TL431AMSDT NXP Product Reliability

Reliability Investigation Results, Type: TL431AMSDT
Time period Q4/2012 to Q3/2013
AEC Q100 Test
Conditions
Duration
Quantity
Rejects
all parts
see
below
6720
0
# E1
TEST
Pre- and Post-Stress
Electrical Test
Ta = 25 °C
N/A
# A1
PC
Preconditioning
JESD22-A113
Bake Ta = 125 °C
Soak Ta = 85 °C, RH = 85%
Reflow soldering
24 hours
168 hours
3 cycles
# A2
THB
Temperature Humidity
Bias
JESD22-A101
Ta = 85 °C, RH = 85%
Vref = 0 V, VKA = 36 V
1000 hours
1680
0
# A3
AC
Autoclave
JESD22-A102
Ta = 121 °C, RH = 100%
Pressure = 205 kPa (29.7 psia)
96 hours
1680
0
# A4
TC
Temperature Cycling
JESD22-A104
-65 °C to +150 °C
1000 cycles
1680
0
# A5
IOL
Intermittent Operating Life
MIL-STD-750 Method 1037
ton = toff = 2min
P = 250 mW to insure ΔTj = 100 °C
for 15000 cycles
1000 hours
1680
0
Ta = 150°C, Vref = 0V,
VKA = 36V
1000 hours
1680
0
JESD22-A111 / JESD22 -B106
260 °C ± 5 °C
10 s
630
0
JESD22-B102
245 °C ± 5 °C
3s
5490
0
# B1
# C3
HTOL
High Temperature
Operating Life
RSH
Resistance to Solder Heat
SD
Solderability
Calculation of FIT and MTBF
Test considered for FIT calculation: High Temp. Operating Life (HTOL, AEC Q100 Test # B1)
Confidence level 60%, derated to 55 °C, activation energy 0.7 eV, test time 168-1000 hours
Wafer Fab
Technology
Quantity
Rejects
Failure Rate
MTBF
NXP DHAM
Bipolar Analog Power
1680
0
2.53 FIT
45130 years
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