567JW

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP6, 1.31x1.04
CASE 567JW
ISSUE O
SCALE 4:1
DATE 29 APR 2014
ÈÈ
ÈÈ
D
PIN A1
REFERENCE
0.10 C
2X
0.10 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
A B
E
DIM
A
A1
A2
b
D
E
eD
eE
TOP VIEW
A2
0.10 C
MILLIMETERS
MIN
MAX
0.50
0.62
0.17
0.23
0.33
0.39
0.24
0.29
1.31 BSC
1.04 BSC
0.40 BSC
0.60 BSC
GENERIC
MARKING DIAGRAM*
A
0.05 C
6X
NOTE 3
6X
A1
C
SIDE VIEW
b
SEATING
PLANE
eD
XXXX
A
Y
WW
G
eE
0.05 C A B
B
0.03 C
A
3
2
XXXXG
AYWW
1
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.40
PACKAGE
OUTLINE
0.60
6X
0.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON84939F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP6, 1.31X1.04
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON84939F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY S. RAO.
DATE
29 APR 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. O
Case Outline Number:
567JW