CCB 892.01 Qual report

TC74
PRODUCT QUALIFICATION REPORT
Document Control # C-0909218
August 27, 2009
Microchip Technology Inc.
2355 West Chandler Blvd.
Chandler, Arizona, USA – 85224
Ph: 480.792.7200, Fax: 480.899.9210
http://www.microchip.com
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
SUMMARY QUALIFICATION REPORT
Document Control #:
C-0909218
Document Revision:
A
Purpose:
Device(s):
Product:
Mask Identification #:
Process:
Product Design Qualification
TC74
Serial Digital Thermal Sensor
GBBW1
8” 130K ANALOG 0.6um POLY
GATE
MSL:
887
Date:
August 27, 2009
Name
Title
Date
C. Desai
Reliability Engineer
August 27, 2009
Approved by
C.K. Barlingay
Reliability Manager
September 3, 2009
Approved by
R. Francisco
Product Engineer
September 1, 2009
Author
Microchip Technology Inc.
2
Chandler, Arizona, U. S. A.
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
TABLE OF CONTENTS
DEVICE DESCRIPTION .................................................................... 4
OVERVIEW ........................................................................................ 5
QUALIFICATION PLAN AND DESCRIPTIONS ..............................................................5
TEST CONDITIONS ...............................................................................................6
RELIABILITY RESULTS ................................................................... 7
QUALIFICATION MATERIAL ....................................................................................7
DIE LEVEL RESULTS.............................................................................................8
PACKAGE RELIABILITY ..........................................................................................9
CONCLUSION ................................................................................... 9
APPENDIX A – DYNAMIC LIFE BURN-IN SCHEMATIC ............... 10
Microchip Technology Inc.
3
Chandler, Arizona, U. S. A.
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
Device Description
TC74 is a serially accessible digital temperature sensor particularly suited for low
cost and small form-factor applications. Temperature data is converted from the
on-board thermal sensing element and made available as an 8-bit digital word.
Communication with the TC74 is accomplished via a simple 2-wire
SMBus/I2C™-compatible serial port. This bus also can be used to implement
multi-drop/multi-zone monitoring. The SHDN bit in the CONFIG register can be
used to activate the low-power Standby mode. Temperature resolution is 1°C.
Conversion rate is a nominal 8 samples/sec. Power consumption in only 200 µA
(5 µA Standby). Small size, low installed cost and ease of use make the TC74 an
ideal choice for implementing thermal management in a variety of systems.
Microchip Technology Inc.
4
Chandler, Arizona, U. S. A.
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
Overview
The purpose of this report is to verify that qualification testing was performed
in accordance with the documented qualification plan required by Microchip
specification QCI-39000, “Worldwide Quality Conformance Requirements.”
Qualification Plan and Descriptions
In keeping with guidelines established in QCI-39000, a minimum of one
production lot was used for qualification testing of the TC74. This qualification
will release the TC74 to production. A detailed qualification plan is listed
below along with descriptions of each test.
High Temperature Operating Life (HTOL) / Dynamic Life Testing (DLT)
This test is designed to accelerate random failure modes which may occur
during normal operation. Devices are programmed with a burn-in program
and exercised at a high ambient temperature to simulate field life.
One lot of the TC74 was subjected to 408 hours of dynamic life burn-in at
150oC.
Conditions:
•
•
•
6.0V
Supply Voltage:
9.0 years @ 55oC
Reachout Î
See attached schematic in Appendix A
Electrostatic Discharge (ESD) Test Using Human Body Model (HBM) and
Machine Model (MM)
This test is conducted to determine the sensitivity of the input protection
circuitry to electrostatic discharge. Human Body Model tests are conducted
according to EIA/JESD22-A114 and Machine Model tests are performed in
accordance with EIA/JESD22-A115 (Microchip Specification QCI-30510).
One lot of TC74 was tested to determine susceptibility to ESD.
Latch-Up (LU) Over Current Testing
This test is employed to determine the sensitivity of a device to overshoots in
input and output signals (also called transients) with respect to Vdd and
Ground. The current injection method is used per Microchip standard QCI30521. This test is performed at 25oC and 125oC.
One lot of TC74 was tested to determine latch up susceptibility.
Microchip Technology Inc.
5
Chandler, Arizona, U. S. A.
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
Test Conditions
Tests are performed in accordance with QCI-39000, “Worldwide Quality
Conformance Requirements.” The various conditions are listed below.
TEST
METHOD
CONDITION
High Temperature
Operating Life /
Dynamic Life Test
MIL-STD 883
Method 1005
150oC, 408 Hrs
Electrical Test at -40oC,
+25oC and +125oC.
ESD Human Body
Model
EIA/JESD22A114
ESD Machine Model
EIA/JESD22A115
Latch-up Testing
QCI-30521
1.5K Ohm, 100 pF
Electrical Test at +25oC and
+125oC.
0 Ohm, 200 pF
Electrical Test at +25oC and
+125oC.
Trigger Voltage Limit =
1.5*VMAX (not to exceed Vabs)
Pulse Width = 5 ms
Rise/Fall Time = 100 us
Test at +25oC and +125oC
Microchip Technology Inc.
6
SAMPLE
SIZE RUN
0/638
ACCEPTANCE
CRITIREA
0/600
1 Lot
12
2000V
1 Lot
12
200V
1 Lot
1 Lot
6
6
100mA
(0/6)
100mA
(0/6)
Chandler, Arizona, U. S. A.
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
Reliability Results
The results of the tests performed are presented below.
Qualification Material
Information regarding the devices that were used in this qualification are
shown in the table below.
LOT
LOT 1
DEVICE
TC74
MASK, REV
GBBW1, A1
WAFER FAB
MICROCHIP
TEMPE
WAFER
PROCESS
8” 130K Analog 0.6um Poly
Gate
WAFER LOT
TMPE209486782.110
ASSEMBLY
LOT
MTAI100701255.000
PACKAGE
5L SOT-23
ASSEMBLY
SITE
MICROCHIP
FINAL TEST
MICROCHIP
THAILAND
THAILAND
QUAL #
MTHAI # – R09100
CHANDLER # – N0936
Microchip Technology Inc.
CN #
C123233
QUAL TESTS
HTOL/ ESD/ LATCH-UP
7
Chandler, Arizona, U. S. A.
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
Die Level Results
The results of die level testing are shown below.
DYNAMIC LIFE TESTING AT 150°C ( HTOL/DLT)
96 Hours
0/700a
Lot 1
a
b
408 Hours
0/638b
Twenty four devices were lost during post testing and 19 devices were removed due to visual/mechanical damage
Nineteen devices were lost during post testing.
Activation Energy
Derated Temperature
Device Hours
Fit Rate - 50% Confidence
0.7 eV
55oC
Infant Mortality
Total Life
MTBF (Years)
63,072
262,128
N/A
42
10
11,184
13
34
8,459
3,367
Fit Rate - 60% Confidence
56
Fit Rate - 90% Confidence
141
Note: One FIT is one fail in 109 device hours
Infant Mortality
Total Life
Best Estimated Failure Rate (%\KHR)
0.0042
0.0010
ELECTROSTATIC DISCHARGE TESTS
Lot 1
Human Body Model
Machine Model
Pass up to 1000V
Pass up to 400V
LATCH-UP TESTS
@ 25OC
Lot 1
Passed 100mA
Note: All pins meet or exceed QCI-39000 guidelines.
Microchip Technology Inc.
8
@ 125OC
Passed 100mA
Chandler, Arizona, U. S. A.
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
Package Reliability
Visit the Microchip Technology Inc. website at www.microchip.com for the
latest package reliability data.
Conclusion
Based on the results, the TC74 complies with the reliability guidelines
specified in QCI-39000 except the ESD Human body model. GBBW1 device
has identical design and process specification when compared to Y4001 and
is streamed out using same design files. An ESD correlation between the
GBBW1 and Y4001 was done under Microchip’s testing conditions and the
two masks were found to perform similarly. Based on these results GBBW1 is
considered qualified by grand fathered clause. Therefore, the TC74 devices
are released to production.
Microchip Technology Inc.
9
Chandler, Arizona, U. S. A.
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
Appendix A – Dynamic Life Burn-In Schematic
TC74 HIGH TEMPERATURE DYNAMIC LIFE TEST
BURN-IN SCHEMATIC
5.5V
R1
1.5K
o
C2
1uF
C1
0.1uF
1
NC
2
GND
3
VDD
SDATA
5
SCLK
4
TC74
GND
Microchip Technology Inc.
10
Chandler, Arizona, U. S. A.
GBBW1, TC74 Rev A1
Product Qualification Report
#C-0909218 Rev. A
NOTES:
Microchip Technology Inc.
11
Chandler, Arizona, U. S. A.
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