PACDN042 D

PACDN042
Transient Voltage
Suppressors and ESD
Protectors
Product Description
The PACDN042/43/44/45/46 family of transient voltage suppressor
arrays provide a very high level of protection for sensitive electronic
components that may be subjected to electrostatic discharge (ESD).
The PACDN042/43/44/45/46 devices safely dissipate ESD strikes,
exceeding the IEC 61000−4−2 International Standard, Level 4 (±8 kV
contact discharge). All pins are rated to withstand ±20 kV ESD pulses
using the IEC 61000−4−2 contact discharge method. Using the
MIL−STD−883D (Method 3015) specification for Human Body
Model (HBM) ESD, all pins are protected from contact discharges of
greater than ±30 kV.
Features
• Two, Three, Four, Five, or Six Transient Voltage Suppressors
• Compact SMT Package Saves Board Space and Facilitates Layout
•
•
in Space−Critical Applications
In−System ESD Protection to ±20 kV Contact Discharge, per the
IEC 61000−4−2 International Standard
These Devices are Pb−Free and are RoHS Compliant
Applications
• ESD Protection of PC Ports, Including USB Ports, Serial Ports,
•
Parallel Ports, IEEE1394 Ports, Docking Ports, Proprietary Ports,
etc.
Protection of Interface Ports or IC Pins which are Exposed to
High ESD Levels
http://onsemi.com
SOT23−3
CASE 318
SOT23−5
CASE 527AH
SOT23−6
CASE 527AJ
SOT−143
CASE 527AF
SC70−3
CASE 419AB
CS70−5
CASE 419AC
SC70−6
CASE 419AD
TSSOP8
CASE 948AL
MSOP8
CASE 846AB
MARKING DIAGRAM
XXX MG
G
1
XXX
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
(see the last page of this document)
© Semiconductor Components Industries, LLC, 2013
December, 2013 − Rev. 6
1
Publication Order Number:
PACDN042/D
PACDN042
ELECTRICAL SCHEMATIC
PACDN043
PACDN042
GND
3
1
2
4
3
8
1
GND
2
1
GND
SOT23−3
SC70−3
SOT−143
PACDN044Y
PACDN045
5
1
2
GND
SOT23−5
SC70−5
PACDN044T
GND
GND
6
5
7
3
GND
TSSOP−8
4
2
PACDN046
4
6
5
4
3
1
2
GND
SOT23−6
SC70−6
3
GND
8
1
GND
7
6
5
2
3
4
MSOP−8
PACKAGE / PINOUT DIAGRAMS
Top View
TVS
Cathode
1
GND
TVS
Cathode
2
3−Pin SOT23
2
TVS
Cathode
3
TVS
Cathode
TVS
Cathode
1
GND
2
TVS
Cathode
5
3
4
5−Pin SOT23
5−Pin SC70
Top View
Top View
2
3
5
4
6−Pin SOT23
2
TVS
Cathode
TVS
Cathode
TVS
Cathode
TVS
Cathode
1
GND
2
TVS
Cathode
3
TVS
Cathode
3
TVS
Cathode
Top View
TVS
Cathode
TVS
Cathode
1
TVS
Cathode
2
GND
4
TVS
Cathode
GND
GND
TVS
Cathode
8
TVS
Cathode
GND
PAC 7
DN054T
3
6
5
8−Pin TSSOP
Top View
6
TVS
Cathode
5
TVS
Cathode
4
TVS
Cathode
6−Pin SC70
GND
TVS
Cathode
TVS
Cathode
TVS
Cathode
1
2
3
4
http://onsemi.com
8
GND
7
TVS
Cathode
TVS
Cathode
TVS
Cathode
6
5
8−Pin MSOP
Note: SOT23, SC70, SOT−143, TSSOP, and MSOP Packages may differ in size. These drawings are not to scale.
2
4
4−Pin SOT−143
D056
GND
6
D55/D56
1
D055
TVS
Cathode
TVS
Cathode
4
2
D54
GND
5
TVS
Cathode
GND
Top View
TVS
Cathode
D054
1
1
3−Pin SC70
Top View
TVS
Cathode
3
GND
D053
3
Top View
1
D52
052
TVS
Cathode
Top View
TVS
Cathode
PACDN042
Table 1. PIN DESCRIPTIONS
Pins
Name
Description
(Refer to Package Outline Drawings)
TVS Cathode
The cathode of the respective TVS diode, which should be connected to the
node requiring transient voltage protection.
(Refer to Package Outline Drawings)
GND
The anode of the TVS diodes.
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
Package Power Dissipation
SC70
SOT23−3, SOT23−5, SOT23−6, SOT−143
TSSOP, MSOP
Rating
Units
−65 to +150
°C
W
0.2
0.225
0.5
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature
Rating
Units
−40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
Symbol
C
VRSO
Parameter
Conditions
Min
Max
30
Units
Capacitance
TA = 25°C, 2.5 VDC, 1 MHz
Reverse Stand−off Voltage
IR = 10 mA, TA = 25°C
5.5
V
IR = 1 mA, TA = 25°C
6.1
V
ILEAK
Leakage Current
VIN = 5.0 VDC, TA = 25°C
VSIG
Small Signal Clamp Voltage
Positive Clamp
Negative Clamp
I = 10 mA, TA = 25°C
I = −10 mA, TA = 25°C
6.2
−0.4
VESD
ESD Withstand Voltage
Human Body Model, MIL−STD−883,
Method 3015
Contact Discharge per IEC 61000−4−2
Standard
(Note 1)
±30
(Note 1)
±20
RD
Typ
Diode Dynamic Resistance
Forward Conduction
Reverse Conduction
pF
1
100
6.8
−0.8
8
−1.2
1. ESD voltage applied between channel pins & ground, one pin at a time; all other channel pins open; all GND pins grounded.
3
V
kV
1.0
1.4
http://onsemi.com
nA
W
PACDN042
PERFORMANCE INFORMATION
Diode Capacitance
Typical diode capacitance with respect to positive TVS cathode voltage (reverse voltage across the diode) is given in Diode
Capacitance vs. Reverse Voltage.
Figure 1. Diode Capacitance vs. Reverse Voltage
Typical High Current Diode Characteristics
Measurements are made in pulse mode with a nominal pulse width of 0.7 mS.
Figure 2. Typical Input VI Characteristics
(Pulse−mode measurements, pulse width = 0.7 mS nominal)
http://onsemi.com
4
PACDN042
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
D
SEE VIEW C
3
HE
E
DIM
A
A1
b
c
D
E
e
L
L1
HE
q
c
1
2
e
b
0.25
q
A
L
A1
L1
VIEW C
SOLDERING FOOTPRINT
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
http://onsemi.com
5
mm Ǔ
ǒinches
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0°
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
−−−
10 °
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0°
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10°
PACDN042
PACKAGE DIMENSIONS
SOT−23, 5 Lead
CASE 527AH
ISSUE O
D
E1
SYMBOL
MIN
A
0.90
A1
0.00
A2
0.90
b
0.30
c
0.08
E
NOM
1.45
0.15
1.15
0.22
D
2.90 BSC
E
2.80 BSC
1.60 BSC
e
0.95 BSC
L
0.45
0.30
L1
PIN #1 IDENTIFICATION
1.30
0.50
E1
e
MAX
0.60
0.60 REF
L2
0.25 REF
θ
0°
4°
8°
θ1
5°
10°
15°
θ2
5°
10°
15°
TOP VIEW
θ1
A2
A
θ
b
θ2
L1
A1
SIDE VIEW
L2
L
END VIEW
Notes:
(1) All dimensions in millimeters. Angles in degrees.
(2) Complies with JEDEC standard MO-178.
http://onsemi.com
6
c
PACDN042
PACKAGE DIMENSIONS
SOT−23, 6 Lead
CASE 527AJ
ISSUE A
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
B
6
5
4
1
2
3
E
E
GAGE
PLANE
6X
e
TOP VIEW
L2
b
0.20
SEATING
PLANE
L
M
C A
S
B
S
DETAIL A
A2
c
A
6X
0.10 C
A1
SIDE VIEW
C
SEATING
PLANE
DETAIL A
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
3.30
6X
0.85
6X
0.56
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
DIM
A
A1
A2
b
c
D
E
E1
e
L
L2
MILLIMETERS
MIN
MAX
--1.45
0.00
0.15
0.90
1.30
0.20
0.50
0.08
0.26
2.70
3.00
2.50
3.10
1.30
1.80
0.95 BSC
0.20
0.60
0.25 BSC
PACDN042
PACKAGE DIMENSIONS
SOT−143, 4 Lead
CASE 527AF
ISSUE A
SYMBOL
MIN
NOM
MAX
A
0.80
1.22
D
A1
0.05
0.15
e
A2
0.75
4
3
E1
1
E
2
e1
TOP VIEW
b
0.30
0.50
0.76
0.89
c
0.08
0.20
D
2.80
E
2.10
E1
1.20
2.90
1.30
e
1.92 BSC
0.20 BSC
0.40
0.50
L1
0.54 REF
L2
0.25
0°
A1
L1
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC TO-253.
http://onsemi.com
8
0.60
c
L
b2
1.40
8°
q
A
3.04
2.64
e1
θ
A2
1.07
b2
L
b
0.90
L2
PACDN042
PACKAGE DIMENSIONS
SC−70, 3 Lead, 1.25x2
CASE 419AB
ISSUE O
D
SYMBOL
MIN
A
0.80
1.10
A1
0.00
0.10
A2
0.80
b
0.15
0.30
c
0.08
0.22
D
1.80
2.00
2.20
E
1.80
2.10
2.40
E1
1.15
1.25
1.35
E1 E
e
e
TOP VIEW
0.90
MAX
1.00
0.65 BSC
0.26
L
e
NOM
0.36
L1
0.42 REF
L2
0.15 BSC
0.46
θ
0º
8º
θ1
4º
10º
q1
A2 A
q
q1
b
L
L1
A1
SIDE VIEW
c
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
http://onsemi.com
9
L2
PACDN042
PACKAGE DIMENSIONS
SC−88A (SC−70 5 Lead), 1.25x2
CASE 419AC
ISSUE A
SYMBOL
D
e
e
E1 E
MIN
MAX
A
0.80
1.10
A1
0.00
0.10
A2
0.80
1.00
b
0.15
0.30
c
0.10
0.18
D
1.80
2.00
2.20
E
1.80
2.10
2.40
E1
1.15
1.25
1.35
0.65 BSC
e
L
TOP VIEW
NOM
0.26
0.36
L1
0.42 REF
L2
0.15 BSC
0.46
θ
0º
8º
θ1
4º
10º
q1
A2 A
q
q1
b
L
L1
A1
SIDE VIEW
c
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
http://onsemi.com
10
L2
PACDN042
PACKAGE DIMENSIONS
SC−88 (SC−70 6 Lead), 1.25x2
CASE 419AD
ISSUE A
SYMBOL
D
e
e
E1 E
MIN
MAX
A
0.80
1.10
A1
0.00
0.10
A2
0.80
1.00
b
0.15
0.30
c
0.10
0.18
D
1.80
2.00
2.20
E
1.80
2.10
2.40
E1
1.15
1.25
1.35
0.65 BSC
e
L
TOP VIEW
NOM
0.26
0.36
L1
0.42 REF
L2
0.15 BSC
0.46
θ
0º
8º
θ1
4º
10º
q1
A2 A
q
q1
b
L
L1
A1
SIDE VIEW
c
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
http://onsemi.com
11
L2
PACDN042
PACKAGE DIMENSIONS
TSSOP8, 4.4x3
CASE 948AL
ISSUE O
b
SYMBOL
MIN
NOM
A
E1
E
MAX
1.20
A1
0.05
A2
0.80
b
0.19
0.30
c
0.09
0.20
D
2.90
3.00
3.10
E
6.30
6.40
6.50
E1
4.30
4.40
4.50
0.15
0.90
e
0.65 BSC
L
1.00 REF
L1
0.50
θ
0º
0.60
1.05
0.75
8º
e
TOP VIEW
D
A2
c
q1
A
A1
L1
SIDE VIEW
L
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
http://onsemi.com
12
PACDN042
PACKAGE DIMENSIONS
MSOP8
CASE 846AB
ISSUE O
D
HE
PIN 1 ID
−T−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
E
e
b 8 PL
0.08 (0.003)
M
T B
S
A
S
SEATING
PLANE
A
0.038 (0.0015)
A1
MILLIMETERS
NOM
MAX
−−
1.10
0.08
0.15
0.33
0.40
0.18
0.23
3.00
3.10
3.00
3.10
0.65 BSC
0.40
0.55
0.70
4.75
4.90
5.05
DIM
A
A1
b
c
D
E
e
L
HE
MIN
−−
0.05
0.25
0.13
2.90
2.90
L
c
SOLDERING FOOTPRINT*
8X
1.04
0.041
0.38
0.015
3.20
0.126
6X
8X
4.24
0.167
0.65
0.0256
5.28
0.208
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
INCHES
NOM
−−
0.003
0.013
0.007
0.118
0.118
0.026 BSC
0.021
0.016
0.187
0.193
MIN
−−
0.002
0.010
0.005
0.114
0.114
MAX
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
PACDN042
ORDERING INFORMATION
Device
ORDERING INFORMATION (cont’d)
Package
Shipping
PACDN042Y3R
SOT23−3
(Pb−Free)
3000/Tape & Reel
PACDN044Y5R
SOT23−5
(Pb−Free)
PACDN045Y6R
Device
Package
Shipping
PACDN044YB5R
SC70−5
(Pb−Free)
3000/Tape & Reel
3000/Tape & Reel
PACDN045YB6R
SC70−6
(Pb−Free)
3000/Tape & Reel
SOT23−6
(Pb−Free)
3000/Tape & Reel
PACDN045YB6R−R
SC70−6
(Pb−Free)
3000/Tape & Reel
PACDN043Y4R
SOT−143
(Pb−Free)
3000/Tape & Reel
PACDN044TR
TSSOP8
(Pb−Free)
2500/Tape & Reel
PACDN042YB3R
SC70−3
(Pb−Free)
3000/Tape & Reel
PACDN046MR
MSOP8
(Pb−Free)
4000/Tape & Reel
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
14
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
PACDN042/D