AR2003FV

AR2003FV
ACTIVE/SYNCHRONOUS RECTIFICATION CONTROLLER
Description
Pin Assignments
The AR2003FV is Active/Synchronous Rectification Controller,
providing output voltage from 4.5V to 21V. Using internal drain-tosource voltage sensing, the AR2003FV is ideal for Fly-back, LLCresonant and other power supply architectures. It has SFB pin that
can eliminate the external feedback resistor when target output
voltage is 5V or 12V.
(Top View)
TON
2
The small footprint of the AR2003FV makes it ideal for space
constrained applications.
AGND 3
14 VCC
TOFF/EN 4
13 GND
VD
SFB 5
11 SYNC
10 GATE
NC 7
8
VS
Applications


USB PD Adaptor

AC-DC Battery Charger

Fly-back Conversion

PC Power Supply

SMPS



Power Adaptors
Auxiliary Power Supplies
PoE Power Devices








Notes:
9
VD
V-DFN3535-14
Features


12 DGATE
OVS 6
Intelligent features of this IC are the Minimum Off Time (TOFF) and
Minimum on Time (TON), these features blank the noise generated
during the turn on and turn off instances of the power FET. Light load
detection for improved efficiency at light and no load is implemented.
Other features include Under Voltage Lock Out (UVLO), SYNC
feature for CCM operation and low turn off threshold voltage for
improved efficiency.
Primary-Side
or
Secondary-side
Active/Synchronous
Rectification, Optimized for Systems with Dynamic Voltage
Scaling Capabilities
Frequency of Operation up to 600kHz
Suitable for Discontinuous (DCM), Continuous (CCM) and
Critical (CrCM) Conduction Mode
Minimum On-time and Off-time to Blanking Turn-on/off
Oscillations
Light Load Detection and Sleep Mode
Drain Voltage Rating of 200V
Recommended Operating Voltage from 4.5V up to 21V
Low Component Count.
Low Under Voltage Lockout
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
NC
1
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AR2003FV
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AR2003FV
Typical Applications Circuit
VCC
T1
VS
VD
VCC
GATE
PWM IC
Active Rectifier
AR2003FV
DGATE
SFB
OVS
Opto Coupler
Secondary-side Synchronous Rectification
VCC
+
+
VD
VS
GATE
VCC
GND
AR2003FV TON
EN/TOFF
OVS
C
E
C
ISENSE
VSENSE
VCC
GND
Primary-side Synchronous Rectification
AR2003FV
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AR2003FV
Pin Descriptions
Pin Number
Pin Name
1, 7
NC
2
TON
3
AGND
Function
Not Connected
Minimum On-time Setting Pin
This is the ground reference for all internal comparators and thresholds.
Enable Pin/ Minimum Off-time
This pin combines the functions of setting the programmable minimum off-time as well as acting as the
enable pin. The device enters Under Voltage Lock Out (UVLO) mode when VCC falls below the UVLO
threshold. At this point the TOFF/EN pin is internally shorted to ground through a resistor. The internal
current source (used for setting TOFF) is powered down. Once the UVLO threshold is exceeded, the internal
resistance is removed and the current source is activated. If the voltage applied to the TOFF/EN pin exceeds
the VENON threshold then the device is in Active Mode. If the voltage drops below the VENOFF threshold then
the device is in Sleep Mode.
4
TOFF/EN
5
SFB
Output pin of internal feedback resistor which is connected to VCC. It is sent to TL431 (or its compatible) to
drive the opto-coupler and provide feedback voltage to primary side controller to realize Secondary
Synchronous Rectification.
6
OVS
Output voltage (VCC) select pin, work together with SFB to select output voltage in 5V or 12V.
8
VS
This is the connection to internal MOSFET Source. VS is also connected to GND.
9, VD pad
VD
This is a connection to the internal MOSFET Drain. The pin needs to be connected as closely as possible to
the transformer used in the application, to minimize the effects of parasitic inductance on the performance of
the device. The device requires that VD has a voltage greater than 1.5V and that the TOFF timer has expired
before the MOSFET is able to be activated. Once these conditions are met and the voltage internally sensed
on the VD pin is 150mV lower than the VS pin, the internal MOSFET is turned on and the TON minimum on
time period is started. The MOSFET will remain on for at least the length of the minimum on time. The only
thing that can override this is if a pulse is detected on the SNYC pin. After the TON period, the MOSFET
remains on until the VD to VS voltage has reached to the VTHOFF threshold, at which point the internal
MOSFET is turned off. As mentioned before, if the V THOFF threshold is reached before the TON period has
expired, the device will enter the Light Load Mode. Under this mode, the MOSFET will not be turned on the
next switching cycle. When the drain voltage has increased to 1.5V, the TOFF timer is triggered, during
which the MOSFET is prevented from turning on.
10
GATE
Connect GATE to the gate of the controlled MOSFET through a small series resistor using short PC board
tracks to achieve optimal switching performance. The GATE output can achieve >2-A peak source current
when High and >4-A peak sink current when Low into a large N-channel power MOSFET.
11
SYNC
If a falling edge is sensed on this pin, the internal MOSFET is immediately turned off, irrespective of the
sensed drain to source voltage or the state of the TON timer. This characteristic allows the device to be
easily used in a Continuous Conduction Mode (CCM) system. The SYNC pin needs to be connected to a
suitable control signal on the primary side of the convertor, using a high voltage isolation cap, transformer or
other suitable means.
12
DGATE
During Over Voltage Protection, DGATE will drive external MOSFET to pull down the output voltage so that
Primary side controller will start the Short Circuit Protection handling.
13
GND
This is the reference potential for all internal comparators and thresholds.
VCC
VCC supplies all the internal circuitry of the device. A DC supply is required to be connected to this pin. It is
required that a 10µF or larger capacitor is placed between this pin and GND, as close to the pins as possible.
The device will not function until the VCC has risen above the UVLO threshold. The device can safely be
turned off by bringing VCC below the UVLO threshold (minus the UVLO threshold hysteresis). If V CC drops
below the UVLO threshold (minus UVLO threshold hysteresis), the MOSFET is turned off and the TOFF/EN
pin is internally connected to GND.
14
AR2003FV
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AR2003FV
Functional Block Diagram
VCC
SFB
Rupper
Rlower
AVDD
AGND
TOFF/EN
LDO
Enable Control
Off Timer
UVLO
Vref
VD
OVP
Vref
1.5V
VTHOFF
General
Control Logic
& Exception
Handling
VTHON
VS
GATE
Driver
AVDD-2V
OVS
On Timer
TON
AR2003FV
Document number: DS37473 Rev. 3 - 2
AVDD
DGATE
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SYNC
GND
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AR2003FV
Absolute Maximum Ratings (Note 4)
Symbol
Rating
Unit
Input Voltage Range VCC
-0.3 to 24
V
VD
Input Voltage Range VD
-1 to 200
V
VS
Input Voltage Range VS
-1 to 1
V
-0.3 to 6
V
-40 to +150
°C
+ 260
°C
-65 to +150
°C
VCC
Parameter
TOFF/EN, TON, OVS, SYNC Input Voltage Range Other
TJ
Operating Junction Temperature
TL
Lead Temperature
TST
Storage Temperature
Human Body Model, JESD22-A114
2
ESD
kV
Charged Device Model, JESD22-C101
Note 4:
0.5
These are stress ratings only. Operation outside the absolute maximum ratings may cause device failure.
Operation at the absolute maximum rating for extended periods may reduce device reliability.
Package Thermal Data (@TA = +25°C, unless otherwise specified)
Symbol
PD
Notes:
Parameter
Power Dissipation (Note 5)
Rating
Unit
0.67
W
RθJA
Thermal Resistance, Junction to Ambient Air (Note 6)
36
°C/W
RθJC
Thermal Resistance, Junction to Case (Note 7)
21
°C/W
5. Device mounted on FR-4 PCB, 2oz with minimum recommended pad layout.
6. Device mounted on 25mm x 25mm 2oz copper board.
7. Device mounted on 50mm x 50mm 2oz copper board.
Recommended Operating Conditions
Symbol
Parameter
Min
Max
Unit
VCC
Supply Voltage Range
4.5
21
VDS
Voltage Cross Drain and Source
-1
200
fSW
Switching Frequency
20
600
kHz
TJ
Operating Junction Temperature Range
-40
+125
°C
RTOFF
TOFF Resistor Value
85
200
kΩ
RTON
TON Resistor Value
8.25
100
kΩ
CVCC
VCC Bypass Capacitor
10
–
μF
Sync Pulse Width
20
–
nS
V
TWsync
AR2003FV
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Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Symbol
VAVDD
ICCSTART
ICCSTANDBY
Parameter
Conditions
Min
Typ
Max
Unit
VCC = 5.5V
–
4.5
–
V
VCC = 12V
–
4.7
–
V
VCC = 2.6V
–
160
220
VCC = 5.5V, REN/OFF = 0Ω
–
380
500
VCC = 12V, REN/OFF = 0Ω
–
450
600
VCC = 5.5V, REN/OFF = 100kΩ,
Cgate=0.
–
1.5
2
–
1.8
2.5
Internal Regulator Output
Supply Current (Under Voltage)
Supply Current (Disabled)
VCC = 12V, REN/OFF = 100kΩ,
µA
Cgate=0.
ICCON
Supply Current (Enabled)
VCC = 5.5V, fsw=100kHz,
mA
–
3.2
4.2
–
5
7
Cgate=3300pf
VCC = 12V, fsw=100kHz,
Cgate=3300pf
VEN-ON
TOFF/EN Turn-on Threshold, Rising
TOFF/EN driven, VTON > 0.6V
1.31
1.4
1.49
VEN-OFF
TOFF/EN Turn-off Threshold, Falling
TOFF/EN driven, VTON < 0.2V
0.55
0.6
0.65
IEN-START
TOFF/EN Input Current, Disabled
RTOFF=50K
-21.5
-20
-18.5
IEN-ON
TOFF/EN Input Current, Enabled
RTOFF=100K
-10.7
-10
-9.3
V
µA
Under-Voltage Lockout (UVLO)
UVLOTH
VCC Under Voltage Lockout Threshold Rising
–
2.8
3.0
3.20
V
UVLOHYS
VCC Under Voltage Lockout Threshold
Hysteresis
–
–
200
–
mV
MOSFET Voltage Sensing
VTHARM
Gate Re-arming Threshold
VD to GND, Rising
1.3
1.5
1.7
V
VTHON
Gate Turn-on Threshold
(VD-VS) falling, VS = 0V
-220
-150
-80
mV
VTHOFF HV
Gate Turn-off Threshold
(VD-VS) rising, VS = 0V, VCC ≥
4.2V
-6
-4
-2
VTHOFF LV
Gate Turn-off Threshold
VD-VS) rising, VS = 0V, VCC <
4.2V
-30
-20
-10
TDON
Gate Turn-on Propagation Delay
From VTHON to Gate > 1V
–
30
50
ns
TDOFF
Gate Turn Off Propagation Delay
From VTHOFF to Gate < 4V
–
30
60
ns
TON-LR
Minimum On Time at Low Resistance
RTON = 8.25KΩ
0.26
0.34
0.42
µs
TON-HR
Minimum On Time at High Resistance
RTON = 100KΩ
2.25
3
3.75
µs
TOFF-LR
Minimum Off Time at Low Resistance
RTOFF = 100KΩ
0.8
1.4
2
µs
TOFF-HR
Minimum Off Time at High Resistance
RTOFF = 200KΩ
7.5
10
12.5
µs
TOFF-LV
Minimum Off Time at Low Voltage
VEN/TOFF=1V
0.8
1.4
2
µs
TOFF-HV
Minimum Off Time at High Voltage
VEN/TOFF=2V
7.5
10
12.5
µs
TOFF-OV
Minimum Off Time at Over Voltage
2V<VEN/TOFF<VAVDD
7.5
10
12.5
µs
mV
Minimum On Time
Minimum Off Time
AR2003FV
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AR2003FV
Electrical Characteristics (@TA = +25°C, unless otherwise specified.) (Cont.)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Over Voltage Protection
VOVP0H
Output Over Voltage High Threshold when
OVS = 0
–
–
6
–
V
VOVP0L
Output Over Voltage Low Threshold when
OVS = 0
–
–
5.4
–
V
SYNC Falling Threshold
Gate Output from High to Low
VAVDD-2.4
VAVDD-2.0
VAVDD-1.6
V
TSDLY
SYNC Propagation Delay (Note 8)
SYNC falling to Gate Falling
10%, 4.5V < VCC < 5.5V
–
40
70
ns
RSYNC
SYNC Pull Up Resistance (Note 8)
Internal Resistance from SYNC
to VCC, 4.5V < VCC < 5.5V
1.6
2.0
2.4
KΩ
RGUP
Gate Pull up Resistance Enabled
Igate=-100mA
–
2.3
4
RGDN
Gate Pull Down Resistance Enabled
Igate=100mA
–
1.1
2
Igate=-100mA, VCC=5V
4.7
--
–
VOHG
Gate Output High Voltage
Igate=100mA, VCC>10V
9.5
--
–
Igate=100mA, VCC=0V
–
--
0.3
4V to 1V, Cgate = 3300pf
–
14
30
10V to 1V, Cgate=3300pf
–
20
35
1V to 4V, Cgate = 3300pf
–
16
35
1V to 10V, Cgate = 3300pf
–
25
40
EN falling to Gate falling
–
160
200
Over Temperature
–
–
+150
–
°C
Temperature to Recover from Over
Temperature Exception
–
–
+125
–
°C
Delay of Turn On Pull Down MOSFET
Cdgate=400pf
–
1.5
–
uS
Synchronization
VTHSYNC
Gate Driver
VOLG
Gate Output Low Voltage
Tfgate
Gate Fall Time
Trgate
TDIS
Gate Rise Time
Disable Delay (note 8)
Ω
V
ns
Exception Handling
Tover
Trecover
Tdgate
Note 8: Guaranteed by design.
AR2003FV
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Typical Performance Characteristics
THRESHOLD VOLTAGE
vs
TEMPERATURE
BIAS SUPPLY CURRENT
vs
TEMPERATURE
2500
3.2
2000
3
I VCC - Bias Supply Current - uA
VCC - Threshold Voltage - V
3.1
VCCON
2.9
VCCOFF
2.8
VCC = 5 V, No Gate Switching
1500
1000
500
2.7
0
2.6
-50
-25
0
25
50
75
100
125
-50
150
-25
0
25
50
75
100
125
150
100
125
150
TJ - Temperature - °C
Figure 2.
TJ - Temperature - °C
Figure 1.
SUPPLY CURRENT
vs
SWITCHING FREQUENCY
ENABLE CURRENT
vs
TEMPERATURE
20
-9.3
-9.5
-9.7
CGATE = 3.3nF
I EN-ON - Enable Current - uA
IVCC - Supply Current - mA
16
12
8
CGATE = 0nF
-9.9
-10.1
-10.3
4
-10.5
0
-10.7
0
100
200
300
400
500
600
700
-50
fsw - Switching Frequency - KHz
Figure 3.
AR2003FV
Document number: DS37473 Rev. 3 - 2
-25
0
25
50
75
TJ - Temperature - °C
Figure 4.
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AR2003FV
THRESHOLD VOLTAGE
vs
TEMPERATURE
SYNC THRESHOLD VOLTAGE
vs
TEMPERATURE
1.6
2.4
VENON
2.3
VTHSYNC - SYNC Threshold Voltage - V
VEN - Threshold Voltage - V
1.4
1.2
1
0.8
0.6
0.4
0.2
2.2
2.1
V REG - V SYNC
2
1.9
1.8
1.7
0
1.6
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
TJ - Temperature - °C
Figure 5.
SYNC PROPAGATION DELAY TIME
vs
TEMPERATURE
75
100
125
150
100
125
150
125
150
V DS GATE-OFF THRESHOLD VOLTAGE
vs
TEMPERATURE
60
0
-2
50
VCC>4.3V
-4
-6
40
VTHOFF - Voltage - mV
t SDLY - SYNC Propagation Delay Time -ns
50
TJ - Temperature - °C
Figure 6.
30
20
-8
-10
-12
-14
-16
VCC<4.3V
-18
10
-20
-22
0
-24
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
TJ - Temperature - °C
Figure 7.
50
75
TJ - Temperature - °C
Figure 8.
GATE PROPAGATION DELAY TIME
vs
TEMPERATURE
V DS GATE-ON THRESHOLD VOLTAGE
vs
TEMPERATURE
50
-0.1
-0.11
GATE Propagation Delay Time - ns
45
VTHON - Voltage - V
-0.12
-0.13
-0.14
-0.15
-0.16
tDOFF
40
35
tDON
30
25
-0.17
-0.18
20
-50
-25
0
25
50
75
100
125
150
-50
TJ - Temperature - °C
Figure 9.
AR2003FV
Document number: DS37473 Rev. 3 - 2
-25
0
25
50
75
100
TJ - Temperature - °C
Figure 10.
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AR2003FV
MINIMUM ON TIME
vs
TON RESISTANCE
GATE RISE AND FALL TIME
vs
TEMPERATURE
28
5
26
4.5
4
Gate Rise and Fall Time - us
TON - Minimum On Time - us
trGATE
24
22
20
18
tfGATE
16
14
3.5
3
2.5
2
1.5
1
12
0.5
0
10
-50
-25
0
25
50
75
100
125
0
150
25
50
100
125
150
TON and TOFF TIME
vs
TEMPERATURE
MINIMUM OFF TIME
vs
TOFF RESISTANCE
12
10
TOFFHR, RENTOFF=200K
9
10
8
TON and TOFF Time - us
TOFF - Minimum OFF Time - us
75
RTON - TON Resistance - KΩ
Figure 12.
TJ - Temperature - °C
Figure 11.
8
6
4
2
0
7
6
5
4
TONHR, RTON=100K
3
2
TOFFLR, RENTOFF=100K
1
TONLR, RTON=8.25K
0
0
50
100
150
200
250
300
350
-50
RTOFF - TOFF Resistance - KΩ
Figure 13.
-25
0
25
50
75
100
125
150
TJ - Temperature - °C
Figure 14.
VD BIAS CURRENT
vs
DRAIN SENSE VOLTAGE
100
VS = 0 V
IVD - Bias Current - uA
50
>
0
<
-50
-100
-150
-200
-1
0
1
2
3
4
5
6
VD - Drain Sense Voltage - V
Figure 15.
AR2003FV
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AR2003FV
Modes of Operation
General Description
AR2003FV is an Active/Synchronous Rectifier which can work with many different primary side controllers. AR2003FV can be used in both SSR
and PSR systems.
AR2003FV has preset of internal feedback resistor that can reduce external BOM for 5V or 12V system.
UVLO MODE
When VCC does not reach UVLOTH, or falls blow UVLOTH - UVLOHYS, AR2003FV will be in UVLO MODE.
In this mode, AR2003FV will turn off external MOSFET, and TOFF/EN pin will internally short to GND. VCC current will be ICCSTART.
Sleep Mode
Sleep Mode is a low-power operating mode similar to UVLO Mode, except that this mode is entered by forcing V EN below the VEN-OFF threshold via
external control. Many internal circuits are turned off to reduce power consumption in this model to reduce device operating losses. External control
overrides any internal timing conditions, and immediately forces the GATE output low and enters Sleep Mode. VCC current is reduced to
ICCSTANDBY level. As VEN is restored to above the VEN-ON threshold, the device exits Sleep Mode into Light-Load Mode after a delay of several μs,
allowing re-powered internal circuits to settle.
Active Mode
This is the normal operation mode when inductor current is large enough and synchronous conduction time is longer than TON. AR MOSFET will be
turned on and off according to VD-VS, TON and TOFF setting and SYNC pin.
Light-Load Mode
When Inductor current is small and synchronous conduction time is less than TON, the AR MOSFET will be kept OFF to reduce switching power
loss. Voltage across body diode of AR MOSFET is continuously monitored. When the MOSFET body-diode conduction time is more than TON, the
device will be back to Active mode again.
Over Voltage Protection
Over Voltage mostly likely was an indication of optical coupler short. Therefore, just reporting output error information is not enough. AR2003FV will
drive an external FET to create a short situation so that primary side can be set to whole system to restart.
Over Temperature Protection (Only for Secondary-side Synchronous Rectification Application)
When AR2003FV is over heated, AR2003FV will light up the optical coupler to let the primary side deliver very little or no energy so that the whole
system will cool down. Hysteresis is set to +25°C.
Usually, VCC might drop blow UVLOTH - UVLOHYS (around 2.8V) due to system load. AR2003FV will enter UVLO mode, and system might restart
again. If AR2003FV is over heated again in short time, VCC might be kept around 2.8V. The primary side controller might treat this event as over
current or short current, and enters its protection mode.
Over Current Protection
Over Current Protection is not implemented in AR2003FV. Over Current Protection will be carried out in Primary side.
Short Current Protection
Short Current Protection is not implemented in AR2003FV. Short Current Protection handling will be carried out in Primary side.
AR2003FV
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AR2003FV
Application Information
ON Timer Programming
The Ton period (minimum on-time) is programmed by adding a resistor from TON pin to ground. In the application, it’s likely that when the MOSFET
is turned on there will be some ringing generated due to parasitic within the system. The minimum on time will stop the device reacting to this
ringing, by blanking out any signal received from the Drain to Source (VD-VS) comparator once the device is initially triggered. This will keep the
MOSFET turned on for duration of the minimum on-time, irrespective of the VD-VS voltage during this period.
If VD-VS reaches the gate turn-off threshold within the minimum on-time period, the device will change into Light Load Mode for the next switching
cycle. If the load conditions of the system change and the MOSFET turn-off threshold is once again reached once the minimum on-time is over, the
device reverts to its nominal mode of operation.
TON (μs) = 0.028μs * RTON (KΩ) + 0.1μs, 0.24μs < TON < 4.3μs, 5KΩ < RTON <150KΩ
Enabling and OFF Timer Programming
When VCC < UVLO, TOFF/EN is internally connected to ground through a resistor.
If VCC rises above UVLO, the chip is in the Sleep Mode, a current source will deliver 20µA (IEN-START) to TOFF/EN pins. If RTOFF > 70KΩ, VTOFF/EN
will over 1.4V (VEN-ON), AR2003FV will enter Active Mode. And the internal current source will switch to deliver 10µA (IEN-ON) to TOFF/EN pin. User
can program the minimum off-time by choosing proper value for RTOFF.
TOFF (µs) = 0.083µs* (RTOFF (KΩ)-81KΩ), valid for 85KΩ < RTOFF < 200KΩ
User can also program OFF timer by control the VTOFF/EN.
TOFF (µs) = 0.083µs* (VTOFF/EN-0.81V), valid for 0.85V < VTOFF/EN < 2V
The minimum off-time is the minimum time; the internal MOSFET will be turned off once VTHOFF turn off threshold is reached. This avoids the
MOSFET accidentally being retriggered by ringing after turn off.
No load mode VDS waveform
Maximum load mode VDS waveform
Minimum
on time
Minimum
off time
TFSW
VDS=VTHON =-150mV
Maximum
on time
VDS=VTHOFF
VDS=VTHON=-150mV
Minimum On Time
Maxima
off time
VDS=VTHARM=1.5V
>The time from VDS fall under VTHON to VDS ringing voltage <
VDS=VTHARM=1.5V
Check with no load waveform
VTHOFF
Maximum On Time
Minimum Off Time
< The time from VDS fall under VTHON to VDS =VTHOFF
> The time from VDS > VTHARM to VDS ringing negative voltage
Check with no load waveform
Check with no load waveform
higher than VTHON after turn off
Maximum Off Time
< The time from VDS=VTHARM to VDS drop from VCC level
AR2003FV
Document number: DS37473 Rev. 3 - 2
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Check with maximum load waveform
December 2014
© Diodes Incorporated
AR2003FV
Application Information (Cont.)
SYNC Input Circuit
SYNC pin is internally pulled up to internal AVDD (4.2V to 5V) through a 2KΩ resistor. If a falling edge of more than 2V is detected, the external
MOSFET will be turned off by AR2003FV. If the amplitude of SYNC signal is larger than 4.2V, an external resistor should be used to limit the input
current less than 2mA.
Ordering Information (Note 9)
Note 9:
Part Number
Marking
Reel size (inches)
Tape width (mm)
Quantity per reel
AR2003FV-13
AR2003
13
12
3,000
For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
AR2003
AR2003FV
Document number: DS37473 Rev. 3 - 2
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December 2014
© Diodes Incorporated
AR2003FV
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1 ) Package Type: V-DFN3535-14
A1
A
A3
Seating Plane
D
e
(Pin #1 ID)
E
E2
e1
D2
L
b
Z
V-DFN3535-14
Dim
Min
Max
Typ
A
0.75
0.85 0.80
A1
0.00
0.05 0.02
A3
0.15
b
0.20
0.30 0.25
D
3.45
3.55 3.50
D2
1.90
2.10 2.00
E
3.45
3.55 3.50
E2
1.90
2.10 2.00
e
0.50
e1
1.50
L
0.35
0.45 0.40
Z
0.625
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1 ) Package Type: V-DFN3535-14
X3
C
G1
Dimensions
X1
Y1
X2
C1
Y3
Y2
G
Y
C
C1
G
G1
X
X1
X2
X3
Y
Y1
Y2
Y3
Value
(in mm)
0.500
1.500
0.250
0.250
0.350
0.600
2.100
2.350
0.600
0.350
2.100
3.800
X
AR2003FV
Document number: DS37473 Rev. 3 - 2
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© Diodes Incorporated
AR2003FV
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
AR2003FV
Document number: DS37473 Rev. 3 - 2
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© Diodes Incorporated
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