AP2141A 51A

AP2141A/ AP2151A
0.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
Pin Assignments
The AP2141A and AP2151A are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8, MSOP-8EP, SOT25, and
U-DFN2018-6 packages.
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Single USB Port Power Switches
Over-Current and Thermal Protection
0.8A Accurate Current Limiting
Reverse Current Blocking
95mΩ On-Resistance
Input Voltage Range: 2.7V - 5.5V
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4kV HBM, 400V MM
Active High (AP2151A) or Active Low (AP2141A) Enable
Ambient Temperature Range -40°C to +85°C
SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6:
Available in “Green” Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
( Top View )
OUT
1
GND
2
FLG
3
5
IN
4
EN
SOT25
15kV ESD Protection per IEC 61000-4-2 (with external
capacitance)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Applications
•
Consumer Electronics – LCD TVs & Monitors, Game Machines
•
•
Communications – Set-Top-Boxes, GPS Systems, Smartphones
Computing – Laptops, Desktops, Servers, Printers, Docking
Stations, HUBs
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
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AP2141A/ AP2151A
Typical Applications Circuit
Available Options
Part Number
Channel
Enable Pin (EN)
Current Limit (typical)
Recommended Maximum Continuous Load Current
AP2141A
AP2151A
1
1
Active Low
Active High
0.8A
0.8A
0.5A
0.5A
Pin Descriptions
Pin
Name
Pin Number
MSOP-8EP
SOT25
1
2
2, 3
5
4
4
Function
U-DFN2018-6
1
Ground
2
Voltage Input Pin (all IN pins must be tied together externally).
3
Enable Input. Active Low (AP2141A) or Active High (AP2151A).
Over-Current and Over-Temperature Fault Report.
4
Open-Drain Flag is Active Low When Triggered
GND
IN
EN
SO-8
1
2, 3
4
FLG
5
5
3
OUT
NC
6, 7
8
6, 7
8
1
N/A
5, 6
N/A
Exposed
Pad
—
Exposed
Pad
—
Exposed
Pad
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
Voltage Output Pin (all OUT pins must be tied together externally).
No internal connection; recommend tie to OUT pins
Exposed Pad.
It should be externally connected to GND plane and thermal mass for
enhanced thermal impedance.
It should not be used as electrical ground conduction path.
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AP2141A/ AP2151A
Functional Block Diagram
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
HBM
MM
ESD
MM
IEC system
level
VIN
VOUT
VEN , VFLG
ILOAD
TJ(MAX)
TST
Parameter
Ratings
Units
Human Body Model ESD Protection
Machine Model ESD Protection
for SO-8,MSOP-8EP, SOT25 packages
Machine Model ESD Protection
for U-DFN2018-6, SO-8 packages
Surges per EN61000-4-2. 1999 applied to
output terminals of EVM (Note 5)
Surges per EN61000-4-2. 1999 applied to
output terminals of EVM (Note 5)
4
kV
400
V
300
V
Air
15
kV
Contact
8
kV
6.5
V
VIN +0.3
V
Input Voltage
Output Voltage
Enable Voltage
Maximum Continuous Load Current
6.5
V
Internal Limited
A
Maximum Junction Temperature
Storage Temperature Range (Note 4)
150
°C
-65 to +150
°C
Caution:
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Notes:
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
5. External capacitors need to be connected to the output, EVM board was tested with capacitor 2.2µF 50V 0805.
This level is a pass test only and not a limit.
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
VIN
Input Voltage
IOUT
Output Current
Min
Max
2.7
5.5
Units
V
0
500
mA
-40
+85
°C
TA
Operating Ambient Temperature
VIL
EN Input Logic Low Voltage
0
0.8
V
VIH
EN Input Logic High Voltage
2
VIN
V
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
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AP2141A/ AP2151A
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.)
Symbol
Min
Typ
Max
VUVLO
Input UVLO
Parameter
RLOAD = 1kΩ
Conditions
1.6
1.9
2.5
Unit
V
ISHDN
Input Shutdown Current
Disabled, IOUT = 0
—
0.5
1
µA
IQ
Input Quiescent Current
Enabled, IOUT = 0
—
45
70
µA
ILEAK
Input Leakage Current
Disabled, OUT grounded
—
—
1
µA
IREV
Reverse Leakage Current
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
—
1
—
µA
—
—
95
90
115
110
RDS(ON) Switch On-Resistance
VIN = 5V,
IOUT = 0.5A
VIN = 3.3V,
IOUT = 0.5A
ISHORT Short-Circuit Current Limit
TA = +25°C
SOT25, SO-8, MSOP-8EP
U-DFN2018-6
-40°C ≤ TA ≤ +85°C
—
—
140
TA = +25°C
—
120
140
170
—
—
Enabled into short circuit, CL = 22µF
—
0.6
-40°C ≤ TA ≤ +85°C
mΩ
—
A
ILIMIT
Over-Load Current Limit
VIN = 5V, VOUT = 4.8V, CL = 22µF, -40°C ≤ TA ≤ +85°C
0.6
0.8
1.0
A
ITRIG
Current Limiting Trigger Threshold
Output Current Slew rate (<100A/s) , CL = 22µF
—
1.0
—
A
ISINK
EN Input Leakage
VEN = 5V
—
—
1
µA
tD(ON)
Output Turn-On Delay Time
CL = 1µF, RLOAD = 10Ω
—
0.05
—
ms
tR
Output Turn-On Rise Time
CL = 1µF, RLOAD = 10Ω
—
0.6
1.5
ms
tD(OFF) Output Turn-Off delay Time
CL = 1µF, RLOAD = 10Ω
—
0.01
—
ms
Output Turn-Off Fall Time
CL = 1µF, RLOAD = 10Ω
—
0.05
0.1
ms
RFLG
FLG Output FET On-Resistance
IFLG =10mA
—
20
40
Ω
tBLANK
FLG Blanking Time
CIN = 10µF, CL = 22µF
4
7
15
ms
TSHDN
Thermal Shutdown Threshold
Enabled, RLOAD = 1kΩ
—
140
—
°C
THYS
Thermal Shutdown Hysteresis
—
25
—
°C
—
—
—
—
110
60
157
70
—
—
—
—
°C/W
°C/W
°C/W
°C/W
tF
θJA
Notes:
Thermal Resistance Junction-toAmbient
—
SO-8 (Note 6)
MSOP-8EP (Note 7)
SOT25 (Note 8)
U-DFN2018-6 (Note 9)
6. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
7. Test condition for SO-8, MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer
and thermal vias to bottom layer ground plane.
8. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
9. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer 1.0” x 1.4” ground plane.
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
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AP2141A/ AP2151A
Typical Performance Characteristics
VEN
50%
50%
VEN
50%
50%
TD(OFF)
OFF)
TR
TD(ON)
ON)
50%
50%
TD(OFF)
OFF)
TR
TF
90%
90%
50%
50%
TD(ON)
ON)
90%
90%
VOUT
TF
90%
90%
90%
90%
VOUT
10%
10%
10%
10%
10%
10%
10%
10%
Figure 1. Voltage Waveforms: AP2141A (left), AP2151A (right)
All Enable Plots are for AP2151A Active High
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
VEN
5V/div
VEN
5V/div
VOUT
2V/div
VOUT
2V/div
CL = 1µF
TA = +25°C
RL =10Ω
CL = 1µF
TA = +25°C
RL =10Ω
500µs/div
500µs/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
VEN
5V/div
VEN
5V/div
VOUT
2V/div
VOUT
2V/div
CL = 1µF
TA = +25°C
RL =10Ω
500µs/div
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
CL = 1µF
TA = +25°C
RL =10Ω
500µs/div
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AP2141A/ AP2151A
Typical Performance Characteristics (continued)
Short Circuit Current,
Device Enabled Into Short
Inrush Current
VEN
5V/div
VEN
5V/div
CL = 100µF
VIN = 5V
TA = +25°C
RL = 10Ω
IOUT
200mA/div
VIN = 5V
TA = +25°C
CL = 22µF
IOUT
200mA/div
CL = 470µF
CL = 220µF
500µs/div
1ms/div
3Ω Load Connected to Enabled Device
2Ω Load Connected to Enabled Device
VIN = 5V
TA = +25°C
CL = 22µF
VFLAG
2V/div
VIN = 5V
TA = +25°C
CL = 22µF
VFLAG
2V/div
IOUT
500mA/div
IOUT
500mA/div
2ms/div
2ms/div
Short Circuit with Blanking Time and Recovery
Power On
VIN = 5V
TA = +25°C
CL = 22µF
VOUT
5V/div
VFLAG
5V/div
VFLAG
5V/div
IOUT
200mA/div
TA = +25°C
CL = 22µF
RL = 10Ω
VEN
5V/div
IOUT
1A/div
VIN
5V/div
20ms/div
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
1ms/div
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AP2141A/ AP2151A
Typical Performance Characteristics (cont.)
UVLO Increasing
UVLO Decreasing
TA = +25°C
CL = 22µF
RL = 10Ω
VIN
2V/div
TA = +25°C
CL = 22µF
RL = 10Ω
VIN
2V/div
IOUT
200mA/div
1ms/div
10ms/div
Turn-On Time vs Input Voltage
Turn-Off Time vs Input Voltage
800
31
700
31
600
Turn-Off Time (us)
Turn-On Time (us)
IOUT
200mA/div
500
400
300
CL = 1µF
RL = 10Ω
TA = +25°C
200
100
30
CL = 1µF
RL = 10Ω
TA = +25°C
30
29
29
28
28
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
6
2
2.5
3
4
4.5
5
5.5
6
Fall Time vs Input Voltage
Rise Time vs Input Voltage
600
25
500
24
400
23
Fall Time (us)
Rise Time (us)
3.5
Input Voltage (V)
Input Voltage (V)
300
200
CL = 1µF
100
RL = 10Ω
TA = +25°C
22
21
CL = 1µF
RL = 10Ω
TA = +25°C
20
19
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
1.5
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
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AP2141A/ AP2151A
Typical Performance Characteristics (cont.)
Supply Current, Output Enabled vs Ambient Temperature
Supply Current, Output Disabled vs Ambient Temperature
1.60
Supply Current, Output Disabled (uA)
Supply Current, Output Enabled (uA)
65
60
VIN = 5.0V
55
VIN = 5.5V
50
45
VIN = 2.7V
40
VIN = 3.3V
35
VIN = 5.5V
1.40
1.20
VIN = 5.0V
1.00
VIN = 3.3V
0.80
0.60
VIN = 2.7V
0.40
0.20
0.00
30
-60
-40
-20
0
20
40
60
80
-45
100
-25
-5
Static Drain-Source On-State Resistance vs Ambient
Temperature
35
55
75
95
Short-Circuit Output Current vs Ambient Temperature
710
Short-Circuit Output Current (mA)
200
190
Static Drain-Source On-State
Resistance (mΩ)
15
Ambient Temperature (°C)
Ambient Temperature (°C)
180
VIN = 2.7V
170
VIN = 3.3V
160
150
140
130
120
110
VIN = 5.0V
100
VIN = 5.0V
700
VIN = 2.7V VIN = 3.3V
690
680
670
660
650
VIN = 5.5V
640
630
-60
-40
-20
0
20
40
60
80
100
-60
-40
-20
Ambient Temperature (°C)
0
20
40
60
80
100
Ambient Temperature (°C)
Undervoltage Lockout vs Ambient Temperature
Threshold Trip Current vs Input Voltage
1.15
2.05
Threshold Trip Current (A)
Undervoltage Lockout (V)
2.04
2.03
UVLO Rising
2.02
2.01
2.00
1.99
UVLO Falling
1.98
1.97
1.14
1.13
1.12
TA = +25°C
CL = 22µF
1.11
1.96
1.10
1.95
-60
-40
-20
0
20
40
60
80
100
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
2.8
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
Ambient Temperature (°C)
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AP2141A/ AP2151A
Typical Performance Characteristics (cont.)
Current Limit Response vs Peak Current
45
Current Limit Response (us)
40
35
30
CL = 22µF
VIN = 5V
TA = +25°C
25
20
15
10
5
0
2
3
4
5
6
7
8
9
10
Peak Current (A)
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
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AP2141A/ AP2151A
Application Information
Power Supply Considerations
A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-µF to 0.1-µF ceramic capacitor improves
the immunity of the device to short-circuit transients.
Over-current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2141A/AP2151A senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2141A/AP2151A is capable of delivering current
up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting
mode and is set at ILIMIT.
Note that when the output has been shorted to GND at an extremely low temperature (< -30°C), a minimum 120-µF electrolytic capacitor on the
output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than a 10% variation of capacitance change when operated at extremely low temperatures. Our recommended aluminum
electrolytic capacitor type is Panasonic FC series.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2141A/AP2151A is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON) × I2
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA = Ambient Temperature °C
RθJA = Thermal Resistance
PD = Total Power Dissipation
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
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AP2141A/ AP2151A
Application Information (continued)
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2141A/AP2151A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.
Figure 2. Typical One-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2141A/AP2151A, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2141A/AP2151A also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2141A/AP2151A between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls
system surge current and provides a hot-plugging mechanism for any device.
Dual-Purpose Port Applications
AP2141A/AP2151A is suitable for use in dual-purpose port applications in which a single port is used for data communication between the host and
peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of this is a shared HDMI/MHL
(Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box and a smartphone or tablet while maintaining a
charge to the smartphone or tablet battery. In such dual-purpose port applications, it is important to insure Vin of the AP2141A/AP2151A is ramped
to its operating voltage prior to enabling the output.
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
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AP2141A/ AP2151A
Ordering Information
Note:
Part Number
Package Code
Packaging
AP21X1AW-7
AP21X1AS-13
AP21X1AMP-13
AP21X1AFM-7
W
S
MP
FM
SOT25
SO-8
MSOP-8EP
U-DFN2018-6
7”/13” Tape and Reel
Quantity
Part Number Suffix
3,000/Tape & Reel
-7
2,500/Tape & Reel
-13
2,500/Tape & Reel
-13
3,000/Tape & Reel
-7
10. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
.
Marking Information
(1)
SO-8
(2)
MSOP-8EP
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
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AP2141A/ AP2151A
Marking Information (continued)
(3)
SOT25
( Top View )
4
7
5
XX : Identification code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
XX Y W X
1
(4)
2
3
Device
Package type
Identification Code
AP2141AW
AP2151AW
SOT25
SOT25
VT
VU
U-DFN2018-6
(Top View)
XX
YWX
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
Device
Package type
Identification Code
AP2141AFM
AP2151AFM
U-DFN2018-6
U-DFN2018-6
ZT
ZU
13 of 17
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March 2015
© Diodes Incorporated
AP2141A/ AP2151A
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
SO-8
0.254
(1)
E1 E
A1
L
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0°
8°
θ
All Dimensions in mm
Gauge Plane
Seating Plane
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
(2)
MSOP-8EP
D
D1
x
E
4X
5
.2
0
E2
10
°
Gauge Plane
Seating Plane
y
a
4X
1
8Xb
e
Detail C
E3
A1
A3
c
A2
A
D
L
10°
E1
MSOP-8EP
Dim
Min
Max
Typ
A
1.10
A1
0.05
0.15
0.10
A2
0.75
0.95
0.86
A3
0.29
0.49
0.39
b
0.22
0.38
0.30
c
0.08
0.23
0.15
D
2.90
3.10
3.00
D1
1.60
2.00
1.80
E
4.70
5.10
4.90
E1
2.90
3.10
3.00
E2
1.30
1.70
1.50
E3
2.85
3.05
2.95
e
0.65
L
0.40
0.80
0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
See Detail C
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
14 of 17
www.diodes.com
March 2015
© Diodes Incorporated
AP2141A/ AP2151A
Package Outline Dimensions (continued) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(3)
SOT25
A
SOT25
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D

 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
N
0.70 0.80 0.75
0°
8°
α

All Dimensions in mm
B C
H
K
J
(4)
M
N
L
D
U-DFN2018-6
A3
A
SEATING PLANE
U-DFN2018-6
Dim Min Max Typ
A 0.545 0.605 0.575
A1
0
0.05 0.02
A3

 0.13
b
0.15 0.25 0.20
D 1.750 1.875 1.80
D2 1.30 1.50 1.40
e

 0.50
E
1.95 2.075 2.00
E2 0.90 1.10 1.00
L
0.20 0.30 0.25
z

 0.30
All Dimensions in mm
A1
Pin#1 ID
D
D2
L
E2
E
z
e
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
b
15 of 17
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March 2015
© Diodes Incorporated
AP2141A/ AP2151A
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1)
SO-8
X
Dimensions
X
Y
C1
C2
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
(2)
MSOP-8EP
X
C
G
Y2
Y
Dimensions
Y1
C
G
X
X1
Y
Y1
Y2
X1
(3)
SOT25
C2
C2
Dimensions Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
2.40
C2
0.95
C1
G
Z
Y
X
(4)
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
U-DFN2018-6
X
C
Y
Dimensions
C
G
X
X1
Y
Y1
Y1
Value (in mm)
0.50
0.20
0.25
1.60
0.35
1.20
G
X1
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
16 of 17
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March 2015
© Diodes Incorporated
AP2141A/ AP2151A
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
AP2141A/ AP2151A
Document number: DS37615 Rev. 1 - 2
17 of 17
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March 2015
© Diodes Incorporated
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