Preliminary Datasheet MLX75304 old 693 DownloadLink 5367

MLX75304
Light-to-Frequency SensorEyeC
Features and Benefits
Low ppm defects
Converts light intensity to an output
Solder reflow 260degC, MSL3
frequency
High dynamical light range
Automotive version is AEC-Q100 qualified
High linearity
Operating temperature -20..85degC or
-40..125degC (automotive version)
Low temperature dependency
RoHS compliant lead-free
Supply voltage range 3V to 5.5V
Easy interface to microcontroller
Applications
General
• Ambient Light Sensor
• LCD Screen Backlight Dimming Sensor for Mobile Phones, Digital Frames
• LED Light Sensor
o LED monitoring
o Closed loop control for LED light intensity & LED color
Automotive
• Cockpit Light Dimming
• LED Headlight Closed Loop Control
• Hand Presence Detection
• Sunload Sensor
Printers/Copiers
• Paper feed detection
• Paper size and orientation detection
• Toner cartridge presence detection
Ordering Information
Part No.
MLX75304EXD
MLX75304EXE
MLX75304KXD
MLX75304KXE
390107530401
Rev. 001
Temperature
Code
Package Code
S
XD
-20°C to 85°C
SO8 Open Cavity
S
XE
-20°C to 85°C
DFN3x3 Open Cavity
K
XD
-40°C to 125°C
SO8 Open Cavity
K
XE
-40°C to 125°C
DFN3x3 Open Cavity
Page 1 of 9
Option Code
Delivery
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Preliminary Datasheet
July/08
MLX75304
Light-to-Frequency SensorEyeC
1 General Description
The MLX75304 is a CMOS integrated Light-to-Frequency sensor with an integrated photodiode. The sensor
is intended for automotive applications and responds in a range of 500nm to 1000nm.
The MLX75304 block diagram is shown in Section 2 and contains following blocks: a photodiode, a current to
frequency converter to convert the photocurrent into a useful output frequency and a digital push-pull output
stage.
2 Functional Diagram
Table of Contents
1
General Description ...................................................................................................2
2
Functional Diagram....................................................................................................2
3
Pin Definitions and Descriptions (SO8 Package)....................................................3
4
Pin Definitions and Descriptions (DFN Package)....................................................3
5
Absolute Maximum Ratings ......................................................................................3
6
MLX75304 Specifications ..........................................................................................4
7
Spectral Response.....................................................................................................5
8
Applications Information ...........................................................................................5
9
SO8 Open Cavity Package Information....................................................................6
10
DFN3x3 Open Cavity Package Information..............................................................7
11
Standard information regarding manufacturability of Melexis products with
different soldering processes ...................................................................................8
12
ESD Precautions ........................................................................................................8
13
Disclaimer ...................................................................................................................9
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Preliminary Datasheet
July/08
MLX75304
Light-to-Frequency SensorEyeC
3 Pin Definitions and Descriptions (SO8 Package)
Pin
Number
1
Pin Name
Description
Type
Vss
Ground connection
Ground
2
OUT
Digital frequency output
Digital push-pull output
3
Vdd
Power supply
Supply
4
OEB
Enable for pin OUT. Active low.
Digital input with pulldown
5-8
N.C.
Not connected
Floating
4 Pin Definitions and Descriptions (DFN Package)
Pin
Number
1
Pin Name
Description
Type
N.C.
Not connected
Floating
2
Vss
Ground connection
Ground
3
OUT
Digital frequency output
Digital push-pull output
4
Vdd
Power supply
Supply
5
OEB
Enable for pin OUT. Active low.
Digital input with pulldown
6-10
N.C.
Not connected
Floating
5 Absolute Maximum Ratings
All voltages are referenced to Vss.
Symbol
Rating
Value
Vdd
Supply Voltage, VDD (over voltage)
Vout
DC Output Voltage
Iout
DC Output Current, per Pin
TStg
Storage Temperature Range, TS
VESD-HBM
ESD Sensitivity (Human Body Model
according to CDF-AEC-Q100)
VESD-MM
ESD Sensitivity (Machine Model according to CDF-AEC-Q100)
Unit
-0.3 to 7
V
-0.3 to Vdd+0.3V
V
±20
mA
-40 to 125
°C
2
kV
200
V
For proper operation Vout should be constrained to the range Vss≤Vout≤Vdd.
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximumrated conditions for extended periods may affect device reliability.
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Preliminary Datasheet
July/08
MLX75304
Light-to-Frequency SensorEyeC
6 MLX75304 Specifications
All voltages are referenced to Vss.
Symbol
Parameter
Conditions
Min
Typ
3
Vdd
Idd
Supply Voltage
Static Power Supply Current
fD
Dark frequency
(a), Ee = 0µW/cm²
At 25°C
At 125°C
fO
fFS
NL10
NL100
Output frequency
2
Full-scale frequency
Non-linearity3
Non-linearity3
(a), Ee = 21.7µW/cm²
(a), Ee = 430µW/cm²
fO = 0 kHz to 10kHz
fO = 0 kHz to 100kHz
TC
Temperature coefficient
tsetup
SPD
λ0.3
Electrical setup-time
Area of photodiode
Spectral bandwidth
Output duty cycle
At Vdd=5.5V
-10%
-1%
-2%
λ= 540nm
λ= 880nm
95%
Tamb = 25°C
1
1.2
50
1.6
Max
Units
Test
5.5
7
V
mA
V
V
+10%
1%
2%
0
300
10
0.36
500
30
1000
50%
VOL
VOH
VIL
VIH
RI,PD
Output voltage low
Output voltage high
Input voltage low
Input voltage high
Input pull down resistance
(a) IOH = 5mA
(a) IOH = -5mA
(a)
(a)
(a)
TA
Operating Temperature Range
Temperature Code S
Temperature Code K
0
0.6Vdd
0
0.7Vdd
50
-20
-40
60
Hz
kHz
kHz
MHz
%
%
ppm/K
ppm/K
µs
mm²
nm
%
0.4Vdd
Vdd
0.3Vdd
Vdd
70
V
V
V
V
kOhm
85
125
°C
°C
V
V
(a) Vdd=5V, CL=50pF, λ= 880nm
1
The column Test indicates if the specific parameter is tested in production. Following symbols are used:
V: the specific parameter is tested in production
X: the specific parameter is verified in characterisation, but is not tested in production (e.g. timings and capacitances)
D: the specific parameter is guaranteed by design and is not tested as such in production
2
Full-scale frequency is the maximum frequency of the device, corresponding to a typical irradiance of 430µW/cm² at a wavelength of 880nm. Note that this
is a hard limit as any higher irradiance will not result in an addition increase of the output frequency.
Non-linearity is defined as the deviation from a line fitted in between the dark frequency and the maximum of the indicated range, expressed as a percentage of this maximum.
3
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Preliminary Datasheet
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1
MLX75304
Light-to-Frequency SensorEyeC
7 Spectral Response
Typical Photodiode Spectral Response Curve (%), without Anti
Reflection Coating*
*There is also an option for an Anti Reflection Coating. This will remove the interference
ripples in the figure above. With this special Anti Reflection Coating, the sensitivity curve in
function of wavelength will be somewhat lower (typically 4%) but will no longer display
interference ripples.
8 Applications Information
A typical connection diagram is shown in the figure below. The load capacitance CL is typically formed by the
input capacitance of the component that is connected to the sensor output, the wiring capacitance and the
output capacitance of the sensor itself.
Vdd
Ee
3
OEB
4
MLX75304
2
1
OUT
CL
Decoupling capacitors between Vdd and Vss (1uF in parallel with 100nF) are highly recommended in all configurations.
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Preliminary Datasheet
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MLX75304
Light-to-Frequency SensorEyeC
9 SO8 Open Cavity Package Information
SO8 open cavity package, MSL3, 260˚C soldering profile (target). Lead free component.
Same package as MLX75303 (see drawing)
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Preliminary Datasheet
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MLX75304
Light-to-Frequency SensorEyeC
10 DFN3x3 Open Cavity Package Information
DFN open cavity package, MSL3, 260˚C
Same package as MLX75303 (see drawing)
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profile
(target).
Lead
free
component.
Preliminary Datasheet
July/08
MLX75304
Light-to-Frequency SensorEyeC
11 Standard information regarding manufacturability
products with different soldering processes
of
Melexis
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices)
•
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
Solderability SMD’s (Surface Mount Devices)
•
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be
agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.asp
12 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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Preliminary Datasheet
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13 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis
reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product
is intended for use in normal commercial applications. Applications requiring extended temperature range,
unusual environmental requirements, or high reliability applications, such as military, medical life-support or
life-sustaining equipment are specifically not recommended without additional processing by Melexis for each
application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data
herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of
technical or other services.
© 2005 Melexis NV. All rights reserved.
For additional information contact Melexis Direct:
Europe, Africa, Asia:
Phone: +32 1367 0495
E-mail: [email protected]
America:
Phone: +1 603 223 2362
E-mail: [email protected]
ISO/TS 16949 and ISO14001 Certified
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Preliminary Datasheet
July/08