TC1264 800 mA Fixed-Output CMOS LDO with Shutdown Features: Description: • • • • • The TC1264 is a fixed-output, high-accuracy (typically ±0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1264’s CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80 µA at full load (20 to 60 times lower than in bipolar regulators). Very Low Dropout Voltage 800 mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Overcurrent and Overtemperature Protection Applications: • • • • • • • TC1264 key features include ultra low noise operation, very low dropout voltage (typically 450 mV at full load), and fast response to step changes in load. Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers The TC1264 incorporates both over temperature and over current protection. The TC1264 is stable with an output capacitor of only 1 µF and has a maximum output current of 800 mA. It is available in 3-pin SOT-223, 3-pin TO-220 and 3-pin DDPAK packages. Package Type Typical Application 3-Pin DDPAK 3-Pin TO-220 VIN VIN VOUT TC1264 + FRONT VIEW VOUT TAB IS GND C1 1 µF TC1264 TC1264 1 2 1 2 3 GND VOUT FRONT VIEW 3 VOUT 2 GND TC1264 2010 Microchip Technology Inc. VIN 3-Pin SOT-223 TAB IS GND GND 3 VOUT VIN GND 1 VIN DS21375D-page 1 TC1264 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage .........................................................6.5V Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 8) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature..........................-65°C to +150°C † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Input Operating Voltage Maximum Output Current Output Voltage Sym Min Typ Max Units VIN 2.7 — 6.0 V IOUTMAX 800 — — mA VOUT VR – 2.5% VR ± 0.5% VR + 2.5% Conditions Note 2 VR 2.5V V VR – 2% VR ± 0.5% VR + 3% VR = 1.8V VR – 7% — VR + 3% IL = 0.1 mA to 800 mA (Note 3) VOUT/T — 40 — ppm/°C Line Regulation VOUT/VIN — 0.007 0.35 % Load Regulation (Note 5) VOUT/VOUT -0.01 0.002 0 %/mA IL = 0.1 mA to IOUTMAX Dropout Voltage (Note 6) VIN–VOUT — 20 30 mV VR 2.5V, IL = 100 µA — 50 160 VR 2.5V, IL = 100 mA — 150 480 VR 2.5V, IL = 300 mA — 260 800 VR 2.5V, IL = 500 mA — 450 1300 VR 2.5V, IL = 800 mA VR = 1.8V, IL = 500 mA VOUT Temperature Coefficient Supply Current — 1000 1200 — 1200 1400 Note 4 (VR + 1V) VIN6V IL = 800 mA IDD — 80 130 µA SHDN = VIH, IL = 0 Power Supply Rejection Ratio PSRR — 64 — db F 1 kHz Output Short Circuit Current IOUTSC — 1200 — mA VOUT = 0V Note 1: VR is the regulator output voltage setting. 2: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 3: 4: This accuracy represents the worst-case over the entire output current and temperature range. 5: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. 6: 7: 8: 6 V OUTMAX – V OUTMIN – 10 TCV OUT = ------------------------------------------------------------------------V OUT T DS21375D-page 2 2010 Microchip Technology Inc. TC1264 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Sym Thermal Regulation Output Noise Note 1: Min Typ Max Units VOUT/PD — 0.04 — V/W eN — 260 — nV/Hz Conditions Note 7 IL = IOUTMAX, F = 10 kHZ VR is the regulator output voltage setting. 2: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 3: 4: This accuracy represents the worst-case over the entire output current and temperature range. 6 TCV OUT 5: 6: 7: 8: V OUTMAX – V OUTMIN – 10 = ------------------------------------------------------------------------V OUT T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 3L-SOT-223 JA — 59 — °C/W Thermal Resistance, 3L-DDPAK JA — 71 — °C/W Thermal Resistance, 3L-TO-220 JA — 71 — °C/W Conditions Temperature Ranges (Note 1) Thermal Package Resistances Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C). 2010 Microchip Technology Inc. DS21375D-page 3 TC1264 TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. LINE REGULATION (%) Note: 0.020 150 0.018 135 0.016 120 0.014 105 0.012 90 IDD (A) 2.0 0.010 0.008 60 0.006 45 0.004 30 0.002 15 0.000 -40°C 0°C 25°C 70°C VOUT = 3V 75 0 -40°C 85°C 125°C 0°C TEMPERATURE (°C) FIGURE 2-1: Temperature. Line Regulation vs. RLOAD = 50Ω COUT = 1 μF FIGURE 2-4: DROPOUT VOLTAGE (V) NOISE (μV/√Hz) 10.0 25°C 70°C 85°C 125°C TEMPERATURE (°C) 1.0 0.1 IDD vs. Temperature. 0.600 0.550 0.500 0.450 0.400 0.350 125°C 85°C 70°C 25°C 0.300 0°C 0.250 0.200 -40°C 0.150 0.100 0.050 0.000 0.0 0.01 0.01 1 10 100 1000 0 100 200 300 400 500 600 700 800 ILOAD (mA) FREQUENCY (kHz) FIGURE 2-2: Output Noise vs. Frequency. FIGURE 2-5: ILOAD. 0.0100 3.030 3.020 ILOAD = 0.1 mA 3.010 3.000 0.0080 0.0070 0.0060 VOUT = 3V 1 mA to 800 mA 0.0040 0.0030 VOUT (V) LOAD REGULATION (%/mA) 0.0090 0.0050 3.0V Dropout Voltage vs. 2.980 2.960 2.950 2.940 0.0010 2.930 0°C 25°C 70°C 85°C 125°C 2.920 -40°C DS21375D-page 4 Load Regulation vs. ILOAD = 800 mA 0°C 25°C 70°C 85°C 125°C TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 2-3: Temperature. ILOAD = 500 mA 2.970 0.0020 0.0100 -40°C ILOAD = 300 mA 2.990 FIGURE 2-6: 3.0V VOUT vs.Temperature. 2010 Microchip Technology Inc. TC1264 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. 3-Pin SOT-223 3-Pin TO-220 3-Pin DDPAK Symbol 1 VIN 2 GND Ground terminal 3 VOUT Regulated voltage output 3.1 Description Unregulated supply input Unregulated Supply (VIN) Unregulated supply input. 3.2 Ground (GND) Ground terminal. 3.3 Regulated Output Voltage (VOUT) Regulated voltage output. 2010 Microchip Technology Inc. DS21375D-page 5 TC1264 4.0 DETAILED DESCRIPTION The TC1264 is a precision, fixed output LDO. Unlike bipolar regulators, the TC1264’s supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to ILOADMAX load current range (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 4-1 shows a typical application circuit. VIN VIN VOUT TC1264 GND FIGURE 4-1: DS21375D-page 6 + VOUT C1 1 µF 4.1 Output Capacitor A 1 µF (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1 and less than 5. A 1 µF capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. SHDN Typical Application Circuit. 2010 Microchip Technology Inc. TC1264 5.0 THERMAL CONSIDERATIONS 5.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160°C. The regulator remains off until the die temperature drops to approximately 150°C. 5.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst-case actual power dissipation: EQUATION 5-1: P D = V INMAX – VOUTMIN ILOADMAX Where: The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). EQUATION 5-2: Copper Area (Backside) Thermal Resistance JA) Board Area 2500 sq mm 2500 sq mm 2500 sq mm 25°C/W 1000 sq mm 2500 sq mm 2500 sq mm 27°C/W 125 sq mm 35°C/W 2500 sq mm 2500 sq mm * Tab of device attached to topside copper Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.3V ± 10% TJMAX = 125°C TAMAX = 95°C JA = 59°C/W (SOT-223) Find: 1. Actual power dissipation. 2. Maximum allowable dissipation. Actual power dissipation: P D VINMAX – V OUTMIN I LOADMAX Table 5-1 and Table 5-2 show various values of JA for the TC1264 packages. THERMAL RESISTANCE GUIDELINES FOR TC1264 IN SOT-223 PACKAGE Copper Area (Backside) Board Area –3 P D = 260 mW Where all terms are previously defined. Thermal Resistance JA) 2500 sq mm 2500 sq mm 2500 sq mm 45°C/W 1000 sq mm 2500 sq mm 2500 sq mm 45°C/W 225 sq mm 2500 sq mm 2500 sq mm 53°C/W 100 sq mm 2500 sq mm 2500 sq mm 59°C/W 1000 sq mm 1000 sq mm 1000 sq mm 52°C/W 1000 sq mm 55°C/W 0 sq mm ILOADMAX = 275 mA P D = 3.3 1.1 – 2.7 .995 275 10 PDMAX = (TJMAX – TAMAX) JA Copper Area (Topside)* Copper Area (Topside)* THERMAL RESISTANCE GUIDELINES FOR TC1264 IN 3-PIN DDPAK/TO-220 PACKAGE VOUTMIN = 2.7V ± 0.5% PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current TABLE 5-1: TABLE 5-2: 1000 sq mm Maximum allowable power dissipation: T JMAX – T AMAX P DMAX = -------------------------------------- JA 125 – 95 P DMAX = ------------------------59 P DMAX = 508 mW In this example, the TC1264 dissipates a maximum of 260 mW, which is below the allowable limit of 508 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN, is found by substituting the maximum allowable power dissipation of 508 mW into Equation 5-1, from which VINMAX = 4.6V. * Tab of device attached to topside copper 2010 Microchip Technology Inc. DS21375D-page 7 TC1264 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 3-Lead DDPAK Example XXXXXXXXX XXXXXXXXX YYWWNNN 3-Lead SOT-223 XXXXXXX XXXYYWW NNN 3-Lead TO-220 XXXXXXXXX XXXXXXXXX YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: DS21375D-page 8 TC1264 e3 1.8VEB^^ 1030256 Example 1264-25 VDB1030 256 Example TC1264 e3 3.0VAB^^ 1030256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2010 Microchip Technology Inc. TC1264 /HDG3ODVWLF(%>''3$.@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ E E1 L1 D1 D H 1 N b BOTTOM VIEW e TOP VIEW b1 CHAMFER OPTIONAL C2 A φ c A1 L 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV ,1&+(6 0,1 1 120 0$; 3LWFK H 2YHUDOO+HLJKW $ %6& ± 6WDQGRII $ ± 2YHUDOO:LGWK ( ± ([SRVHG3DG:LGWK ( ± ± 0ROGHG3DFNDJH/HQJWK ' ± 2YHUDOO/HQJWK + ± ([SRVHG3DG/HQJWK ' ± ± /HDG7KLFNQHVV F ± 3DG7KLFNQHVV & ± /RZHU/HDG:LGWK E ± 8SSHU/HDG:LGWK E ± )RRW/HQJWK / ± 3DG/HQJWK / ± ± )RRW$QJOH ± 1RWHV 6LJQLILFDQW&KDUDFWHULVWLF 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% 2010 Microchip Technology Inc. DS21375D-page 9 TC1264 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS21375D-page 10 2010 Microchip Technology Inc. TC1264 /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU'%>627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ D b2 E1 E 3 2 1 e e1 A2 A b c φ L A1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI/HDGV 0,//,0(7(56 0,1 120 0$; 1 /HDG3LWFK H %6& 2XWVLGH/HDG3LWFK H 2YHUDOO+HLJKW $ ± ± 6WDQGRII $ ± 0ROGHG3DFNDJH+HLJKW $ 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' /HDG7KLFNQHVV F /HDG:LGWK E 7DE/HDG:LGWK E )RRW/HQJWK / ± ± /HDG$QJOH ± %6& 1RWHV 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% 2010 Microchip Technology Inc. DS21375D-page 11 TC1264 /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU'%>627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ DS21375D-page 12 2010 Microchip Technology Inc. TC1264 /HDG3ODVWLF7UDQVLVWRU2XWOLQH$%>72@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ CHAMFER OPTIONAL φP E A A1 Q H1 D D1 L1 L b2 1 2 N b c e A2 e1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV ,1&+(6 0,1 1 120 0$; 3LWFK H %6& 2YHUDOO3LQ3LWFK H %6& 2YHUDOO+HLJKW $ ± 7DE7KLFNQHVV $ ± %DVHWR/HDG $ ± 2YHUDOO:LGWK ( ± 0RXQWLQJ+ROH&HQWHU 4 ± 2YHUDOO/HQJWK ' ± 0ROGHG3DFNDJH/HQJWK ' ± 7DE/HQJWK + ± 0RXQWLQJ+ROH'LDPHWHU 3 ± /HDG/HQJWK / ± /HDG6KRXOGHU / ± ± /HDG7KLFNQHVV F ± /HDG:LGWK E 6KRXOGHU:LGWK E 1RWHV 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0 %6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &% 2010 Microchip Technology Inc. DS21375D-page 13 TC1264 NOTES: DS21375D-page 14 2010 Microchip Technology Inc. TC1264 APPENDIX A: REVISION HISTORY Revision D (September 2010) The following is the list of modifications: 1. 2. Updated Figure 2-4. Updated package drawings (C04-011B, C04-2011A, C04-032B, C04-2032A, C04-034B). Revision C (October 2006) The following is the list of modifications: 1. 2. 3. Section 1.0 “Electrical Characteristics”: Changed dropout voltage typical value for IL = 500 mA from 700 to 1000 and maximum value from 1000 to 1200 for. Changed typical value for IL = 800 mA from 890 to 1200. Section 6.0 “PackAging Information”: Added package marking information and package outline drawings. Added disclaimer to package outline drawings. Revision B (May 2002) • Undocumented Changes. Revision A (March 2002) • Original Release of this Document. 2010 Microchip Technology Inc. DS21375D-page 15 TC1264 NOTES: DS21375D-page 16 2010 Microchip Technology Inc. TC1264 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X.XX XX XX Device Voltage Option Package Tape and Reel Device TC1264 Fixed Output CMOS LDO Voltage Option:* 1.8V 2.5V 3.0V 3.3V Examples: a) b) c) d) TC1264-1.8VAB TC1264-2.5VAB TC1264-3.0VAB TC1264-3.3VAB a) TC1264-1.8VEBTR 1.8V LDO, DDPAK-3 pkg., Tape and Reel TC1264-2.5VEBTR 2.5V LDO, DDPAK-3 pkg., Tape and Reel TC1264-3.0VEBTR 3.0V LDO, DDPAK-3 pkg., Tape and Reel TC1264-3.3VEBTR 3.3V LDO, DDPAK-3 pkg., Tape and Reel b) = = = = 1.8V 2.5V 3.0V 3.3V * Other output voltages are available. Please contact your local Microchip sales office for details. Package AB = DB = DBTR = EB = EBTR = Plastic (TO-220), 3-Lead Plastic (SOT-223), 3-lead Plastic (SOT-223), 3-lead, Tape and Reel Plastic Transistor Outline (DDPAK), 3-Lead Plastic Transistor Outline (DDPAK), 3-Lead, Tape and Reel c) d) a) b) c) d) e) f) g) h) 2010 Microchip Technology Inc. 1.8V LDO, TO-220-3 pkg. 2.5V LDO, TO-220-3 pkg. 3.0V LDO, TO-220-3 pkg. 3.3V LDO, TO-220-3 pkg. TC1264-1.8VDB 1.8V LDO, SOT-223 pkg. TC1264-1.8VDBTR 1.8V LDO, SOT-223 pkg., Tape and Reel TC1264-2.5VDB 2.5V LDO, SOT-223 pkg. TC1264-2.5VDBTR 2.5V LDO, SOT-223 pkg., Tape and Reel TC1264-3.0VDB 3.0V LDO, SOT-223 pkg. TC1264-3.0VDBTR 3.0V LDO, SOT-223 pkg., Tape and Reel TC1264-3.3VDB 3.3V LDO, SOT-223 pkg. TC1264-3.3VDBTR 3.3V LDO, SOT-223 pkg., Tape and Reel DS21375D-page 17 TC1264 NOTES: DS21375D-page 18 2010 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-60932-564-0 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2010 Microchip Technology Inc. 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