Recommended Reflow Soldering Profile Limiting Values* The below temperature profile for moisture sensitivity characterization is based on the IPC/JEDEC joint industry standard: J-STD-020D-01. Profile Feature SnPb eutectic assembly Pb-free assembly Average ramp-up rate (Tsmax to Tp) 3 °C/s maximum 3 °C/s maximum Temperature minimum (Tsmin) 100 °C 150 °C Temperature maximum (Tsmax) 150 °C 200 °C Time (tsmin to tsmax) 60 s to 120 s 60 s to 180 s Temperature (TL) 183 °C 217 °C Time (tL) 60 s to 150 s 60 s to 150 s Peak/classification temperature (Tp) 235 °C 260 °C Number of allowed reflow cycles 3 3 Time within 5 °C of actual peak temperature (tp) 10 s to 30 s 20 s to 40 s Ramp-down rate 6 °C/s maximum 6 °C/s maximum Time 25 °C to peak temperature 6 minutes maximum 8 minutes maximum Preheat Time maintained above * applicable for devices from NXP Business Line GA Discretes. Pb-free assembly data on base of SnAg3.8Cu0.7 (SAC). Reflow Soldering Profile All information hereunder is per NXP Semiconductors’ best knowledge. In case NXP Semiconductors has tested the product, this documentation reflects the outcome of the analysis of the actually tested parts only. This document does not provide for any representation or warranty express or implied by NXP Semiconductors. Applications and test results, analysis or assessments that are described herein are for illustrative purposes only. NXP Semiconductors makes no representation or warranty neither that such applications will be suitable for the specified use nor that the information, test results, analysis or assessments are reliable without further testing or modification through customer. BL GA Discretes, Product Quality Engineering, Customer Support Discretes, Sep 2013