AP91352

AP91352
SAS DISABLE +5V eFUSE WITH INTEGRATED ISOFET
Pin Assignments
The eFuse is a 5V protection device with a bidirectional switch that
incorporates input slew rate control to reduce input surge current and
reverse current detection to prevent discharge to VCC from VOUT.
The eFuse protection features include under voltage lockout, a fixed
2.5A current limit, trimmed fast response over voltage protection and
thermal shutdown. The EN/FAULT line is a tri-state bidirectional
interface that can be used to disable the output by pulling the line low
through an external open drain device. If a thermal fault occurs, the
voltage on the pin will go to an intermediate voltage indicating a fault
and it can be connected to another device to cause simultaneous shut
down. The SAS pin is an ESD protected interface that allows direct
external control of the eFuse. Driving the SAS pin high pulls the
enable line low causing the eFuse to shutdown and enter a low
quiescent current state.
The integrated Isofet latches off when the reverse current is detected.
This can be reset only by triggering the under voltage lock out, by
EN/FAULT pin or when voltage on the output pin (VOUT) falls below
the supply pin voltage (VCC) in AP91352.
The AP91352 is available in a standard Green W-QFN3020-12
package and is RoHS compliant.
Features












(Top View)
GND
12
VCC
1
VCC
2
VCC
3
SAS
4
EN/FAULT
5
GND
NEW PRODUCT
Description
13
11
VOUT
10
VOUT
9
VOUT
8
NC
7
NC
6
NC
W-QFN3020-12
Applications





HHD Drives
SSD Drives
Mother Board Power Management
Printer Load Power Management
Fan Drives
SAS Disable

2.1V Signal Disables the eFuse

ESD Compliant to 1kV HBM and 500V CDM
Integrated Isofet that latches off when reverse current is
detected. Latch off is reset by

VOUT Falling below VCC

UVLO Trigger

EN/FAULT Pin
Input Tolerant of Continuous +12V
50mΩ Typical Total on Resistance
Fixed 2.5A Over Current Protection (OCP)
Over Voltage Protection (OVP)
Fixed 13ms +/- 20% Slew Rate Control (SRC)
Over Temperature Protection (OTP)
Under Voltage Lockout (UVLO)
Thermally Efficient Low Profile Package, W-QFN3020-12
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Notes:
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP91352
Document number: DS38109 Rev. 2 - 2
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AP91352
NEW PRODUCT
Typical Applications Circuit
EN
N
Pin Descriptions
Pin Number
Pin Name
Description
1, 2, 3
VCC
Supply input, a 1µF capacitor is needed to supply internal charge pump. The capacitor return
should be connected directly to the GND pin.
4
SAS
SAS Disable, When this pin is pulled high to a voltage greater then 2.1V, the eFuse is turned off.
The EN/FAULT pin is a tri−state, bidirectional interface. It can be used to enable or disable the
output of the device by pulling it to ground using an open drain device. If a thermal fault occurs,
the voltage on this pin will go to an intermediate state to signal a monitoring circuit that the device
is in thermal shutdown. It can also be connected to another device in this family to cause a
simultaneous shutdown during thermal events.
5
EN/FAULT
6, 7, 8
NC
9, 10, 11
VOUT
Output: eFuse controlled output; a 20µF capacitor is needed for over voltage protection stability.
The capacitor return should be connected directly to the GND pin.
12
GND
Ground
13
GND
Ground exposed pad
AP91352
Document number: DS38109 Rev. 2 - 2
Do not connect on PCB, internally connected for production purpose
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AP91352
NEW PRODUCT
Functional Block Diagram
Absolute Maximum Ratings (Note 4) (@ TA = +25°C, unless otherwise specified.)
Symbol
VCC
Parameter
Input Voltage
EN/FAULT
SAS
VOUT
Ratings
Steady State
-0.3 to 12
Transient (100ms)
-0.3 to 15
Enable Voltage
Units
V
-0.3 to 6
V
SAS Disable Voltage
-0.3 to 3.6
V
VOUT Voltage
-0.3 to 7.0
V
ESD HBM
Human Body ESD Protection JESD22-A114
2000
V
ESD CDM
Charged Device Model ESD Protection JESD22-C101
1000
V
TA(max)
Maximum Ambient Temperature
-40 to +125
°C
TJ(max)
Maximum Junction Temperature
+150
°C
-65 to +150
°C
TST
Storage Temperature
PD
Power Dissipation (TA = +25°C)
RθJA
Notes:
W-QFN3020-12
Thermal Resistance, Junction to Ambient (0.5 sq in) W-QFN3020-12 (Note 5)
1.3
W
40
°C/W
4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
5. For a device surface mounted on 25mm by 25mm by 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady state condition.
Recommended Operating Conditions (All specifications are for -10°C < TA < +85°C, VCC = 5V, unless otherwise noted.)
Symbol
VCC
TA
Parameter
Min
Typ
Max
Units
Input Voltage Range
3.6
–
12
V
Operating Ambient Temperature
-40
–
+85
°C
AP91352
Document number: DS38109 Rev. 2 - 2
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AP91352
Electrical Characteristics (Note 6) (All specifications are for -10°C < TA < +85°C, VCC = 5V, unless otherwise noted.)
Symbol
Parameters
Conditions
Min
Typ
Max
Unit
Supply Current
NEW PRODUCT
IQ
VCC Supply Current
EN = High, SAS = 0, ILOAD = 0A
–
–
300
μA
Fault Latch off
–
100
–
μA
EN = Low
–
–
100
μA
TA = +25°C
–
50
65
mΩ
TJ = +80°C
–
95
–
mΩ
μs
Power FET
RDS(ON)
ON Resistance
tON-DLY
Turn-on Delay
Enable ID = 100mA, 1A Resistive Load
–
500
–
IDC
Continuous Current
TA = +25°C, 0.5 sq in copper
–
2
–
A
IOFF
Off State Leakage
VCC = 12V, EN = Low
–
–
1
μA
EN to VOUT = 4.7V (Note 7)
10.4
13.0
15.6
ms
Current Limit
–
2.5
3.0
–
A
Short Circuit Current
–
3.0
–
A
Current Limit Response
–
5.5
–
40
μs
Slew Rate Control
SRC
Slew Rate Control
Current Protection
ILIM
ISHORT
tILIM
Reverse Current Limit / Under Voltage Protection
IQREVERSE
Fast Reverse Current Limit
(Note 8)
1
–
1.7
A
tQREVERSE
Fast Reverse Current Limit Response Time
VCC dv/dt = -5V/1ms
5
–
10
μs
Under Voltage Lock Out
UVLO Rising
3.8
4.0
4.2
V
UVLO-hys
Under Voltage Hysteresis
–
–
0.3
–
V
–
Under Voltage Response
–
–
2.0
–
μs
–
5.5
6
6.25
V
–
20
40
μs
UVLO
Over Voltage Protection
OVP
tOVP
Over Voltage Clamping
Over Voltage Response
COUT = 20µF, dv/dt (VCC) = 0.5V/µs, VOUT
< 6.5V
Thermal Protection
Shutdown Temperature
–
+130
+150
+200
°C
VL
Logic Level Low
Output Disabled (Note 7)
0.35
–
0.8
V
VM
Logic Level Mid
Thermal Fault, Output Disabled (Note 7)
0.9
–
1.95
V
VH
Logic Level High
Output Enabled
2.1
–
3.3
V
Maximum High State
–
3.4
–
5.2
V
IL
Logic Low Sink Current
EN = 0V
–
-12
-20
μA
IH
Logic Level High
EN = 3.3V
–
–
1
μA
Fan out
–
–
–
3
Units
THSD
Enable/Fault
VMAX
FAN
AP91352
Document number: DS38109 Rev. 2 - 2
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AP91352
Electrical Characteristics (Cont.) (Note 6) (All specifications are for -10°C < TA < +85°C, VCC = 5V, unless otherwise noted.)
Symbol
Parameters
Conditions
Min
Typ
Max
Unit
NEW PRODUCT
SAS Disable
SASL
Logic Level Low
Output Enabled
0.35
–
1.2
V
SASH
Logic Level High
Output Disabled
1.3
1.9
2.1
V
SASHmax
Maximum Pin Voltage
–
SAS-ΩIN
Input Impedance
To GND
SAS-TDLY
Deglitch Filter
–
–
Human Body JESD22-A114
–
Charged Device JESD22-C101
Notes:
–
–
3.3
V
350
500
1000
kΩ
2
–
50
μs
–
1
–
–
kV
–
500
–
–
V
6. Typical data is measured at TA = +25C, VCC = 5V. The maximum and minimum parameters values over operating temperature range are not tested in
production, they are guaranteed by design, characterization and process control.
7. The slew rate control is held in reset until the input voltage is greater than the UVLO rising threshold and Enable = High. The slew rate control is reset
when input voltage drops below UVLO falling threshold, Enable changes from High to Mid or Low, SA = High or reverse current detection.
8. Reverse current detection will latch off the Isofet switch; In AP91352, this condition can be reset by under voltage lock out, by EN/FAULT and SAS pin, or
when VOUT falls below the supply pin voltage (VCC) by 100mV typical at TA = +25C, VCC = 5V.
AP91352
Document number: DS38109 Rev. 2 - 2
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AP91352
NEW PRODUCT
Performance Characteristic
VCC=5V
IOUT=2A
AP91352
Document number: DS38109 Rev. 2 - 2
VCC=5V
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AP91352
Performance Characteristic (Cont.)
VCC=5V
EN to VOUT=4.7V
NEW PRODUCT
VCC=5V
Input/Output Transient Response when Short Circuit
VCC=5V
VCC
2V/div
VOUT
2V/div
VCC=5V
VEN
5V/div
tLIMIT=18μs
IOUT
2A/div
200μs/div
VCC=5V
AP91352
Document number: DS38109 Rev. 2 - 2
VCC=5V
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AP91352
Application Note
Theory of Operation
The AP91352 is a self protected, resettable electronic fuse. It monitors the input and output voltage, the output current and the die temperature.
When the AP91352 is powered up it will ramp up the output voltage based on the fixed slew rate (see above electrical spec) and current will
begin to flow. The Overcurrent Protection, Overvoltage Clamp, Under Voltage Lockout and Thermal Protection are internally set.
NEW PRODUCT
Also, integrated reverse blocking MOSFET would prevent back-drive from an active load inadvertently causing undetermined behavior in the
application.
Overvoltage Clamping
The AP91352 monitor the input voltage and clamp output voltage once it exceeds 6.25V (MAX). This will allow for transient on the input for short
periods of time. If the input voltage stays above 6.25V (MAX) for extended times the voltage drop across the FET with the load current will
increase the die temperature and the thermal shutdown feature will protect the device and shut it down.
Under Voltage Lock Out
The input voltage of AP91352 is monitored by an UVLO circuit (under voltage lockout) if the input voltage drops below this threshold the output
transistor will be pulled into a high impedance state.
Enable/Fault
The AP91352 has a tri state EN/FAULT pin. It is used to turn on and off the device with high and low signals from a GPIO, but can also indicate a
thermal fault. When the EN/FAULT pin is pulled low the output is turned off, when the EN/FAULT pin is pulled high the output is turned on. Also,
the EN/FAULT pin would be internally pulled high after VCC reach UVLO. In the event of a thermal fault the EN/FAULT pin will be pulled low to
an intermediate voltage by an internal circuit. This can be used to chain up to 3 efuse together, like AP91352, NIS5132 (12V effuse), or NIS5135
(5V effuse) together that during a thermal shut down the linked devices turn off as well.
Due to this fault indication capability it should not be connected to any type of logic with an internal pull up device.
AP91352 connected to a 2nd device will latch off until the EN/FAULT pin has been pulled to low and then allowed to go back up to a high signal,
or SAS pin has been toggled from High to Low or if the power has been cycled. Once the part starts up again it will go through the start-up ramp
determined by the internal circuit, 13ms (typ).
Symbol
Description
Enable/Fault
eFuse State
Latching
VL
Off
No
N/A
UVLO
Under Voltage Lock Out
SASH
SAS Disable = 1
VL
Off
Thermal Shutdown
VM
Off
Yes
Reverse Current Protection
VM
Off
(Note 8)
SASO
SAS Disable = Open
VH
On
N/A
SASL
SAS Disable = 0
VH
On
N/A
VCC > UVLO, No Fault
VH
On
N/A
THSD
IREVERSE
–
Table 1. EN/FAULT Signal Levels & Device Status
Thermal Protection
The AP91352 has an integrated temperature sensing circuit that protects the die in the event of over temperature. The trip point has been
intentionally set high at +150˚C (typ) to allow for increased trip times during high power transient events. The AP91352 will shut down current
flow to the output when the die temperature reaches +150°C (typ). The AP91352 will restart after the Enable pin has been toggled or the input
power has been cycled.
Even though the thermal trip point has been set high to allow for high current transients the circuit design should accomplish best thermal
performance with good thermal layout of the PCB. It is not recommended to operate AP91352 above +150°C over extended periods of time.
AP91352
Document number: DS38109 Rev. 2 - 2
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AP91352
Ordering Information
AP91352 XX X - XXX - XX
Version
Function
Package
Packing
NEW PRODUCT
7 : Tape & Reel
MN : Product Version 1: Thermal or Reverse DT8 : W-QFN3020-12
7R: Tape & Reel
Current Latching
Different Tape Orientation
(Note 8)
7” Tape and Reel
Package
Packaging
Identification
Code
(Note 9)
Code
Quantity
Part Number Suffix
AP91352MN1-DT8-7
DT8
W-QFN3020-12
P9
3000/Tape & Reel
-7
AP91352MN1-DT8-7R
DT8
W-QFN3020-12
P9
3000/Tape & Reel
-7R
Part Number
Note 9:
Pad layout as shown in Diodes Incorporated’s package outline PDFs, which can be found on our website at
http://www.diodes.com/package-outlines.html.
Marking Information
W-QFN3020-12
(Top View)
XX : Identification Code
Y : Year : 0~9
X X
YW y
x x x x
W : Week : A~Z : 1~26 week; a~z : 27~52 week;
z represents 52 and 53 week
y : Internal Code
x : Internal Code
Part Number
Package
Identification Code
AP91352MN1-DT8-7
W-QFN3020-12
P9
AP91352MN1-DT8-7R
W-QFN3020-12
P9
AP91352
Document number: DS38109 Rev. 2 - 2
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AP91352
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
W-QFN3020-12
E
L1
L
NEW PRODUCT
PIN#1 ID
L2
b
e
D
e1
b1
A
A
b
A3
W-QFN3020-12
Dim
Min
Max
Typ
A
0.700 0.800
A1
0
0.05
A3
0.203REF
b
0.200 0.300
b1
0.350 0.450
D
1.900 2.100 2.000
E
2.900 3.100 3.000
e
0.500
e1
0.575
L
0.350 0.450
L1
0.450 0.550
L2
0.750 0.850
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
W-QFN3020-12
X1
X
Dimensions
Y
C
Y2
Y4
C1
Y1
Y3
C
G
X
X1
X2
X3
Y
Y1
Y2
Y3
Y4
Value
(in mm)
0.500
0.575
0.650
0.750
0.350
2.400
0.300
0.450
0.900
1.050
3.400
X2
X3
AP91352
Document number: DS38109 Rev. 2 - 2
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AP91352
NEW PRODUCT
Taping Orientation
(1)
Package Type: AP91352MN1-DT8-7
(2)
Package Type: AP91352MN1-DT8-7R
Note 10:
The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf.
AP91352
Document number: DS38109 Rev. 2 - 2
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AP91352
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
NEW PRODUCT
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
AP91352
Document number: DS38109 Rev. 2 - 2
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