Datasheet

Datasheet
5.5V to 28V Input,
2ch Synchronous Buck DC/DC Controller
BD95602MUV
General Description
Applications

BD95602MUV is a dual buck regulator controller with
adjustable output voltage from1.0V to 5.5V and an input
voltage range of 5.5 to 28V. High efficiency is achieved
with an external synchronous Nch-MOSFET. H3RegTM,
Rohm’s advanced proprietary control method that uses
constant on-time control to provide ultra high transient
responses to load changes is used. SLLM(Simple Light
Load Mode) technology is added to improve efficiency
with light loads giving high efficiency over a wide load
range. In addition to the dual buck regulator controllers,
here are 2 LDO regulators included that are fixed output
voltage of 3.3V and 5.0V. Other functions included are
soft start, variable frequency, short circuit protection with
timer latch, over voltage, and power good outputs. This
buck regulator is optimal for high-current applications.
FPGA, POL Power Supply,
Mobile PC, Desktop PC, LCD-TV,
Digital Components, etc.
Key Specifications




Input Voltage Range:
5.5V to 28V
Output Voltage Range:
1.0V to 5.5V
Switching Frequency:
150k to 500MHz(Typ)
Operating Temperature Range:
-20°C to +85°C
Package
VQFN032V5050
W(Typ) x D(Typ) x H(Max)
5.00mm x 5.00mm x 1.00mm
Features








Adjustable Simple Light Load Mode (SLLM), Quiet
light Load Mode (QLLM), Forced continuous Mode.
Multifunctional Protection Circuit
-Settable Over Current Protection (OCP)
-Thermal Shut down (TSD)
-Under Voltage Lock Out (UVLO)
-Over Voltage Protection (OVP)
-Short Circuit Protection with Timer-Latch (SCP)
150kHz to 500kHz Switching frequency.
Adjustable Soft Start.
Power Good.
Dual Linear Regulator (5V/3.3V (total 50mA)).
Output Discharge.
Reference voltage Circuit (0.7V).
○Product structure : Silicon monolithic integrated circuit
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VQFN032V5050
○This product has no designed protection against radioactive rays
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BD95602MUV
R8
R25
16
15
14
13
12
11
10
9
MCTL2
FS1
FB1
AGND
REF
FB2
FS2
CTL
C4
R7
R15
R26
R16
Typical Application Circuit
R5
17 ILIM1
R6
ILIM2 8
18 MCTL1
VO2 7
19 SS1
SS2 6
C5
C6
20 PGOOD1
PGOOD2 5
U1
U1
BD95602MUV
BD95602MUV
21 EN1
23 HG1
HG2 2
Q3
Q1
C7
BOOT2 3
C8
22 BOOT1
C9
EN_2.5
EN2 4
C12
EN_3.3
REG2
REG1
VIN
LG2
PGND2
26
27
28
29
30
31
32
C1
C2
C3
Q4
C29
VO1
25
2.5V
SW2 1
Q2
C19
LG1
L2
24 SW1
PGND1
L1
3.3V
+12V
REG1_5V
REG2_3.3V
GND PGND
Figure 1. Application Circuit
SW1
HG1
BOOT1
EN1
PGOOD1
SS1
MCTL1
ILIM1
Pin Configuration
24
23
22
21
20
19
18
17
PGND1 25
16 MCTL2
LG1 26
15 FS1
Vo1 27
14 FB1
REG2 28
13 AGND
FIN
9 CTL
SW2
1
2
3
4
5
6
7
8
ILIM2
PGND2 32
Vo2
10 FS2
SS2
LG2 31
PGOOD2
11 FB2
EN2
VIN 30
BOOT2
12 REF
HG2
REG1 29
Figure 2. Pin Configuration
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Pin Descriptions
Pin No.
Pin Name
1
24
SW2
SW1
Ground pin for High-side FET. The maximum voltage range of this pin is 30V.
2
23
HG2
HG1
High-side FET gate drive pin.
3
22
BOOT2
BOOT1
4
21
EN2
EN1
5
20
PGOOD2
PGOOD1
6
19
SS2
SS1
This is the setting pin for soft start. The rising time is determined by the capacitor connected
between SS and ground, and the fixed current inside IC after it is the status of low in standby
mode. It controls the output voltage till SS voltage catch up the REF pin to become the SS
terminal voltage.
7
27
VO2
VO1
This is the output discharge pin, and output voltage feedback pin for frequency setting.
8
17
ILIM2
ILIM1
This is the coil current limit setting pin. Set the resistor which is connected in between ground.
9
CTL
When CTL pin voltage is at least 2.3V, the status of the linear regulator REG1 and REG2
output becomes active. Conversely, the status switches off when CTL pin voltage goes lower
than 0.8V. The switching regulator doesn’t become active when the status of CTL pin is low, if
the status of EN pin is high.
This pin is pulled up to VIN with 1MΩ resistor.
10
15
FS2
FS1
Frequency input. A resistor to ground will set the switching frequency.
Frequencies from 150kHz to 500kHz are possible.
11
14
FB2
FB1
This is the output voltage feedback pin.
The IC controls reference voltage and FB terminal voltage are almost same.
12
REF
This is the output voltage setting pin.
The IC controls reference voltage and FB terminal voltage are almost same.
13
AGND
16
18
MCTL2
MCTL1
25
32
PGND1
PGND2
26
31
LG1
LG2
28
REG2
29
REG1
30
VIN
FIN
FIN
Function
This is the power supply pin for High-side FET driver. The maximum voltage range to
ground is to 35V, to SW pin is to 7V. In switching operations, the voltage swings from
(VIN+REG1) to REG1 by BOOT pin operation.
When EN pin voltage is at least 2.3V, the status of the switching regulator becomes active.
Conversely, the status switches off when EN pin voltage goes lower than 0.8V.
This pin is pulled down to AGND with 1MΩ resistor.
If FB pin voltage is 15% or less of reference voltage, it will output low level.
The output format is open drain, so please connect pull-up resistance.
Ground input for control circuit.
This is the operation mode setting pin. If terminal voltage reaches less than 0.8V, it will be Low
Level.
If terminal voltage reaches more than 2.3V, it will be High Level. This pin is pulled down to
AGND with 300kΩ resistor.
Input
Control Mode
MCTL1
MCTL2
Low
Low
SLLM
Low
High
QLLM
High
Low
Continuous PWM Mode
High
High
Continuous PWM Mode
This is the ground pin for Low-side FET drive.
This is the Low-side FET gate drive pin. It is operated in switching between REG1 to PGND.
ON resistance of output stage when High, it is 2Ω and when Low, it is 0.5Ω drive
Low-side FET gate with the high pace.
This is the output pin for 3.3V/50mA linear regulator (5V/3.3V (total 50mA)).
Please connect 10µF capacitor which characteristic is more than X5R near the pin.
This is the output pin for 5V/50mA linear regulator (5V/3.3V (total 50mA)).
Please connect 10µF capacitor which characteristic is more than X5R near the pin.
Supply pin of H3RegTM control circuit and linear regulator. Monitor input voltage and determine
necessary on-time. As a result, this terminal voltage changes, and then the IC operation
become unstable. Please connect 10µF capacitor which characteristic is more than X5R near
the pin.
This is the thermal PAD. Please connect to the ground.
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Output condition table
Input
Output
CTL
EN1
EN2
REG1(5V)
REG2(3.3V)
DC/DC1
DC/DC2
Low
Low
Low
OFF
OFF
OFF
OFF
Low
Low
High
OFF
OFF
OFF
OFF
Low
High
Low
OFF
OFF
OFF
OFF
Low
High
High
OFF
OFF
OFF
OFF
High
Low
Low
ON
ON
OFF
OFF
High
Low
High
ON
ON
OFF
ON
High
High
Low
ON
ON
ON
OFF
High
High
High
ON
ON
ON
ON
* CTL pin is connected to VIN pin with 1MΩ resistor(pull up) internal IC.
* EN pin is connected to AGND pin with 1MΩ resistor(pull down) internal IC.
3
2
1
31
32
22
PGND1
SW1
23
LG1
HG1
BOOT1
PGND2
LG2
SW2
HG2
BOOT2
VIN
VIN
Vo2
Adjustable
Vo1
Adjustable
Block Diagram
24
26
25
REG1
REG1
REG1
REG1
CL2
SCP2
OVP2
AGND
Short through
Protection
Circuit
Short through
Protection
Circuit
SLLMTM
Block
SLLMTM
Block
13
CL1
SCP1
OVP1
FS1
FS2
UVLO
EN2
REF
FB2
11
REG1
SCP1
Timer
EN1
FB1
Thermal
Protection
14
6
REF
12
SS1
19
ILIM2
ILIM1
17
3.3V
Reg
EN2
SW1
PGND1
SLLM Mode Control
MCTL
5V
Reg
Vo1
Reference
Block
REG1
PGND2
SW2
REF
8
CL1
Over Current
Protect
CL2
Over Current
Protect
SS2
PGOOD1
Power Good
H Reg
Controller
Block
FS1
20
Timer
FS2
Short Circuit Protect
H Reg
Controller
Block
TM
OVP1
3
TM
Over Voltage Protect
MCTL
REF
3
MCTL
TSD
OVP2
Timer
Short Circuit Protect
Timer
Power Good
Over Voltage Protect
SCP2
REG1
5
PGOOD2
RFS1
15
10
EN1
4
5V
5.5～28V
16
Vo1
18
MCTL2
REG2
REG2
REG1
28
MCTL1
29
27
3.3V
30
REG1
VIN
9
VIN
7
CTL
Vo2
21
Figure 3. Block Diagram
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BD95602MUV
Absolute Maximum Ratings(Ta = 25°C)
Parameter
Symbol
Rating
Unit
Conditions
VIN, CTL, SW1, SW2
30
V
Note 1
6
V
Note 1, Note 2
REG1+0.3
V
Note 1
BOOT1, BOOT2
35
V
Note 1, Note 2
BOOT1-SW1, BOOT2-SW2,
HG1-SW1, HG2-SW2
7
V
Note 1, Note 2
HG1
BOOT1+0.3
V
Note 1, Note 2
HG2
BOOT2+0.3
V
Note 1, Note 2
PGND1, PGND2
AGND±0.3
V
Note 1, Note 2
Power Dissipation1
Pd1
0.38
W
Note 3
Power Dissipation2
Pd2
0.88
W
Note 4
Power Dissipation3
Pd3
3.26
W
Note 5
Power Dissipation4
Pd4
4.56
W
Note 6
EN1, EN2, PGOOD1, PGOOD2
Vo1, Vo2, MCTL1, MCTL2
FS1, FS2, FB1, FB2, ILIM1, ILIM2,
SS1, SS2, LG1, LG2, REF,REG2
Terminal Voltage
Operating Temperature Range
Topr
-20 to +85
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Junction Temperature
Tjmax
+150
°C
(Note 1) Not to exceed Pd.
(Note 2) Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle.
(Note 3) Derating in done 3.0 mW/°C for operating above Ta ≥ 25°C (when don’t mounted on a heat radiation board).
(Note 4) Derating in done 7.0 mW/°C for operating above Ta ≥ 25°C (Mount on 1-layer 74.2mm x 74.2mm x 1.6mm board).
Surface heat dissipation copper foil:20.2mm2.
(Note 5) Derating in done 26.1 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 74.2mm x 74.2mm x 1.6mm board
Two sides heat dissipation copperfoil:20.2mm2. 2 or 3-layer : heat dissipation copper foil : 5505mm2).
(Note 6) Derating in done 36.5 mW/°C for operating above Ta ≥ 25°C (Mount on 4-layer 74.2mm x 74.2mm x 1.6mm board)
All layers heat dissipation copper foil:5505mm2.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
VIN
5.5
-
28
V
CTL
-0.3
-
28
V
EN1, EN2, MCTL1, MCTL2
-0.3
-
5.5
V
BOOT1, BOOT2
4.5
-
33
V
SW1, SW2
BOOT1-SW1, BOOT2-SW2,
HG1-SW1, HG2-SW2
Vo1, Vo2, PGOOD1, PGOOD2
-0.3
-
28
V
-0.3
-
5.5
V
-0.3
-
5.5
V
TONMIN
-
-
150
nsec
Terminal Voltage
Minimum ON Time
Conditions
This product should not be used in a radioactive environment.
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BD95602MUV
Electrical Characteristics (Unless otherwise noted, Ta=25°CVIN=12V, CTL=OPEN, EN1=EN2=5V, FS1=FS2=51kΩ)
Parameter
VIN Standby Current
Symbol
Min
Typ
Max
Unit
Conditions
ISTB
70
150
250
μA
EN1= EN2= 0V, CTL= 5V
IIN
60
130
230
μA
Vo1= 5V
ISHD
6
12
18
μA
CTL= 0V
CTL Low Voltage
VCTLL
-0.3
-
0.8
V
CTL High Voltage
VCTLH
2.3
-
28
V
CTL Bias Current
ICTL
-18
-12
-6
μA
EN Low Voltage
VENL
-0.3
-
0.8
V
EN High Voltage
VENH
2.3
-
5.5
V
EN Bias Current
IEN
-
3
6
μA
EN= 3V
VREG1
4.90
5.00
5.10
V
IREG1=1mA
Maximum Current
IREG1
50
-
-
mA
IREG2= 0mA, (Note 7)
Line Regulation
REG.I1
-
90
180
mV
VIN= 5.5 to 28V
Load Regulation
REG.L1
-
30
50
mV
IREG1= 0 to 30mA
VREG2
3.27
3.30
3.33
V
Maximum Current
IREG2
50
-
-
mA
IREG1= 0mA, (Note 7)
Line Regulation
REG.I2
-
-
20
mV
VIN= 5.5 to 28V
Load Regulation
REG.L2
-
-
30
mV
IREG2= 0 to 30mA
REG1th
4.1
4.4
4.7
V
Input Delay Time
TREG1
1.5
3
6
ms
Switch Resistance
RREG1
-
1.0
3.0
Ω
REG1_ UVLO
3.9
4.2
4.5
V
dV_ UVLO
50
100
200
mV
Feedback Voltage1
VFB1
0.693
0.700
0.707
V
FB1 Bias Current
IFB1
-
0
1
μA
VIN Bias Current
VIN Shut Down Mode Current
CTL= 0V
5V Linear Regulator -VIN
REG1 Output Voltage
3.3V Linear Regulator
REG2 Output Voltage
IREG2= 1mA
5V Linear Regulator -Vo1
Input Threshold Voltage
Vo1: Sweep up
Under Voltage Lock Out Block
REG1 Threshold Voltage
Hysteresis Voltage
REG1: Sweep up
REG1: Sweep down
Output Voltage Sense Block
Output Discharge Resistance1
Feedback Voltage2
RDISOUT1
50
100
200
Ω
VFB2
0.693
0.700
0.707
V
FB1= REF
IFB2
-
0
1
μA
RDISOUT2
50
100
200
Ω
On Time1
tON1
0.760
0.910
1.060
μs
Vo1= 5V,FS1= 51kΩ
On Time2
tON2
0.470
0.620
0.770
μs
Vo2= 3.3V ,FS2= 51kΩ
FB2 Bias Current
Output Discharge Resistance2
FB2= REF
H3REGTM Control Block
Maximum On Time 1
tONMAX1
2.5
5
10
μs
Vo1= 5V
Maximum On Time 2
tONMAX2
1.65
3.3
6.6
μs
Vo2= 3.3V
Minimum Off Time
tOFFMIN
-
0.2
0.4
μs
HG High Side ON Resistance
HGHON
-
3.0
6.0
Ω
HG Low Side ON Resistance
HGLON
-
2.0
4.0
Ω
LG High Side ON Resistance
LGHON
-
2.0
4.0
Ω
LG Low Side ON Resistance
LGLON
-
0.5
1.0
Ω
FET Driver Block
(Note 7) IREG1+IREG2 ≤ 50mA.
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BD95602MUV
Electrical Characteristics (Unless otherwise noted, Ta=25°CVIN=12V, CTL=OPEN, EN1=EN2=5V, FS1=FS2=51kΩ)
Over Voltage Protection Block
OVP Threshold Voltage
OVP Hysteresis
VOVP
dV_OVP
0.77
(+10%)
50
0.84
0.91
(+20%) (+30%)
150
300
0.49
(-30%)
0.75
0.56
(-20%)
1.5
ms
mV
V
mV
Output Short Protection Block
SCP Threshold Voltage
VSCP
Delay Time
TSCP
0.42
(-40%)
0.4
dVSMAX
80
100
120
0.595
(-15%)
0.1
0.665
(-5%)
0.2
V
Over Current Protection Block
Offset Voltage
ILIM= 100kΩ
Power Good Block
VPGL
0.525
(-25%)
-
Delay Time
TPGOOD
0.4
0.75
1.5
ms
Power Good Leakage Current
ILEAKPG
-2
0
2
μA
Charge Current
ISS
1.5
2.3
3.1
μA
Standby Voltage
VSS_STB
-
-
50
mV
MCTL Low Voltage
VMCTL_L
-0.3
-
V
MCTL High Voltage
VMCTL_H
2.3
-
MCTL Bias Current
IMCTL
8
16
0.3
REG1
+0.3
24
Power Good Low Threshold
Power Good Low Voltage
VPGTHL
V
V
IPGOOD= 1mA
VPGOOD= 5V
Soft Start Block
Mode Control Block
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V
μA
MCTL= 5V
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BD95602MUV
Typical Performance Curves (Reference data)
HG
10V/div
HG
10V/div
SW
10V/div
SW
10V/div
LG
5V/div
LG
5V/div
2μs
2μs
Figure 4. Switching Waveform
(Vo= 5V, Io= 0A, PWM)
グラフ中の文字は 9pt
Figure 5. Switching Waveform
(Vo= 5V, Io= 8A, PWM)
HG
10V/div
HG
10V/div
SW
10V/div
SW
10V/div
LG
5V/div
LG
5V/div
10μs
10μs
Figure 6. Switching Waveform
(Vo= 5V, Io= 0A, QLLM)
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Figure 7. Switching Waveform
(Vo= 5V, Io= 0A, SLLM)
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Typical Performance Curves
- continued
HG
10V/div
HG
10V/div
SW
10V/div
SW
10V/div
LG
5V/div
LG
5V/div
2μs
2μs
Figure 8. Switching Waveform
(Vo= 3.3V, Io= 0A, PWM)
Figure 9. Switching Waveform
(Vo= 3.3V, Io= 8A, PWM)
HG
10V/div
HG
10V/div
SW
10V/div
SW
10V/div
LG
5V/div
LG
5V/div
10μs
10μs
Figure 10. Switching Waveform
(Vo= 3.3V, Io= 0A, QLLM)
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Figure 11. Switching Waveform
(Vo= 3.3V, Io= 0A, SLLM)
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Typical Performance Curves
- continued
HG
10V/div
HG
10V/div
SW
10V/div
SW
10V/div
LG
5V/div
LG
5V/div
2μs
2μs
Figure 12. Switching Waveform
(Vo= 1V, Io= 0A, PWM)
Figure 13. Switching Waveform
(Vo= 1V, Io= 8A, PWM)
HG
10V/div
HG
10V/div
SW
10V/div
SW
10V/div
LG
5V/div
LG
5V/div
10μs
10μs
Figure 14. Switching Waveform
(Vo= 1V, Io= 0A, QLLM)
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Figure 15. Switching Waveform
(Vo= 1V, Io= 0A, SLLM)
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Typical Performance Curves
- continued
100
100
80
80
5V
60
7V
η [%]
η [%]
7V
12V
21V
40
40
20
20
0
0
1
10
100
Io[mA]
1000
21V
1
10000
Figure 16. Efficiency
(Vo= 5V, PWM)
10
100
Io[mA]
1000
10000
Figure 17. Efficiency
(Vo= 5V, QLLM)
100
100
7V
80
80
12V
21V
60
η [%]
η [%]
12V
60
40
20
7V
12V
60
21V
40
20
0
1
10
100
1000
0
10000
1
Io[mA]
Figure 18. Efficiency
(Vo= 5V, SLLM)
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10
100
Io[mA]
1000
10000
Figure 19. Efficiency
(Vo= 3.3V, PWM)
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BD95602MUV
Typical Performance Curves
- continued
100
100
7V
80
80
12V
12V
21V
60
η[%]
η[%]
7V
60
21V
40
40
20
20
0
0
1
10
100
Io[mA]
1000
1
10000
10
1000
10000
Figure 21. Efficiency
(Vo= 3.3V, SLLM)
Figure 20. Efficiency
(Vo= 3.3V, QLLM)
100
100
80
80
7V
100
Io[mA]
12V
7V
12V
60
η[%]
η[%]
60
21V
21V
40
40
20
20
0
0
1
10
100
1000
10000
Io[mA]
10
100
1000
10000
Io[mA]
Figure 22. Efficiency
(Vo= 1V, PWM)
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1
Figure 23. Efficiency
(Vo= 1V, QLLM)
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BD95602MUV
Typical Performance Curves
- continued
100
7V
80
η[%]
Vo
100mV/div
60
12V
21V
40
IL
5A/div
IO
5A/div
20
20μs
0
1
10
100
1000
10000
Io[mA]
Figure 24. Efficiency
(Vo= 1V, SLLM)
Figure 25. Transient Response
(Vo= 5V, PWM, Io= 0A→8A)
Vo
100mV/div
Vo
100mV/div
IL
5A/div
IO
5A/div
IL
5A/div
IO
5A/div
20μs
20μs
Figure 26. Transient Response
(Vo= 5V, PWM, Io= 8A→0A)
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Figure 27. Transient Response
(Vo= 3.3V, PWM, Io= 0A→8A)
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BD95602MUV
Typical Performance Curves
- continued
Vo
100mV/div
Vo
100mV/div
IL
5A/div
IO
5A/div
IL
5A/div
IO
5A/div
20μs
20μs
Figure 28. Transient Response
(Vo= 3.3V, PWM, Io= 8A→0A)
Figure 29. Transient Response
(Vo= 1V, PWM, Io= 0A→8A)
Vo
100mV/div
20μs
IL
5A/div
IO
5A/div
Figure 30. Transient Response
(Vo= 1V, PWM, Io= 8A→0A)
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Vo
50mV/div
2μs
Figure 31. Output Voltage
(Vo= 5V, PWM, Io= 0A)
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Typical Performance Curves
- continued
Vo
50mV/div
2μs
Vo
50mV/div
10μs
Figure 32. Output Voltage
(Vo= 5V, PWM, Io= 8A)
Figure 33. Output Voltage
(Vo= 5V, QLLM, Io= 0A)
Vo
50mV/div
Vo
50mV/div
2μs
2μs
Figure 34. Output Voltage
(Vo= 5V, SLLM, Io= 0A)
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Figure 35. Output Voltage
(Vo= 3.3V, PWM, Io= 0A)
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Typical Performance Curves
- continued
Vo
50mV/div
Vo
50mV/div
10μs
2μs
Figure 36. Output Voltage
(Vo= 3.3V, PWM, Io= 8A)
Figure 37. Output Voltage
(Vo= 3.3V, QLLM, Io= 0A)
Vo
50mV/div
Vo
50mV/div
2μs
2μs
Figure 38. Output Voltage
(Vo= 3.3V, SLLM, Io= 0A)
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Figure 39. Output Voltage
(Vo= 1V, PWM, Io= 0A)
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BD95602MUV
Typical Performance Curves
- continued
Vo
50mV/div
Vo
50mV/div
10μs
2μs
Figure 40. Output Voltage
(Vo= 1V, PWM, Io= 8A)
Figure 41. Output Voltage
(Vo= 1V, QLLM, Io= 0A)
EN1
5V/div
Vo1
2V/div
Vo
50mV/div
EN2
5V/div
Vo2
2V/div
400μs
2μs
Figure 42. Output Voltage
(Vo= 1V, SLLM, Io= 0A)
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Figure 43. Start-up
(EN1= EN2)
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BD95602MUV
Typical Performance Curves
- continued
EN1
5V/div
Vo1
2V/div
EN1
5V/div
Vo1
2V/div
EN2
5V/div
EN2
5V/div
Vo2
2V/div
Vo2
2V/div
40ms
40ms
Figure 44. Start-up
(EN2→EN1)
Figure 45. Start-up
(EN1→EN2)
IOUT-frequency (VOUT=5V, R(FS)=68kΩ )
500
EN2
5V/div
PGOOD2
2V/div
40ms
450
frequency [kHz]
EN1
5V/div
PGOOD1
2V/div
400
VIN=7.5V
VIN=12V
VIN=18V
350
300
0
Figure 46. Start-up
(EN1/2→PGOOD1/2)
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1
2
3
4
IOUT [A]
5
6
7
Figure 47. Io-frequency
(Vo= 5V, PWM, RFS= 68kΩ)
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Typical Performance Curves
- continued
IOUT-frequency (VOUT=5V, R(FS)=68kΩ )
2.5
500
VOUT=5V
2
VOUT=3.3V
ONTIME [usec]
frequency [kHz]
450
400
VIN=7.5V
VIN=12V
VIN=18V
350
1.5
1
0.5
0
300
0
1
2
3
4
IOUT [A]
5
6
0
7
50
100
150
RFS [kΩ ]
Figure 49. On time-RFS
Figure 48. lo-frequency
(Vo= 3.3V, PWM, RFS= 68kΩ)
700
5.500
5.000
500
VOUT=5V
4.500
VOUT=3.3V
4.000
VIN=7.5V(-5℃）
VIN=21V（-5℃）
VIN=7.5V(75℃）
VIN=21V（75℃）
3.500
400
VOUT [V]
frequency [kHz]
600
300
3.000
2.500
2.000
200
1.500
1.000
100
0.500
0
0.000
0
50
100
150
0
RFS [kΩ ]
4
6
8
10
12
14
16
IOUT [A]
Figure 50. SW Frequency-RFS
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2
Figure 51. Current Limit
(Vo= 5V)
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Typical Performance Curves
- continued
IOUT - REG1 voltage
5.1
3.500
3.000
5
VOUT [V]
2.500
REG1 voltage [V]
VIN=7.5V(-5℃）
VIN=21V（-5℃）
VIN=7.5V(75℃）
VIN=21V（75℃）
2.000
1.500
1.000
4.9
4.8
4.7
4.6
0.500
4.5
0.000
0
2
4
6
8
IOUT [A]
10
12
14
16
0
50
100
150
200
250
IOUT [mA]
Figure 53. REG1 Load Regulation
Figure 52. Current Limit
(Vo= 3.3V)
IOUT - REG2 voltage
3.4
REG2 voltage [V]
3.3
3.2
3.1
3
2.9
2.8
0
50
100
150
200
250
IOUT [mA]
Figure 54. REG2 Load Regulation
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BD95602MUV
Description of Block
BD95602MUV is a dual channel synchronous buck regulator using H3RegTM, Rohm’s latest constant on-time controller
technology. Fast load response is achieved by controlling the output voltage using a comparator without relying on the
switching frequency.
When VOUT drops due to a rapid load change, the system quickly restores VOUT by extending the tON time interval. Thus, it
serves to improve the regulator’s transient response. Activation of the light load mode further increases efficiency by using
VIN
Simple Light Load Mode (SLLM) control.
H3RegTM Control
Comparator for
Output voltage control
VOUT/VIN
Circuit
HG
FB
A
○
Driver
B
○
Internal
Reference
Voltage
REF
SW
VOUT
LG
Transient
Circuit
(Normal operation)
FB
When FB falls to a reference voltage (REF),
the drop is detected, activating the H3RegTM
control system
REF
VOUT
VIN
tON =
LG
HG output on-time is determined by the formula (1).
When HG is off, LG is on until the output voltage becomes
FB= REF.
After the status of HG is off, LG go on outputting until
output voltage become FB= REF.
(VOUT drops due to a rapid load change)
FB
[sec]・・・(1)
When VOUT drops due to a rapid load change, and
the voltage remains below the output setting following the
programmed tON time, the system quickly restores VOUT
by extending the tON time, thus improving the transient
response. Once VOUT is restored, the controller continues
normal operation.
REF
Io
x
1
f
HG
tON +α
HG
LG
(When VIN drops)
VIN
tON 1
t ON 2
t ON 4+α
t ON 4
t ON 3
H3 RegTM
HG
t OFF 1
t OFF2
t OFF 3
t OFF 4=t OFF3
t OFF 4=t OFF3
LG
FB
FB=REF
REF
Output voltage drops
Based on the value of VIN, the on-time tON and off-time tOFF are determined by tON= VOUT / VIN x I/f and tOFF= (VIN- VOUT )/VIN.
As the VIN voltage drops, in order to maintain the output voltage, tON becomes longer and tOFF is shorter. However, for
normal operation, if VIN drops further, tON is longer and tOFF= tminoff (minimum off- time is defined internally), the output
voltage will decrease because tOFF cannot be any shorter than the minimum off-time. With H3RegTM, if VIN goes even lower,
the output voltage is maintained as the tON time is extended. (tON time is extended until FB>REF). In this case, the switching
frequency is lowered so that the tON time can be extended.
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BD95602MUV
Description of Block
- continued
Light Load Control
(SLLM)
FB
SLLM will activate when the LG pin is off and the coil current is
near 0A (current flows from VOUT to SW).
When the FB input is lower than the REF voltage again, HG will
be enabled once again.
REF
HG
LG
0A
(QLLM)
FB
QLLM will activate when the LG pin is off and the coil
current is near 0A (current flows from VOUT to SW). In this
case, the next HG is prevented. Then, when FB falls below
the output programmed voltage within the programmed time
(Typ= 40μs), HG will resume. In the case where FB doesn’t
fall in the programmed time, LG is forced on causing VOUT to
fall. As a result, the next HG is on.
REF
HG
LG
0A
MCTL1
MCTL2
Control Mode
Start-up
L
L
L
H
SLLM
QLLM
PWM
PWM
H
X
PWM
PWM
*Attention: To effect the rapid transient response, the H3RegTM control
monitors the current from the output capacitor to the load using
the ESR of the output capacitor Do not use ceramic capacitors
on COUT side of power supply. Ceramic bypass capacitors can
be used near the individual loads if desired.
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The BD95602MUV operates in PWM mode until the SS
input reaches the clamp voltage (2.5V), regardless of the
control mode setting, this assures stable operation while the
during soft start.
COUT
Load
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26.Jun.2015 Rev.002
BD95602MUV
Timing Chart
・Soft Start Function
Soft start is exercised with the EN pin set high. Current
control takes effect at startup, enabling a moderate
output voltage “ramping start.” Soft start timing and
incoming current are calculated with formulas (2) and (3)
below.
EN
tSS
SS
・Soft start time
0.7(Typ) x CSS
tSS =
2.3μA(Typ)
VOUT
IIN
[sec] ・・・(2)
CSS(pF)
Soft start time(ms)
18000
5
33000
10
68000
20
・ Inrush current
Co x VOUT
VOUT
[A] ・・・(3)
VIN
(Css: Soft start capacitor Co: Output capacitor)
Iin
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TSZ22111・15・001
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=
tSS
x
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BD95602MUV
Timing Chart
- continued
・Notes when waking up with CTL pin or VIN pin
If EN pin is high or short (or pull up resistor) to REG1 pin, IC starts up by switching CTL pin, the IC might fail to start
up (SCP function) with the reason below, please be careful of SS pin and REF pin capacitor capacity.
REG1 REG2
FB
VIN
CTL
BG
Inner
Reference
Circuit
SCP circuit
Delay
SCP
REF
SCP_REF
1ms(Typ)
SCP
PWM
SS
(Switching control signal)
CTL
(Vin)
REG1(5V)
REG2(3.3V)
SCP invalid for
SS has not reached 1.5V.
SS
SCP becomes valid from
the point SS reached 1.5V.
about 1.5V
FB
FB
SCP_REF
SCP is effective at SCP_REF>FB condition.
SCP protection (function) activates when output
shorts and FB falls below the activation standard
of SCP.
FB
SCP valid area
Inclination of REF is
influenced by the external
condenserconnected to
REF.
REF
FB
SCP is valid here,
because this is
SCP valid area
and also because
FB fall below
SCP_REF.
SCP will be
effective with
EN=ON at this
section.
SCP is valid here,but with FB exceeding
SCP_REF it is normally activate-able
area.
EN
Start up NG
SW
SCP
EN
Start up OK
SW
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? To be accurate,Delay occurs after SCP activating.
But this shows the relationship of each signals briefly.
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BD95602MUV
Output Discharge
It will be available to use if connecting VOUT pin to DC/DC output.
(about 100Ω) . Discharge function operates when <1> EN=’L’
<2> UVLO= ON(If input voltage is low) <3> SCP latch
<4> TSD= ON.
The function at output discharge time is shown as left.
VIN,CTL
EN
[1] When switch to low from high with EN pin.
If EN pin voltage is below than EN threshold voltage, output
discharge function is operated, and discharge output capacitor charge.
VOUT
VIN, CTL
REG1
VOUT
The efficiency of VIN voltage
drop output discharge
Output discharge
Output Hi-Z
[2] When switch to low from high with EN pin
1) IC is in normal operation until REG1 voltage becomes lower than
UVLO voltage. However, because VIN voltage also becomes low, output
voltage will drop, too.
2) If REG1 voltage reaches the UVLO voltage, output discharge function is
operated, and discharge output capacitor charge.
3) In addition, if REG1 voltage drops, inner IC logic cannot operate, so that
output discharge function does not work, and becomes output Hi-z.
(In case, FB has resistor against ground, discharge at the resistor. )
UVLO ON
・Timer Latch Type Output Short Circuit Protection
FB
Short protection is enabled when the output voltage
falls to or below REF X 0.7.
Once the programmed time period has elapsed, the
output is latched off to prevent destruction of the circuit.
(HG= Low, LG= Low) Output voltage can be restored
either by cycling the EN pin or disabling UVLO.
REF x 0.7
SCP
0.75ms(Typ)
EN / UVLO
・Over Voltage Protection
When the output voltage increases to or above REF x
1.2(Typ), output over voltage protection is enabled, and
the Low-side FET turns on to reduce the output.
(LG= High, HG= Low).
When the output falls to within normal operation, the
function is restored to normal operation.
REF x 1.2
FB
HG
LG
Switching
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BD95602MUV
・Over current protection circuit
tON
tON
tON
tON
During normal operation, if FB is less than REF, HG is
high during the time tON, but when the coil current
exceeds the ILIMIT threshold, HG is set to off. The next
pulse returns to normal operation if the output voltage
drops after the maximum on-time or IL becomes lower
than ILIMIT.
HG
LG
tOFF1
tOFF1
tOFF1
tOFFα
IL
Over current protection
setting value
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OCP detection
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BD95602MUV
Selection of Components Externally Connected
1.Inductor (L) selection
The inductor value is a major influence on the output ripple current.
As formula (4) below indicates, the greater the inductor or the switching
frequency, the lower the ripple current.
ΔIL
ΔIL=
VIN
(VIIN-VOUT) x VOUT
[A]・・・(4)
L x VIN x f
Generally, lower inductance values offer faster response times but
also result in increased output ripple and lower efficiency.
IL
VOUT
0.47µH to 2.2µH are recommended as appropriate setting value.
L
Co
The peak current rating of coil is approximated by formula (5).
Please select inductor which is higher than this value.
(VIN-VOUT) x VOUT
ILPEAK= IOUTMAX +
Output ripple current
2 x L x VIN x f
[A]・・・(5)
*Passing a current larger than inductor’s rated current will cause magnetic saturation in the inductor and decrease
system efficiency. In selecting the inductor, be sure to allow enough margin to assure that peak current does not
exceed the inductor rated current value.
*To minimize possible inductor damage and maximize efficiency, choose an inductor with a low (DCR, ACR) resistance.
2. Output Capacitor (CO) Selection
VIN
The output capacitor should be determined by equivalent series resistance
and equivalent series inductance so that the output ripple voltage is 30mV
or more.
The rating of the capacitor is selected with sufficient margin given the
output voltage.
VOUT
L
ESR
ΔVOUT =ΔIL x ESR+ESL x ΔIL / tON・・・(6)
Load
ESL CEXT
ΔIL: Output ripple current
ESR: Equivalent series resistance,
ESL: Equivalent series inductance
Co
Output Capacitor
Please give due consideration to the conditions in formula (7) below for the output capacitor, bearing in mind that the
output start-up time must be established within the soft start timeframe. Capacitors used as bypass capacitors are
connected to the load side affect the overall output capacitance (CEXT, figure above). Please set the soft start time or
over-current detection value, regarding these capacities.
Co+CEXT ≤
TSS x (Limit- IOUT)
VOUT
TSS : Soft start time
Limit : Over current detection
・・・(7)
Note: If an inappropriate capacitor is used, OCP may be detected during activation and may cause startup malfunctions.
3. Input Capacitor (Cin) Selection
The input capacitor selected must have low enough ESR to fully support high output
ripple so as to prevent extreme over current conditions. The formula for ripple current
IRMS is given in (8) below.
VIN
Cin
√VOUT (VIN-VOUT)
VOUT
L
IRMS= IOUT x
Co
[A]・・・(8)
VIN
IOUT
Where VIN= 2 x VOUT, IRMS=
2
Input Capacitor
A ceramic capacitor is recommended to reduce ESR loss and maximize efficiency.
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BD95602MUV
4.MOSFET Selection
High-side driver and Low-side driver are designed to activate N channel MOSFET’s
with low on-resistance.
The chosen MOSFET may result in the loss described below, please select a proper
FET for each considering the input-output and load current.
VIN
High-side MOSFET
< Loss of High-side MOSFET >
VOUT
Pmain= PRON+PTRAN
L
Co
VOUT
=
PGND
(Tr+Tf) x VIN x IOUT x f
x RON x IOUT2 +
6
VIN
・・・(9)
(Ron: On-resistance of FET
f: Switching frequency
Tr: Rise time, Tf: Fall time)
PGND
Low-side MONFET
< Loss of Low-side MOSFET >
Psyn= PRON
=
VIN -VOUT
VIN
x RON x IOUT2
・・・(10)
The High-side MOSFET generates loss when switching, along with the loss due to on-resistance.
Good efficiency is achieved by selecting a MOSFET with low on-resistance and low Qg (gate total charge amount).
Recommended MOSFETs for various current values are as follows:
Output current
High-side MOSFET
Low-side MOSFET
to 5A
RQ3E080GN
RQ3E100GN
5 to 8A
RQ3E120GN
RQ3E150GN
8 to 10A
RQ3E150GN
RQ3E180GN
5. Output Voltage Set Point
This IC operates such that output voltage is REF ≌ FB.
<Output Voltage>
(R1+R2)
VOUT =
R2
1
ΔVOUT
2
x REF(0.7V)+
(ΔVOUT: Output ripple voltage)
(ΔIL: ripple current of coil)
ΔVOUT =ΔIL x ESR
ΔIL =( VIN - VOUT) x
VOUT
(L x VIN x f)
L: inductance[H]
f: switching frequency[Hz]
*(Notice)Please set output ripple voltage more than 30mV to 50mV.
(Example) VIN= 20V, VOUT= 5V, f= 300kHz, L= 2.5µH, ESR= 20mΩ, R1= 56kΩ, R2= 9.1kΩ
5V
ΔIL =(20V-5V) x
=5(A)
(2.5 x 10-6H x 20V x 300 x 103Hz)
ΔVOUT =5A x 20 x 10-3Ω= 0.1(V)
VOUT = 0.7V x
(51kΩ+ 9.1kΩ)
+
9.1kΩ
1
2
x 0.1V=5.057(V)
VIN
H3REG
CONTROLLER
REF
VIN
R
SLLM
Q
Output
voltage
Driver
Circuit
S
SLLM
FB
R1
R2
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BD95602MUV
6. Setting over current protection
VIN
The on resistance (between SW and PGND) of the low side MOSFET is used
to set the over current protection.
Over current reference voltage (ILIM_ref) is determined as in formula(11) below.
L
VOUT
ILIM_ref =
SW
CO
(RILIM: Resistance for setting of over current voltage protection value[kΩ]
RON: Low-side on resistance value of FET[mΩ])
PGND
RILIM
10k
[A]・・・(11)
RILIM[kΩ] x RON[mΩ]
Over current protection is actually determined by the formula (12) below.
1
Iocp = ILIM_ref + 2 ΔIL
1
V - VO x I x Vo ・・・(12)
x IN
= ILIM_ref +
VIN
2
f
L
Coil current
ΔIL:Coil ripple current[A]
VIN:Input voltage[V]
VO:Output voltage [V]
f:Switching frequency [HZ]
L:Inductance [H]
IOCP
ILIM_ref
(Example)
If a load current 5A is desired with VIN=6 to 19V, VOUT=5V, f=400kHZ, L=2.5µH, RON=20mΩ, the formula would be:
IOCP=
10k
1
+
RILIM[kΩ] ×RON[mΩ] 2
I x
x VIN – VO x
f
L
VO
VIN
>5
When VIN= 6V, IOCP will be minimum(this is because the ripple current is also minimum) so that if each condition is
input, the formula will be the following: RILIM<109.1[kΩ].
*To design the actual board, please consider enough margin for FET on resistance variation, Inductance variation, IC
over current reference value variation, and frequency variation.
7. Relation between output voltage and tON time
For BD95602MUV, both channels, are high efficiency synchronous regulator controllers with variable frequency.
tON time varies with Input voltage [VIN], output voltage [VOUT], and RFS of FS pin resistance.
See Figure 52 and Figure 53 for tON time.
3.5
2.5
VIN=7V
VIN=7V
3
VIN=1 2V
VIN=12V
VIN=2 1V
VIN=21V
2
ontime[us]
ontime[us]
2.5
2
1.5
1.5
1
1
0.5
0.5
0
0
20
40
60
80
100
0
120
0
20
RFS[kΩ ]
40
60
80
100
120
RFS[kΩ ]
Figure55. RFS – ontime(VOUT= 5V)
Figure56. RFS – ontime(VOUT= 3.3V)
From tON time, frequency on application condition is following:
Frequency =
VOUT
VIN
x
1
tON
[kHz]・・・(13)
However, real-life considerations (such as the external MOSFET gate capacitor and switching speed) must be
factored in as they affect the overall switching rise and fall time, so please confirm by experiment.
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R26
R8
R25
16
15
14
13
12
11
10
9
MCTL2
FS1
FB1
AGND
REF
FB2
FS2
CTL
C4
R7
R15
R16
Application Example (Vin= 12V, Vo1= 3.3V/8A, f1= 400kHz, Vo2= 2.5V/8A, f2= 400kHz)
R5
17 ILIM1
R6
ILIM2 8
18 MCTL1
VO2 7
19 SS1
SS2 6
C5
C6
20 PGOOD1
PGOOD2 5
U1
U1
BD95602MUV
BD95602MUV
21 EN1
Q1
C12
C7
BOOT2 3
C8
22 BOOT1
C9
EN_2.5
EN2 4
23 HG1
HG2 2
Q3
EN_3.3
REG2
REG1
VIN
LG2
PGND2
26
27
28
29
30
31
32
2.5V
SW2 1
C1
C2
C3
Q4
C29
VO1
25
Q2
C19
LG1
L2
24 SW1
3.3V
PGND1
L1
+12V
REG1_5V
REG2_3.3V
GND PGND
Figure 57. Application Example
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Reference
Designator
C1, C9, C10,
C11, C12
C2, C3, C4
C5, C6
C7, C8
Type
Ceramic
Capacitor
Ceramic
Capacitor
Ceramic
Capacitor
Ceramic
Capacitor
Value
Description
Manufacturer
Part Number
Manufacturer
Configuration
(mm)
10µF
35V, X5R, ±10%
GRM32ER6YA106KA12
MURATA
3225
10µF
16V, X5R, ±10%
GRM21BR61C106ME15
MURATA
2012
0.1µF
16V, X5R, ±10%
GRM155R61C104KA88
MURATA
1005
0.47µF
10V, X5R, ±10%
GRM188R61A474KA61
MURATA
1608
SANYO
7343
GLMC1R003A
ALPS
6565
RQ3E150GN
ROHM
3333
RQ3E180GN
ROHM
3333
MCR01MZPJ623
ROHM
1005
C18, C19,
C28, C29
POSCAP
330µF
L1,L2
Inductor
1µH
Q1, Q3
MOSFET
-
Q2, Q4
MOSFET
-
R5, R6
Resistor
62kΩ
6.3V, ±20%, ESR
18mΩmax
±20%,10A(L=-30%),
DCR=5.8mΩ±10%
N-ch, Vdss 30V, Id 15A,
Ron 4.7mΩ
N-ch, Vdss 30V, Id 18A,
Ron 3.3mΩ
1/16W, 50V, 5%
R7, R8
Resistor
51kΩ
1/16W, 50V, 5%
MCR01MZPJ513
ROHM
1005
R15
Resistor
16kΩ
1/16W, 50V, 0.5%
MCR01MZPD1602
ROHM
1005
R16
Resistor
4.3kΩ
1/16W, 50V, 0.5%
MCR01MZPD4301
ROHM
1005
R24
Resistor
100Ω
1/16W, 50V, 5%
MCR01MZPJ101
ROHM
1005
R25
Resistor
12kΩ
1/16W, 50V, 0.5%
MCR01MZPD1202
ROHM
1005
R26
Resistor
4.7kΩ
1/16W, 50V, 0.5%
MCR01MZPD4701
ROHM
1005
U1
IC
-
Buck DC/DC Controller
BD95602MUV
ROHM
VQFN032V5050
6TPE330MIL
Without any ripple (about 10mV), there is a possibility that the FB signal is not stable due to the adoption of the comparator control method. Please ensure
enough ripple voltage either by (1)reducing the L-value of inductor, or (2)using high ESR output capacitor. Ripple voltage can be generated in FB terminal by
adding a capacitor in parallel to resistor (R17, R19) of the FB input, but the circuit will be sensitive to noise from the output (Vo1/Vo2) line and is not
recommended. Stability of the circuit is influenced by the layout of the PCB, please pay careful attention to the layout.
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BD95602MUV
Power Dissipation
[mW]
1000
74.2mm x 74.2mm x 1.6mm Glass-epoxy PCB
Power Dissipation (Pd)
880mW
θj-a=142. °C /W
800
600
IC Only
θj-a=328.9°C/W
380mW
400
200
0
25
50
75
85
100
125
150 [°C]
Ambient Temperature (Ta)
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BD95602MUV
I/O equivalence circuits
1, 24pin (SW2, SW1)
2, 23pin (HG2, HG1)
BOOT
BOOT
3, 22pin (BOOT2, BOOT1)
BOOT
HG
HG
SW
SW
4, 21pin (EN2, EN1)
5, 20pin (PGOOD2, PGOOD1)
6, 19pin (SS2, SS1)
REG1
50Ω
1MΩ
12pin (REF)
11, 14pin (FB2, FB1)
10, 15pin (FS2, FS1)
9pin (CTL)
26, 31pin (LG1, LG2)
REG1
16, 18pin (MCTL2, MCTL 1)
VIN
REG1
100kΩ
1MΩ
500kΩ
300kΩ
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I/O equivalence circuit(s)
- continued
7, 27pin (Vo2, Vo1)
28pin (REG2)
29pin (REG1)
REG1
VIN
VIN
50Ω
30pin (VIN)
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BD95602MUV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 58. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD95602MUV
Ordering Information
B
D
9
5
6
Part Number
0
2
M
U
Package
MUV: VQFN
V
-
E2
Packaging and forming specification
E2: Embossed tape and reel (VQFN032V5050)
Marking Diagrams
VQFN032V5050
(TOP VIEW)
Part Number Marking
D 9 5 6 0 2
LOT Number
1PIN MARK
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Physical Dimension, Tape and Reel Information
Package Name
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Revision History
Date
Revision
6.Sep.2013
26.Jun.2015
001
002
Changes
New Release
P.31 Change ‘’the description’’ of L1,L2
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001