AP24x1

 AP2401/AP2411
Green
2.0A SINGLE CHANNEL CURRENT-LIMITED
POWER SWITCH WITH LATCH-OFF
Description
Pin Assignments
The AP2401 and AP2411 are single channel current-limited
(Top View)
integrated high-side power switches optimized for Universal Serial
8 NC
GND 1
Bus (USB) and other hot-swap applications. The family of devices
complies with USB standards and is available with both polarities of
IN 2
7 OUT
IN 3
6 OUT
EN 4
5 FLG
enable input.
The devices have fast short-circuit response time for improved overall
system robustness, and have integrated output discharge function to
ensure completely controlled discharging of the output voltage
SO-8
capacitor. They provide a complete protection solution for applications
(Top View)
subject to heavy capacitive loads and the prospect of short circuit,
and offer reverse current blocking, over-current, over-temperature
GND
1
8
NC
and short-circuit protection, as well as controlled rise time and
IN
2
7
OUT
IN
EN
3
6
4
5
OUT
FLG
under-voltage lockout functionality. A 7ms deglitch capability on the
open-drain Flag output prevents false over-current reporting and does
not require any external components. AP2401 and AP2411 will be
MSOP-8/MSOP-8EP
Note: Latter with exposed pad
(dotted line)
latched off after 7ms deglitch.
All
devices
are
available
in
SO-8,
MSOP-8,
MSOP-8EP,
U-DFN3030-8 and U-DFN2020-6 packages.
(Top View)
Features
GND
IN
IN
EN

Single Channel Current-Limited Power Switch

Output Discharge Function

Output Current Latch-Off when OCP Triggered

Fast Short-Circuit Response Time: 2µs

2.5A Accurate Current Limiting

Reverse Current Blocking

70mΩ On-Resistance

Input Voltage Range: 2.7V - 5.5V

Built-In Soft-Start with 0.6ms Typical Rise Time

Over-Current and Thermal Protection

Fault Report (FLG) with Blanking Time (7ms typ)

ESD Protection: 2kV HBM, 200V MM

Active Low (AP2401) or Active High (AP2411) Enable

Ambient Temperature Range: -40°C to +85°C

SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:

Halogen and Antimony Free. “Green” Device (Note 3) IEC60950-1 CB Scheme Certified
Notes:
6 OUT
4
5 FLG
Applications
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

7 OUT
3
U-DFN2020-6

UL Recognized, File Number E322375
8 NC
2
U-DFN3030-8
Available in “Green” Molding Compound (No Br, Sb)

1

LCD TVs & Monitors

Set-Top-Boxes, Residential Gateways

Laptops, Desktops, Servers, e-Readers

Printers, Docking Stations, HUBs
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
1 of 18
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March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Applications Circuit
Enable Active High
IN
Power Supply
2.7V to 5.5V
0.1uF
0.1uF
10k
Load
OUT
120uF
FLG
EN
ON
GND
OFF
Available Options
Part
Number
Channel
Enable Pin
(EN)
AP2401
1
Active Low
AP2411
1
Active High
Recommended Maximum
Continuous Load Current
(A)
Typical Output Latch-Off
Current Limit
(A)
Package
2.5
SO-8
MSOP-8
MSOP-8EP
U-DFN3030-8
U-DFN2020-6
2
Pin Descriptions
Pin Name
Pin Number
Function
MSOP-8EP,
U-DFN2020-6
U-DFN3030-8
1
2
Ground
1
Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to GND as close
2, 3
as possible. (all IN pins must be tied together externally)
GND
SO-8,
MSOP-8
1
IN
2, 3
EN
4
4
FLG
5
5
OUT
6, 7
6, 7
5
NC
8
8
6
Exposed Pad
—
Exposed Pad
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
3
4
Enable Input. Active low (AP2401) or active high (AP2411).
Over-temperature and over-current fault reporting with 7ms deglitch; active low open-drain
output. FLG is disabled for 7ms after turn-on.
Voltage Output Pin (all OUT pins must be tied together externally)
No Internal Connection. Recommend tie to OUT pins.
Exposed pad. It should be externally connected to GND plane and thermal mass for
Exposed Pad enhanced thermal impedance. Exposed pad should not be used as electrical ground
conduction path.
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March 2013
© Diodes Incorporated
AP2401/AP2411
Functional Block Diagram
Current
Sense
IN
OUT
Discharge
Control
UVLO
Driver
EN
Current
Limit
FLG
Deglitch
Thermal
Sense
GND
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
ESD MM
VIN
VOUT
VEN , VFLG
ILOAD
TJ(MAX)
TST
Notes:
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage (Note 4)
Output Voltage (Note 4)
Enable Voltage (Note 4)
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 4)
Ratings
4
300
Unit
kV
V
-0.3 to 6.5
-0.3 to VIN +0.3 or 6.5
-0.3 to VIN +0.3 or 6.5
Internal Limited
150
-65 to +150
V
V
V
A
°C
°C
4. All voltages referred to GND pin. Maximums are the lower of VIN + 0.3 and 6.5V
5. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C).
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol
VIN
IOUT
VIL
VIH
TA
Parameter
Input voltage
Output Current
EN Input Logic Low Voltage
EN Input Logic High Voltage
Operating Ambient Temperature
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
Min
2.7
0
0
2
-40
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Max
5.5
2
0.8
VIN
+85
Unit
V
A
V
V
°C
March 2013
© Diodes Incorporated
AP2401/AP2411
Electrical Characteristics (@TA = +25°C, VIN = +5.0V, CIN = 0.1µF, CL= 1µF, unless otherwise specified.)
Symbol
Parameter
VUVLO
Input UVLO
ΔVUVLO Input UVLO Hysteresis
ISHDN
Input Shutdown Current
IQ
ILEAK
IREV
RDS(ON)
Input Quiescent Current
Input Leakage Current
Reverse Leakage Current
Switch on-resistance
Test Conditions (Note 5)
VIN rising
VIN decreasing
Disabled, OUT = open
Enabled, OUT = open
Disabled, OUT grounded
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
TA = +25°C
VIN = 5V, IOUT= 2.0A
-40°C ≤ TA ≤ +85°C
TA = +25°C
VIN = 3.3V, IOUT= 2.0A
-40°C ≤ TA ≤ +85°C
Over-Load Current Limit
(Note 6)
VIN= 5V, VOUT= 4.5V
Current limiting trigger threshold
Short-Circuit Current Limit
Short-circuit Response Time
EN Input Logic Low Voltage
Output Current Slew rate (< 100A/s)
Enabled into short circuit
VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground)
VIN = 2.7V to 5.5V
EN Input Logic High Voltage
VIN = 2.7V to 5.5V
ILEAK-EN
EN Input leakage
VIN = 5V, VEN = 0V and 5.5V
ILEAK-O
TD(ON)
TR
TD(OFF)
TF
RFLG
IFOH
Output leakage current
Output turn-on delay time
Output turn-on rise time
Output turn-off delay time
Output turn-off fall time
FLG output FET on-resistance
FLG Off Current
Disabled, VOUT = 0V
CL = 1µF, RLOAD = 5Ω
CL = 1µF, RLOAD = 5Ω
CL = 1µF, RLOAD = 5Ω
CL = 1µF, RLOAD = 5Ω
IFLG = 10mA
VFLG = 5V
TBLANK
FLG blanking and latch off time
TDIS
RDIS
TSHDN
Discharge time
Discharge resistance (Note 7)
Thermal Shutdown Threshold
THYS
Thermal Shutdown Hysteresis
ILIMIT
ITrig
ISHORT
TSHORT
VIL
VIH
θJA
Notes:
Thermal Resistance Junction-toAmbient
Min
1.6
-40°C ≤ TA ≤+85°C
Assertion or deassertion due to overcurrent and overtemperature condition
CL= 1µF, VIN = 5V, disabled to VOUT < 0.5V
VIN = 5V, disabled, IOUT = 1mA
Enabled
Typ
2.0
50
0.1
Max
2.4
60
0.1
0.01
70
100
1
1
84
105
108
135
90
1
2.05
2.5
2.85
2.1
2.5
2.75
2
3.3
µA
µA
µA
mΩ
A
0.8
A
A
µs
V
0.01
1
µA
0.5
0.1
0.6
0.1
0.05
20
0.01
1
0.1
40
1
µA
ms
ms
ms
ms
Ω
µA
15
ms
2
4
Unit
V
mV
µA
V
7
1.5
0.6
100
140
ms
Ω
°C
SO-8 (Note 8)
MSOP-8 (Note 8)
MSOP-8EP (Note 9)
U-DFN3030-8 (Note 9)
20
96
130
92
84
°C
°C/W
°C/W
°C/W
°C/W
U-DFN2020-6 (Note 10)
90
°C/W
6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO.
The discharge function offers a resistive discharge path for the external storage capacitor for limited time.
8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
10. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
4 of 18
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March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Performance Characteristics
VEN
50%
TD(ON)
TD(ON)
90%
10%
10%
TD(OFF)
TR
TF
90%
50%
50%
TD(OFF)
TR
VOUT
VEN
50%
VOUT
TF
90%
90%
10%
10%
Figure 1 Voltage Waveforms: AP2401 (left), AP2411 (right)
All Enable Plots are for Enable Active Low
Turn-On Delay and Rise Time
TA=25°C
VIN=5V
CL=1µF
ROUT=2.5Ω
Vout
2V/div
Ven
5V/div
Turn-Off Delay and Fall Time
Vout
2V/div
Ven
5V/div
Device Disable
Device Enable
Iin
1A/div
Iin
1A/div
Turn-On Delay and Rise Time
Vout
2V/div
TA=25°C
VIN=5V
CL=120µF
ROUT=2.5Ω
Ven
5V/div
Turn-Off Delay and Fall Time
Inrush Current Limit
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
TA=25°C
VIN=5V
CL=120µF
ROUT=2.5Ω
Vout
2V/div
Ven
5V/div
Device Enable
Iin
1A/div
TA=25°C
VIN=5V
CL=1µF
ROUT=2.5Ω
Device Disable
Iin
1A/div
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© Diodes Incorporated
AP2401/AP2411
Typical Performance Characteristics (cont.)
Device Enabled Into Short-Circuit
TA=25°C
VIN=5V
CL=120µF
ROUT=1Ω
Ven
5V/div
Inrush Current
Ven
5V/div
TA=25°C
VIN=5V
CL=120µF,220uF, 470µF
ROUT=5Ω
CL=470µF
CL=220µF
Iout
0.5A/div
Iout
1A/div
Full-Load to Short-Circuit
Transient Response
CL=120µF
No-Load to Short-Circuit
Transient Response
Output Short Circuit
Vout
2V/div
Output Short Circuit
TA=25°C
VIN=5V
ROUT=2.5Ω
Iin
2A/div
FLG
5V/div
Device Turns off and Re-enables
Into Current-Limit
Device is latched-off
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
Vout
2V/div
Iin
2A/div
FLG
5V/div
6 of 18
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TA=25°C
VIN=5V
Device Turns off and Re-enables
Into Current-Limit
Device is latched-off
March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Performance Characteristics (cont.)
UVLO Increasing
Power ON
Vin
2V/div
FLG
5V/div
TA=25°C
VIN=5V
ROUT=2.5Ω
CL=120µF
IIout
1A/div
TA=25°C
VIN=5V
ROUT=2.5Ω
CL=120µF
Vout
5V/div
Iout
2A/div
Vin
5V/div
UVLO Decreasing
Vin
2V/div
TA=25°C
VIN=5V
ROUT=2.5Ω
CL=120µF
Iout
2A/div
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
7 of 18
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March 2013
© Diodes Incorporated
AP2401/AP2411
260
240
220
Turn-Off Time (µs)
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
2
200
180
160
140
120
100
80
60
CL = 1µF
40
RL = 5 
TA = 25°C
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Turn-On vs. Input Voltage
20
0
6
2
1000
100
900
90
800
80
700
70
Fall Time (µs)
Rise Time (µs)
Turn-On Time (µs)
Typical Performance Characteristics (cont.)
600
500
400
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Turn-Off vs. Input Voltage
6
2.5
3
6
60
50
40
30
300
20
CL = 1µF
200
RL = 5 
TA = 25°C
100
0
2.5
2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Rise Time vs. Input Voltage
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
10
0
6
8 of 18
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2
3.5
4
4.5
5
5.5
Input Voltage (V)
Fall Time vs. Input Voltage
March 2013
© Diodes Incorporated
AP2401/AP2411
Typical Performance Characteristics (cont.)
0.30
90
Supply Current Output Disabled (µA)
Supply Current Output Enabled (µA)
100
VIN = 5.5V
80
VIN = 5V
70
60
VIN = 3.3V
50
VIN = 2.7V
40
30
20
10
0
-50 - 25
25
50
75
100 125
Temperature (C)
Supply Current, Output Enabled vs. Temperature
0.05
VIN = 2.7V
-0.05
-0.10
-0.15
-0.20
-0.25
25
50
75
100 125
Temperature (C)
Supply Current, Output Disabled vs. Temperature
VIN = 2.7V
-25
0
VIN = 3.3V
VIN = 5V
-25
0
VIN = 5.5V
25
50
75
100
Temperature (°C)
RDS(ON) vs. Temperature
2.6
2.5
2.2
2.1
25
50
75
100 125
Temperature (°C)
Short-Circuit, Output Current vs. Temperature
UVLO Falling
1.85
1.80
1.75
Threshold Trip Current (A)
3.4
1.95
VIN = 5.5V
2.3
2.10
2.00
VIN = 5V
2.4
3.5
UVLO Rising
VIN = 3.3V
2.7
2.0
-50
125
2.05
VIN = 2.7V
2.8
2.15
1.70
1.65
-50
VIN = 3.3V
0
Short-Circuit Output Current (A)
RDS(ON) (m)
Undervoltage Lockout (V)
0.10
2.9
120
110
1.90
VIN = 5V
0.15
3.0
150
140
130
100
90
80
70
60
50
40
-50
0.20
-0.30
-50
0
180
170
160
VIN = 5.5V
0.25
-25
0
CL = 120µF
TA = 25°C
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
-25
2.5
0
25
50
75
100 125
Temperature (°C)
Undervoltage Lockout vs. Temperature
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
9 of 18
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2
2.5
3
3.5
4
4.5
5
5.5
Input Voltage (V)
Turn-Off vs. Input Voltage
6
March 2013
© Diodes Incorporated
AP2401/AP2411
Application Information
Power Supply Considerations
A 0.1μF to 2.2μF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external
power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device
maximum input rating during short circuit condition. In this case a 2.2μF or bigger capacitor is recommended. Placing a high-value electrolytic
capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that
may cause ringing on the input. Additionally, bypassing the output with a 0.1μF to 1.0μF ceramic capacitor improves the immunity of the device
to short circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the devices will limit the current until the overload condition is removed
or the internal deglitch time (7-ms typical) is reached and the device is turned off. The device will remain latched off even overload condition is
removed until power is cycled or the device enable is toggled.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before
VIN has been applied. The AP2401/AP2411 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT,
and turns off after deglitch time(7-ms typical).
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current
may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the
over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT current for deglitch time period
(7-ms typical), and then turned off.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2401/AP2411 is capable of delivering current
up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting
mode and output current is clamped at ILIMIT for deglitch time period (7-ms typical), and then turned off.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout.
When that happens, the FLG will remain low and the switch will be latched off until the fault condition is removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2401/AP2411 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I
2
Finally, calculate the junction temperature:
TJ = PD x RJA + TA
Where:
TA= Ambient temperature°C
RJA = Thermal resistance
PD = Total power dissipation
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2401/AP2411 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately +140°C due to excessive power dissipation in an over-current condition, the internal thermal sense circuitry
turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to
cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is
removed. The FLG open-drain output is asserted when an over-temperature shutdown occurs with 7-ms deglitch.
When the FLG is asserted, the switch will be latched off until the temperature drops to 20°C below the thermal shutdown threshold and the power
or EN pin is cycled.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
10 of 18
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AP2401/AP2411
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V,
even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implementation is activated
and
offers
a resistive discharge path for the external storage capacitor. This is designed for discharging any
residue of the output voltage when either no external output resistance or load resistance is present at the output.
Ordering Information
Part
Number
Status
AP24X1S-13
New Product
S
SO-8
AP24X1M8-13
AP24X1MP-13
AP24X1FGE-7
AP24X1SN-7
New Product
New Product
New Product
Preview
M8
MP
FGE
SN
MSOP-8
MSOP-8EP
U-DFN3030-8
U-DFN2020-6
Package
Code
Packaging
7”/13” Tape and Reel
Quantity
Part Number Suffix
2500/Tape & Reel
-13
2500/Tape & Reel
2500/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
-13
-13
-7
-7
Marking Information
(1) SO-8
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
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© Diodes Incorporated
AP2401/AP2411
Marking Information (cont.)
(2)
MSOP-8
(3)
MSOP-8EP
(4)
U-DFN3030-8
( Top View )
XX
YW X
Part Number
AP2401FGE-7
AP2411FGE-7
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Internal Code
Package
U-DFN3030-8
U-DFN3030-8
Identification Code
BD
BF
(5) U-DFN2020-6
( Top View )
XX
YW X
Part Number
AP2401SN-7
AP2411SN-7
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Internal Code
Package
U-DFN2020-6
U-DFN2020-6
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Identification Code
DD
DF
March 2013
© Diodes Incorporated
AP2401/AP2411
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Package type: SO-8
0.254
1.
E1 E
A1
Gauge Plane
Seating Plane
L
Detail ‘A’
h
7°~9°
45°
Detail ‘A’
A2 A A3
b
e
D
2.
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0
8

All Dimensions in mm
Package type: MSOP-8
D
4x
10
°
0.25
E Gauge Plane
x
Seating Plane
a
y
4x10°
L
Detail C
1
b
E3
A3
A2
A
e
A1
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
E1
c
See Detail C
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MSOP-8
Dim Min Max Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
e
0.65
L 0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
March 2013
© Diodes Incorporated
AP2401/AP2411
Package Outline Dimensions (cont.) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
3.
Package type: MSOP-8EP
D
4X
10
°
x
E
0.25
D1
E2
Gauge Plane
Seating Plane
a
y
1
4X
10
°
8Xb
e
Detail C
E3
A1
A3
c
A2
A
L
D
E1
See Detail C
4.
Package type: U-DFN3030-8 Type E
U-DFN3030-8
Type E
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
0.15


b
0.20 0.30 0.25
D
2.95 3.05 3.00
D2 2.15 2.35 2.25
E
2.95 3.05 3.00
e
0.65


E2 1.40 1.60 1.50
L
0.30 0.60 0.45
Z
0.40


All Dimensions in mm
A
A3
A1
D
D2
L (x8)
E
E2
Z (x4)
5.
MSOP-8EP
Dim Min Max Typ
A
1.10
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b
0.22 0.38 0.30
c
0.08 0.23 0.15
D
2.90 3.10 3.00
D1 1.60 2.00 1.80
E
4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
0.750
y
0.750
All Dimensions in mm
e
b (x8)
Package type: U-DFN2020-6
A
A3
SEATING PLANE
A1
Pin#1 ID
D
D2
D2/2
E
E2
L
e
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
U-DFN2020-6
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.03
A3

 0.15
b
0.20 0.30 0.25
D
1.95 2.075 2.00
D2 1.45 1.65 1.55
e

 0.65
E
1.95 2.075 2.00
E2
0.76 0.96 0.86
L
0.30 0.40 0.35
All Dimensions in mm
b
14 of 18
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March 2013
© Diodes Incorporated
AP2401/AP2411
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package type: SO-8
X
Dimensions
X
Y
C1
C2
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
Y
(2) Package type: MSOP-8
X
C
Y
Dimensions Value (in mm)
C
0.650
X
0.450
Y
1.350
Y1
5.300
Y1
(3) Package type: MSOP-8EP
X
C
Dimensions
C
G
X
X1
Y
Y1
Y2
Y
G
Y2
Y1
X1
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
15 of 18
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Value
(in mm)
0.650
0.450
0.450
2.000
1.350
1.700
5.300
March 2013
© Diodes Incorporated
AP2401/AP2411
Suggested Pad Layout (cont.)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4) Package type: U-DFN3030-8 Type E
X (x8)
C
Y
(x8)
Y1
Dimensions
C
C1
X
Y
Y1
Y2
Y2
Value (in mm)
0.65
2.35
0.30
0.65
1.60
2.75
C1
(5) Package type: U-DFN2020-6
Y
C
Dimensions
Z
G
X1
X2
Y
C
G
X2
X1
Value (in mm)
1.67
0.15
0.90
0.45
0.37
0.65
G
Y
Z
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
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March 2013
© Diodes Incorporated
AP2401/AP2411
Taping Orientation (Note 11)
For U-DFN2020-6 and U-DFN3030-8 Type E
Note:
11. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
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March 2013
© Diodes Incorporated
AP2401/AP2411
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
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March 2013
© Diodes Incorporated
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