506BP

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8, 2.0x2.2, 0.5P
CASE 506BP−01
ISSUE A
8
DATE 13 JAN 2010
1
SCALE 4:1
D
PIN ONE
REFERENCE
2X
A B
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
ÏÏÏ
ÏÏÏ
ÏÏÏ
DETAIL A
E
ALTERNATE TERMINAL
CONSTRUCTIONS
0.10 C
2X
0.10 C
ÎÎÎ
ÎÎÎ
ÏÏÏ
EXPOSED Cu
TOP VIEW
(A3)
DETAIL B
0.05 C
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
A
MOLD CMPD
DETAIL B
9X
ALTERNATE
CONSTRUCTIONS
0.05 C
NOTE 4
SIDE VIEW A1
C
SEATING
PLANE
D2
DETAIL A
L
1
8
K
5
e
BOTTOM VIEW
1.05
0.20
0.25
---
8X b
0.05 C
NOTE 3
XXMG
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Device
0.10 C A B
0.10 C A B
e/2
1.43
1
4
E2
8X
0.20
MILLIMETERS
TYP
MAX
--1.00
--0.05
0.20 REF
--0.30
2.00 BSC
--1.53
2.20 BSC
--1.25
0.50 BSC
0.22
0.30
--0.35
--0.15
GENERIC
MARKING DIAGRAM*
0.10 C A B
8X
MIN
0.80
0.00
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
1.63
ÎÎ
Î
ÎÎ
ÎÎ
ÎÎÎÎÎÎÎ
1.15
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
1
0.50
PITCH
8X
0.45
2.50
8X
0.28
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON38697E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8, 2.0X2.2, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON38697E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY C. GOYON.
18 FEB 2009
A
CHANGED DRAWINGS TO PLACE LEADS ON SHORTER SIDE OF PACKAGE.
ADDED NOMINAL VALUE FOR DIMENSION K.
13 JAN 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2010
January, 2010 − Rev. 01A
Case Outline Number:
506BP
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