STiD325 DOCSIS 3.1 system-on-chip for data gateways Data brief Description The STiD325 is STMicroelectronics' next generation DOCSIS® 3.1 device for data gateway applications. It can also be used as cable modem, eMTA (embedded Media Terminal Adapter) or as a front-end device for headed cable multimedia gateway applications. 67L' Features • Multi-core 64-bit ARM® Cortex™ CPU offering greater than 10 K DMIPS. • DOCSIS® 3.1 cable modem: – Two 196-MHz OFDM demodulators for DOCSIS 3.1 downstream – Two OFDMA modulators for DOCSIS 3.1 upstream channels – 32 single-carrier QAM demodulators for DOCSIS 3.0 downstream – 8 single-carrier QAM modulators for DOCSIS 3.0 upstream channels • Comprehensive integrated networking solution: – Hardware-accelerated L3 / L4 router and L2 switch providing line-rate networking on every port – Rich number of interface for WAN / LAN / Wi-Fi connection – Wi-Fi bridging for deployment of dual-band concurrent Wi-Fi (2.4 GHz and 5 GHz) The STiD325 is built around a multi-Gigabit DOCSIS® 3.1 modem fully certifiable by Cable Labs® with full DOCSIS 3.0 backward compatibility. Besides DOCSIS modem, it embeds line-rate hardware-accelerated switching, routing, Wi-Fi bridging and a carrier grade telephony engine. The STiD325 is powered by a powerful multi-core 64-bit ARM CPU and comes pre-integrated with a RDK-B software allowing OEM to deliver and customize efficiently advanced and future proof CPE (Customer Premises Equipment) solution to MSO's (Multiple System Operators). Using innovative 28 nm FD-SOI silicon technology, the STiD325 provides a cost-effective path for operators towards large-scale deployments. • Telephony support: – PacketCable™ 1.5 / 2.0 – Up to 4 carrier grade HD voice lines • Secure boot with hardware-accelerated cryptographic engine and security hardening July 2015 DocID028146 Rev 1 For further information contact your local STMicroelectronics sales office. 1/3 www.st.com Revision history 1 STiD325 Revision history Table 1. Document revision history 2/3 Date Revision 27-Jul-2015 1 Changes Initial release. DocID028146 Rev 1 STiD325 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved DocID028146 Rev 1 3/3 3