D3ZxVxBF

D3Z2V4BF – D3Z36BF
0.4W SURFACE MOUNT PRECISION ZENER DIODE
Mechanical Data

400mW Power Dissipation on FR-4 PCB

Case: SOD323F

Very Tight Tolerance on VZ


Ideally Suited for Automated Assembly Processes
Case Material: Molded Plastic, “Green” Molding Compound;
UL Flammability Classification Rating 94V-0

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Moisture Sensitivity: Level 1 per J-STD-020

Halogen and Antimony Free. “Green” Device (Note 3)

Terminal Connections: Cathode Band

Terminals: Finish - Matte Tin Annealed over Copper Alloy
leadframe. Solderable per MIL-STD-202, Method 208

Weight: 0.01 grams (Approximate)
NEW PRODUCT
Features
SOD323F
Top View
Ordering Information (Note 4)
Part Number
(Type Number)-7*
Case
SOD323F
Packaging
3,000/Tape & Reel
* Example: The part number for the 3.6 Volt device would be D3Z3V6BF-7.
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year
2010
Code
X
Month
Code
2011
Y
Jan
1
Feb
2
D3Z2V4BF – D3Z36BF
Document number: DS35437 Rev. 9 - 2
2012
Z
Mar
3
2013
A
Apr
4
YM
XX
XX = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking
Y = Year (ex: X = 2010)
M = Month (ex: 9 = September)
2014
B
May
5
2015
C
Jun
6
1 of 5
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2016
D
Jul
7
2017
E
Aug
8
2018
F
Sep
9
Oct
O
2019
G
Nov
N
2020
H
Dec
D
January 2016
© Diodes Incorporated
D3Z2V4BF – D3Z36BF
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Forward Voltage
@ IF = 10mA
Symbol
VF
Value
0.9
Unit
V
Symbol
PD
RJA
TJ, TSTG
Value
400
312.5
-65 to +150
Unit
mW
°C/W
°C
NEW PRODUCT
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient Air (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics
Type
Number
Marking
Code
D3Z2V4BF
D3Z2V7BF
D3Z3V0BF
D3Z3V3BF
D3Z3V6BF
D3Z3V9BF
D3Z4V3BF
D3Z4V7BF
D3Z5V1BF
D3Z5V6BF
D3Z6V2BF
D3Z6V8BF
D3Z7V5BF
D3Z8V2BF
D3Z9V1BF
D3Z10BF
D3Z11BF
D3Z12BF
D3Z13BF
D3Z15BF
D3Z16BF
D3Z18BF
D3Z20BF
D3Z22BF
D3Z24BF
D3Z27BF
D3Z30BF
D3Z33BF
D3Z36BF
L0
L1
L2
L3
L4
L5
L6
L7
GM, L8
L9
LA
LB
LC
LD
LE
LF
LG
LH
LJ
LK
LL
LM
LN
LP
LQ
LR
LS
LT
LU
Notes:
(@TA = +25°C, unless otherwise specified.)
Zener Voltage Range
(Note 6)
VZ @ IZT
Min (V)
2.43
2.69
2.85
3.32
3.60
3.89
4.17
4.55
4.96
5.48
6.06
6.65
7.28
8.02
8.85
9.77
10.78
11.74
12.91
14.34
15.85
17.56
19.52
21.54
23.72
26.19
29.19
32.15
35.07
Max (V)
2.63
2.91
3.07
3.53
3.85
4.16
4.48
4.75
5.20
5.73
6.33
6.93
7.60
8.36
9.23
10.21
11.22
12.24
13.49
14.98
16.51
18.35
20.39
22.47
24.78
27.53
30.69
33.79
36.87
Maximum Zener Impedance
f = 1kHz
IZT
ZZT @ IZT
mA
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
100
100
95
95
90
90
90
90
60
50
50
40
10
10
10
10
10
10
10
15
20
20
20
25
30
40
40
40
60
Maximum Reverse
Current (Note 7)
Typical
Temperature
Coefficient
ZZK @ IZK
IZK
IR
@ VR
@ IZT = 5mA
1000
1000
1000
1000
500
500
600
600
250
100
80
60
60
60
60
60
60
80
80
80
80
80
100
100
120
150
200
250
300
mA
0.5
0.5
0.5
0.5
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
A
50
20
10
5
5
3
3
2
2
1
0.5
0.5
0.5
0.5
0.5
0.1
0.1
0.1
0.1
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
0.05
V
1
1
1
1
1
1
1
1
1.5
2.5
3
3.5
4
5
6
7
8
9
10
11
12
13
15
17
19
21
23
25
27
mV/°C
-1.6
-1.7
-1.7
-1.9
-2.4
-2.5
-2.5
-1.1
0.3
1.7
2.5
3.4
4.0
4.6
5.0
6.1
7.4
8.2
9.4
12.1
13.7
15.8
16.4
18.4
20.4
18.0
28.6
32.2
34.9
Ω
Typical Total
Capacitance
@ VR = 0V,
f = 1MHz
pF
215
205
195
145
185
175
165
150
145
20
95
82
70
57
50
45
41
36
33
28
25
24
22
20
18
17
17
15
14
5. Device mounted on FR-4 PCB with suggested pad layout, board size 35mm * 25mm.
6. The Zener voltage is measured <40ms after power is supplied.
7. Short duration pulse test used to minimize self-heating effect.
D3Z2V4BF – D3Z36BF
Document number: DS35437 Rev. 9 - 2
2 of 5
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January 2016
© Diodes Incorporated
IF, INSTANTANEOUS FORWARD CURRENT (mA)
D3Z2V4BF – D3Z36BF
0.6
PD, POWER DISSIPATION (W)
0.5
0.4
0.3
0.2
0.1
0
25
50
75
100
125
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Derating Curve
1,000
150
100
10
1
0.1
0.4
0.6
0.8
1
1.2
1.4
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
20
20
16
16
IZ, ZENER CURRENT (mA)
IZ, ZENER CURRENT (mA)
0
12
8
4
0
1
2
3
4
5
6
7
8
9
10
VZ, ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
16BF
10BF 12BF
15BF
18BF
12
8
4
0
8
10
12
14 16 18 20 22 24 26
VZ, ZENER VOLTAGE (V)
Fig. 4 Typical Zener Breakdown Characteristics
20
IZ, ZENER CURRENT (mA)
NEW PRODUCT
Note 5
15
27BF
30BF
33BF
36BF
10
5
0
22
24
26
28
30 32 34 36 38 40
VZ, ZENER VOLTAGE (V)
Fig. 5 Typical Zener Breakdown Characteristics
D3Z2V4BF – D3Z36BF
Document number: DS35437 Rev. 9 - 2
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January 2016
© Diodes Incorporated
D3Z2V4BF – D3Z36BF
Package Outline Dimensions
Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version.
SOD323F
c
D
2
1
NEW PRODUCT
He
SOD323F
Dim
Min
Max
Typ
A
0.60 0.75

b
0.25 0.35

c
0.05 0.26

D
1.15 1.35 1.25
E
1.60 1.80 1.70
He
2.30 2.70 2.50
L1
0.30 0.50 0.40
L2
0.41 0.61 0.51
α1
7°


α2
3°


β1
7°


β2
3°


All Dimensions in mm
L2 (2x)
E
L1
b (2x)
b (2x)
1
A
2
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version.
SOD323F
X1
X
Dimensions Value (in mm)
G
1.280
X
0.710
X1
2.700
Y
0.403
Y
G
D3Z2V4BF – D3Z36BF
Document number: DS35437 Rev. 9 - 2
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© Diodes Incorporated
D3Z2V4BF – D3Z36BF
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
NEW PRODUCT
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
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website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
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D3Z2V4BF – D3Z36BF
Document number: DS35437 Rev. 9 - 2
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