AP2303

A Product Line of
Diodes Incorporated
AP2303
DDR BUS TERMINATION REGULATOR
Description
Pin Assignments
NEW PRODUCT
The AP2303 is a low dropout linear regulator to generate termination
voltage of DDR-SDRAM system. The regulator can source or sink up
to 1.75A current continuously. The output voltage is regulated to track
tightly with the reference voltage (1/2VDDQ) within ±10mV.
(Top View)
The AP2303 supports soft start-up when used to turn on the VCNTL
and VREFEN. It integrates a shutdown circuit that will be triggered
once the voltage of VIN, VCNTL or VREFEN falls below a certain
value.
VIN
1
8
NC
GND
2
7
NC
VREFEN
3
6
VCNTL
VOUT
4
5
NC
8
NC
7
NC
6
VCNTL
5
NC
AP2303 features over temperature protection and current limit
protection for both source and sink.
SOIC-8
AP2303 is available in packages of SOIC-8 and PSOP-8.
(Top View)
Features










Support DDR-II (VTT=0.9V), DDR-III (VTT=0.75V), DDR-IIIL
(VTT=0.675V), DDR-IV (VTT=0.6V) Application
Source and Sink up to 1.75A Current
Output Voltage Accuracy Over Full Load: ±2% (Max.)
Soft Start-up and Shutdown along with VIN, VCNTL and VREFEN
Rising and Shutdown along with VIN, VCNTL and VREFEN Dropping
Flexible Output by 2 External Resistors
Requires Minimum 10µF Output Ceramic Capacitor for
Application
Current Limit Protection for Both Source and Sink
OTSD Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Notes:
VIN
1
GND
2
VREFEN
3
VOUT
4
Exposed
Pad
PSOP-8
Applications




DDR-II/DDR-III/DDR-IIIL/DDR-IV Memory System
Desktop PC, Notebook Mother Board
Graphic Card
STB, LCD-TV, Web-TV
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Typical Applications Circuit
VCNTL=3.3V/5V
VIN=1.8V/1.5V/1.35V/1.2V
CCNTL
1
VIN
R1
3
Shutdown
R2
Enable
AP2303
Document number: DS36546 Rev. 3 - 2
VREFEN
CSS
6
VCNTL
AP2303 VOUT
GND
2
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RTT
CIN
4
COUT RDUMMY
September 2014
© Diodes Incorporated
A Product Line of
Diodes Incorporated
AP2303
NEW PRODUCT
Pin Descriptions
Pin Number
Pin Name
Function
1
VIN
Unregulated input supply. A small 10µF MLCC should be connected from this pin to GND.
2
GND
Ground
3
VREFEN
Reference voltage input and active low shutdown control pin. Pulling the pin to ground turns off
device by BJT or FET. When it is released, a soft-start will take for about 0.1ms.
4
VOUT
Regulated voltage output. A minimum of 10µF ceramic capacitor to ground is required to assure
stability.
5, 7, 8
NC
6
VCNTL
–
Exposed Pad
No Connection
VCNTL supplies the internal control circuitry and provides the drive voltage.
The exposed pad should be connected to ground copper for better heat dissipation performance.
Functional Block Diagram
VCNTL
VIN
6
1
Power On
Reset
Thermal
Shutdown
3
VREFEN
OTSD
EN
POR
Error
Amplifier
and
Soft Start
4
VOUT
Enable
VREF
Current Limit
2
GND
AP2303
Document number: DS36546 Rev. 3 - 2
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AP2303
Absolute Maximum Ratings (Note 4)
NEW PRODUCT
Symbol
Rating
Unit
VIN
Power Input Voltage
-0.3 to 6
V
VCNTL
Control Input Voltage
-0.3 to 6
V
VREFEN
Reference Input Voltage
-0.3 to 6
V
TSTG
Storage Temperature
+150
°C
TJ
Junction Temperature
+150
°C
Lead Temperature (Soldering, 10sec)
+260
°C
TLEAD
θJA
θJC
Notes:
Parameter
PSOP-8
80
SOIC-8
110
PSOP-8
38
SOIC-8
50
Thermal Resistance (Junction to Ambient) (Note 5)
°C/W
Thermal Resistance (Junction to Case)
°C/W
ESD
ESD (Human Body Model)
2000
V
ESD
ESD (Machine Model)
200
V
4. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied.
Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.
5. θJA is measured with the component mounted on a 2-Layer FR-4 board with 2.54cm*2.54cm thermal sink pad in free air.
Recommended Operating Conditions
Symbol
Min
Max
Unit
Control Input Voltage (Note 6)
3.0
5.5
V
Power Input Voltage
1.2
5.5
V
Reference Input Voltage
0.6
VCNTL-2.2
V
TJ
Operating Junction Temperature Range
-40
+125
°C
TA
Operating Ambient Temperature Range
-40
+85
°C
VCNTL
VIN
VREFEN
Note 6:
Parameter
Keep VCNTL ≥ VIN in operation power on and power off sequences.
AP2303
Document number: DS36546 Rev. 3 - 2
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A Product Line of
Diodes Incorporated
AP2303
Electrical Characteristics
(@TA = +25°C, VIN = 1.8V/1.5V/1.35V/1.2V, VCNTL = 3.3V, VREFEN = 0.9V/0.75V/0.675V/0.6V, CIN = 10µF
(Ceramic), COUT = 10µF (Ceramic), unless otherwise specified.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Input
VCNTL Operating Current
No Load
–
0.5
1.5
mA
VCNTL Input Current in Shutdown Mode
VREFEN < 0.15V
–
30
50
µA
ISD-VIN
VIN Input Current in Shutdown Mode
VREFEN < 0.15V
-1
–
1
µA
IVREFEN
VREFEN Leakage Current
VREFEN = 0.75V
-1
–
1
µA
Output Offset Voltage (Note 7)
No Load
-10
0
10
mV
VCNTL = 3.3V, IOUT = 1A
–
220
–
VCNTL = 3.3V, IOUT = 1.5A
–
400
–
VCNTL = 3.3V, IOUT = 1.75A
–
520
–
IOUT = 0A to 1.75A
-20
–
20
IOUT = 0A to -1.75A
-20
–
20
Source
1.75
–
–
Sink
–
–
-1.75
VOUT = 0V
–
2
–
VOUT = VIN
–
-2
–
Thermal Shutdown Temperature
3.3V ≤ VCNTL ≤ 5V
–
+160
–
°C
Thermal Shutdown Hysteresis
–
–
+30
–
°C
Output = High
0.4
–
–
Output = Low
–
–
0.15
Output = High
2.9
–
–
Output = Low
–
–
2.2
Output = High
1.1
–
–
Output = Low
–
–
0.4
NEW PRODUCT
IVCNTL
ISD-VCNTL
Output
VOS
VDROPOUT
VLOAD
Dropout Voltage
Load Regulation
mV
mV
Protection
ILIMIT
ISHORT
TSHDN
–
Current Limit
A
Short Current
A
Start-up & Shutdown Function
VIH
VREFEN Shutdown Threshold Voltage
VIL
VCNTL-ON
V
VCNTL Shutdown Threshold Voltage
VCNTL-OFF
VIN-ON
V
VIN Shutdown Threshold Voltage
VIN-OFF
Note 7:
V
VOS is the voltage measurement defined as VOUT subtracted from VREFEN.
AP2303
Document number: DS36546 Rev. 3 - 2
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AP2303
Performance Characteristics
Output Offset Voltage vs. Ambient Temperature
Dropout Voltage vs. Output Current
3.0
700
650
VCNTL=3.3V
600
2.5
o
TA=-40 C
Dropout Voltage (mV)
Output Offset Voltage (mV)
2.0
1.5
1.0
o
TA=25 C
500
o
TA=85 C
450
400
350
300
250
200
150
0.5
100
50
0.0
-40
-20
0
20
40
60
80
100
0
0.00
120
0.25
0.50
0.75
1.00
1.25
1.50
1.75
Ambient Temperature ( C)
Output Current (A)
Source Current Limit vs. VCNTL Input Voltage
Sink Current Limit vs. VCNTL Input Voltage
4.0
-4.0
3.8
-3.8
3.6
-3.6
3.4
-3.4
3.2
-3.2
Sink Current Limit (A)
Source Current Limit (A)
o
3.0
2.8
2.6
2.4
2.2
2.0
VIN=1.5V, VREFEN=0.75V
1.8
o
TA=-40 C
1.6
-2.8
-2.6
-2.4
-2.2
-2.0
VIN=1.5V, VREFEN=0.75V
-1.8
o
o
TA=-40 C
o
-1.4
TA=25 C
-1.2
TA=85 C
TA=85 C
1.2
-3.0
-1.6
TA=25 C
1.4
1.0
o
o
-1.0
3.0
3.2
3.4
3.6
3.8
4.0
4.2
4.4
4.6
4.8
5.0
3.0
3.2
3.4
3.6
VCNTL Input Voltage (V)
3.8
4.0
4.4
4.6
4.8
5.0
VCNTL Standby Current vs. Ambient Temperature
700
40
VCNTL=5V
VCNTL=5V, VREFEN=0.15V
35
VCNTL Standby Current (A)
650
600
550
500
450
400
-40
4.2
VCNTL Input Voltage (V)
VCNTL Operating Input Current vs. Ambient Temperature
VCNTL Operating Input Current (A)
NEW PRODUCT
550
30
25
20
15
10
-20
0
20
40
60
80
100
120
-40
o
AP2303
Document number: DS36546 Rev. 3 - 2
-20
0
20
40
60
80
100
120
o
Ambient Temperature ( C)
Ambient Temperature ( C)
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AP2303
Performance Characteristics (Cont.)
Output Voltage vs. Source Current (DDR-III)
Output Voltage vs. Sink Current (DDR-III)
0.770
0.770
VIN=1.5V, VCNTL=3.3V, VREFEN=0.75V
0.765
0.765
o
TA=-40 C
o
TA=25 C
0.760
0.760
Output Voltage (V)
Output Voltage (V)
0.755
0.750
0.745
0.740
0.755
0.750
0.745
VIN=1.5V, VCNTL=3.3V, VREFEN=0.75V
o
0.740
TA=-40 C
o
0.735
TA=25 C
0.735
0.730
0.00
0.25
0.50
0.75
1.00
1.25
1.50
o
TA=85 C
0.730
0.00
1.75
-0.25
-0.50
Source Current (A)
-0.75
-1.00
-1.25
-1.50
-1.75
Sink Current (A)
Output Voltage vs. Source Current (DDR-IV)
Output Voltage vs. Sink Current (DDR-IV)
0.620
0.620
VIN=1.2V, VCNTL=3.3V, VREFEN=0.6V
0.615
0.615
o
TA=-40 C
o
TA=25 C
0.610
0.610
Output Voltage (V)
Output Voltage (V)
o
TA=85 C
0.605
0.600
0.595
0.605
0.600
0.595
VIN=1.2V, VCNTL=3.3V, VREFEN=0.6V
0.590
0.590
o
TA=-40 C
o
TA=25 C
0.585
0.585
0.580
0.00
0.580
0.00
6
o
TA=85 C
0.25
0.50
0.75
1.00
1.25
1.50
1.75
-0.25
-0.50
-0.75
-1.00
-1.25
-1.50
-1.75
Source Current (A)
Sink Current (A)
VIN Input Current vs. VIN Input Voltage
VIN Input Current vs. VCNTL Input Voltage
2000
7
VCNTL=5V,VREFEN=0.9V
No Load
1800
1600
VIN=1.5V, VREFEN=0.75V
No Load
o
TA=-40 C
o
5
VIN Input Current (A)
VIN Input Current (A)
NEW PRODUCT
o
TA=85 C
4
3
2
TA=25 C
1400
o
TA=85 C
1200
1000
800
600
400
1
200
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Document number: DS36546 Rev. 3 - 2
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VCNTL Input Voltage (V)
VIN Input Voltage (V)
AP2303
0
0.0
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AP2303
Performance Characteristics (Cont.)
NEW PRODUCT
Source Load Transient (DDR-III)
(CIN=COUT=10µF, IOUT=0A to 1.75A,
VIN=1.5V, VREFEN=0.75V, VCNTL=3.3V)
VIN
500mV/div
VREFEN
50mV/div
VOUT
20mV/div
Sink Load Transient (DDR-III)
(CIN=COUT=10µF, IOUT=0A to -1.75A,
VIN=1.5V, VREFEN=0.75V, VCNTL=3.3V)
VIN
500mV/div
VREFEN
50mV/div
VOUT
20mV/div
IOUT
1A/div
IOUT
1A/div
Time 100µs/div
Time 100µs/div
Source Load Transient (DDR-IV)
(CIN=COUT=10µF, IOUT=0A to 1.75A,
VIN=1.2V, VREFEN=0.6V, VCNTL=3.3V)
VIN
500mV/div
VREFEN
50mV/div
VOUT
20mV/div
Sink Load Transient (DDR-IV)
(CIN=COUT=10µF, IOUT=0A to -1.75A,
VIN=1.2V, VREFEN=0.6V, VCNTL=3.3V)
VIN
500mV/div
VREFEN
50mV/div
VOUT
20mV/div
IOUT
1A/div
IOUT
1A/div
Time 100µs/div
Time 100µs/div
VREFEN Power On
(CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V)
VREFEN Power Off
(CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V)
VOUT
500mV/div
VOUT
500mV/div
VIN
1V/div
VIN
1V/div
VREFEN
500mV/div
VREFEN
500mV/div
IOUT
200mA/div
IOUT
200mA/div
Time 100µs/div
AP2303
Document number: DS36546 Rev. 3 - 2
Time 100µs/div
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AP2303
Performance Characteristics (Cont.)
VIN Power On
(CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V)
VIN Power Off
(CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V)
NEW PRODUCT
VOUT
500mV/div
VOUT
500mV/div
VIN
1V/div
VIN
1V/div
VREFEN
1V/div
VREFEN
1V/div
IOUT
200mA/div
IOUT
200mA/div
Time 100µs/div
Time 500ms/div
VCNTL Power On
(CIN=COUT=10µF, RLOAD=5Ω)
VCNTL Power Off
(CIN=COUT=10µF, RLOAD=5Ω)
VOUT
500mV/div
VOUT
500mV/div
VIN
1V/div
VIN
1V/div
VCNTL
2V/div
VCNTL
2V/div
IOUT
200mA/div
IOUT
200mA/div
Time 100µs/div
AP2303
Document number: DS36546 Rev. 3 - 2
Time 100µs/div
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AP2303
Application Information
1. Input Capacitor
The input capacitor of VIN should be placed to VIN pin as close as possible. Use a low ESR, 10µF or larger MLCC capacitor to provide surge
current during load transient.
NEW PRODUCT
The input capacitor for VCNTL is recommended to be 0.47µF or larger to decouple the supply voltage of AP2303’s control circuitry.
2. Output Capacitor
The output capacitor is recommended with a 10µF or higher MLCC capacitor which will be sufficient at full temperature range. An aluminum
electrolytic capacitor with low ESR also should be larger than 10µF. The output capacitor should be placed to VOUT pin as close as possible.
3. Reference Voltage
A reference voltage is applied to the VREFEN pin by a resistor divider between VIN and GND pins. And a 0.1µF to 1µF bypass capacitor is
preferred to form a low-pass filter to reduce the noise from VIN. More capacitance and large resistance will increase the start-up time after VIN
power-up.
4. Thermal Consideration
There’s an internal thermal protection circuitry of AP2303 to protect device during overload conditions. For continuous operation, make sure not to
exceed the operating junction temperature range of +125°C. The power dissipation definition in device is:
PD=(VIN - VOUT)xIOUT+VINxIQ
The maximum power dissipation depends on the thermal resistance of IC package, PCB layout and the surrounding airflow. The maximum power
dissipation can also be calculated as:
PD(MAX) = (TJ(MAX)-TA)/θJA
The maximum power dissipation for PSOP-8 package at TA = +25°C can be calculated as:
PD(MAX) = (125°C-25°C) / (80°C/W) = 1.25W
AP2303
Document number: DS36546 Rev. 3 - 2
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AP2303
Ordering Information
AP2303 XX XX – XX
Package
Packing
RoHS/Green
M : SOIC-8
MP : PSOP-8
TR : Tape & Reel
G1 : Green
NEW PRODUCT
Product Name
Package
Temperature Range
SOIC-8
Part Number
Marking ID
Packing
AP2303MTR-G1
2303M-G1
4000/Tape & Reel
AP2303MPTR-G1
2303MP-G1
4000/Tape & Reel
-40 to +85C
PSOP-8
Marking Information
(1) SOIC-8
(Top View)
2303M
-G1
YWWAXX
First and Second Lines: Logo and Marking ID
Third Line: Date Code
Y: Year
WW: Work Week of Molding
A: Assembly House Code
th
th
XX: 7 and8 Digits of Batch No.
(2) PSOP-8
(Top View)
2303MP
-G1
YWWAXX
AP2303
Document number: DS36546 Rev. 3 - 2
First and Second Lines: Logo and Marking ID
Third Line: Date Code
Y: Year
WW: Work Week of Molding
A: Assembly House Code
th
th
XX: 7 and 8 Digits of Batch No.
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AP2303
Package Outline Dimensions (All dimensions in mm(inch).)
(1)
Package Type: SOIC-8
4.700(0.185)
5.100(0. 201)
7°
~ 9°
0.320(0. 013)
TYP
1.350(0. 053)
1.750(0. 069)
NEW PRODUCT
8°
8°
~ 9°
7°
0.600(0. 024)
0.725(0. 029)
D
5.800(0. 228)
6.200(0. 244)
1.270(0. 050)
TYP
D
20:1
0.300(0. 012)
R0.150(0.006)
0.100(0. 004)
1.000(0. 039)
TYP
3.800(0. 150)
Option 1
4.000(0. 157)
0.300(0. 012)
0.150(0. 006)
0.250(0. 010)
Option 1
0°
8°
1°
7°
0.510(0. 020)
R0.150(0.006)
0.450(0. 017)
0.820(0. 032)
Option 2
0.350(0. 014)
TYP
Note: Eject hole , oriented hole and mold mark is optional .
AP2303
Document number: DS36546 Rev. 3 - 2
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AP2303
Package Outline Dimensions (Cont. All dimensions in mm(inch).)
(2)
Package Type: PSOP-8
3.800(0.150)
4.000(0.157)
NEW PRODUCT
2.110(0.083)
2.750(0.108)
3.402(0.134)
2.710(0.107)
1.270(0.050)
TYP
4.700(0.185)
5.100(0.201)
0.300(0.012)
0.510(0.020)
5.800(0.228)
6.200(0.244)
0.050(0.002)
0.150(0.006)
1.350(0.053)
1.550(0.061)
0°
8°
0.400(0.016)
1.270(0.050)
0.150(0.006)
0.250(0.010)
Note: Eject hole, oriented hole and mold mark is optional.
AP2303
Document number: DS36546 Rev. 3 - 2
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AP2303
Suggested Pad Layout
(1)
Package Type: SOIC-8
NEW PRODUCT
Grid
placement
courtyard
G
Z
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value
6.900/0.272
3.900/0.154
0.650/0.026
1.500/0.059
1.270/0.050
AP2303
Document number: DS36546 Rev. 3 - 2
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AP2303
Suggested Pad Layout (Cont.)
Package Type: PSOP-8
NEW PRODUCT
(2)
Y1
G
Z
X1
Y
E
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
E
(mm)/(inch)
Value
6.900/0.272
3.900/0.154
0.650/0.026
1.500/0.059
3.600/0.142
2.700/0.106
1.270/0.050
AP2303
Document number: DS36546 Rev. 3 - 2
14 of 15
www.diodes.com
September 2014
© Diodes Incorporated
A Product Line of
Diodes Incorporated
AP2303
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
AP2303
Document number: DS36546 Rev. 3 - 2
15 of 15
www.diodes.com
September 2014
© Diodes Incorporated
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