Material Content Data Sheet Sales Product Name BSZ110N06NS3 G MA# MA000473712 Package PG-TSDSON-8-22 Issued 7. January 2016 Weight* 36.50 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver tin lead phosphorus zinc iron copper phosphorus zinc iron copper 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7723-14-0 7440-66-6 7439-89-6 7440-50-8 1.296 3.55 0.002 0.01 0.009 0.03 259 0.189 0.52 5189 7.689 21.07 21.63 210677 216190 0.075 0.21 0.21 2054 2054 0.036 0.10 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.55 35510 35510 65 995 1.870 5.12 16.251 44.52 49.74 445286 51245 497526 0.375 1.03 1.03 10267 10267 0.081 0.22 0.22 2214 2214 0.072 0.20 1974 1.369 3.75 0.001 0.00 0.005 0.01 129 0.094 0.26 2575 3.816 10.46 0.001 0.00 0.004 0.01 107 0.078 0.21 2147 3.182 8.72 3.95 37510 10.73 104557 2. 3. 8.94 87181 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 107293 27 Important Remarks: 1. 39484 32 89462 1000000