MC13783VK5.pdf

Freescale Semiconductor Inc
PART INFORMATION
Mfg Item Number
Mfg Item Name
MC13783VK5
TMAP 247 10*10*0.7P0.5
SUPPLIER
Company Name
Company Unique ID
Response Date
Response Document ID
Contact Name
Contact Title
Contact Phone
Contact Email
Authorized Representative
Representative Title
Representative Phone
Representative Email
URL for Additional Information
Freescale Semiconductor Inc
14-141-7928
2016-02-04
5320A1.3
Freescale Semiconductor Inc
Product Technical Support
1-800-521-6274
support@freescale.com
Daniel Binyon
EPP Customer Response
512-895-3406
eppanlst@freescale.com
www.freescale.com
DECLARATION
EU RoHS
Pb Free
HalogenFree
Plating Indicator
EU RoHS Exemption(s)
MANUFACTURING
Mfg Item Number
Mfg Item Name
Version
Weight
UoM
Unit Volume
J-STD-020 MSL Rating
Peak Processing Temperature
Max Time at Peak Temperature
Number of Processing Cycles
Yes
Yes
Yes
e1
MC13783VK5
TMAP 247 10*10*0.7P0.5
ALL
0.205300
g
EACH
3
260 C
40 seconds
3
RoHS
RoHS Directive
RoHS Definition
RoHS Legal Definition
RoHS Declaration
Supplier Acceptance
Signature
Exemption List Version
List of Freescale Accepted
Exemptions
2011/65/EU
RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB),
Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium
Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states)
of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS
restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess
of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the
declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy
and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company
will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company
acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such
information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have
provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company
and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or
remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding
information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of
Sale applicable to such part(s) shall apply.
1 - Item(s) do not contain RoHS restricted substances per the definition above
Accepted
Daniel Binyon
2012/51/EU
6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight
6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight
6(c) : Copper alloy containing up to 4% lead by weight
7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for
telecommunications
7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or
ceramic matrix compound
7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher
7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC
7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors
15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
MATERIAL COMPOSITION
Homogeneous Material
Weight
SubstanceClass
Substance
CAS
Non-Conductive Epoxy/Adhesive
0.005
Non-Conductive Epoxy/Adhesive
Plastics/polymers
Proprietary Material-Other Epoxy resins
-
0.000375
g
Non-Conductive Epoxy/Adhesive
Plastics/polymers
Crosslinked acrylate polymer
25767-43-5
0.001
g
Non-Conductive Epoxy/Adhesive
Plastics/polymers
Other polymers
-
0.000375
Non-Conductive Epoxy/Adhesive
Plastics/polymers
Proprietary Material-Other polymers
-
Non-Conductive Epoxy/Adhesive
Glass
Silica, vitreous
60676-86-0
Bonding Wire
SubstanceWeight
SubPart%
ARTICLEPPM
ARTICLE%
UoM SubPart
PPM
75000
7.5
1826
0.1826
200000
20
4870
0.487
g
75000
7.5
1826
0.1826
0.001
g
200000
20
4870
0.487
0.00225
g
450000
45
10959
1.0959
1000000
100
17535
1.7535
g
0.0036
Bonding Wire
Die Encapsulant, Halogen-free
Exemption
g
Metals
Gold, metal
7440-57-5
0.0036
0.1064
g
g
Die Encapsulant, Halogen-free
Metals
Aluminum, metal
7429-90-5
0.00012811
g
1204
0.1204
624
0.0624
Die Encapsulant, Halogen-free
Plastics/polymers
Proprietary Material-Other Epoxy resins
-
0.01281545
g
120446
12.0446
62423
6.2423
Die Encapsulant, Halogen-free
Solvents, additives, and other materials
Carbon Black
1333-86-4
0.00032037
g
3011
0.3011
1560
0.156
Die Encapsulant, Halogen-free
Metals
Magnesium, metal
7439-95-4
0.00012811
g
1204
0.1204
624
0.0624
Die Encapsulant, Halogen-free
Plastics/polymers
Other polymers
-
0.00032037
g
3011
0.3011
1560
0.156
Die Encapsulant, Halogen-free
Glass
Silica, vitreous
60676-86-0
0.09268759
g
871124
87.1124
451488
45.1488
Silicon Semiconductor Die
0.0198
g
Silicon Semiconductor Die
Solvents, additives, and other materials
Other miscellaneous substances (less than 5%).
-
0.000396
g
20000
2
1928
0.1928
Silicon Semiconductor Die
Glass
Silicon, doped
-
0.019404
g
980000
98
94515
9.4515
Organic Substrate, Halogen-fre
0.0437
g
Organic Substrate, Halogen-fre
Metals
Barium sulfate
7727-43-7
0.0097014
g
222000
22.2
47254
4.7254
Organic Substrate, Halogen-fre
Metals
Copper, metal
7440-50-8
0.0098325
g
225000
22.5
47893
4.7893
Organic Substrate, Halogen-fre
Plastics/polymers
Other Epoxy resins
-
0.0028405
g
65000
6.5
13835
1.3835
Organic Substrate, Halogen-fre
Metals
Gold, metal
7440-57-5
0.000437
g
10000
1
2128
0.2128
Organic Substrate, Halogen-fre
Metals
Other nickel compounds
-
0.0045885
g
105000
10.5
22350
2.235
Organic Substrate, Halogen-fre
Solvents, additives, and other materials
Other organic phosphorous compounds
-
0.004807
g
110000
11
23414
2.3414
Organic Substrate, Halogen-fre
Solvents, additives, and other materials
Other Aromatic carbonyl compounds
-
0.0003496
g
8000
0.8
1702
0.1702
Organic Substrate, Halogen-fre
Glass
Silica, crystalline - tridymite
15468-32-3
0.0111435
g
255000
25.5
54279
5.4279
Solder Balls - Lead Free
0.0268
g
Solder Balls - Lead Free
Metals
Aluminum, metal
7429-90-5
0.00000027
g
10
0.001
1
0.0001
Solder Balls - Lead Free
Antimony/Antimony Compounds
Antimony (metallic)
7440-36-0
0.00001337
g
499
0.0499
65
0.0065
Solder Balls - Lead Free
Arsenic/Arsenic Compounds
Arsenic
7440-38-2
0.00000801
g
299
0.0299
39
0.0039
Solder Balls - Lead Free
Bismuth/Bismuth Compounds
Bismuth
7440-69-9
0.00000801
g
299
0.0299
39
0.0039
Solder Balls - Lead Free
Cadmium/Cadmium Compounds
Cadmium
7440-43-9
0.00000054
g
20
0.002
2
0.0002
Solder Balls - Lead Free
Metals
Copper, metal
7440-50-8
0.00004012
g
1497
0.1497
195
0.0195
Solder Balls - Lead Free
Metals
Gold, metal
7440-57-5
0.00000134
g
50
0.005
6
0.0006
Solder Balls - Lead Free
Metals
Iron, metal
7439-89-6
0.00000536
g
200
0.02
26
0.0026
Solder Balls - Lead Free
Lead/Lead Compounds
Lead
7439-92-1
0.00001337
g
499
0.0499
65
0.0065
Solder Balls - Lead Free
Nickel (external applications only)
Nickel
7440-02-0
0.00000801
g
299
0.0299
39
0.0039
Solder Balls - Lead Free
Metals
Silver, metal
7440-22-4
0.00026776
g
9991
0.9991
1304
0.1304
Solder Balls - Lead Free
Metals
Tin, metal
7440-31-5
0.02643357
g
986327
98.6327
128755
12.8755
Solder Balls - Lead Free
Metals
Zinc, metal
7440-66-6
0.00000027
g
10
0.001
1
0.0001
LINKS
MCD LINK
NXP website
GENERAL ENVIRONMENTAL
COMPLIANCE LINKS
RoHS signed letter
China RoHS
REACH signed letter
ELV signed letter
Conflict Minerals statement
NXP ENVIRONMENTAL
INFORMATION
Environmental Compliance
website
FAQ
Technical Service Request
LINKS TO BLANK IPC1752
FORMS
Blank IPC1752 v1.1 Form
http://www.nxp.com
http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf
http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY
http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf
http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf
http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf
http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX
http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ
http://www.nxp.com/support/sales-and-support:SUPPORTHOME
http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf
IPC1752 XML LINKS
http://www.freescale.com/mcds/MC13783VK5_IPC1752_v11.xml
http://www.freescale.com/mcds/MC13783VK5_IPC1752A.xml