Data Sheet

UBA2211
Half-bridge power IC family for CFL lamps
Rev. 3 — 26 August 2011
Product data sheet
1. General description
The UBA2211 family of integrated circuits are a range of high voltage monolithic ICs for
driving Compact Fluorescent Lamps (CFL) in half-bridge configurations. The family is
designed to provide easy integration of lamp loads across a range of burner power and
mains voltages.
2. Features and benefits
2.1 System integration
 Integrated half-bridge power transistors
 UBA2211A: 220 V mains; 13.5 ; 0.9 A maximum ignition current
 UBA2211B: 220 V mains; 9 ; 1.35 A maximum ignition current
 UBA2211C: 220 V mains; 6.6 ; 1.85 A maximum ignition current
 Integrated bootstrap diode
 Integrated high voltage supply
2.2 Burner current
 Adjustable current controlled preheat mode enables the preheat time (tph) to be set
 RMS current control
2.3 Burner lifetime




Current controlled preheat with adjustable preheat time and preheat current
Minimum glow time control to support cold start
Lamp power independent from mains voltage variations
Lamp inductor saturation protection during ignition
2.4 Safety





Saturation Current Protection (SCP)
OverTemperature Protection (OTP)
Capacitive Mode Protection (CMP)
Overpower control
System shutdown when the burner fails to ignite
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
2.5 Ease of use
 Adjustable operating frequency for easy fit with various burners
 Each device in the family incorporates the same controller functionality ensuring easy
power scaling and roll-out across a complete range of CFLs
3. Applications
 Compact Fluorescent Lamps up to 25 W for indoor and outdoor applications
4. Ordering information
Table 1.
Ordering information
Type number
UBA2211AP/N1
Package
Name
Description
Version
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
SO14
plastic small outline package; 14 leads; body width
3.9 mm
SOT108-1
UBA2211BP/N1
UBA2211CP/N1
UBA2211AT/N1
UBA2211BT/N1
UBA2211CT/N1
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
2 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
5. Block diagram
Clamp
COUT1
rectified mains
VDD
startup
UBA2211
LAMP
Llamp
COUT2
CVDD
VDD
DVDT
HV
7(6)
n.p. (5)
6(3)
CDVDT
n.p. (4)
VDD
3(11) FS
VDD
VO(ref)RMS
OTP
Isat
reset
HSPT
DRIVER
LATCH
reset
HSPT
Cbs
set
5(14) OUT
GLOW AND Isat
CONTROL
VDD
SGND
PULSE
Rosc
VOLTAGE
CONTROLLED
OSCILLATOR
:2
RC 8(7)
Cosc
SW 1(8)
HS on
fosc
NON-OVERLAP LS on
TIMER
RSENSE
LSPT
DRIVER
LSPT
VSW
VSW(ph)
CSW
4(12) SENSE
burn state
preheat
RMS control
X2 - VO(ref)RMS2
SGND 2(1, 2, 9, 10, 13)
preheat
VO(ref)RMS
Vref(ph)
001aal990
UBA2211XT (SO14) pin numbers are between brackets.
n.p. in the diagram means not present in UBA2211XP (DIP8 package).
Fig 1.
Block diagram
In the SO14 package, the two diodes which are required for the DVDT supply are
integrated and connected between pins DVDT and PGND.
Mount these diodes externally when using the DIP8 packaged devices because they are
not bonded out.
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
3 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
6. Pinning information
6.1 Pinning
SW
1
SGND
2
8
RC
7
VDD
6
HV
5
OUT
UBA2211P
FS
3
SENSE
4
SGND
1
14 OUT
SGND
2
13 SGND
HV
3
12 SENSE
PGND
4
DVDT
5
VDD
6
RC
7
UBA2211T
014aab092
Fig 2.
11 FS
10 SGND
9
SGND
8
SW
014aab093
Pin configuration for UBA2211XP (SOT97-1)
Fig 3.
Pin configuration for UBA2211XT (SOT108-1)
6.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
UBA2211XP UBA2211XT
UBA2211
Product data sheet
SW
1
8
sweep timing and VCO input
SGND
2
1, 2, 9, 10, 13
signal ground
FS
3
11
high-side floating supply output
SENSE
4
12
voltage sense for preheat and RMS control
OUT
5
14
half-bridge output
HV
6
3
high-voltage supply
VDD
7
6
internal low-voltage supply output
RC
8
7
internal oscillator input
DVDT
n.p.
5
DVDT supply input
PGND
n.p.
4
DVDT supply ground
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Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
4 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
7. Functional description
7.1 Supply voltage
The UBA2211 family is powered using a start-up current source and a DVDT supply.
When the voltage on pin HV increases, the VDD capacitor (CVDD) is charged using the
internal Junction gate Field-Effect Transistor (JFET) current source. The voltage on pin
VDD rises until VDD equals VDD(start). The start-up current source is then disabled. The
half-bridge starts switching causing the charge pump to generate the required VDD supply.
The amount of current flowing towards VDD equals VHV  CDVDT  f where f represents the
momentary frequency. The charge pump consists of an external half-bridge capacitor
(CDVDT). The SO14 package contains two internal diodes with an internal Zener diode.
Mount these diodes externally with the DIP8 packaged devices. The Zener diode ensures
the VDD voltage cannot rise above the maximum VDD rating.
The DVDT supply has its own ground pin (PGND) to prevent large peak currents from
flowing through the external small signal ground pin (SGND).
The start-up current source is enabled when the voltage on pin VDD is below the VDD(stop)
level.
7.2 Start-up state
When the supply voltage on pin VDD increases, the IC enters the start-up state. In the
start-up state the High-Side Power Transistor (HSPT) is switched off and the Low-Side
Power Transistor (LSPT) is switched on. The circuit is reset and the capacitors on the
bootstrap pin FS (Cbs) and the low-voltage supply pin VDD (CVDD) are charged. Pins RC
and SW are switched to ground.
When pin VDD is above VDD(start), the start-up state is exited and the preheat state is
entered. If the voltage on pin VDD falls below VDD(stop), the system returns to the start-up
state.
Remark: If OTP is active, the IC remains in the start-up state indefinitely. The VDD voltage
slowly oscillates between VDD = VDD(stop) and VDD = VDD(start).
7.3 Reset
A DC reset circuit is incorporated in the high-side driver. The high-side transistor is
switched off when the voltage on pin FS is below the high-side lockout voltage.
7.4 Oscillation control
The oscillation frequency is based on the 555-timer function. A self oscillating circuit is
created comprising the external components: resistors Rosc, RSENSE and capacitor Cosc.
Rosc and Cosc determine the nominal oscillating frequency.
An internal divider 0.5  fosc(int) is used to generate the accurate 50 % duty cycle. The
divider sets the bridge frequency at half the oscillator frequency.
The input on pin SW generates the VSW signal and it is used to determine the frequency in
all states except preheat. Signal VSW(ph) is an internally generated signal used to
determine the frequency during the preheat state.
UBA2211
Product data sheet
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Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
5 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
The output voltage of the bridge changes with the falling edge of the signal on pin RC. The
nominal half-bridge frequency is shown in Equation 1:
1
f osc  nom  = ------------------------------------------k osc  R osc  C osc
(1)
The maximum frequency is 2.5  fosc(nom) and is set at VSW. An overview of the oscillator,
internal LSPT and HSPT drive signals and the output is shown in Figure 4.
VRC
0
time (s)
HSPT driver
time (s)
0
LSPT driver
time (s)
0
VOUT
half-bridge
time (s)
0
001aam035
Fig 4.
Oscillator, HSPT/LSPT drivers and output signals
7.5 Preheat state
As described in Section 7.2, the IC enters the preheat state when the voltage on pin
VDD is above VDD(start) and OTP is not active. The sweep current (ISW) charges the
capacitor on pin SW (CSW). The preheat Operational Transconductance Amplifier (OTA) is
enabled and the half-bridge circuit starts oscillating.
The preheat current is monitored using the external RSENSE resistor. The OTA controls the
frequency using output voltage VSW(ph) so that the peak voltage across RSENSE equals the
internal reference voltage (Vref(ph)). The peak voltage is the voltage at the end of the LSPT
conduction time. The preheat peak current through the lamp filament is calculated as
shown in Equation 2:
V ref  ph 
I ph  peak  = ----------------R SENSE
(2)
The value of the external capacitor (CSW) sets the preheat time. Typically, the external
capacitor is calculated as shown in Equation 3. The preheat state ends when the falling
CSW voltage equals VSW(ph); see Figure 4.
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
6 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
t ph
C sw = ----------------------------------1.5 s  100 nF
(3)
If during the preheat time, capacitive mode is sensed and the internal VSW HIGH node is
discharged. The frequency sweep restarts at fmax which is equal to 2.5  fmin.
Vlamp
2.5 × fosc(nom)
fosc(int)
fosc(nom)
VSW HIGH
VSW
VSW
0.6 × VH(RC)
VSW(ph)
0
time (s)
preheat time
ignition
Fig 5.
RMS control
001aal992
Vlamp, fosc(int), VSW and VSW(ph) plotted against time
7.6 Ignition state
The ignition state is entered after the preheat state has finished. The current ISW charges
the capacitor on pin SW (CSW) up to 0.6  VH(RC) which corresponds to the frequency
fosc(nom).
During this frequency sweep, the resonance frequency is reached resulting in the ignition
of the lamp (see Figure 4). The combination of lamp inductor (Llamp) and lamp capacitor
(Clamp) set the resonance frequency. The ignition state ends when the voltage on pin SW
(VSW) reaches 0.6  VH(RC).
7.7 Steady state
In the steady state, the RMS current control is active. This control sets the frequency so
that the RMS voltage across the sense resistor (RSENSE) is equal to VO(ref)RMS. This
ensures the current through the power switches and through the lamp is constant. This
results in constant IC dissipation and temperature at a fixed ambient temperature.
During one oscillator clock cycle, the voltage on pin SENSE (VSENSE) is squared and
converted into a positive current. This discharge current is added to the capacitor CSW.
UBA2211
Product data sheet
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Rev. 3 — 26 August 2011
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7 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
During the other oscillator clock cycle, the input of the squarer is connected to the internal
reference voltage VO(ref)RMS. This voltage is squared and converted into a negative
current. This charge current is also added to capacitor CSW. When both currents are
equal, then Equation 4 is true:
T osc
1
---------- 
T osc

T osc
V
2
SENSE  t DT
0
1
= ---------- 
T osc

V
(4)
2
O  ref RMS DT
0
Where Tosc equals the operating frequency fosc / 1.
Taking the square root of both sides results in Equation 5:
T osc
1
---------- 
T osc

T osc
V
2
SENSE  t DT
0
=
1
---------- 
T osc

V
2
O  ref RMS DT
(5)
0
or
RMS V SENSE = V O  ref RMS = R SENSE  I LSPT
(6)
A constant current flows through the power switches and the lamp which is defined by the
internal reference voltage (VO(ref)RMS) and the external RSENSE resistor.
The RSENSE resistor sets both the preheat current and the RMS half-bridge current. The
ratio between them is fixed. However by adding a resistor in parallel to Csw (see Figure 7)
this ratio can be adjusted. The ratio adjustment is described in more detail in UM10418,
the UBA2211 user manual.
7.8 Non-overlap time
The non-overlap time is defined as the time when both MOSFETs are not conducting. The
non-overlap time is fixed internally and is fixed at the tno value (see Table 5).
7.9 OverTemperature Protection (OTP)
OTP is active in all states. When the die temperature reaches the OTP activation
threshold (Tth(act)otp), the oscillator is stopped and the power switches (LSPT/HSPT) are
set to the start-up state. When the oscillator is stopped, the DVDT supply no longer
generates the supply current IDVDT. Voltage VDD gradually decreases and the start-up
state is entered as described in Section 7.2 on page 5. OTP is reset when the
temperature < Tth(rel)otp.
7.10 Minimum glow time control
If the preheat time is set too short or omitted, the lamp electrodes do not have the correct
temperature in the ignition state. This results in instant light but also in a reduced
switching lifetime because when the electrode temperature is too low electrode sputtering
and damage occur. The minimum glow time control minimizes electrode damage by
ensuring maximum power use during the glow phase to heat the electrodes as quickly as
possible (see Figure 6).
UBA2211
Product data sheet
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Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
8 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
Vlamp
2.5 × fosc(nom)
fosc(int)
fosc(nom)
VSW HIGH
VSW
VSW
0.6 × VH(RC)
VSW(ph)
VSW(ph)
0
preheat time
glow
ignition
time (s)
RMS control
001aal991
Fig 6.
Vlamp, fosc(int), VSW and VSW(ph) plotted against time
Remark: The glow time control is active as tph is too short to preheat the electrodes.
7.11 Saturation Current Protection (SCP)
A critical parameter in the design of the lamp inductor is its saturation current. When the
momentary inductor exceeds its saturation current, the inductance drops significantly. If
the inductance drops significantly, the inductor current and the current flowing through the
high-side and low-side power switches increases rapidly. This increase can cause the
current to exceed the half-bridge power transistors maximum ratings.
Saturation of the lamp inductor is likely to occur in cost-effective and miniaturized CFLs.
The UBA2211 family internally monitors the power transistor current. When this current
exceeds the momentary rating of the internal power transistors, the conduction time is
reduced and the frequency is slowly increased (by discharging CSW). This action causes
the system to balance at the edge of the current rating of the power switches.
7.12 Capacitive Mode Protection (CMP)
When capacitive mode is detected, capacitor CSW is discharged causing the frequency to
increase. The system sets itself to the operating point where capacitive mode switching is
minimized. CMP is active during the ignition state and in the steady state.
If capacitive mode is sensed during the preheat time, the oscillator restarts at fmax (which
is 2.5  fmin). CMP could be triggered by an end of lamp life condition when a lamp
electrode is broken.
UBA2211
Product data sheet
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Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
9 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
voltage on pin HV
VHV
Conditions
Min
Max
Unit
operating
-
373
V
mains transients: 10 minutes
maximum over lifetime
-
550
V
VFS
voltage on pin FS
with respect to pin OUT
0
14
V
VDD
supply voltage
DC supply
0
15
V
VSENSE
voltage on pin SENSE
5
+5
V
VRC
voltage on pin RC
IRC < 1 mA
0
VDD
V
VSW
voltage on pin SW
ISW < 1 mA
0
VDD
V
current on pin OUT
Tj < 125 C
IOUT
[1]
UBA2211AX
0.9
+0.9
A
UBA2211BX
1.35
+1.35
A
UBA2211CX
1.65
+1.65
A
0.9
+0.9
A
IDVDT
current on pin DVDT
Tj < 125 C
SR
slew rate
repetitive output on pin OUT
Tj
junction temperature
Tstg
storage temperature
VESD
electrostatic discharge
voltage
4
+4
V/ns
40
+150
C
55
+150
C
[2]
HBM:
pins HV, FS, OUT
-
1000
V
pins SW, RC, VDD, DVDT
-
2500
V
-
250
V
-
500
V
MM:
[3]
all pins
CDM:
all pins
[3]
[1]
X where the last letter is P or T.
[2]
In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a
1.5 k series resistor.
[3]
In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 k
series resistor and a 0.75 H inductor.
9. Thermal characteristics
Table 4.
Symbol
Product data sheet
Parameter
Conditions
Rth(j-a)
thermal resistance from junction to ambient
in free air
[1]
Rth(j-c)
thermal resistance from junction to case
in free air
[1]
[1]
UBA2211
Thermal characteristics
Typ
Unit
95
K/W
16
K/W
In accordance with IEC 60747-1
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Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
10 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
10. Characteristics
Table 5.
Characteristics
Tj = 25 C; all voltages are measured with respect to SGND; positive currents flow into the IC.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Low-voltage supply
Start-up state
IHV
current on pin HV
VHV = 100 V
-
0.85
-
mA
VDD(start)
start supply voltage
oscillation start
10.7
11.7
12.7
V
VDD(stop)
stop supply voltage
oscillation stop
8
8.5
9
V
VDD(hys)
hysteresis of supply voltage
start  stop
VDD(reg)
regulation supply voltage
Isink
sink current
capability of VDD regulator
on-state resistance
high-side transistor:
3
3.5
4
V
-
13.8
-
V
6
-
-
mA
UBA2211AX; VHV = 310 V; ID = 100 mA
-
13.5
-

UBA2211BX; VHV = 310 V; ID = 100 mA
-
9.3
-

-
6.6
-

UBA2211AX; ID = 100 mA
-
13.5
-

UBA2211BX; ID = 100 mA
-
8.2
-

UBA2211CX; ID = 100 mA
-
6.6
-

-
1.4
-
HS; IF = 200 mA
-
-
2
V
LS; IF = 200 mA
-
-
2
V
Output stage
Ron
[1]
UBA2211CX; VHV = 310 V; ID = 100 mA
low-side transistor:
Ron(150)/
Ron(25)
on-state resistance ratio
(150 C to 25 C)
VF
forward voltage
[1]
bootstrap diode; IF = 1 mA
0.7
1
1.3
V
1.05
1.35
1.65
s
3.6
4.2
4.8
V
10
14
18
A
UBA2211AX; VDS = 30 V; Tj  125 C;
VHV = 310 V
0.90
-
-
A
UBA2211BX; VDS = 30 V; Tj  125 C;
VHV = 310 V
1.35
-
-
A
UBA2211CX; VDS = 30 V; Tj  125 C;
VHV = 310 V
1.85
-
-
A
UBA2211AX; VDS = 30 V; Tj  125 C
0.90
-
-
A
UBA2211BX; VDS = 30 V; Tj  125 C
1.35
-
-
A
UBA2211CX; VDS = 30 V; Tj  125 C
1.85
-
-
A
tno
non-overlap time
VFS
voltage on pin FS
IFS
current on pin FS
VHV = 310 V; VFS = 12 V
Isat
saturation current
high-side transistor:
UnderVoltage LockOut with respect to
pin OUT
low-side transistor:
UBA2211
Product data sheet
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Rev. 3 — 26 August 2011
[1]
[1]
© NXP B.V. 2011. All rights reserved.
11 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
Table 5.
Characteristics …continued
Tj = 25 C; all voltages are measured with respect to SGND; positive currents flow into the IC.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
60
kHz
Internal oscillator
fosc(int)
internal oscillator frequency
VSW = VDD; steady state
-
-
fosc(nom)
nominal oscillator frequency
Rosc = 100 k; Cosc = 220 pF;
VSW = VDD
40.05
41.32 42.68 kHz
fosc(max)
maximum oscillator frequency
Rosc = 100 k; Cosc = 220 pF; VSW = 0 V
-
104
-
kHz
Rosc = 100 k; Cosc = 220 pF;
T = 20 to +150 C
-
2
-
%
fosc(nom)/T nominal oscillator frequency
variation with temperature
kH
high-level trip point factor
0.382
0.395 0.408
kL
low-level trip point factor
0.030
0.033 0.036
VH(RC)
HIGH-level voltage on pin RC
trip point; VH(RC) = kH  VDD
4.58
4.94
VL(RC)
LOW-level voltage on pin RC
trip point; VL(RC) = kL  VDD
0.367
0.413 0.458 V
Kosc
oscillator constant
Rosc = 100 k; Cosc = 220 pF
1.065
1.1
1.135
-
620
-
mV
-
0.55
-
s
262
285
308
mV
5.29
V
Preheat function
Vref(ph)
preheat reference voltage
tph
preheat time
CSW = 47 nF
RMS current control function
VO(ref)RMS
RMS reference output voltage
OTP function
Tth(act)otp
overtemperature protection
activation threshold temperature
155
175
-
C
Tth(rel)otp
overtemperature protection
release threshold temperature
-
100
-
C
[1]
X where the last letter is P or T.
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
12 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
11. Application information
LFILT
D1
COUT1
D4
Llamp
LAMP
Clamp
SGND
L_N
HV
PGND
CBUF
AC input
DVDT
Rfuse
L_L
VDD
Rosc
D2
CVDD
COUT2
D3
CDVDT
U1
SGND
RC
1
14
2
13
3
12
4
UBA2211 11
5
10
6
9
7
8
OUT
SGND
CFS
SENSE
FS
SGND
SGND
RSENSE
SW
CSW
Cosc
001aal993
Fig 7.
Application diagram for the SO14 devices
The components used in Figure 7 are illustrated in Table 6.
Table 6.
SO14 device bill of materials
Number
Reference
Typical value
Quantity
1
Rfuse
Alias
10 ; 1 W
1
2
D1, D2, D4, D5
M7
4
3
CBUF
C1
2.7 F; 400 V; 105 C; 10*16
1
4
CFS
C5
10 nF; 50 V; 0805
1
5
CSW, CVDD
C6
100 nF; 50 V; 0805
2
6
CDVDT
C9
220 pF; 500 V
1
7
Cosc
C7
220 pF; 50 V; 0805
1
9
C0, COUT1, COUT2
C0, C2, C3
100 nF; 400 V; CL21
3
10
Clamp
C4
2.2 nF; 1 kV; CBB28
1
11
LFILT
L1
3 mH; LGB
1
12
Llamp
L2
3 mH; EE13; PC40
1
13
Rosc
R1
100 k; 1 %; 0805
1
14
RSENSE
R2
1.8 ; 1 W; 1 %
1
15
PCB
UBA2211-1; UBA2211-8
2
16
IC
UBA2211B
1
17
Burner
3U-12 W; 2700k
1
Remark: The customized component values depend on the burner characteristics. An
on-line tool is available to calculate the required components values. This on-line tool can
be found on the product information page of the UBA2211.
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
13 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
U1
LFILT
D1
HV
COUT1
D3
6
7
VDD
D5a
Rosc
FS
Rfuse
3
8
RC
CV
Cosc
UBA2211
L_L
CFS
Llamp
CBUF
AC input
5
LAMP
L_N
SENSE
COUT2
D4
SW
CDVDT
Clamp
D2
1
D5b
RSW
CSW
4
2
SGND
RSENSE
aaa-0001
Fig 8.
Application diagram for DIP8 devices
The components used in Figure 8 are illustrated in Table 7.
Table 7.
DIP8 device bill of materials
Number
Reference
Alias
Typical value
Quantity
1
Rfuse
-
22 ; 1 W
1
2
D1, D2, D4, D5
-
M7
4
2
D5a, D5b
-
1N4148
2
3
CBUF
C1
2.7 F; 400 V; 105 C; 10*16
1
4
CFS
C5
10 nF; 50 V; 0805
1
5
CSW, CVDD
C6
100 nF; 50 V; 0805
2
6
CDVDT
C9
220 pF; 630 V
1
7
Cosc
C7
220 pF; 50 V; 0805
1
9
COUT1, COUT2
C0, C2, C3
100 nF; 400 V; CL21
3
10
Clamp
C4
2.2 nF; 1 kV; CBB28
1
11
LFILT
L1
3 mH; LGB
1
12
Llamp
L2
3 mH; EE13; PC40
1
13
Rosc
R1
100 k; 1 %; 0805
1
1.8 ; 1 W; 1 %
1
14
RSENSE
R2
15
RSW
RSW
not mounted
2
16
IC
-
UBA2211BP
1
17
Burner
-
3U-12 W; 2700k
1
Remark: The customized component values depend on the burner characteristics. An
on-line tool is available to calculate the required components values. This on-line tool can
be found on the product information page of the UBA2211.
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
14 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
12. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
D
A2
A
A1
L
c
Z
w M
b1
e
(e 1)
b
MH
b2
5
8
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.02
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
Fig 9.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT97-1
050G01
MO-001
SC-504-8
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Package outline SOT97-1 (DIP8)
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
15 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT108-1 (SO14)
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
16 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
13. Revision history
Table 8.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
UBA2211 v.3
20110826
Product data sheet
-
UBA2211 v.2.1
Modifications:
•
•
Data sheet status changed from preliminary to product.
•
Minor text and graphics changes.
Figure 8 “Application diagram for DIP8 devices” and Table 7 “DIP8 device bill of materials”
added.
UBA2211 v.2.1
20110307
Preliminary data sheet
-
UBA2211 v.2
UBA2211 v.2
20110103
Objective data sheet
-
UBA2211 v.1
UBA2211 v.1
20100628
Objective data sheet
-
-
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
17 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
18 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
UBA2211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 26 August 2011
© NXP B.V. 2011. All rights reserved.
19 of 20
UBA2211
NXP Semiconductors
Half-bridge power IC family for CFL lamps
16. Contents
1
2
2.1
2.2
2.3
2.4
2.5
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
8
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
System integration . . . . . . . . . . . . . . . . . . . . . . 1
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Burner lifetime . . . . . . . . . . . . . . . . . . . . . . . . . 1
Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ease of use. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 5
Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Oscillation control . . . . . . . . . . . . . . . . . . . . . . . 5
Preheat state . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Ignition state . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Steady state . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 8
Minimum glow time control . . . . . . . . . . . . . . . . 8
Saturation Current Protection (SCP) . . . . . . . . 9
Capacitive Mode Protection (CMP) . . . . . . . . . 9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Thermal characteristics . . . . . . . . . . . . . . . . . 10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11
Application information. . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 26 August 2011
Document identifier: UBA2211
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