Data Sheet

INTEGRATED CIRCUITS
DATA SHEET
TDA7056AT
3 W mono BTL audio amplifier with
DC volume control
Product specification
1998 Feb 23
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
FEATURES
GENERAL DESCRIPTION
• DC volume control
The TDA7056AT is a mono Bridge-Tied Load (BTL) output
amplifier with DC volume control. It is designed for use in
TVs and monitors, but is also suitable for battery-fed
portable recorders and radios. The device is contained in
a 20-lead small outline package.
• Few external components
• Mute mode
• Thermal protection
• Short-circuit proof
A Missing Current Limiter (MCL) is built in. The MCL circuit
is activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(300 mA typ.). This level of 100 mA allows for
Single-Ended (SE) headphone applications.
• No switch-on or switch-off clicks
• Good overall stability
• Low power consumption
• Low HF radiation
• ESD protected on all pins.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
supply voltage
4.5
−
18
V
Po
output power
VP = 12 V; RL = 16 Ω
3
3.5
−
W
Gv(max)
maximum total voltage gain
VP = 12 V; RL = 16 Ω
34.5
35.5
36.5
dB
ΔGv
voltage gain control range
75
80
−
dB
Iq(tot)
total quiescent current
VP = 12 V; RL = ∞
−
8
16
mA
THD
total harmonic distortion
Po = 0.5 W
−
0.3
1
%
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
DESCRIPTION
VERSION
TDA7056AT
SO20
plastic small outline package with 20 leads; body width 7.5 mm
SOT163-1
1998 Feb 23
2
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
BLOCK DIAGRAM
handbook, full pagewidth
positive input
DC volume control
VP
n.c.
1 to 3, 8 to 13,
16, 18 to 20
4
TDA7056AT
I + i
14
+
I − i
17
−
+
7
−
+
Vref
STABILIZER
TEMPERATURE
PROTECTION
6
15
MGM576
signal
ground
Fig.1 Block diagram.
1998 Feb 23
positive output
5
3
power
ground
negative output
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
PINNING
SYMBOL
PIN
DESCRIPTION
n.c.
1
not connected
n.c.
2
not connected
n.c.
3
not connected
VP
4
positive supply voltage
VI
5
positive input
GND1
6
VC
n.c.
n.c. 1
20 n.c.
n.c. 2
19 n.c.
signal ground
n.c. 3
18 n.c.
7
DC volume control
VP 4
17 OUT−
8
not connected
n.c.
9
not connected
n.c.
10
not connected
n.c.
11
not connected
n.c.
12
not connected
n.c.
13
not connected
OUT+
14
positive output
GND2
15
power ground
n.c.
16
not connected
OUT−
17
negative output
n.c.
18
not connected
n.c.
19
not connected
n.c.
20
not connected
1998 Feb 23
handbook, halfpage
VI 5
16 n.c.
TDA7056AT
GND1 6
15 GND2
VC 7
14 OUT+
n.c. 8
13 n.c.
n.c. 9
12 n.c.
n.c. 10
11 n.c.
MGM577
Fig.2 Pin configuration.
4
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
FUNCTIONAL DESCRIPTION
TDA7056AT
The maximum gain of the amplifier is fixed at 35.5 dB.
The DC volume control stage has a logarithmic control
characteristic.
The TDA7056AT is a mono BTL output amplifier with DC
volume control. It is designed for use in TVs and monitors
but is also suitable for battery-fed portable recorders and
radios.
The total gain can be controlled from +35.5 to −44 dB.
If the DC volume control voltage is below 0.3 V, the device
switches to the mute mode.
In conventional DC volume circuits the control or input
stage is AC-coupled to the output stage via external
capacitors to keep the offset voltage low. In the
TDA7056AT the DC volume control stage is integrated into
the input stage so that no coupling capacitors are required.
With this configuration, a low offset voltage is still
maintained and the minimum supply voltage remains low.
The amplifier is short-circuit proof to ground, VP and
across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, thereby reducing the
output power. Special attention is given to switch-on and
switch-off clicks, low HF radiation and a good overall
stability.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
Power dissipation
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
Assume VP = 12 V; RL = 16 Ω.
The maximum sine wave dissipation is 1.8 W.
Consequently, a reduced power supply with smaller
capacitors can be used which also results in cost
reductions. For portable applications there is a trend to
decrease the supply voltage, resulting in a reduction of
output power at conventional output stages. Using the BTL
principle increases the output power.
The Rth vj-a of the package is 60 K/W.
Therefore Tamb(max) = 150 − 60 × 1.8 = 42 °C.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
−
18
V
V5, 7
input voltage pins 5 and 7
−
5
V
IORM
repetitive peak output current
−
1.25
A
IOSM
non-repetitive peak output current
−
1.5
A
Ptot
total power dissipation
−
1.5
W
Tamb
operating ambient temperature
−40
+85
°C
Tstg
storage temperature
−55
+150
°C
Tvj
virtual junction temperature
−
150
°C
tsc
short-circuit time
−
1
h
Tcase < 60 °C
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
1998 Feb 23
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
5
in free air
VALUE
UNIT
60
K/W
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
CHARACTERISTICS
VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 Ω; Tamb = 25 °C; unless otherwise specified (see Fig.14).
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
supply voltage
Iq(tot)
total quiescent current
4.5
−
18
V
RL = ∞; note 1
−
8
16
mA
Maximum gain (V7 = 1.4 V)
Po
output power
THD = 10%; RL = 16 Ω
3
3.5
−
W
THD
total harmonic distortion
Po = 0.5 W
−
0.3
1
%
Gv(max)
maximum total voltage gain
34.5
35.5
36.5
dB
Vi(rms)
input signal handling (RMS value)
VVC = 0.8 V; THD < 1%
0.5
0.65
−
V
Vn(o)(rms)
noise output voltage (RMS value)
f = 500 kHz; note 2
−
210
−
μV
B
bandwidth
at −1 dB
−
0.02 to 300
−
kHz
SVRR
supply voltage ripple rejection
note 3
38
46
−
dB
⎪ΔVOS⎪
DC output offset voltage
⎪V17 − v14⎪
−
0
150
mV
Zi
input impedance (pin 3)
15
20
25
kΩ
−
−44
−
dB
note 4
−
20
30
μV
VVC ≤ 0.3 V;
VI = 600 mV; note 4
−
35
45
μV
75
80
−
dB
60
70
80
μA
Minimum gain (V7 = 0.5 V)
Gv
voltage gain
Vo(n)(rms)
noise output voltage (RMS value)
Mute position
Vo(mute)
output voltage in mute position
DC volume control
ΔGv
voltage gain control range
IVC
control current
VVC = 0 V
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (Vn(o)(rms)) at f = 500 kHz, is measured with Rs = 0 Ω and B = 5 kHz.
3. The ripple rejection is measured with Rs = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage (Vripple = 200 mV RMS)
is applied to the positive supply rail.
4. The noise output voltage (Vn(o)(rms)) is measured with Rs = 5 kΩ unweighted.
1998 Feb 23
6
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
MGM578
20
MGM579
12
THD
(%)
10
handbook, halfpage
handbook, halfpage
Iq
(mA)
16
8
12
6
8
4
4
2
(1)
0
0
4
8
12
16
0
10−1
20
VP (V)
V5 = 1.4 V; no load.
Fig.3
1
10
Po (W)
VDC = 1.4 V.
(1) VP = 12 V; RL = 16 Ω.
Quiescent current as a function of the
supply voltage.
Fig.4 THD as a function of output power.
MGM580
8
MGM581
100
handbook, halfpage
handbook, halfpage
RR
(dB)
THD
(%)
80
6
(1)
60
(2)
4
40
(3)
2
20
(1)
0
10
102
103
104
f (Hz)
0
10
105
103
104
f (Hz)
105
VP = 12 V; RL = 16 Ω; Vr = 200 mV.
(1) V7 = 0.3 V; Rs = 5 kΩ.
(2) V7 = 1.4 V; Rs = 0 Ω.
(3) V7 = 1.4 V; Rs = 5 kΩ.
VP = 12 V, Po = 0.5 W, VDC = 1.4 V.
(1) RL = 16 Ω.
Fig.5 THD as a function of frequency.
1998 Feb 23
102
Fig.6 Ripple rejection as a function of frequency.
7
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
MGM583
MGM582
1000
Vn
(μV)
handbook,40
halfpage
handbook, halfpage
gain
(dB)
20
800
0
600
−20
400
−40
200
−60
−80
0
0
0.4
0.8
1.2
1.6
2.0
0
0.4
1.2
0.8
2.0
1.6
V7 (V)
V7 (V)
Measured with Rs = 5 kΩ unweighted; f = 22 Hz to 22 kHz.
Fig.7
Gain control as a function of DC volume
control.
Fig.8
Noise output voltage as a function of DC
volume control.
MGM585
MGM584
5
1000
Vi
handbook, halfpage
handbook, halfpage
Po
(W)
(mV)
800
4
600
3
400
2
200
1
(1)
0
0
4
8
12
16
(2)
(3)
0
20
0
VP (V)
4
8
12
16
20
VP (V)
Measured at THD = 10%. The maximum output power is limited by
the maximum power dissipation and the maximum available output
current.
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
Tamb = 25 °C; THD = 1%; RL = 16 Ω; VDC = 0.8 V.
Fig.9
Input signal handling as a function of the
supply voltage.
1998 Feb 23
Fig.10 Output power as a function of the supply
voltage.
8
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
MGM587
MGM586
3
100
handbook, halfpage
handbook, halfpage
I5
(μA)
P
(W)
60
2
(1)
(2)
20
(3)
−20
1
−60
−100
0
0
4
8
12
16
20
VP (V)
0
0.4
0.8
1.2
2.0
1.6
V7 (V)
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) RL = 25 Ω.
Fig.11 Total worst case power dissipation as a
function of supply voltage.
1998 Feb 23
Fig.12 Control current as a function of DC volume
control.
9
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
handbook, full pagewidth
a. Top view of bottom copper.
+VP
GND
220 μF
100 nF
−OUT
20
0.47 μF
IN
1
5 kΩ
TDA7056A/BT
100
nF
+OUT
D&A AUDIO POWER
CIC NIJMEGEN
volume
MGM591
b. Top view of component side.
Fig.13 Printed-circuit board layout.
1998 Feb 23
10
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
TEST AND APPLICATION INFORMATION
Thermal behaviour:
Test conditions
The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductors manufacturers because the
application boards and test methods are not (yet)
standardized. The thermal performance of packages for a
specific application may also be different than presented
here, because the configuration of the application boards
(copper area) may be different. NXP Semiconductors uses
FR-4 type application boards with 1 oz copper traces with
solder coating. The measurements have been carried out
with vertical placed boards.
Tamb = 25 °C if not specified: VP = 12 V; VDC = 1.4 V;
f = 1 kHz; RL = 16 Ω; audio bandpass: 22 Hz to 22 kHz.
In Figures 5 and 6 a low-pass filter of 80 kHz was applied.
It should be noted that capacitive loads (100 pF and 5 nF)
connected between the output pins to a common ground
can cause oscillations. The BTL application circuit diagram
is shown in Fig.14. To avoid instabilities and too high
distortion, the input and power ground traces must be
separated as far as possible and connected together as
close as possible to the IC. The quiescent current has
been measured without load impedance.
The maximum closed-loop voltage gain has been
internally fixed at 35.5 dB. The input sensitivity at
maximum gain for Po = 3 W (RL = 16 Ω) is 115 mV.
The gain bandwidth is 20 Hz to 300 kHz within 1 dB.
Using a practical PCB layout with wider copper tracks and
some copper area to the IC pins and just under the IC, the
thermal resistance from junction to ambient can be
reduced. In the demonstration application PCB the
Rth(j-a) = 56 K/W for the SO20 plastic package. For a
maximum ambient temperature of Tamb = 50 °C the
following calculation can be made for the maximum power
Output power
( 150 K/W – 50 K/W )
dissipation: ----------------------------------------------------- = 1.79 W
56 K/W
The output power as a function of supply voltage has been
measured at THD = 10%. The maximum output power is
limited by the maximum allowed power dissipation at
Tamb = 25 °C approximately 2 W, and the maximum
available output current is 1.25 A repetitive peak current.
For the application at VP = 12 V and RL = 16 Ω the worst
case sine wave dissipation is 1.85 W. Because in practice
the ‘music-power’ causes about the half of the sine wave
dissipation, this application (VP = 12 V; RL = 16 Ω) has
been allowed.
Voltage gain
Switch-on/switch-off
Short-circuit protection:
The switch-on behaviour depends on the following:
The output pins (pins 14 and 17) can be short-circuited to
ground respectively to +VP. The Missing Current Limiter
(MCL) protection circuit will shut-off the amplifier.
Removing the short-circuit will reset the amplifier
automatically. Short-circuit across the load
(pins 14 and 17) will activate the thermal protection circuit;
this will result in reducing the short-circuit current.
• The rise time of the power supply (if tr > 40 ms for
VP = 0 to 12 V then the switch-on behaviour will be
good)
• The input capacitor and source impedance (a higher
source impedance and/or lower input capacitor value
will have a positive influence on the switch-on/switch-off
behaviour)
• The DC volume control pin (a capacitor of >0.1 μF
avoids disturbances).
1998 Feb 23
11
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
VP
handbook, full pagewidth
(1)
220 μF
100 nF
n.c.
0.47 μF
positive input
1 to 3, 8 to 13,
16, 18 to 20
4
TDA7056AT
I + i
14
+
5
+
7
RL = 16 Ω
−
I − i
17
−
+
Rs
5
kΩ
Vref
STABILIZER
TEMPERATURE
PROTECTION
DC
volume
control
6
15
MGM588
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220 μF electrolytic capacitor is connected close to pin 2.
Fig.14 Test and application diagram.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MLC) will be activated.
1998 Feb 23
12
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
VP = 12 V
handbook, halfpage
handbook, halfpage
82 kΩ
volume
control
7
TDA7056AT
7
1 μF
1 μF
100 kΩ
22 kΩ
GND
GND
MGM589
volume
control
Fig.15 Application with potentiometer as volume
control; maximum gain = 30 dB.
1998 Feb 23
TDA7056AT
MGM590
Fig.16 Application with potentiometer as volume
control; maximum gain = 36 dB.
13
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
PACKAGE OUTLINE
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
20
11
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
10
1
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013
1998 Feb 23
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
14
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
SOLDERING
Wave soldering
Introduction
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1998 Feb 23
15
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
TDA7056AT
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
1998 Feb 23
16
NXP Semiconductors
Product specification
3 W mono BTL audio amplifier with DC
volume control
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
1998 Feb 23
TDA7056AT
17
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/25/01/pp18
Date of release: 1998 Feb 23
Document order number:
9397 750 03253
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