IPA032N06N3 G Type OptiMOSTM3 Power-Transistor Product Summary Features • Ideal for high frequency switching and sync. rec. • Optimized technology for DC/DC converters VDS 60 V RDS(on),max 3.2 mW ID 84 A • Excellent gate charge x R DS(on) product (FOM) • Very low on-resistance RDS(on) • N-channel, normal level • 100% avalanche tested • Pb-free plating; RoHS compliant • Qualified according to JEDEC1) for target applications • Halogen-free according to IEC61249-2-21 Type IPA032N06N3 G Package PG-TO220-3-31 Marking 032N06N Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value T C=25 °C 84 T C=100 °C 60 Unit A Pulsed drain current2) I D,pulse T C=25 °C 336 Avalanche energy, single pulse3) E AS I D=100 A, R GS=25 W 235 mJ Gate source voltage V GS ±20 V Power dissipation P tot 41 W Operating and storage temperature T j, T stg -55 ... 175 °C T C=25 °C IEC climatic category; DIN IEC 68-1 55/175/56 1) J-STD20 and JESD22 See figure 3 for more detailed information 3) See figure 13 for more detailed information 2) Rev. 2.0 page 1 2013-08-27 IPA032N06N3 G Parameter Values Symbol Conditions Unit min. typ. max. - - 3.7 Thermal characteristics Thermal resistance, junction - case R thJC K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA 60 - - Gate threshold voltage V GS(th) V DS=V GS, I D=118 µA 2 3 4 Zero gate voltage drain current I DSS V DS=60 V, V GS=0 V, T j=25 °C - 0.1 1 V DS=60 V, V GS=0 V, T j=125 °C - 10 100 V µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 1 100 nA Drain-source on-state resistance R DS(on) V GS=10 V, I D=80 A - 2.6 3.2 mW Gate resistance RG - 1.3 - W Transconductance g fs 68 135 - S |V DS|>2|I D|R DS(on)max, I D=80 A 4) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 2.0 page 2 2013-08-27 IPA032N06N3 G Parameter Values Symbol Conditions Unit min. typ. max. - 10000 13000 pF - 2200 2900 Dynamic characteristics Input capacitance C iss Output capacitance C oss Reverse transfer capacitance C rss - 73 - Turn-on delay time t d(on) - 35 - Rise time tr - 120 - Turn-off delay time t d(off) - 62 - Fall time tf - 20 - Gate to source charge Q gs - 51 - Gate to drain charge Q gd - 11 - Switching charge Q sw - 32 - Gate charge total Qg - 124 165 Gate plateau voltage V plateau - 5.1 - Output charge Q oss - 100 134 nC - - 84 A - - 336 - 0.9 1.2 V - 89 - ns - 82 - nC V GS=0 V, V DS=30 V, f =1 MHz V DD=30 V, V GS=10 V, I D=120 A, R G,ext=3.5 W ns Gate Charge Characteristics5) V DD=30 V, I D=80 A, V GS=0 to 10 V V DD=30 V, V GS=0 V nC V Reverse Diode Diode continous forward current IS Diode pulse current I S,pulse Diode forward voltage V SD Reverse recovery time t rr Reverse recovery charge Q rr 5) T C=25 °C V GS=0 V, I F=80 A, T j=25 °C VR=30 V, IF=120A, diF/dt=100 A/µs See figure 16 for gate charge parameter definition Rev. 2.0 page 3 2013-08-27 IPA032N06N3 G 1 Power dissipation 2 Drain current P tot=f(T C) I D=f(T C); V GS≥10 V 100 40 80 30 60 ID [A] Ptot [W] 50 20 40 10 20 0 0 0 50 100 150 200 0 50 100 TC [°C] 150 200 TC [°C] 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T C=25 °C; D =0 Z thJC=f(t p) parameter: t p parameter: D =t p/T 103 101 limited by on-state resistance 1 µs 10 µs 0.5 102 100 0.2 ID [A] ZthJC [K/W] 100 µs 1 ms 101 0.1 0.05 10-1 0.02 0.01 10 ms single pulse DC 100 10-2 10-1 100 101 102 VDS [V] Rev. 2.0 10-5 10-4 10-3 10-2 10-1 100 101 tp [s] page 4 2013-08-27 IPA032N06N3 G 5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 300 8 10 V 7 V 5V 6V 5.5 V 6V 6 RDS(on) [mW] ID [A] 200 5.5 V 4 7V 100 10 V 2 5V 4.5 V 0 0 0 1 2 3 4 5 0 50 100 VDS [V] 150 200 250 300 ID [A] 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C parameter: T j 300 200 250 160 200 gfs [S] ID [A] 120 150 80 100 40 50 175 °C 25 °C 0 0 0 2 4 6 0 VGS [V] Rev. 2.0 50 100 150 ID [A] page 5 2013-08-27 IPA032N06N3 G 9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=80 A; V GS=10 V V GS(th)=f(T j); V GS=V DS parameter: I D 6 4 3.5 5 1180 µA 3 max 118 µA 2.5 3 VGS(th) [V] RDS(on) [mW] 4 typ 2 1.5 2 1 1 0.5 0 0 -60 -20 20 60 100 140 180 -60 -20 20 Tj [°C] 60 100 140 180 Tj [°C] 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz I F=f(V SD) parameter: T j 105 103 Ciss 104 25 °C 175 °C, max 175 °C 102 IF [A] C [pF] Coss 103 25 °C, max 101 Crss 102 101 100 0 20 40 60 VDS [V] Rev. 2.0 0 0.5 1 1.5 2 VSD [V] page 6 2013-08-27 IPA032N06N3 G 13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=25 W V GS=f(Q gate); I D=80 A pulsed parameter: T j(start) parameter: V DD 102 12 30 V 10 12 V 100 °C 8 25 °C IAS [A] VGS [V] 150 °C 48 V 6 4 2 101 0 1 10 100 1000 0 50 tAV [µs] 100 150 Qgate [nC] 15 Drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS)=f(T j); I D=1 mA 70 V GS Qg VBR(DSS) [V] 65 60 V gs(th) 55 Q g(th) Q sw Q gs 50 -60 -20 20 60 100 140 Q gate Q gd 180 Tj [°C] Rev. 2.0 page 7 2013-08-27 IPA032N06N3 G PG-TO220-3-31 Rev. 2.0 page 8 2013-08-27 IPA032N06N3 G Published by Infineon Technologies AG 81726 Munich, Germany © 2010 Infineon Technologies AG All Rights Reserved. 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Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 2.0 page 9 2013-08-27