”. When Vstep(SHHB) is above the hard switching protection
threshold voltage on pin SHHB (Vth(hswp)SHHB), the fault timer is activated.
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
14 of 29
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
UBA2017
Product data sheet
VFSHB
HV
VGHHB
VSHHB
GHHB
tno(LH)
high side
switch
tno(HL)
VDD
SHHB
VGLHB
Iload
GND
SENSE
GLHB
Vstep(SHHB)
low side
switch
VSHHB
GND
GND
hard switching (due to small phase
difference between VSHHB and iload)
hard switching (due to
small amplitude of iload)
Iload
0
boundary of capacitive
mode switching
capacitive mode switching
15 of 29
© NXP B.V. 2012. All rights reserved.
001aan209
Fig 9.
Switching
UBA2017/UBA2017A
zero voltage switching
600 V fluorescent lamp driver with linear dimming function
Rev. 2 — 15 May 2012
All information provided in this document is subject to legal disclaimers.
VHV
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
7.5.5 Coil saturation protection
When the peak voltage on pin SLHB exceeds saturation threshold voltage Vth(sat)SLHB, an
additional current Iadd(CF) is sourced to pin CF to shorten the running oscillator cycle. In
the Ignition state, the fault timer is started and a discharge current Idch(CIFB) is drawn from
pin CIFB during the next cycle to increase the switching frequency.
In the Burn state, the IC will go to the Stop state if coil saturation is detected longer than
the saturation detection delay time td(det)sat.
Current Ibias(SLHB) is sourced to pin SLHB which will force the controller into coil saturation
protection if pin SLHB is left open.
7.5.6 Lamp overcurrent protection
If voltage on pin IFB exceeds the overcurrent detection threshold voltage Vth(ocd)(IFB), and
the oscillator is running at fsw(high), an overcurrent is detected and the IC will immediately
enter the Stop state.
7.5.7 Lamp overvoltage protection
When the peak voltage on pin VFB exceeds Vth(ov)(VFB), the fault timer is started and a
discharge current Idch(CIFB) is drawn from pin CIFB during the next cycle to increase the
switching frequency.
When VVFB > Vth(ovextra)(VFB) for longer than the fault activation delay time tdet(fault) then the
IC will enter the Stop state.
7.5.8 Lamp removal detection
Removing the lamp from applications that have the resonant capacitor connected via the
lamp filaments, will result in hard switching because current cannot flow through the
ballast inductor.
If hard switching is detected during the Ignition or Burn state, the fault timer will be started.
For applications with the resonant capacitor connected directly to the ballast inductor,
capacitive mode, coil saturation or over voltage will be detected. Capacitive mode is
activated if the switching frequency ends up below the resonance frequency due to
removal of the lamp. If the switching frequency is near or above the resonance frequency,
the lamp (or rather the lamp socket) voltage and half-bridge current will be very high due
to the unloaded resonant circuit (lamp inductor and lamp capacitor) which activates the
coil saturation protection or the overvoltage protection.
7.5.9 Temperature protection
When the temperature is above Tth(act)otp and GLHB is high, the IC enters the Standby
state. The IC cannot exit the Standby state until the temperature drops below Tth(rel)otp.
7.5.10 Fault timer
Any fault that starts the fault timer must be detected for longer than the fault activation
delay time td(act)fault to start the timer. When the timer is started, the capacitor at pin CPT is
alternately being charged and discharged. After 8 charging and 7 discharging cycles the
fault time-out period tto(fault) is reached and the IC enters either the Stop state or the
Auto-restart state, depending on the fault detected, the current state of the timer and the
number of ignition attempts; see Figure 6 “State diagram”.
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
16 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
If the fault that started the timer is no longer detected for a period longer than the fault
release delay time td(rel)fault, the fault timer will be reset and at any new occurrence of the
fault, the timer will start from zero.
Faults which activate the fault timer are shown as SlowFault in Figure 6 “State diagram”.
The fault timer uses the same pin (CPT) to set the time with an external capacitor Cext(CPT)
as the preheat timer. The ratio between the preheat time-out time tto(ph) and the fault
time-out time tto(fault) can be changed by adding an external series resistor Rs(ext)(CPT) or
an external parallel resistor Rp(ext)(CPT) to the external capacitor Cext(CPT); see Figure 10
“CPT connections”.
CPT
CPT
CPT
Rs(ext)(CPT)
Cext(CPT)
Rp(ext)(CPT)
Cext(CPT)
Cext(CPT)
smaller ratio
tto(ph)/tto(fault)
default ratio
tto(ph)/tto(fault)
larger ratio
tto(ph)/tto(fault)
001aan210
Fig 10. CPT connections
The fault timer incorporates a protection that ensures safe operation conditions if the CPT
pin voltage is below Vth(scp)(CPT) (shorted to GND) by holding the oscillation frequency at
fsw(high).
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
17 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to signal ground (GND
pin 15); current flow into the IC is positive.
Symbol
Parameter
Conditions
Min
Max
Unit
30
36
kΩ
−4
+4
V/ns
General
Rref(IREF)
reference resistance on
pin IREF
SR
slew rate
pins FSHB, GHHB and SHHB
Tamb
ambient temperature
−40
+125
°C
Tj
junction temperature
−40
+150
°C
Tstg
storage temperature
−55
+150
°C
continuous
0
570
V
t < 0.5 s
0
630
V
with respect to VSHHB
−0.3
+14
V
with respect to VSHHB
−0.3
+14
V
Voltage
VFSHB
voltage on pin FSHB
VGHHB
voltage on pin GHHB
VGLHB
voltage on pin GLHB
−0.3
+14
V
VVDD
voltage on pin VDD
−0.3
+14
V
VEOL
voltage on pin EOL
−9
+9
V
VSLHB
voltage on pin SLHB
−9
+9
V
VIFB
voltage on pin IFB
−5
+5
V
VDIM
voltage on pin DIM
−0.1
+5
V
VPH/EN
voltage on pin PH/EN
−0.1
+5
V
VVFB
voltage on pin VFB
−0.1
+5
V
IVDD
current on pin VDD
-
50
mA
IEOL
current on pin EOL
−1
+1
mA
ISLHB
current on pin SLHB
−1
+1
mA
JEDEC Class 2 for pins: SLHB, IFB, EOL, CIFB,
CPT, IREF, VFB, CF, DIM, BOOST, PH/EN, FBPFC,
COMPPFC, AUXPFC, GPFC, VDD and GLHB
−2
+2
kV
JEDEC Class 1C for pins: GHHB, FSHB and SHHB
−1
+1
kV
−500
+500
V
−100
+100
mA
Current
ElectroStatic Discharge (ESD)
VESD
electrostatic discharge
voltage
Human Body Model (HBM):
Charge Device Model (CDM):
JEDEC Class 3 for all pins
Latch-up
latch-up current
Ilu
[1]
[1]
Positive and negative latch-up currents tested at Tj = 150 °C by discharging a 22 μF capacitor though a 50 Ω series resistor with a
350 μH series inductor. Latch-up current values are in accordance with the general quality specification.
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
18 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
9. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction to
ambient
in free air; mounted on a single-sided PCB;
SO16 package
120
K/W
in free air; mounted on a single-sided PCB;
DIP16 package
90
K/W
10. Characteristics
Table 6.
Characteristics
Tamb = 25 °C; settings according to default setting[1]; all voltages referenced to GND; current flow into the IC is positive;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
leakage current
VFSHB = 630 V;
VGHHB = 630 V;
VSHHB = 630 V; VVDD = 0 V
-
-
2
μA
High voltage
Ileak
Start-up
Vstartup(VDD)
start-up voltage on pin VDD
11.9
12.4
12.9
V
Vstop(VDD)
stop voltage on pin VDD
9.6
10.0
10.4
V
Vhys(VDD)
hysteresis voltage on pin VDD
2.1
2.4
2.7
V
Istb(VDD)
standby current on pin VDD
VVDD = 11.5 V
0.2
0.24
0.28
mA
Ipu(PH/EN)
pull-up current on pin PH/EN
Standby or Stop state;
VPH/EN = 0.25 V
7.7
9
10.3
μA
Vrst(VDD)
reset voltage on pin VDD
3.6
4.2
4.8
V
Vrestart(VDD)
restart voltage on pin VDD
6.2
6.5
6.8
V
Irestart(VDD)
restart current on pin VDD
VVDD = 9 V
0.85
1.1
1.35
mA
Vclamp(VDD)
clamp voltage on pin VDD
IC off; IVDD = 0.33 mA
13.0
13.4
13.8
V
Iclamp(VDD)
clamp current on pin VDD
IC off; VVDD = 14.0 V
25
45
-
mA
IVDD
supply current
1.2
1.7
2.2
mA
Rext(PH/EN)
external resistance on pin PH/EN
38.6
-
-
kΩ
tto(ph)
preheat time-out time
CCPT = 100 nF
0.8
0.94
1.08
s
during preheat or ignition state
HB preheat
VO(PH/EN)
output voltage on pin PH/EN
1.78
1.84
1.9
V
Vctrl(ph)SLHB
overcurrent protection threshold voltage preheat
on pin SLHB
0.44
0.48
0.52
V
Ich(CIFB)
charge current on pin CIFB
no fault detected; Preheat and
Ignition states only;
VCIFB = 1.5 V
−10.3 −9.0
−7.7
μA
Idch(CIFB)
discharge current on pin CIFB
preheat overcurrent detected;
VCIFB = 1.5 V
7.7
10.3
μA
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
9.0
© NXP B.V. 2012. All rights reserved.
19 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
Table 6.
Characteristics …continued
Tamb = 25 °C; settings according to default setting[1]; all voltages referenced to GND; current flow into the IC is positive;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fsw(ph)
preheat switching frequency
Rext(PH/EN) = 40 kΩ;
Cext(CF) = 200 pF
93
97.7
102.4 kHz
Rext(PH/EN) = 100 kΩ;
Cext(CF) = 200 pF
62
66
70
kHz
HB lamp ignition
fsw(high)/fsw(low)
high switching frequency to low
switching frequency ratio
2.2
2.4
2.6
Vfsw(low)(CIFB)
low switching frequency voltage on pin
CIFB
-
3.0
-
V
Vth(lod)(IFB)
lamp on detection threshold voltage on
pin IFB
1
1.11
1.22
V
Vth(lod)(VFB)
lamp on detection threshold voltage on
pin VFB
0.9
1.0
1.1
V
V(Vreg−Vth(lod))
regulation voltage to lamp-on-detect
threshold voltage difference
40
160
250
mV
td(lod)
lamp on detection delay time
2
3
4
ms
41
43
45
kHz
20
-
80
kHz
-
2.5
-
V
VCIFB = 2 V; VIFB > 0 V
1.22
1.27
1.32
V
VCIFB = 2 V; VDIM = 127 mV;
VIFB > 0 V
77
127
177
mV
VCIFB = 2 V; VIFB < 0 V
−1.34 −1.27 −1.2
V
VCIFB = 2 V; VDIM = 127 mV;
VIFB < 0 V
−197
−127
−57
mV
-
47
-
μA
pin IFB
HB normal operation
fsw(low)
low switching frequency
CCF = 200 pF
Vhigh(CF)
high voltage on pin CF
Vreg(IFB)
regulation voltage on pin IFB
Ich(low)(CF)
low charge current on pin CF
Vi(IFB)
input voltage on pin IFB
VCIFB = 2 V
−3.1
-
+3.1
V
Ri(IFB)
input resistance on pin IFB
VIFB = 1 V
-
60
-
kΩ
Ven(PH/EN)
enable voltage on pin PH/EN
VO(burn)(PH/EN)
burn state output voltage on pin PH/EN
gm(IFB)
IO(clamp)(PH/EN)
VIFB = −1 V
-
30
-
kΩ
0.21
0.25
0.29
V
Burn state
1.21
1.27
1.33
V
IFB transconductance
VCIFB = 2 V
14
16.5
19
μA/V
output current clamp on pin PH/EN
Preheat, Ignition or Burn
states; VPH/EN = 0.2 V
-
-
0.16
mA
Isource(GLHB)
source current on pin GLHB
VGLHB = 4 V
−105
−90
−75
mA
Rsink(GLHB)
sink resistance on pin GLHB
VGLHB = 2 V
13.5
16
18.5
Ω
Isource(GHHB)
source current on pin GHHB
VSHHB = 0 V; VGHHB = 4 V
−105
−90
−75
mA
Rsink(GHHB)
sink resistance on pin GHHB
VSHHB = 0 V; VGHHB = 2 V
13.5
16
18.5
Ω
tno
non-overlap time
1.25
1.5
1.75
μs
VFd(bs)
bootstrap diode forward voltage
1.0
1.5
2.0
V
HB driver
UBA2017
Product data sheet
IFS = 5 mA
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
20 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
Table 6.
Characteristics …continued
Tamb = 25 °C; settings according to default setting[1]; all voltages referenced to GND; current flow into the IC is positive;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Dimming
Ibias(DIM)
bias current on pin DIM
VDIM = 1 V
−28
−26
−24
μA
Ri(DIM)
input resistance on pin DIM
VDIM = 2.5 V
-
30
-
kΩ
2.35
2.5
2.65
V
-
0.3
-
μs
260
340
420
ns
HB protection
Vth(sat)(SLHB)
saturation threshold voltage on pin
SLHB
td(det)sat
saturation detection delay time
tleb(SLHB)
leading edge blanking time on pin SLHB
Iadd(CF)
additional current on pin CF
VSLHB > Vth(sat)SLHB; VCF = 2 V
−107
−96
−85
μA
VSLHB = 2.5 V
Burn state
Ibias(SLHB)
bias current on pin SLHB
−10
−8.5
−7
μA
Vth(ocd)(IFB)
overcurrent detection threshold voltage
on pin IFB
2.8
3.0
3.2
V
Vth(osp)(VFB)
open/short protection threshold voltage
on pin VFB
40
80
120
mV
Vth(ov)(VFB)
overvoltage threshold voltage on pin
VFB
2.4
2.5
2.6
V
tdet(fault)
fault detection time
-
125
-
μs
-
50
-
μs
overvoltage extra or capacitive
mode during burn state
trel(fault)
fault release time
-
1
-
ms
Vth(ovextra)(VFB)
overvoltage extra threshold voltage on
pin VFB
3.2
3.35
3.5
V
Ibias(VFB)
bias current on pin VFB
2.3
2.6
2.9
μA
Vth(low)EOL
low threshold voltage on pin EOL
1
1.1
1.2
V
Vth(high)EOL
high threshold voltage on pin EOL
2
2.25
2.5
V
Ibias(EOL)
bias current on pin EOL
15.4
16.2
17
μA
Vth(oveol)(VFB)
overvoltage end-of-life threshold voltage UBA2017 or UBA2017A pin
on pin VFB
DIM open
0.8
0.88
0.96
V
VEOL = 1.65 V
UBA2017A
VDIM = 1.0 V
0.92
1.0
1.08
V
VDIM = 0.5 V
1.15
1.23
1.31
V
Ven(oveol)(DIM)
overvoltage end-of-life enable voltage
on pin DIM
UBA2017A
0.21
0.25
0.29
V
Vth(hswp)SHHB
hard switching protection threshold
voltage on pin SHHB
fsw = 50 kHz
-
100
-
V
Vth(cm)SHHB
capacitive mode detection threshold
voltage on pin SHHB
tno(LH)
-
30
-
V/μs
Vth(scp)(CPT)
short-circuit protection threshold voltage
on pin CPT
80
120
160
mV
Rpar(ext)(CPT)
external parallel resistance on pin CPT
700
-
-
kΩ
Rs(ext)(CPT)
external series resistance on pin CPT
-
-
40
kΩ
tto(fault)
fault time-out time
0.16
0.19
0.22
s
UBA2017
Product data sheet
CCPT = 100 nF
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
21 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
Table 6.
Characteristics …continued
Tamb = 25 °C; settings according to default setting[1]; all voltages referenced to GND; current flow into the IC is positive;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
tto(ph)/tto(fault)
ratio between preheat time-out time and Rpar(ext) = 700 kΩ; Rs(ext) not
fault time-out time
connected (short)
3
3.4
3.8
Rpar(ext) not connected (open);
Rs(ext) not connected (short)
4.7
5.2
5.7
Rpar(ext) not connected (open);
Rs(ext) = 40 kΩ
9
11.5
14
Unit
Temperature protection
Tth(act)otp
overtemperature protection activation
threshold temperature
120
140
160
°C
Tth(rel)otp
overtemperature protection release
threshold temperature
65
80
95
°C
[1]
Default setting; see Table 7.
Table 7.
UBA2017
Product data sheet
Default settings for characteristics
Pin name
Pin
Application
SLHB
1
connected to ground
IFB
2
connected to ground
EOL
3
connected to a 1.6 V test supply
VFB
4
connected to a 0.5 V test supply
IREF
5
connected via a 33 kΩ resistor to ground
CIFB
6
connected via a 100 nF capacitor to ground
CF
7
connected via a 200 pF C0G (NP0) capacitor to ground
CPT
8
connected via a 100 nF capacitor to ground
DIM
9
connected via a 100 pF capacitor to ground
PH/EN
10
not connected
GND
11
connected to ground
VDD
12
connected to a 13 V test supply
GLHB
13
not connected (open)
SHHB
14
connected to ground
FSHB
15
connected to a 13 V test supply
GHHB
16
not connected (open)
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
22 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
11. Application information
11.1 Connecting the IC in an application
A 33 kΩ resistor must be connected between pin IREF and GND. The tolerance of this
resistor adds to any current related tolerances of the IC, including fsw(low). No other
components can be connected to pin IREF.
The tolerance and temperature dependency of the capacitor connected between pin CF
and GND will add to the tolerance on fsw(low).
A Small decoupling capacitor (about 100 pF) is recommended on pin IFB close to the IC.
Normal sized decoupling capacitors (about 10 nF) are recommended on pins DIM and
EOL.
The capacitors at pins CF, CPT, FSHB and VDD should also be placed close to the IC.
A capacitor between pin CIFB and GND of at least 470 pF is needed for stability of the low
switching frequency.
A capacitor between pin VDD and GND of at least 10 nF is needed for stability of the
internal VDD voltage clamp. However, for reliable operation of the IC a low ESR type of at
least 470 nF is recommended.
A capacitor between pin FSHB and SHHB is needed to supply the high-side driver. The
recommended value for this capacitor is 1⁄5 of the value of the capacitor at VDD.
A series resistor of at least 1 kΩ is recommended on pin SLHB.
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
23 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
12. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
b2
MH
9
16
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches
0.17
0.02
0.13
0.068
0.051
0.021
0.015
0.049
0.033
0.014
0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
SOT38-4
Fig 11. Package outline SOT38-4 (DIP16)
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
24 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.039
0.016
0.028
0.020
inches
0.010 0.057
0.069
0.004 0.049
0.16
0.15
0.05
0.244
0.041
0.228
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 12. Package outline SOT109-1 (SO16)
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
25 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
13. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
UBA2017 v.2
20120515
Product data sheet
-
UBA2017 v.1
UBA2017 v.1
20120330
Preliminary data sheet
-
-
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
26 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
UBA2017
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
27 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
UBA2017
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 15 May 2012
© NXP B.V. 2012. All rights reserved.
28 of 29
UBA2017/UBA2017A
NXP Semiconductors
600 V fluorescent lamp driver with linear dimming function
16. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.3
7.3.1
7.3.2
7.3.3
7.3.4
7.3.5
7.3.6
7.3.7
7.3.7.1
7.3.7.2
7.3.8
7.4
7.5
7.5.1
7.5.2
7.5.3
7.5.4
7.5.5
7.5.6
7.5.7
7.5.8
7.5.9
7.5.10
8
9
10
11
11.1
12
13
14
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Half-bridge driver . . . . . . . . . . . . . . . . . . . . . . . 5
VDD supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Low- and high-side drivers . . . . . . . . . . . . . . . . 6
Non-overlap . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Fluorescent lamp control . . . . . . . . . . . . . . . . . 7
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Standby. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Oscillating states (Preheat, Ignition and Burn) . 9
Preheat . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ignition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Auto-restart . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Burn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Lamp current control and dimming . . . . . . . . . 11
Operation without lamp current control. . . . . . 13
Stop state . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Enable and Disable . . . . . . . . . . . . . . . . . . . . 13
Protection circuits . . . . . . . . . . . . . . . . . . . . . . 13
End-of-life rectifying lamp detection . . . . . . . . 13
End-of-life overvoltage detection . . . . . . . . . . 13
Capacitive mode detection . . . . . . . . . . . . . . . 14
Hard switching protection . . . . . . . . . . . . . . . . 14
Coil saturation protection . . . . . . . . . . . . . . . . 16
Lamp overcurrent protection. . . . . . . . . . . . . . 16
Lamp overvoltage protection . . . . . . . . . . . . . 16
Lamp removal detection . . . . . . . . . . . . . . . . . 16
Temperature protection. . . . . . . . . . . . . . . . . . 16
Fault timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 18
Thermal characteristics . . . . . . . . . . . . . . . . . 19
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 19
Application information. . . . . . . . . . . . . . . . . . 23
Connecting the IC in an application . . . . . . . . 23
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
14.1
14.2
14.3
14.4
15
16
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
27
27
27
28
28
29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 May 2012
Document identifier: UBA2017
Similar pages