BTS5210G Data Sheet (326 KB, EN)

Data Sheet, Rev. 1.3, April 2009
BTS5210G
Smart High-Side Power Switch
PROFET
Automotive
Smart High-Side Power Switch
BTS5210G
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Data Sheet
Block Diagram
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channel 1
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Data Sheet
3
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Pin Definitions and Functions
Pin
Symbol
1,7,
8,14
Vbb
2
3
5
4
6
GND
IN1
IN2
ST1
ST2
12,13
OUT1
9,10
OUT2
Output 1,2 protected high-side power output of
channel 1,2. Design the wiring for the max.
short circuit current; both output pins have to
be connected in parallel for operation
according this spec.
11
NC
Not Connected
Data Sheet
Function
Positive power supply voltage. Design the
wiring for the simultaneous max. short circuit
currents from channel 1 to 2 and also for low
thermal resistance
Logic Ground
Input 1,2 activates channel 1,2 in case
of logic high signal
Diagnostic feedback 1,2 of channel 1,2
open drain
4
Pin configuration
(top view)
Vbb
GND
IN1
ST1
IN2
ST2
Vbb
1
2
3
4
5
6
7
•
14
13
12
11
10
9
8
Vbb
OUT1
OUT1
NC
OUT2
OUT2
Vbb
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Parameter
Symbol
Supply voltage (overvoltage protection see page 6)
Supply voltage for full short circuit protection
Tj,start = -40 ...+150°C
Load current (Short-circuit current, see page 6)
Load dump protection1) VLoadDump = VA + Vs, VA = 13.5 V
RI2) = 2 Ω, td = 400 ms; IN = low or high,
each channel loaded with RL = 13.5 Ω,
Operating temperature range
Storage temperature range
Power dissipation (DC)4)
Ta = 25°C:
(all channels active)
Ta = 85°C:
Maximal switchable inductance, single pulse
Vbb = 12V, Tj,start = 150°C4), see diagrams on page 10
IL = 2.9 A, EAS = 65 mJ, 0 Ω
one channel:
IL = 5.7 A, EAS = 125 mJ, 0 Ω
two parallel channels:
Electrostatic discharge capability (ESD)
IN:
(Human Body Model)
ST:
out to all other pins shorted:
Vbb
Vbb
Values
Unit
43
36
V
V
IL
VLoad dump3)
self-limited
60
A
V
Tj
Tstg
Ptot
-40 ...+150
-55 ...+150
3,05
1,59
°C
11,2
5,6
mH
1.0
4.0
8.0
kV
-10 ... +16
±0.3
±5.0
±5.0
V
mA
ZL
VESD
W
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
R=1.5kΩ; C=100pF
Input voltage (DC) see internal circuit diagram page 9
Current through input pin (DC)
Pulsed current through input pin5)
Current through status pin (DC)
1)
2)
3)
4)
5)
VIN
IIN
IINp
IST
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150Ω
resistor for the GND connection is recommended.
RI = internal resistance of the load dump test pulse generator
VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70μm thick) copper area for Vbb
connection. PCB is vertical without blown air. See page 14
only for testing
Data Sheet
5
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Parameter and Conditions
Thermal resistance
junction - soldering point6)7)
junction – ambient6)
@ 6 cm2 cooling area
Symbol
each channel: Rthjs
Rthja
one channel active:
all channels active:
Values
min
typ
max
Unit
15
----
K/W
Values
min
typ
max
Unit
-----
--45
40
Electrical Characteristics
Parameter and Conditions, each of the four channels
Symbol
at Tj = -40...+150°C, Vbb = 12 V unless otherwise specified
Load Switching Capabilities and Characteristics
On-state resistance (Vbb to OUT); IL = 2 A
each channel,
Tj = 25°C: RON
Tj = 150°C:
two parallel channels, Tj = 25°C:
----
110
210
55
140
280
70
mΩ
1.8
3.4
2.4
3.9
--
A
--
--
2
mA
---
100
100
250
270
μs
0.2
0.2
---
1.0
1.1
V/μs
V/μs
see diagram, page 11
Nominal load current
one channel active: IL(NOM)
two parallel channels active:
Device on PCB6), Ta = 85°C, Tj ≤ 150°C
Output current while GND disconnected or pulled up8); IL(GNDhigh)
Vbb = 32 V, VIN = 0,
see diagram page 9
Turn-on time9)
Turn-off time
RL = 12 Ω
Slew rate on 9)
Slew rate off 9)
6)
7)
8)
9)
IN
IN
to 90% VOUT: ton
to 10% VOUT: toff
10 to 30% VOUT, RL = 12 Ω: dV/dton
70 to 40% VOUT, RL = 12 Ω: -dV/dtoff
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70μm thick) copper area for Vbb
connection. PCB is vertical without blown air. See page 14
Soldering point: upper side of solder edge of device pin 15. See page 14
not subject to production test, specified by design
See timing diagram on page 12.
Data Sheet
6
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Parameter and Conditions, each of the four channels
Symbol
at Tj = -40...+150°C, Vbb = 12 V unless otherwise specified
Values
min
typ
max
Unit
Operating Parameters
Operating voltage
Undervoltage switch off10)
Overvoltage protection12)
I bb = 40 mA
Standby current13)
VIN = 0; see diagram page 11
Vbb(on)
Tj =-40°C...25°C: Vbb(u so)
Tj =125°C:
Vbb(AZ)
Tj =-40°C...25°C: Ibb(off)
Tj =150°C:
Tj =125°C:
Off-State output current (included in Ibb(off))
IL(off)
VIN = 0; each channel
Operating current 14), VIN = 5V,
one channel on: IGND
all channels on:
Protection Functions15)
Current limit, Vout = 0V, (see timing diagrams, page 12)
Tj =-40°C: IL(lim)
Tj =25°C:
=+150°C:
Tj
Repetitive short circuit current limit,
Tj = Tjt
each channel IL(SCr)
two channels
5.5
--41
---47
40
4.5
4.511)
52
V
V
-----
5
--1
8
12
811)
5
μA
---
0.5
1.0
0.9
1.7
mA
--5
-9
--
14
---
A
---
6.5
6.5
---
A
--
2
--
ms
41
47
52
V
150
--
-10
---
°C
K
V
μA
(see timing diagrams, page 12)
Initial short circuit shutdown time
Vout = 0V
Tj,start =25°C: toff(SC)
(see timing diagrams on page 12)
VON(CL)
Output clamp (inductive load switch off)16)
at VON(CL) = Vbb - VOUT, IL= 40 mA
Tjt
ΔTjt
Thermal overload trip temperature
Thermal hysteresis
10)
11)
12)
13)
14)
15)
16)
is the voltage, where the device doesn´t change it´s switching condition for 15ms after the supply voltage
falling below the lower limit of Vbb(on)
not subject to production test, specified by design
Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150Ω
resistor for the GND connection is recommended). See also VON(CL) in table of protection functions and
circuit diagram on page 9.
Measured with load; for the whole device; all channels off
Add IST, if IST > 0
Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not
designed for continuous repetitive operation.
If channels are connected in parallel, output clamp is usually accomplished by the channel with the lowest
VON(CL)
Data Sheet
7
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Parameter and Conditions, each of the four channels
Symbol
at Tj = -40...+150°C, Vbb = 12 V unless otherwise specified
Reverse Battery
Reverse battery voltage 17)
Drain-source diode voltage (Vout > Vbb)
IL = - 2.0 A, Tj = +150°C
-Vbb
-VON
Values
min
typ
max
Unit
---
-600
32
--
V
mV
Diagnostic Characteristics
Open load detection voltage
V OUT(OL)
1.7
2.8
4.0
V
Input and Status Feedback18)
Input resistance
RI
2.5
4.0
6.0
kΩ
VIN(T+)
VIN(T-)
Δ VIN(T)
td(STon)
-1.0
---
--0.2
10
2.5
--20
V
V
V
—s
td(STon)
30
--
--
—s
td(SToff)
--
--
500
—s
td(SToff)
--
--
20
—s
IIN(off)
IIN(on)
5
10
-35
20
60
μA
μA
VST(high)
VST(low)
5.4
--
---
-0.6
V
1
(see circuit page 9)
Input turn-on threshold voltage
Input turn-off threshold voltage
Input threshold hysteresis
Status change after positive input slope19)
with open load
Status change after positive input slope19)
with overload
Status change after negative input slope
with open load
Status change after negative input slope19)
with overtemperature
Off state input current
VIN = 0.4 V:
On state input current
VIN = 5 V:
Status output (open drain)
Zener limit voltage
IST = +1.6 mA:
ST low voltage
IST = +1.6 mA:
17)
Requires a 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Power dissipation is higher compared to normal operating
conditions due to the voltage drop across the drain-source diode. The temperature protection is not active
during reverse current operation! Input and Status currents have to be limited (see max. ratings page 4 and
circuit page 9).
18) If ground resistors R
GND are used, add the voltage drop across these resistors.
19) not subject to production test, specified by design
Data Sheet
8
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Truth Table
( each channel )
Normal operation
Open load
Overtemperature
L = "Low" Level
H = "High" Level
IN
OUT
ST
L
H
L
H
L
H
Z
H
H
H
L
H
L
L
L20)
H
H
L
X = don't care
Z = high impedance, potential depends on external circuit
Status signal valid after the time delay shown in the timing diagrams
Parallel switching of channel 1 and 2 is easily possible by connecting the inputs and outputs in parallel (see truth
table). If switching channel 1 to 2 in parallel, the status outputs ST1 and ST2 have to be configured as a 'Wired
OR' function with a single pull-up resistor.
Terms
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Leadframe (Vbb) is connected to pin 1,7,8,14
External RGND optional; single resistor RGND = 150 Ω for reverse battery protection up to the max.
operating voltage.
20)
L, if potential at the Output exceeds the OpenLoad detection voltage
Data Sheet
9
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Input circuit (ESD protection), IN1 or IN2
Overvolt. and reverse batt. protection
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The use of ESD zener diodes as voltage clamp at DC
conditions is not recommended.
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Status output, ST1 or ST2
VZ1 = 6.1 V typ., VZ2 = 47 V typ., RGND = 150 Ω,
RST= 15 kΩ, RI= 3.5 kΩ typ.
In case of reverse battery the load current has to be
limited by the load. Temperature protection is not
active
9
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Open-load detection, OUT1 or OUT2
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OFF-state diagnostic condition:
Open Load, if VOUT > 3 V typ.; IN low
ESD-Zener diode: 6.1 V typ., max 0.3 mA; RST(ON) < 375 Ω
at 1.6 mA. The use of ESD zener diodes as voltage clamp at
DC conditions is not recommended.
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Any kind of load. In case of IN = high is VOUT ≈ VIN - VIN(T+).
Due to VGND > 0, no VST = low signal available.
Data Sheet
10
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
GND disconnect with GND pull up
Inductive load switch-off energy
dissipation
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Vbb disconnect with energized inductive
load
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Any kind of load. If VGND > VIN - VIN(T+) device stays off
Due to VGND > 0, no VST = low signal available.
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Energy stored in load inductance:
2
EL = 1/2·L·I L
While demagnetizing load inductance, the energy
dissipated in PROFET is
EAS= Ebb + EL - ER= VON(CL)·iL(t) dt,
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Maximum allowable load inductance for
a single switch off (one channel)4)
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For inductive load currents up to the limits defined by ZL
(max. ratings and diagram on page 10) each switch is
protected against loss of Vbb.
/ I,/Tj,start = 150°C, Vbb = 12 V, RL = 0 Ω
ZL [mH]
Consider at your PCB layout that in the case of Vbb disconnection with energized inductive load all the load current
flows through the GND connection.
IL [A]
Data Sheet
11
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Typ. on-state resistance
521 I9EE7M; IL = 2 A, IN = high
RON [mOhm]
7M ƒ&
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Vbb [V]
Typ. standby current
,EERII I7M; Vbb = 9...34 V, IN1,2 = low
Ibb(off) [μA]
Tj [°C]
Data Sheet
12
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Timing diagrams
All channels are symmetric and consequently the diagrams are valid for channel 1 to
channel 4
Figure 2b: Switching a lamp:
Figure 1a: Vbb turn on:
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Figure 2a: Switching a resistive load,
turn-on/off time and slew rate definition:
Figure 3a: Turn on into short circuit:
shut down by overtemperature, restart by cooling
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Data Sheet
Heating up of the chip may require several milliseconds, depending
on external conditions
13
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Figure 5a: Open load: detection in OFF-state, turn
on/off to open load
Open load of channel 1; other channels normal
operation
Figure 3b: Turn on into short circuit:
shut down by overtemperature, restart by cooling
(two parallel switched channels 1 and 2)
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ST1 and ST2 have to be configured as a 'Wired OR' function
ST1/2 with a single pull-up resistor.
Figure 6a: Status change after, turn on/off to
overtemperature
Overtemperature of channel 1; other channels normal
operation
Figure 4a: Overtemperature:
Reset if Tj <Tjt
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Data Sheet
14
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Package Outlines
1.75 MAX.
1)
4 -0.2
B
1.27
0.64 ±0.25
0.1
2)
0.41+0.10
-0.06
0.2 M
14
6±0.2
A B 14x
0.2 M C
8
1
7
1)
8.75 -0.2
8˚MAX.
0.19 +0.06
0.175 ±0.07
(1.47)
0.35 x 45˚
C
A
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Lead width can be 0.61 max. in dambar area
GPS01230
Figure 1
PG-DSO-14-37 (Plastic Dual Small Outline Package) (RoHS-compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pbfree finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Please specify the package needed (e.g. green package) when placing an order
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Data Sheet
15
Dimensions in mm
Rev. 1.3, 2009-04-16
Smart High-Side Power Switch
BTS5210G
Revision History
Version
Date
Changes
Rev. 1.3
2009-04-16
Modification of the package name extension.
V1.2
2007-09-25
Modification of the package drawing.
V1.1
2007-05-29
Creation of the green datasheet.
First page :
Adding the green logo and the AEC qualified
Adding the bullet AEC qualified and the RoHS compliant features
Package page
Modification of the package to be green.
Data Sheet
16
Rev. 1.3, 2009-04-16
Edition 2009-04-16
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
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characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
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Infineon Technologies components may be used in life-support devices or systems only with the express written
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