Datasheet

Datasheet
4.5V to 25V Input
1ch Synchronous Buck DC/DC Controller
BD95601MUV-LB
General Description
Key Specifications



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This is the product guarantees long time support in
industrial market.
BD95601MUV-LB is a high current buck regulator that
produces low output voltage (0.75V to 2.0V) from a wide
input voltage range (4.5V to 25V).High efficiency is
realized using external N channel MOSFETs.
3
TM
Using H Reg , Rohm’s advanced proprietary control
method that uses constant on-time control to provide
ultra-high transient responses to load changes.
SLLM (Simple Light Load Mode) technology is added to
improve efficiency with light loads giving high efficiency
over a wide load range. Soft start functionality, short
circuit protection with timer latch, over current protection
and tracking are all included features. This switching
regulator was designed for low voltage high current
power supplies.
VIN Input Voltage Range:
VCC Input Voltage Range:
VDD Input Voltage Range:
Output Voltage Range:
Standby Current:
Operating Temperature Range:
Package
4.5V to 25V
4.5V to 5.5V
4.5V to 5.5V
0.75V to 2.0V
0μA (Typ)
-10°C to +85°C
W(Typ) x D(Typ) x H(Max)
4.00mm x 4.00mm x 1.00mm
VQFN020V4040
Features






Long Time Support Product for Industrial
Applications.
Adjustable Light Load and Selectable Continuous
Modes.
Multifunctional Protection Circuits.
-Thermal Shut down (TSD).
-Under Voltage Lock Out (UVLO).
-Over Current Protection (OCP).
-Over Voltage Protection (OVP).
-Short Circuit Protection (SCP).
Adjustable Soft Start.
Power Good Output.
200kHz to 500kHz Switching Frequency.
VQFN020V4040
Applications
 FPGA, POL application.
 Mobile PC, Desktop PC, LCD-TV, Digital Components
etc.
 Industrial Equipment.
Typical Application Circuit
+12V
C6
R7
REG1_5V
17
16
OUT
VIN
BOOT
EN_1MGT
1
SS
2
EN/SLLM
HG 15
C12
18
C11
19
C1
C4
C10
20
PGOOD
EN_1
R6
GND
R8
PG_2
C5
PG_1
1V
Q1
1VMGT
SW 14
L1
U1
R1
EN_2
3
ILIM
4
VCC
5
FB
R13
VDD 13
BD95371MUV
BD95601MUV-LB
1.2V
C8
1.35/1.5V
C3
EN_1.8
C14
EN_1.35/1.5
C13
EN_1.2
1.8V
VOUT
FREQ
FS
IS-
IS+
7
8
9
10
2V
Q2
PGND 11
C7
R5
R12
R10
JP1
R3
LG 12
6
R20
R18
R4
C2
R2
R11
GND
PGND
Figure 1. Application Circuit
○Product structure : Silicon monolithic integrated circuit
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○This product has no designed protection against radioactive rays
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PGND
LG
VDD
HG
Pin Configuration
SW
BD95601MUV-LB
15 14 13 12 11
BOOT 16
10 Is+
VIN 17
9 Is-
OUT 18
8 FS
2
3
4
5
FB
1
VCC
6 VOUT
ILIM
GND 20
EN/SLLM
7 FREQ
SS
PGOOD 19
Figure 2. Pin Configuration
Pin Description
Pin No.
Pin Name
1
SS
2
EN/SLLM
3
ILIM
4
VCC
5
FB
6
VOUT
Output Voltage Monitor input.
7
FREQ
8
FS
9
Is-
10
Is+
11
PGND
12
LG
13
VDD
14
SW
15
HG
16
BOOT
17
VIN
18
OUT
19
PGOOD
20
GND
Current Sense Amplifier Output.
Frequency input. A resistor sets the switching frequency. The frequency can be set from
200kHz to 500kHz.
Input Current Sense Amplifier input. FREQ pin is output.
Output Current Sense Amplifier input. If the voltage between this pin and VOUT pin
reaches the specified voltage level (setting at ILIM pin), the switching is turned OFF.
Ground pin for Low-side FET driver.
This is the pin to drive the gate of the Low-side FET. This voltage swings between VDD
and PGND. High-speed gate driving for the Low-side FET is achieved using an output
MOS (3Ω when LG is high, 0.5Ω when LG is low.).
This is the power supply pin to drive the Low-side FET.
It is recommended that 10μF bypass capacitor be used to compensate for peak current
during the FET on/off transition.
This is the ground pin for High-side FET.
The maximum absolute rating is 30V from ground.
This is the pin to drive the gate of the High-side FET. The status of the switching swings
between BOOT and SW. High-speed gate driving for High-side FET is achieved using an
output MOS (3Ω when HG is high, 2Ω when HG is low).
This is the power supply pin to drive the High-side FET.
The maximum absolute ratings are 35V from ground and 7V from SW.
The switching waveform sweeps from (VIN+VDD) to VDD by BOOT operation.
3
TM
This is the pin for H Reg control. It determines necessary on-time by monitoring input
voltage. It is recommended to connect 1kΩ / 0.1μF CR filter.
This is the output pin of output voltage control amp. Please connect a resistor and
capacitor to ground in series.
It is recommended that a 0.01μF capacitor be established in normal operation.
Power Good output. This pin outputs a high-level when the FB pin voltage is above 63%
of the reference voltage.
This is an open drain pin and therefore requires an external pull-up.
Ground pin of control circuit. It is the same as FIN potential.
FIN
FIN
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Function
Soft Start Time input. The rise time is set by a capacitor connected between SS and
ground. At startup, a fixed current flows into the SS capacitor. Output voltage is
controlled until the SS input reaches the reference voltage of 0.75V.
Enable and Mode Selection Input. Voltage on this input selects the operating mode.
Standby Mode:
< 0.8V
Continuous Mode: 2.3V – 3.8V
Light Load Mode:
4.2V – 5.5V
Coil Current Limit input.
A 100KΩ resistor should be connected between this input and ground.
IC Internal Circuits Power input.
Output Voltage Sense input. A resistor divider to this input sets the output voltage.
Backside thermal pad. Please connect to the Ground.
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BD95601MUV-LB
Block Diagram
VIN
VDD
4
EN/SLLM
VCC
17
1
BG
+
EN
SCP
REF×0.56
SS×0.56
FB
VOUT
3
REF
BOOT
Soft Start Block
+
Q
VOUT
14
Driver
SLLM
S
VIN
HG
15
OVP
SW
Circuit
SLLM
18
FB
5
SS
REF
+
+
+
FREQ
7
OVP
+
-
9
10
ls-
Is+
Current Limit
ILIM
ls+ UVLO
ILIM
SCP
TSD
FS
8
+
-
VOUT
PGND
16
SLLM
R
OUT
GND
GND
VDD
TM
H Reg
Controller
Block
EN/UVLO
20
SS
REF×1.2
FB
2.5ms Delay
BG
SS
TSD
Thermal
Protection
UVLO
+
-
Reference
Block
2
VIN
Is+
6
REF
×0.63
FB
3
VDD
13
12
LG
11
PGND
19
+
-
PGOOD
ILIM
Figure 3. Block Diagram
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BD95601MUV-LB
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Condition
Input Voltage 1
VCC
7
V
Note 1, Note 2
Input Voltage 2
VDD
7
V
Note 1, Note 2
Input Voltage 3
VIN
28
V
Note 1, Note 2
BOOT Voltage
BOOT
35
V
Note 1, Note 2
BOOT-SW
7
V
Note 1, Note 2
HG-SW
7
V
Note 1, Note 2
BOOT-SW Voltage
HG-SW Voltage
LG Voltage
LG
VDD
V
VOUT/Is+/Is-
VCC
V
EN Input Voltage
EN
7
V
Note 1
Power Dissipation 1
Pd1
0.34
W
Note 3
Power Dissipation 2
Pd2
0.70
W
Note 4
Power Dissipation 3
Pd3
2.20
W
Note 5
Power Dissipation 4
Pd4
3.56
W
Note 6
Operating Temperature Range
Topr
-10 to +85
°C
Tstg
-55 to +150
°C
Tjmax
+150
°C
Output Voltage
Storage Temperature Range
Maximum Junction Temperature
(Note 1) Not to exceed Pd.
(Note 2) Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
(Note 3) Derating in done 2.7 mW/°C for operating above Ta ≥ 25°C (when don’t mounted on a heat radiation board).
(Note 4) Derating in done 5.6 mW/°C for operating above Ta ≥ 25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board).
Surface heat dissipation copper foil:10.29mm2.
(Note 5) Derating in done 17.6 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board
Two sides heat dissipation copperfoil:10.29mm2. 2 or 3-layer : heat dissipation copper foil : 5505mm2).
(Note 6) Derating in done 28.5 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 70.0mm x 70.0mm x 1.6mm board)
All layers heat dissipation copper foil:5505mm2.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= 25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Input Voltage 1
VCC
4.5
-
5.5
V
Input Voltage 2
VDD
4.5
-
5.5
V
Input Voltage 3
VIN
4.5
-
25
V
BOOT Voltage
BOOT
4.5
-
30
V
SW
-0.7
-
25
V
BOOT-SW
4.5
-
5.5
V
EN
0
-
5.5
V
IS+/IS-
0.7
-
2.7
V
TONMIN
-
-
80
ns
SW Voltage
BOOT-SW Voltage
EN Input Voltage
Is Input Voltage
MIN ON Time
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Condition
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BD95601MUV-LB
Electrical Characteristics
(Unless otherwise specified VCC=5V VDD=5V EN=3V VIN=12V VOUT=1.05V RFS=36kΩ Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Whole Device
VCC Bias Current
VCC Stand-by Current
VIN Bias Current
VIN Stand-by Current
ICC
-
1500
1800
µA
ICCSTB
-
0
10
µA
IIN
-
30
80
µA
EN= 0V
IINSTB
-
0
10
µA
ENLOW
GND
-
0.8
V
ENHIGH_CON
2.3
-
3.8
V
ENHIGH_SLLM
4.5
-
5.5
V
IEN
-
15
25
µA
EN= 3V
VCC Threshold Voltage
VCC_UVLO
3.7
4.0
4.2
V
VCC:Sweep up
VCC Hysteresis Voltage
dVCC_ UVLO
100
160
220
mV
EN Low Voltage
EN High Voltage
(Forced Continuous Mode)
EN High Voltage
(SLLM Mode)
EN Bias Current
EN= 0V
Under Voltage Locked Out
3
H Reg
TM
VCC:Sweep down
Control
ON Time
TON
194
219
244
ns
MAX ON Time
TONMAX
-
3.5
-
µs
MIN OFF Time
TOFFMIN
-
490
700
ns
HG High-side ON Resistance
HGHON
-
3.0
6.0
Ω
HG Low-side ON Resistance
HGLON
-
2.0
4.0
Ω
LG High-side ON Resistance
LGHON
-
3.0
6.0
Ω
LG Low-side ON Resistance
LGLON
-
0.5
1.0
Ω
SCP Start-up Voltage
VSCP
0.345
0.420
0.495
V
SCP Delay Time
TSCP
-
2.5
-
ms
VOVP
0.825
0.900
0.975
V
ISS
1
2
3
µA
VSS_STB
-
-
50
mV
Setting Current
IILIM
-
10
-
µA
Current Limit Threshold Voltage
VILIM
75
100
120
mV
FET Driver
SCP
OVP
FB Threshold Voltage
Soft Start
Charge Current
Stand-by Voltage
Current Limit
RILIM= 100kΩ
Output Voltage Sense
Output Reference Voltage 1
REF1
0.743
0.750
0.757
V
Is+ Input Voltage
IS+
-1
0
1
µA
LS+= 1.05V
Is- Input Voltage
IS-
-1
0
1
µA
LS-= 1.05V
VPGOOD
0.38
0.47
0.56
V
RONPGOOD
-
50
150
Ω
VF
0.4
0.5
0.6
V
POWER GOOD
FB Power Good Voltage
Discharge ON Resistance
Diode for BOOT
VF Voltage
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BD95601MUV-LB
Typical Performance Curves (Reference data)
Figure 4. Efficiency (VIN= 7.5V)
Figure 5. Efficiency (VIN= 12V)
0
VOUT (20mV/div)
⊿V=8.0mV
IOUT (5.0A/div)
10µs/div
Figure 6. Efficiency (VIN= 21V)
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Figure 7. Transient Response Waveform (VIN= 5V)
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Typical Performance Curves (Reference data)
- continued
VCC (5V/div)
VOUT (20mV/div)
VOUT (500mV/div)
⊿V=7.6mV
IOUT (5.0A/div)
400µs/div
SW (5V/div)
10µs/div
Figure 8. Transient Response Waveform (VIN= 5V)
Figure 9. Power-up with VCC
VIN (5V/div)
VIN (5V/div)
SW
(5V/div)
SW
(5V/div)
LG(5V/div)
LG(5V/div)
VOUT (200mV/div)
VOUT (200mV/div)
20µs/div
Figure 10. Line Regulation
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20µs/div
Figure 11. Line Regulation
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BD95601MUV-LB
Typical Performance Curves (Reference data)
- continued
EN (5V/div)
SW (10V/div)
VOUT
(500mV/div)
LG (5V/div)
400µs/div
SCP delay time
SW
(5V/div)
IOUT (5A/div)
Figure 12. Power-up with EN
Figure 13. OCP & SCP
SW (5V/div)
SW (5V/div)
HG (5V/div)
HG (5V/div)
LG (5V/div)
LG (5V/div)
1µs/div)
1µs/div)
Figure 14. Switching Waveform (VIN= 5V, IOUT= 18A)
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400µs/div
Figure 15. Switching Waveform (VIN= 21V, IOUT= 18A)
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BD95601MUV-LB
Description of Blocks
3
TM
BD95601MUV-LB is a single channel synchronous buck regulator using H Reg , Rohm’s latest constant on-time controller
technology. Fast load response is achieved by controlling the output voltage using a comparator without relying on the
switching frequency.
When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the tON time interval. Thus, it
serves to improve the regulator’s transient response. Activating the light load mode further increases efficiency by using
VIN
Simple Light Load Mode (SLLM) control.
3
H Reg
TM
Control
Comparator for
Output voltage control
VOUT/VIN
Circuit
HG
FB
Driver
Internal
Reference
Voltage
REF
VOUT
SW
LG
Transient
Circuit
(Normal operation)
When FB falls to a reference voltage (REF),
3
TM
the drop is detected, activating the H Reg
control system
FB
REF
tON=
HG
VOUT x
VIN
1
f
[sec]・・・(1)
HG output on-time is determined by the formula (1).
When HG is off, LG is on until the output voltage
becomes FB= REF.
LG
(VOUT drops due to a rapid load change)
FB
When VOUT drops due to a rapid load change, and
the voltage remains below the output setting following the
programmed tON time, the system quickly restores VOUT by
extending the tON time, thus improving the transient
response. Once VOUT is restored, the controller continues
normal operation.
REF
Io
tON+α
HG
LG
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BD95601MUV-LB
Description of Blocks - continued
(Light Load Control)
FB
In SLLM (EN/SLLM = 4.5V to 5.5V), SLLM function will
operate when the LG pin is off and the coil current is
lower than 0A (the current goes from VOUT to SW).
When the FB input is lower than REF voltage again, HG
will be enabled once again.
REF
HG
LG
0A
3
TM
*Attention: To affect the rapid transient response, the H Reg control
monitors the current from the output capacitor to the load
using the ESR of the output capacitor Do not use ceramic
capacitors on COUT side of power supply. Ceramic bypass
capacitors can be used near the individual loads if desired.
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COUT
LOAD
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BD95601MUV-LB
Timing Chart
The Soft start function is exercised when the EN/SLLM
input is set to high. Current control takes effect at
startup enabling a moderate output voltage “ramping.”
Soft start timing and incoming current are calculated
with the following:
formulas (2) and (3) below.
Soft-start function
EN
tSS
SS
Soft start time
tSS=
0.75(Typ) x CSS
2µA(Typ)
FB
IIN
[sec] ・・・(2)
CSS (pF)
Soft start time(ms)
12000
5
27000
10
51000
20
Inrush current
IIN
=
CO x VOUT
tSS
x
VOUT
[A] ・・・(3)
VIN
(CSS: Soft start capacitor CO: Output capacitor)
Timer Latch Type Short Circuit Protection
REF x 0.7
Short circuit protection is enabled when FB falls to or
below REF X 0.7.
Once the programmed time period has elapsed, the output is
latched off to prevent destruction of the circuit.
Output voltage can be restored either by cycling the EN pin or
disabling UVLO.
Short circuit protection time is programmed at 2.5msec (Typ).
FB
tSCP
SCP
EN/UVLO
Over Current Voltage Protection
tON
tON
tMAX
During normal operation, if FB is less than REF, HG is high
during the time tON, but when the coil current exceeds the ILIMIT
threshold, HG is set to off.
The next pulse returns to normal operation if the output
voltage drops after the maximum on-time or IL becomes lower
than ILIMIT.
HG
LG
ILIMIT
IL
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BD95601MUV-LB
Selection of Components Externally Connected
1. Inductor (L) Selection
The inductor value is a major influence on the output ripple current.
As formula (4) below indicates, the greater the inductor or the switching
frequency, the lower the ripple current.
ΔIL
ΔIL=
VIN
(VIN - VOUT) x VOUT
L x VIN x f
[A]・・・(4)
Generally, lower inductance values offer faster response times but
also result in increased output ripple and lower efficiency.
IL
0.47μH to 2.2μH are a recommended range of values.
VOUT
L
The peak current rating of the coil is approximated by formula (5).
Please select an inductor equal to or higher than this value.
CO
PGND
(VIN-VOUT) x VOUT
PGND
ILPEAK= IOUTMAX +
Output ripple current
2 x L x VIN x f
[A]・・・(5)
*Passing a current larger than inductor’s rated current will cause magnetic saturation in the inductor and decrease
system efficiency. When selecting the inductor, be sure to allow enough margin to assure that peak currents do not
exceed the inductor rated current value.
*To minimize possible inductor damage and maximize efficiency, choose a inductor with a low (DCR, ACR) resistance.
2. Output Capacitor (Co) Selection
VIN
VOUT
L
The output capacitor should be determined by equivalent series resistance and
equivalent series inductance so that the output ripple voltage is 30mV or more.
The rating of the capacitor is set with sufficient margin given the output voltage.
ESR
Load
ESL CEXT
ΔVOUT= ESR x ΔIL+ESL×ΔIL / tON・・・(6)
Co
PGND
ΔIL: Output ripple current
ESR: Equivalent series resistance,
ESL: Equivalent series inductance
PGND
Output capacitor
Please give due consideration to the conditions in formula (7) below for the output capacitor, bearing in mind that the
output start-up time must be established within the soft start timeframe. Capacitors used as bypass capacitors are
connected to the load side affect the overall output capacitance ( CEXT, figure above). Please set the soft start time or
over-current detection value, regarding these capacities.
CO+ CEXT ≤
tSS x (Limit- IOUT)
VOUT
tSS: Soft start time
Limit: Over current detection
・・・(7)
If an inappropriate capacitor is used, OCP may be detected during activation and may cause startup malfunctions.
3. Input Capacitor (Cin) Selection
VIN
The input capacitor selected must have low enough ESR to fully support high
output ripple so as to prevent extreme over current conditions. The formula for
ripple current IRMS is given in (8) below.
Cin
VOUT
L
IRMS= IOUT x
VOUT (VIN -VOUT)
VIN
[A]・・・(8)
CO
IOUT
PGND
Where VIN = 2 x VOUT, IRMS=
PGND
2
Input capacitor
A ceramic capacitor is recommended to reduce ESR loss and maximize efficiency.
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BD95601MUV-LB
Selection of Components Externally Connected - continued
4. MOSFET selection
The High-side and Low-side drivers are designed to activate N channel MOSFETs
having low on-resistance.
The chosen MOSFET may result in the loss described below, please select a
proper FET for each considering the input-output and load current.
VIN
High-side MOSFET
< Loss of High-side MOSFET >
VOUT
L
PHigh-side= PRON+PTRAN
Co
VOUT
=
PGND
2
x RON x IOUT +
VIN
(Tr+Tf) x VIN x IOUT x f
6
・・・(9)
PGND
Low-side MOSFET
(Ron: On-resistance of FET, f: Switching frequency, Tr: Rise time, Tf: Fall time)
< Loss of High-side MOSFET >
PLow-side= PRON
=
VIN -VOUT
VIN
x RON x IOUT
2
・・・(10)
The High-side MOSFET generates loss when switching, along with the loss due to on-resistance.
Good efficiency is achieved by selecting a MOSFET with low on-resistance and low Qg (gate total charge amount).
Recommended MOSFETs for various current values are as follows:
Output current
High-side MOSFET
Low-side MOSFET
to 5A
RQ3E080GN
RQ3E080GN
5 to 8A
RQ3E120GN
RQ3E150GN
8 to 10A
RQ3E150GN
RQ3E180GN
5. Set Point Output Voltage
This IC operates such that output voltage is REF ≌ FB.
<Output Voltage>
VOUT =
(R1+R2)
R2
x REF(0.7V)
Setting resistance are selected from 10kΩ to 50kΩ, because of external Noise resistant and feedback current.
Please refer to constant the following for typical output voltage.
Output
voltage
1.0V
R1
R2
10kΩ
30kΩ
1.2V
18kΩ+1.8kΩ
33kΩ
1.35V
24kΩ
30kΩ
1.5V
24kΩ
12kΩ(30kΩ//20kΩ)
1.8V
39kΩ+3kΩ
30kΩ
2.0V
36kΩ+0.68kΩ
22kΩ
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TSZ02201-0J1J0AZ00520-1-2
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BD95601MUV-LB
Selection of Components Externally Connected - continued
6. Selecting resistance for over current setting
(A) High-precision current detection circuit (use a low value resistor)
VIN
HG
L
R
VOUT
ILMIT=
0.1
[A]・・・(11)
R
IL
Co
LG
(R: Detection resistor)
PGND
PGND
Please make sure that 100kΩ is used for RILIM.
IS+
VOUT
Current limit
ILIM
RILIM
100kΩ
GND
(B) Low loss current detection circuit (Use DCR of L)
VIN
IL
HG
L
ILMIT=0.1 x
RL
VOUT
rxC
However, RL =
r
LG
Co
C
PGND
PGND
IS+
[A]・・・(12)
L
L
rxC
(RL: DCR value of inductor)
Must be adjusted so that the power dissipation into the r.
About 47kΩ to 330kΩ.
Please make sure that 100kΩ is used for RILIM.
VOUT
Current limit
ILIM
RILIM
100kΩ
GND
IL
detect point
As shown in the diagram to the left, if the voltage between Is+ and VOUT
exceed the ILMIT, the High-side FET gate is set low.
Because the peak value of inductor current is detected and corresponds
to the saturation time of inductor, the reliability of the system is improved.
ILIMIT
0
t
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BD95601MUV-LB
Application Example
+12V
C6
R7
REG1_5V
17
16
OUT
VIN
BOOT
C1
EN_1MGT
1
SS
2
EN/SLLM
HG 15
C12
18
C11
19
C4
C10
20
PGOOD
EN_1
R6
GND
R8
PG_2
C5
PG_1
1V
Q1
1VMGT
SW 14
L1
U1
R1
3
EN_2
ILIM
R13 C8
VDD 13
BD95371MUV
BD95601MUV-LB
1.35/1.5V
C3
EN_1.8
1.2V
C14
EN_1.35/1.5
C13
EN_1.2
1.8V
IS-
IS+
FB
FS
5
LG 12
FREQ
VCC
VOUT
JP1
6
7
8
9
10
2V
Q2
PGND 11
C7
R5
R12
R10
R3
4
R20
R18
R4
C2
R2
R11
GND PGND
Figure 16. BD95601MUV-LB Basic Application Circuit
Bills of Materials
Reference
Designator
Manufacturer
Configuration
(mm)
GRM155R71E223KA61
MURATA
1005
GRM188R61A105KA61
MURATA
1608
25V, X5R, ±10%
GRM32DR61E106KA12
MURATA
3225
0.47µF
10V, X5R, ±10%
GRM188R61A474KA61
MURATA
1608
Ceramic Capacitor
0.01µF
25V, X7R, ±10%
GRM155R71E103KA01
MURATA
1005
C7
Ceramic Capacitor
10pF
50V, CH, ±5%
GRM1552C1H100JA01
MURATA
1005
C8
Ceramic Capacitor
1000pF
50V, X5R, ±10%
GRM155R61H102KA01
MURATA
1005
C10
Ceramic Capacitor
0.1µF
50V, X5R, ±10%
GRM155R61E104KA87
MURATA
1005
C11, C12
Ceramic Capacitor
10µF
35V, X5R, ±10%
GRM32ER6YA106KA12
MURATA
3225
L1
Inductor
0.56µH
±20%, 14.2A(L=-20%), DCR=3.2mΩmax
FDU0650-H-R56M
TOKO
7667
Q1
MOSFET
-
N-ch, Vdss 30V, Id 15A, Ron 4.7mΩ
RQ3E150GN
ROHM
3333
Q2
MOSFET
-
N-ch, Vdss 30V, Id 18A, Ron 3.3mΩ
RQ3E180GN
ROHM
3333
R1
Resistor
100kΩ
1/16W, 50V, 5%
MCR01MZPJ104
ROHM
1005
R2
Resistor
10Ω
1/16W, 50V, 5%
MCR01MZPJ100
ROHM
1005
R5
Resistor
36kΩ
1/16W, 50V, 5%
MCR01MZPJ363
ROHM
1005
R6
Resistor
3.3Ω
1/16W, 50V, 5%
MCR01MZPJ3R3
ROHM
1005
R7
Resistor
1kΩ
1/16W, 50V, 5%
MCR01MZPJ102
ROHM
1005
R8
Resistor
2.7kΩ
1/16W, 50V, 5%
MCR01MZPJ272
ROHM
1005
R10
Resistor
510Ω
1/16W, 50V, 5%
MCR01MZPJ511
ROHM
1005
R11, R12
Resistor
100Ω
1/16W, 50V, 5%
MCR01MZPJ101
ROHM
1005
R13
Resistor
100kΩ
1/16W, 50V, 5%
MCR01MZPJ104
ROHM
1005
U1
IC
-
Buck DC/DC Controller
BD95601MUV-LB
ROHM
VQFN020V4040
Type
Value
C1
Ceramic Capacitor
0.022µF
25V, X7R, ±10%
C2
Ceramic Capacitor
1µF
10V, X5R, ±10%
C3
Ceramic Capacitor
10µF
C4
Ceramic Capacitor
C5, C6
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Part Number
Description
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TSZ02201-0J1J0AZ00520-1-2
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BD95601MUV-LB
VOUT=1.0V, IOUT=6A
Reference
Designator
C13, C14
Manufacturer
Part Number
Type
Value
Description
POSCAP
470µF
2.5V, ±20%, ESR 6mΩmax
2R5TPF470M6L
Manufacturer
Configuration
(mm)
SANYO
7343
JP1
Jumper
n/a
Not applicable
-
-
-
R3
Resistor
30kΩ
1/16W, 50V, 0.5%
MCR01MZPD3002
ROHM
1005
R4
Resistor
10kΩ
1/16W, 50V, 0.5%
MCR01MZPD1002
ROHM
1005
R18
Resistor
0Ω
Jumper, 1A, 50mΩmax
MCR01MZPJ000
ROHM
1005
R20
Resistor
n/a
Not applicable
-
-
-
Manufacturer
Configuration
(mm)
SANYO
7343
-
-
VOUT=1.2V, IOUT=4A
Reference
Designator
C13, C14
Manufacturer
Part Number
Type
Value
Description
2.5V, ±20%, ESR 6mΩmax
2R5TPF470M6L
Not applicable
-
POSCAP
470µF
JP1
Jumper
n/a
R3
Resistor
30kΩ
1/16W, 50V, 0.5%
MCR01MZPD3002
ROHM
1005
R4
Resistor
18kΩ
1/16W, 50V, 0.5%
MCR01MZPD1802
ROHM
1005
R18
Resistor
0Ω
Jumper, 1A, 50mΩmax
MCR01MZPJ000
ROHM
1005
R20
Resistor
n/a
Not applicable
-
-
-
Type
Value
Description
Manufacturer
Configuration
(mm)
2.5V, ±20%, ESR 6mΩmax
2R5TPF470M6L
SANYO
7343
Not applicable
-
-
-
VOUT=1.8V, IOUT=6A
Reference
Designator
C13, C14
Manufacturer
Part Number
POSCAP
470µF
JP1
Jumper
n/a
R3
Resistor
30kΩ
1/16W, 50V, 0.5%
MCR01MZPD3002
ROHM
1005
R4
Resistor
39kΩ
1/16W, 50V, 0.5%
MCR01MZPD3902
ROHM
1005
R18
Resistor
3kΩ
1/16W, 50V, 5%
MCR01MZPJ302
ROHM
1005
R20
Resistor
n/a
Not applicable
-
-
-
Type
Value
Description
Manufacturer
Configuration
(mm)
2.5V, ±20%, ESR 6mΩmax
2R5TPF470M6L
SANYO
7343
0: 1.35V, 1: 1.5V
-
VOUT=1.35V, IOUT=4A
Reference
Designator
C13, C14
POSCAP
470µF
JP1
Jumper
-
R3
Resistor
30kΩ
1/16W, 50V, 0.5%
R4
Resistor
24kΩ
R18
Resistor
0Ω
R20
Resistor
120kΩ
Type
Value
Manufacturer
Part Number
-
-
MCR01MZPD3002
ROHM
1005
1/16W, 50V, 0.5%
MCR01MZPD2402
ROHM
1005
Jumper, 1A, 50mΩmax
MCR01MZPJ000
ROHM
1005
1/16W, 50V, 0.5%
MCR01MZPD1203
ROHM
1005
Manufacturer
Configuration
(mm)
SANYO
7343
VOUT=2.0V, IOUT=2A
Reference
Designator
C13, C14
Manufacturer
Part Number
Description
6.3V, ±20%, ESR 18mΩmax
6TPE330MIL
Not applicable
-
18kΩ
1/16W, 50V, 0.5%
30kΩ
POSCAP
330µF
JP1
Jumper
n/a
R3
Resistor
R4
Resistor
R18
Resistor
R20
Resistor
-
-
MCR01MZPD1802
ROHM
1005
1/16W, 50V, 0.5%
MCR01MZPD3002
ROHM
1005
0Ω
Jumper, 1A, 50mΩmax
MCR01MZPJ000
ROHM
1005
n/a
Not applicable
-
-
-
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TSZ22111・15・001
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TSZ02201-0J1J0AZ00520-1-2
01.Apr.2014 Rev.002
BD95601MUV-LB
Power Dissipation
4.0
PCB size: 74.2mm×74.2mm×1.6mmt
Substrate(1): IC only
2
Substrate(2): 1-layer (copper foil density 0mm )
2
Substrate(3): 4-layer (copper foil density 10.29 mm )
2,3-layer (copper foil de density 5505mm2)
2
Substrate(4): 4-layer (copper foil density 5505 mm )
(4)3.56W
Power Dissipation Pd (W)
3.5
3.0
Substrate(1):θja=367.6°C /W
Substrate(2):θja=178.6°C /W
Substrate(3):θja=56.6°C /W
Substrate(4):θja=35.1°C /W
2.5
(3)2.20W
2.0
1.5
1.0
(2)0.70W
0.5
(1)0.34W
0.0
0
25
50
75
85
100
125
150
Ambient Temperature(℃)
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BD95601MUV-LB
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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BD95601MUV-LB
Operational Notes – continued
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 17. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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TSZ22111・15・001
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TSZ02201-0J1J0AZ00520-1-2
01.Apr.2014 Rev.002
BD95601MUV-LB
Ordering Information
B
D
9
5
6
0
1
Part Number
M
U
Package
MUV: VQFN
V
-
L B
H 2
Product class
LB for Industrial applications
Packaging and forming specification
H2: Embossed tape and reel
Marking Diagrams
VQFN020V4040 (TOP VIEW)
Part Number Marking
9 5 6 0 1
LOT Number
1PIN MARK
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TSZ22111・15・001
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TSZ02201-0J1J0AZ00520-1-2
01.Apr.2014 Rev.002
BD95601MUV-LB
Physical Dimension, Tape and Reel Information
Package Name
VQFN020V4040
<Tape and Reel information>
Tape
Quantity
Direction
of feed
Embossed carrier tape
250pcs
H2
The direction of the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand.
Reel
1pin
Direction of feed
*Order quantity needs to be multiple of the minimum quantity.
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01.Apr.2014 Rev.002
BD95601MUV-LB
Revision History
Date
Revision
6.Sep.2013
001
1.Apr.2014
002
Changes
New Release
Delete sentence “and log life cycle” in General Description and Futures.
Change “Packaging and forming specification” from E2 to H2.
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TSZ22111・15・001
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TSZ02201-0J1J0AZ00520-1-2
01.Apr.2014 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice – SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice – SS
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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