AP22802

AP22802
965010
SINGLE CHANNEL POWER DISTRIBUTION LOAD
SWITCH
ADVANCED INFORMATION
Description
Pin Assignments
The AP22802 is a single channel current-limited integrated high-side
power switch optimized for Universal Serial Bus (USB) and other
hot-swap applications. The family of devices complies with
USB standards and is available with both polarities of Enable input.
The device has fast short-circuit response time for improved overall
system robustness, and has an integrated output discharge function
to ensure completely controlled discharging of the output voltage
capacitor. They provide a complete protection solution for applications
subject to heavy capacitive loads and the prospect of short circuit,
and offer reverse current blocking, over-current, over-temperature
and short-circuit protection, as well as controlled rise time and
under-voltage lockout functionality. A 6ms deglitch capability on the
open-drain Flag output prevents false over-current reporting and does
not require any external components.
The AP22802 is available in a standard Green SOT25 and RoHS
compliant.
Features





Integrated Single Channel Load Switch
Protection

Over Current with Auto Recovery

Short Circuit with Auto Recovery

Over Temperature with Auto Recovery
Small Form Factor Packages
SOT25 – Footprint of just 9mm2
Thermally Efficient Low Profile Package
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)


UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified

Notes:
Top View
OUT
1
GND
2
FLG
3
5
IN
4
EN
SOT25
Applications









Integrated Load Switches in Ultrabook PC’s
Power Up/Down Sequencing in Ultrabook PC’s
Notebook
Netbook
Set-Top Boxes
SSD (Solid State Drives)
Consumer Electronics
Tablet PC
Telecom Systems
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
Enable Active High
IN
Power Supply
2.7V to 5.5V
0.1μF
1μF
10k
Load
OUT
120μF
FLG
EN
ON
GND
OFF
AP22802
Document number: DS36218 Rev. 3 - 2
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AP22802
965010
ADVANCED INFORMATION
Pin Descriptions
Pin Number
Pin Name
Function
1
OUT
Voltage Output Pin
2
GND
Ground Pin of the Circuitry
3
FLG
Over Current and Over temperature fault report;
Open-Drain flag is active low when triggered.
Enable Input
4
EN
AP22802A: Active High
AP22802B: Active Low
5
IN
Voltage Input Pin
Functional Block Diagram
Current
Sense
IN
Discharge
Control
UVLO
Current
Limit
Driver
EN
OUT
FLG
Deglitch
Thermal
Sense
GND
Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.) (Note 4)
Symbol
ESD HBM
ESD MM
Units
2000
200
V
V
-0.3 to 5.7
V
Output Voltage
-0.3 to (VIN +0.3)
V
VEN
Enable Voltage
-0.3 to (VIN +0.3)
V
Load Current
Internal Limited
A
+150
°C
IL
TJ(max)
Input Voltage
Ratings
VOUT
VIN
Notes:
Parameter
Human Body ESD Protection
Machine Model ESD Protection
Maximum Junction Temperature
TST
Storage Temperature
RθJA
Thermal Resistance, Junction to Ambient
RθJC
Thermal Resistance, Junction to Case
-65 to +150
°C
SOT25 (Note 5)
180
°C/W
SOT25 (Note 5)
50
°C/W
4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
5. Test condition for SOT25: Device mounted on 1”x1” FR-4 substrate PC board, 2oz copper with minimum recommended pad layout.
AP22802
Document number: DS36218 Rev. 3 - 2
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AP22802
965010
Recommended Operating Conditions (Note 6)
ADVANCED INFORMATION
Symbol
Parameter
Min
Max
Unit
V
VIN
Input Voltage
2.7
5.5
IOUT
Output Current
0
2
A
VIL
EN Input Logic Low Voltage
0
0.5
V
VIH
EN Input Logic High Voltage
1.5
VIN
V
TA
Operating Ambient Temperature
-40
+85
C
Electrical Characteristics
Symbol
(VIN = 5V @ TA = +25°C, CIN = 1µF, CL = 100nF, unless otherwise specified.)
Parameter
Test Conditions
Min
Typ
Max
1.6
2.0
2.4
V
VIN Decreasing
–
75
–
mV
Input Shutdown Current
Disabled, OUT = Open
–
0.1
1
µA
VUVLO
Input UVLO
VIN Rising
∆VUVLO
Input UVLO Hysteresis
ISHDN
IQ
Unit
Input Quiescent Current
Enabled, OUT = Open
–
50
–
µA
ILEAK
Input Leakage Current
Disabled, OUT Grounded
–
0.1
1
µA
IREV
Reverse Leakage Current
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
–
0.01
1
µA
VIN = 5V, IOUT = 2.0A
TA = +25°C
–
50
–
VIN = 3.3V, IOUT = 2.0A
TA = +25°C
–
60
–
RDS(ON)
Switch On-Resistance
mΩ
Over Load Current Limit
VIN = 5V, VOUT = 4.5V
2.2
2.7
3.2
A
ISHORT
Short-Circuit Current Limit
Enabled into Short Circuit
–
1.1
–
A
tSHORT
Short-Circuit Response Time
VIN = 5V, No Load Figure 1
–
0.7
–
µs
VIL
EN Input Logic Low Voltage
VIN = 2.7V to 5.5V
–
–
0.5
V
VIH
EN Input Logic High Voltage
VIN = 2.7V to 5.5V
1.5
–
–
V
0.01
1
µA
ILIMIT
ILEAK-EN
EN Input Leakage
VIN = 5V, VEN = 0V and 5.5V
–
ILEAK-O
Output Leakage Current
Disabled, VOUT = 0V
–
0.5
1
µA
tD(ON)
Output Turn-On Delay Time
CL = 4.7µF, RLOAD = 10Ω @ VIN = 3.3V Figure 2
–
1.7
–
ms
tR
Output Turn-On Rise Time
CL = 4.7µF, RLOAD = 10Ω @ VIN = 3.3V Figure 2
1.0
2.1
3.5
ms
tD(OFF)
Output Turn-Off Delay Time
CL = 4.7µF, RLOAD = 10Ω @ VIN = 3.3V Figure 2
–
0.2
–
ms
Output Turn-Off Fall Time
CL = 4.7µF, RLOAD = 100Ω @ VIN = 3.3V Figure 2
–
0.65
–
ms
RFLG
FLG output FET On-Resistance
IFLG = 10mA
–
40
60
Ω
IFOH
FLG Off Current
VFLG = 5V
–
0.01
1
µA
tBlank
FLG Blanking Time
Assertion or deassertion due to overcurrent and
over-temperature condition
2
6
13
ms
tDIS
Discharge Time
CL = 1µF, VIN = 5V, Disabled to VOUT < 0.5V
–
0.4
–
ms
RDIS
Discharge Resistance
VIN = 5V, Disabled, IOUT = 1mA
–
90
–
Ω
+140
–
C
+60
–
C
tF
Note:
TSHDN
Thermal Shutdown Threshold
Enabled
–
THYS
Thermal Shutdown Hysteresis
–
–
6. Refer to the typical application circuit.
AP22802
Document number: DS36218 Rev. 3 - 2
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AP22802
965010
ADVANCED INFORMATION
Performance Characteristics
Figure 1. Response Time to Short Circuit Waveform
VEN
50%
VEN
50%
tD(OFF)
tR
tD(ON)
tD(ON)
90%
VOUT
tD(OFF)
tR
tF
90%
50%
50%
tF
90%
90%
VOUT
10%
10%
10%
10%
Figure 2. Voltage Waveforms: AP22802B (Active Low, left), AP22802A (Active High, right)
AP22802
Document number: DS36218 Rev. 3 - 2
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AP22802
965010
Performance Characteristics (Cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Turn on Delay and Rise Time
VIN=3.3V
RLOAD=10Ω
CL=4.7μF
VOUT
2V/div
ADVANCED INFORMATION
Turn Off Delay and Fall Time
VIN=3.3V
RLOAD=10Ω
CL=4.7μF
VOUT
2V/div
EN
5V/div
EN
5V/div
IIN
200mA/div
IIN
200mA/div
1ms/div
400μs/div
Turn-On Delay and Rise Time
VOUT
5V/div
Turn-Off Delay and Fall Time
VIN=5V
RLOAD=2.5Ω
CL=120μF
VIN=5V
RLOAD=2.5Ω
CL=120μF
VOUT
5V/div
EN
5V/div
EN
5V/div
IIN
2A/div
IIN
2A/div
1ms/div
400μs/div
Device Enabled Into Short-Circuit
Inrush Current
VIN=5V
RLOAD=2.5Ω
Active Low
VIN=5V
OUT grounded
EN
5V/div
EN
5V/div
CL=470μF
CL=220μF
IOUT
1A/div
IIN
1A/div
1ms/div
AP22802
Document number: DS36218 Rev. 3 - 2
CL=120μF
CL=1μF
1ms/div
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AP22802
965010
Performance Characteristics (Cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Full-Load to Short-Circuit
Transient Response
ADVANCED INFORMATION
VOUT
2V/div
Output short
circuited
Short-Circuit to Full-Load
Recovery Response
VIN=5V
RLOAD=2.5Ω
CL=120μF
Output short
circuit removed
VOUT
2V/div
VIN=5V
RLOAD=2.5Ω
CL=120μF
Short circuit present and
device thermal cycles
IIN
2A/div
Device turns off and re-enables
into short-circuit current limit
IIN
2A/div
FLG
5V/div
FLG
5V/div
2ms/div
No-Load to Short-Circuit
Transient Response
VOUT
2V/div
Output short
circuited
10ms/div
Short-Circuit to No-Load
Recovery Response
VIN=5V
No load
CL=120μF
Output short
circuit removed
VIN=5V
No load
CL=120μF
VOUT
2V/div
Short circuit present and
device thermal cycles
IIN
2A/div
Device enters short-circuit
current limit
IIN
2A/div
FLG
5V/div
FLG
5V/div
2ms/div
Power ON
10ms/div
Short-Circuit with Blanking Time and
Recovery
FLG
5V/div
VIN
5V/div
VIN=5V
RLOAD=2.5Ω
CL=120μF
IOUT
1A/div
VIN=5V
No load
CL=120μF
VOUT
5V/div
VOUT
5V/div
IOUT
2A/div
FLG
5V/div
1ms/div
AP22802
Document number: DS36218 Rev. 3 - 2
10ms/div
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AP22802
965010
Performance Characteristics (Cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
UVLO Increasing
UVLO Decreasing
ADVANCED INFORMATION
VIN=5V
RLOAD=2.5Ω
CL=120μF
VIN=5V
RLOAD=2.5Ω
CL=120μF
VIN
2V/div
VIN
2V/div
VOUT
2V/div
VOUT
2V/div
1ms/div
AP22802
Document number: DS36218 Rev. 3 - 2
1ms/div
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AP22802
965010
Performance Characteristics (Cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Turn-on Time vs. Input Voltage
1000
CL=4.7μF
RLOAD=10Ω
1800
CL=4.7μF
RLOAD=10Ω
1500
Turn-off Time (μs)
Turn-on Time (μs)
800
1200
900
600
400
600
200
300
0
0
2.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Input Voltage (V)
Input Voltage(V)
Rise Time vs. Input Voltage
Fall Time vs. Input Voltage
4000
1000
6.0
CL=4.7μF
RLOAD=100Ω
CL=4.7μF
RLOAD=10Ω
3500
800
Fall Time (μs)
Rise Time (μs)
ADVANCED INFORMATION
2100
Turn-off Time vs. Input Voltage
3000
2500
600
400
2000
200
1500
0
1000
2.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Document number: DS36218 Rev. 3 - 2
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Input Voltage (V)
Input Voltage (V)
AP22802
2.5
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AP22802
965010
Performance Characteristics (Cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Supply Current vs. Temperature
(Output Enabled)
Supply Current vs. Temperature
(Output Disabled)
1.0
Supply Current Output Disabled (µA)
Supply Current Output Enabled (µA)
70
VIN=5.5V
VIN=5V
60
50
40
VIN=3.3V
VIN=2.7V
30
20
10
0
VIN=5.5V
VIN=3.3V
0.5
VIN=5V
VIN=2.7V
0.0
-0.5
-1.0
-50
-25
0
25
50
75
100
125
-50
-25
0
Temperature (℃)
25
50
75
100
125
Temperature ( ℃)
RDS(ON) vs. Temperature
Short-Circuit Output Current vs. Temperature
100
2.0
Short-Circuit Output Current (A)
VIN=3.3V
80
RDS(ON) (mΩ)
ADVANCED INFORMATION
80
VIN=2.7V
VIN=5V
60
40
VIN=5.5V
20
0
1.5
2.7V
5.5V
1.0
3.3V
5V
0.5
0.0
-50
-25
0
25
50
75
100
125
-50
Temperature (℃)
AP22802
Document number: DS36218 Rev. 3 - 2
-25
0
25
50
75
100
125
Temperature (°C)
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AP22802
965010
Performance Characteristics (Cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Under Voltage Lockout vs. Temperature
Over Load Current Limit vs. Input Voltage
3.2
Over Load Current Limit (A)
2.1
Undervoltage Lockout (V)
ADVANCED INFORMATION
2.2
UVLO Rising
2.0
1.9
UVLO Falling
1.8
1.7
3.0
2.8
UVLO Rising
2.6
2.4
2.2
1.6
-50
-25
0
25
50
75
100
2.0
125
Temperature (℃)
AP22802
Document number: DS36218 Rev. 3 - 2
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Input Voltage (V)
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AP22802
965010
Application Information
Power Supply Considerations
ADVANCED INFORMATION
A 1μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value capacitor (10μF
minimum) on both input and output pins is recommended when the output transient load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01μF to 0.1μF ceramic capacitor improves the immunity
of the device to short-circuit transients.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 6ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy
capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 6ms deglitch
timeout. The AP22802 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before
VIN has been applied. The AP22802 senses the short circuit and immediately clamps output current to a certain safe level.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current
may flow for a very short period of time before the current limit function can react. After the current limit function has tripped, the device switches
into current limiting mode and the current is clamped at ILIMIT, or ISHORT.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP22802 is capable of delivering current up to the
current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and
is set at ILIMIT.
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP22802 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature
rises to approximately +140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry
turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to
cool down approximately +60°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is
removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 6ms deglitch.
ON/OFF Input Operator
The EN input allows the output current to be switched on and off using a GPIO compatible input. The high signal (switch on) should be at least
1.5V, and the low signal (switch off) no higher than 0.5V. This pin should NOT be left floating. It is advisable to hold the EN signal low when
applying or removing power.
Under-voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even
if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of
the output voltage when either no external output resistance or load resistance is present at the output.
AP22802
Document number: DS36218 Rev. 3 - 2
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AP22802
965010
Application Information (Cont.)
Power Dissipation and Junction Temperature
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA = Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
Ordering Information
AP22802X XX - 7
Enable
Package
Packing
A : Active High
B : Active Low
W5 : SOT25
-7 : Tape & Reel
Part Number
Package
Code
Packaging
AP22802AW5-7
AP22802BW5-7
W5
W5
SOT25
SOT25
Quantity
3000/Tape & Reel
3000/Tape & Reel
13” Tape and Reel
Part Number Suffix
-7
-7
Marking Information
( Top View )
5
4
7
ADVANCED INFORMATION
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
XX Y W X
1
2
Part Number
AP22802AW5-7
AP22802BW5-7
AP22802
Document number: DS36218 Rev. 3 - 2
3
XX : Identification code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
Package Type
SOT25
SOT25
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Identification Code
XA
XB
August 2015
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AP22802
965010
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
ADVANCED INFORMATION
A
SOT25
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D

 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
N
0.70 0.80 0.75
0°
8° 

All Dimensions in mm
B C
H
K
M
N
J
L
D
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version
C2
Z
C2
Dimensions Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
G
C1
Y
C2
2.40
0.95
X
AP22802
Document number: DS36218 Rev. 3 - 2
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AP22802
965010
IMPORTANT NOTICE
ADVANCED INFORMATION
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2015, Diodes Incorporated
www.diodes.com
AP22802
Document number: DS36218 Rev. 3 - 2
14 of 14
www.diodes.com
August 2015
© Diodes Incorporated
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