AP2181D 91D

AP2181D/AP2191D
Green
1.5A SINGLE CHANNEL CURRENT-LIMITED
POWER SWITCH WITH OUTPUT DISCHARGE
Description
Pin Assignments
The AP2181D and AP2191D are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and undervoltage lockout functionality. A 7ms deglitch capability
on the open-drain flag output prevents false overcurrent reporting and
does not require any external components.
( Top View )
GND
1
8
NC
IN
2
7
OUT
IN
3
6
OUT
EN
4
5
FLG
All devices are available in SO-8, MSOP-8, MSOP-8EP, SOT25, and
U-DFN2018-6 packages.
SO-8
( Top View )
Features
•
•
•
Single USB Port Power Switches with Output Discharge
Overcurrent and Thermal Protection
2.1A Accurate Current Limiting
Fast Transient Response
Reverse Current Blocking
90mΩ On-Resistance
Input Voltage Range: 2.7V – 5.5V
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4kV HBM, 300V MM
Active High (AP2191D) or Active Low (AP2181D) Enable
Ambient Temperature Range -40°C to +85°C
SOT25, SO-8, MSOP-8, MSOP-8EP (Exposed Pad), and
U-DFN2018-6: Available in “Green” Molding Compound
(No Br, Sb)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
•
•
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
•
•
•
•
•
•
•
•
•
•
•
•
•
•
8
NC
IN
2
7
OUT
IN
3
6
OUT
EN
4
5
FLG
( Top View )
OUT
1
GND
2
FLG
3
5
IN
4
EN
SOT25
( Top View )
Consumer Electronics – LCD TVs & Monitors, Game Machines
Communications – Set-Top-Boxes, GPS, Smartphones
Computing – Laptops, Desktops, Servers, Printers, Docking
Stations, HUBs
Notes:
1
MSOP-8 / MSOP-8EP
Note: Latter with Exposed Pad
(Dotted Line)
Applications
•
•
•
GND
GND
1
6
OUT
IN
2
5
OUT
EN
3
4
FLG
U-DFN2018-6
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
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AP2181D/AP2191D
Typical Applications Circuit
AP2191
AP2191D
2191D Enable Active High
IN
Power Supply
2.7V to 5.5V
10k
10k
Load
OUT
0.1uF
0.1uF
10uF
10uF
120uF
120uF
FLG
ON
EN
GND
OFF
Available Options
Part Number
Channel
Enable Pin
(EN)
Current Limit
(Typical)
Recommended Maximum
Continuous Load Current
AP2181D
AP2191D
1
1
Active Low
Active High
2.1A
2.1A
1.5A
1.5A
Pin Descriptions
Pin
Name
Pin Number
SO-8
MSOP-8
MSOP-8EP
SOT25
U-DFN2018-6
GND
IN
EN
1
2, 3
4
1
2, 3
4
2
5
4
1
2
3
FLG
5
5
3
4
OUT
NC
6, 7
8
6, 7
8
1
N/A
5, 6
N/A
Exposed tab
—
Exposed tab
—
Exposed tab
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
Functions
Ground
Voltage input pin (all IN pins must be tied together externally)
Enable input, active low (AP2181D) or active high (AP2191D)
Overcurrent and over-temperature fault report; open-drain flag is active low when
triggered
Voltage output pin (all OUT pins must be tied together externally)
No internal connection; recommend tie to OUT pins
Exposed pad.
It should be connected to GND and thermal mass for enhanced thermal
impedance.
It should not be used as electrical ground conduction path.
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AP2181D/AP2191D
Functional Block Diagram
Current
Sense
IN
OUT
Discharge
Control
UVLO
Driver
EN
Current
Limit
FLG
Deglitch
Thermal
Sense
GND
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
VIN
VOUT
VEN , VFLG
ILOAD
TJMAX
TST
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage
Output Voltage
Enable Voltage
Maximum Continuous Load Current
Ratings
Unit
4
300
kV
V
6.5
V
VIN +0.3
V
6.5
V
Internal Limited
A
150
°C
-65 to +150
°C
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Caution:
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note:
4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
Parameter
Min
Max
2.7
5.5
V
Output Current
0
1.5
A
VIL
EN Input Logic Low Voltage
0
0.8
V
VIH
EN Input Logic High Voltage
TA
Operating Ambient Temperature
VIN
Input Voltage
IOUT
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
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Unit
2
VIN
V
-40
+85
°C
March 2015
© Diodes Incorporated
AP2181D/AP2191D
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, unless otherwise specified.)
Symbol
Min
Typ
Max
VUVLO
Input UVLO
—
1.6
1.9
2.5
V
ISHDN
Input Shutdown Current
Disabled, IOUT = 0
—
0.5
1
µA
IQ
Input Quiescent Current
Enabled, IOUT = 0
—
45
70
µA
ILEAK
Input Leakage Current
Disabled, OUT grounded
—
0.1
1
µA
IREV
Reverse Leakage Current
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
SOT25, MSOP-8, SO-8,
TA = +25°C MSOP-8-EP
VIN = 5V,
U-DFN2018-6
IOUT = 1.5A
—
0.1
1
µA
—
95
115
—
—
90
—
110
-40°C ≤ TA ≤ +85°C
TA = +25°C
—
120
140
-40°C ≤ TA ≤ +85°C
—
—
170
RDS(ON)
Parameter
Switch On-Resistance
Test Conditions
VIN = 3.3V,
IOUT = 1.5A
140
Unit
mΩ
Short-Circuit Current Limit
Enabled into short circuit, CL=120µF
—
2.0
—
A
ILIMIT
Over-Load Current Limit
VIN = 5V, VOUT = 4V, CL = 120µF, -40°C ≤ TA ≤ +85°C
1.6
2.1
2.6
A
ITrig
Current Limiting Trigger Threshold
Output Current Slew rate (<100A/s) , CL = 120µF
—
2.6
VIL
EN Input Logic Low Voltage
VIN = 2.7V to 5.5V
—
—
0.8
V
VIH
EN Input Logic High Voltage
VIN = 2.7V to 5.5V
2
—
—
V
EN Input Leakage
VEN = 5V
—
—
1
µA
TD(ON)
Output Turn-On Delay Time
CL = 1µF, RLOAD = 10Ω
—
0.05
TR
Output Turn-On Rise Time
CL = 1µF, RLOAD = 10Ω
—
0.6
1.5
ms
TD(OFF)
Output Turn-Off Delay Time
CL = 1µF, RLOAD = 10Ω
—
0.05
—
ms
Output Turn-Off Fall Time
CL = 1µF, RLOAD = 10Ω
—
0.05
0.1
ms
RFLG
FLG Output FET On-Resistance
IFLG =10mA
—
20
40
Ω
TBlank
ISHORT
ISINK
TF
A
ms
FLG Blanking Time
CIN = 10uF, CL = 22F
4
7
15
ms
TDIS
Discharge Time
CL = µF, VIN = 5V, disabled to VOUT < 0.5V
—
0.6
—
ms
RDIS
Discharge Resistance (Note 5)
VIN = 5V, disabled, IOUT = 1mA
—
100
—
Ω
TSHDN
Thermal Shutdown Threshold
Enabled, RLOAD = 1kΩ
—
140
—
°C
THYS
Thermal Shutdown Hysteresis
—
—
25
—
°C
Thermal Resistance Junction-toAmbient
SOT25 (Note 6)
SO-8 (Note 6)
MSOP-8 (Note 6)
MSOP-8-EP (Note 7)
U-DFN2018-6 (Note 7)
—
—
—
—
—
170
127
118
67
70
—
—
—
—
—
°C/W
θJA
Notes:
5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path
for the external storage capacitor.
6. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
7. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
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AP2181D/AP2191D
Typical Performance Characteristics
VEN
50%
50%
VEN
50%
50%
TD(OFF)
OFF)
TR
TD(ON)
ON)
TD(OFF)
OFF)
TR
TF
90%
90%
50%
50%
50%
50%
TF
TD(ON)
ON)
90%
90%
VOUT
90%
90%
90%
90%
VOUT
10%
10%
10%
10%
10%
10%
10%
10%
Figure 1 Voltage Waveforms: AP2181D (left), AP2191D (right)
All Enable Plots are for AP2181D Active Low
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
Vout
2V/div
CL = 1µF
CL = 1µF
TA = +25°C
TA = +25°C
RL = 10Ω
RL = 10Ω
100µs/div
100µs/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
CL = 120µF
Vout
2V/div
CL = 120µF
TA = 25°C
TA = +25°C
RL = 10Ω
RL = 10Ω
500µs/div
500µs/div
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
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AP2181D/AP2191D
Typical Performance Characteristics (continued)
Short Circuit Current, Device Enabled Into Short
Ven
5V/div
Short Circuit with Blanking Time and Recovery
VIN = 5V
VIN = 5V
TA = +25°C
CL = 120µF
TA = +25°C
Vout
5V/div
CL = 120µF
Vflag
5V/div
Iout
2A/div
Iout
500mA/div
500us/div
50ms/div
0.6 Ω Load Connected to Enabled Device
Power On with Full Load
VIN = 5V
Vflag
2V/div
TA = +25°C
CL = 120µF
Vin
5V/div
Iout
500mA/div
Iout
1A/div
Vflg
5V/div
Vout
5V/div
TA = +25°C
CL = 120µF
RL = 3.3Ω
2ms/div
1ms/div
UVLO Increasing With Full Load
UVLO Decreasing With Full Load
TA = +25°C
CL = 22µF
RL = 3.3Ω
Vin
2V/div
Vin
2V/div
Iout
500mA/div
TA = +25°C
Iout
500mA/div
CL = 22µF
RL = 3.3Ω
1ms/div
10ms/div
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
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AP2181D/AP2191D
Typical Performance Characteristics (cont.)
Discharge Time
(No Load Resistance)
Vout
2V/div
Inrush Current
Ven
5V/div
TA = +25°C
VIN = 5V
No Load
Resistance
CL =120µF
CL =470µF
VIN = 5V
TA = +25°C
RL = 3.3Ω
CL=470uF
CL =22µF
CL=100uF
CL=220uF
Iout
500mA/div
Ven
2V/div
100ms/div
1ms/div
Turn-On Time vs Input Voltage
Turn-Off Time vs Input Voltage
850
55
750
50
CL = 1µF
45
TA = +25°C
Turn-Off Time (us)
Turn-On Time (us)
RL = 10Ω
650
550
450
CL = 1µF
RL = 10Ω
350
40
35
30
TA = +25°C
25
250
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
6
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
Rise Time vs Input Voltage
Fall Time vs Input Voltage
650
25
600
24
Fall Time (us)
Rise Time (us)
550
500
450
CL = 1µF
400
23
22
21
CL = 1µF
20
TA = +25°C
RL = 10Ω
RL = 10Ω
350
TA = +25°C
19
300
2
2.5
3
3.5
4
4.5
5
5.5
6
2
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
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AP2181D/AP2191D
Typical Performance Characteristics (cont.)
Supply Current, Output Enabled vs Ambient Temperature
Supply Current, Output Disabled vs Ambient Temperature
0.9
Supply Current, Output Disabled (uA)
Supply Current, Output Enabled (uA)
52
Vin = 5.0V
47
Vin =
5.5V
42
37
Vin = 2.7V
Vin = 3.3V
32
Vin = 5.5V
0.8
Vin = 5.0V
0.7
0.6
Vin = 3.3V
0.5
0.4
0.3
0.2
Vin = 2.7V
0.1
0.0
27
-60
-40
-20
0
20
40
60
80
-60
100
-40
-20
0
20
40
60
80
100
Ambient Temperature (°C)
Ambient Temperature (°C)
Static Drain-Source On-State Resistance vs Ambient
Temperature
Short-Circuit Output Current vs Ambient Temperature
2.60
Vin = 2.7V
170
Short-Circuit Output Current (A)
Static Drain-Source On-State
Resistance (mΩ)
180
160
150
140
130
Vin = 3.3V
120
110
100
Vin = 5V
90
80
CL = 100µF
2.50
Vin = 3.3V
Vin = 2.7V
Vin = 5.0V
2.40
2.30
2.20
2.10
Vin = 5.5V
2.00
-60
-40
-20
0
20
40
60
80
100
-60
-40
-20
Ambient Temperature (°C)
0
20
40
60
80
100
Ambient Temperature (°C)
Undervoltage Lockout vs Ambient Temperature
Threshold Trip Current vs Input Voltage
3.24
2.15
Threshold Trip Current (A)
Undervoltage Lockout (V)
3.22
2.10
UVLO Rising
2.05
2.00
UVLO Falling
1.95
3.20
3.18
3.16
TA = +25°C
3.14
CL = 120µF
3.12
3.10
3.08
1.90
-60
-40
-20
0
20
40
60
80
100
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
2.8
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
Ambient Temperature (°C)
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AP2181D/AP2191D
Application Note
The AP2181D and AP2191D are integrated high-side power switches optimized for Universal Serial Bus (USB) that require protection functions.
The power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the various
protection features and special functions, make these power switches ideal for hot-swap or hot-plug applications.
Protection Features:
Undervoltage Lockout (UVLO)
Under-voltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions only when the
switch is enabled. Even if the switch is enabled, the switch is not turned ON until the power supply has reached at least 1.9V. Whenever the input
voltage falls below approximately 1.9V, the power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible
to turn off the power switch before input power is removed.
Overcurrent and Short Circuit Protection
An internal sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
The different overload conditions and the corresponding response of the AP2181D/AP2191D are outlined below:
S. NO
Conditions
1
Short circuit condition at start-up
Explanation
Output is shorted before
input voltage is applied or
before the part is enabled.
Behavior of the AP2181D/AP2191D
The IC senses the short circuit and immediately clamps
output current to a certain safe level namely ILIMIT.
2
Short-circuit or overcurrent
condition
Short-circuit or overload
condition that occurs when
the part is enabled.
At the instance the overload occurs, higher current may flow
for a very short period of time before the current limit
function can react.
After the current limit function has tripped (reached the
overcurrent trip threshold), the device switches into current
limiting mode and the current is clamped at ILIMIT.
3
Gradual increase from nominal
operating current to ILIMIT
Load increases gradually
until the current-limit
threshold.(ITRIG)
The current rises until ITRIG or thermal limit. Once the
threshold has been reached, the device switches into its
current limiting mode and is set at ILIMIT.
Note that when the output has been shorted to GND at an extremely low temperature (< -20°C), a minimum 120-µF electrolytic capacitor on the
output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than a 10% variation of capacitance change when operated at extremely low temperatures. Our recommended aluminum
electrolytic capacitor type is Panasonic FC series.
Thermal Protection
Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or
short-circuit faults are present for extended periods of time. The AP2181D/AP2191D implements thermal sensing to monitor the operating junction
temperature of the power distribution switch. Once the die temperature rises to approximately 140°C, the Thermal protection feature gets
activated as follows: The internal thermal sense circuitry turns the power switch off and the FLG output is asserted thus preventing the power
switch from damage. Hysteresis in the thermal sense circuit allows the device to cool down to approximately 25°C before the output is turned back
on. The built-in thermal hysteresis feature avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this
manner until the load fault is removed, resulting in a pulsed output. The FLG open-drain output is asserted when an overcurrent occurs with 7-ms
deglitch.
Reverse Current Protection
In a normal MOSFET switch, current can flow in reverse direction (from the output side to the input side) when the output side voltage is higher
than the input side, even when the switch is turned off. A reverse-current blocking feature is implemented in the AP21x1 series to prevent such
back currents. This circuit is activated by the difference between the output voltage and the input voltage. When the switch is disabled, this feature
blocks reverse current flow from the output back to the input.
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
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AP2181D/AP2191D
Application Note (continued)
Special Functions:
Discharge Function
When enable is de-asserted, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge
resistance of 100Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the
resistance and the output capacitor.
FLG Response
The FLG open-drain output goes active low for any of the two conditions: Overcurrent or Over-Temperature. The time from when a fault condition
is encountered to when the FLG output goes low is 7-ms (TYP). The FLG output remains low until both overcurrent and over-temperature
conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary overcurrent condition, which does
not trigger the FLG due to the 7-ms deglitch timeout. This 7-ms timeout is also applicable for overcurrent recovery and Thermal recovery. The
AP2181D/AP2191D is designed to eliminate erroneous overcurrent reporting without the need for external components, such as an RC delay
network.
Power Supply Considerations
A 0.01-µF to 0.1-µF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input
voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10-µF minimum) and output pin(s) is recommended
when the output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing
the output with a 0.01-µF to 0.1-µF ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents
output from going negative during turn-off due to inductive parasitics.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
The junction temperature can be calculated by:
TJ = PD x RθJA + TA
Where:
TA= Ambient Temperature °C
RθJA = Thermal Resistance
PD = Total Power Dissipation
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges as seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp up the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise and fall times of the AP2181D/AP2191D, these devices can be used to provide a softer
start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2181D/AP2191D also ensures that the switch is off after
the card has been removed, and that the switch is off during the next insertion.
By placing the AP2181D/AP2191D between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls
the system surge current and provides a hot-plugging mechanism for any device.
Dual-Purpose Port Applications
AP2181D/AP2191D is not recommended for use in dual-purpose port applications in which a single port is used for data communication between
the host and peripheral devices while simultaneously maintaining a charge to the battery of the peripheral device. An example of such a nonrecommended application is a shared HDMI/MHL (Mobile High-definition Link) port that allows streaming video between an HDTV or set-top box
and a smartphone or tablet while maintaining a charge to the smartphone or tablet battery. Since the AP2181D/AP2191D includes an embedded
discharge feature that discharges the output load of the device when the device is disabled, the batteries of the connected peripheral device will
be subject to continual discharge whenever the AP2181D/AP2191D is disabled. In addition, if the output of the AP2181D/AP2191D is subjected to
a constant voltage that would be present during a dual-purpose port application such as MHL, an overstress condition to the device’s discharge
MOS transistor may result.
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
10 of 18
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© Diodes Incorporated
AP2181D/AP2191D
Ordering Information
Part Number
Package Code
Packaging
AP21X1DSG-13
AP21X1DM8G-13
AP21X1DMPG-13
AP21X1DWG-7
AP21X1DFMG-7
S
M8
MP
W
FM
SO-8
MSOP-8
Quantity
7”/13”
13” Tape and Reel
Part Number Suffix
2,500/Tape & Reel
2,500/Tape & Reel
-13
-13
MSOP-8EP
2,500/Tape & Reel
-13
SOT25
U-DFN2018-6
3,000/Tape & Reel
3,000/Tape & Reel
-7
-7
Marking Information
(1)
SO-8
( Top View )
8
7
6
5
1 : 1 Channel
YY : Year : 08, 09,10~
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
G : Green
Logo
Part Number
AP21X X D
: ActiveLow
Low
8 :76Active
: Active High
9 : Active High
YY WW X X
2
1
(2)
3
4
MSOP-8
( Top view )
8
7
YWX
AP21 X
AP23
X1 D
Part
PartNumber
Number
Active Low
08::Active
Low
Active High
19: :Active
High
1
Document number: DS32251 Rev. 4 - 2
5
A~Z
: Green
X : Internal
Code
Logo
Logo
AP2181D/AP2191D
6
2
3
Y :: Year
Year: :0~9
0~9
W
Week::A~Z
A~Z: 1~26
: 1~26week;
week
week;
W : Week
a~z :: 27~52
27~52week;
week;
z represents
z represents
52 and
and53
53week
week
11 : 11 Channel
Channel
4
11 of 18
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March 2015
© Diodes Incorporated
AP2181D/AP2191D
Marking Information (continued)
(3)
MSOP-8EP
( Top view )
8
7
6
Logo
YWXE
AP21
AP23 X
X1 D
PartNumber
Number
Part
08 :: Active Low
Low
Active High
19 :: Active
1
(4)
5
2
3
4
A~Z
: Green
X : Internal
Code
MSOP-8-EP
MSOP-8EP
Year :: 0~9
0~9
Y
Y :: Year
W
A~Z :: 1~26
1~26week;
week;
Week :: A~Z
W :: Week
a~z
27~52 week;
week;zzrepresents
represents
a~z :: 27~52
52
and 53
53 week
week
52 and
11 :: 1
Channel
1 Channel
SOT25
( Top View )
4
7
5
XX : Identification code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
XX Y W X
1
(5)
2
3
Device
Package Type
Identification Code
AP2181DW
SOT25
JE
AP2191DW
SOT25
JF
U-DFN2018-6
(Top View)
XX
YWX
Device
AP2181DFM
AP2191DFM
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
Package Type
U-DFN2018-6
U-DFN2018-6
12 of 18
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Identification Code
JE
JF
March 2015
© Diodes Incorporated
AP2181D/AP2191D
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
SO-8
0.254
(1)
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
7°~9°
h
45°
Detail ‘A’
A2 A A3
b
e
D
(2)
MSOP-8
MSOP-8
Dim Min Max Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
e
0.65
L 0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
D
4x
10
°
0.25
E Gauge Plane
x
Seating Plane
a
y
4x10°
L
Detail C
1
b
E3
A3
A2
A
e
E1
A1
(3)
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
θ
0°
8°
All Dimensions in mm
c
See Detail C
MSOP-8EP
D
x
E
E2
4X
10
°
0.25
D1
Gauge Plane
Seating Plane
a
y
1
4X
10
°
8Xb
e
Detail C
E3
A1
A3
L
c
A2
A
D
E1
See Detail C
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
13 of 18
www.diodes.com
MSOP-8EP
Dim Min Max Typ
A
1.10
A1
0.05 0.15 0.10
A2
0.75 0.95 0.86
A3
0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1
1.60 2.00 1.80
E
4.70 5.10 4.90
E1
2.90 3.10 3.00
E2
1.30 1.70 1.50
E3
2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
March 2015
© Diodes Incorporated
AP2181D/AP2191D
Package Outline Dimensions (continued) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
(4)
SOT25
A
B C
H
K
J
(5)
M
N
L
D
SOT25
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D

 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
N
0.70 0.80 0.75
0°
8°
α

All Dimensions in mm
U-DFN2018-6
A3
A
SEATING PLANE
U-DFN2018-6
Dim Min Max Typ
A 0.545 0.605 0.575
A1
0
0.05 0.02
A3

 0.13
b
0.15 0.25 0.20
D 1.750 1.875 1.80
D2 1.30 1.50 1.40
e

 0.50
E
1.95 2.075 2.00
E2 0.90 1.10 1.00
L
0.20 0.30 0.25
z

 0.30
All Dimensions in mm
A1
Pin#1 ID
D
D2
L
E2
E
z
e
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
b
14 of 18
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March 2015
© Diodes Incorporated
AP2181D/AP2191D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1)
SO-8
X
Dimensions
X
Y
C1
C2
C1
Value (in mm)
0.60
1.55
5.4
1.27
C2
Y
(2)
MSOP-8
X
C
Y
Y1
Dimensions Value (in mm)
C
0.650
X
0.450
Y
1.350
Y1
5.300
(3)
MSOP-8-EP
X
C
G
Y2
Y
Dimensions
Y1
C
G
X
X1
Y
Y1
Y2
X1
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
15 of 18
www.diodes.com
Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
March 2015
© Diodes Incorporated
AP2181D/AP2191D
Suggested Pad Layout (continued)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4)
SOT25
C2
Z
C2
C1
G
Dimensions Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
Y
X
C1
C2
(5)
2.40
0.95
U-DFN2018-6
X
C
Dimensions
C
G
X
X1
Y
Y1
Y
Y1
Value (in mm)
0.50
0.20
0.25
1.60
0.35
1.20
G
X1
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
16 of 18
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March 2015
© Diodes Incorporated
AP2181D/AP2191D
Taping Orientation (Note 8)
For U-DFN2018-6
Note:
8. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.
AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
17 of 18
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March 2015
© Diodes Incorporated
AP2181D/AP2191D
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
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AP2181D/AP2191D
Document number: DS32251 Rev. 4 - 2
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March 2015
© Diodes Incorporated
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