MX25L12845G, 3V, 128Mb, v1.1

MX25L12845G
MX25L12845G
3V, 128M-BIT [x 1/x 2/x 4]
CMOS MXSMIO® (SERIAL MULTI I/O)
FLASH MEMORY
MX25L12845G
Contents
1. FEATURES............................................................................................................................................................... 4
2. GENERAL DESCRIPTION...................................................................................................................................... 6
Table 1. Read performance Comparison.....................................................................................................6
3. PIN CONFIGURATIONS .......................................................................................................................................... 7
4. PIN DESCRIPTION................................................................................................................................................... 7
5. BLOCK DIAGRAM.................................................................................................................................................... 8
6. DATA PROTECTION................................................................................................................................................. 9
Table 2. Protected Area Sizes....................................................................................................................10
Table 3. 4K-bit Secured OTP Definition..................................................................................................... 11
7. Memory Organization............................................................................................................................................ 12
Table 4. Memory Organization...................................................................................................................12
8. DEVICE OPERATION............................................................................................................................................. 13
8-1. Quad Peripheral Interface (QPI) Read Mode........................................................................................... 15
9. COMMAND DESCRIPTION.................................................................................................................................... 16
9-1.
9-2.
9-3.
9-4.
9-5.
9-6.
9-7.
9-8.
9-9.
9-10.
9-11.
9-12.
9-13.
9-14.
9-15.
9-16.
9-17.
9-18.
9-19.
9-20.
9-21.
9-22.
9-23.
9-24.
P/N: PM2145
Table 5. Command Set...............................................................................................................................16
Write Enable (WREN)............................................................................................................................... 20
Write Disable (WRDI)................................................................................................................................ 21
Factory Mode Enable (FMEN).................................................................................................................. 22
Read Identification (RDID)........................................................................................................................ 23
Release from Deep Power-down (RDP), Read Electronic Signature (RES)............................................ 24
Read Electronic Manufacturer ID & Device ID (REMS)............................................................................ 26
QPI ID Read (QPIID)................................................................................................................................ 27
Table 6. ID Definitions ...............................................................................................................................27
Read Status Register (RDSR).................................................................................................................. 28
Read Configuration Register (RDCR)....................................................................................................... 29
Table 7. Configuration Register..................................................................................................................33
Write Status Register (WRSR).................................................................................................................. 35
Table 8. Protection Modes..........................................................................................................................36
Read Data Bytes (READ)......................................................................................................................... 39
Read Data Bytes at Higher Speed (FAST_READ)................................................................................... 40
Dual Output Read Mode (DREAD)........................................................................................................... 42
2 x I/O Read Mode (2READ).................................................................................................................... 43
Quad Read Mode (QREAD)..................................................................................................................... 44
4 x I/O Read Mode (4READ).................................................................................................................... 45
4 x I/O Double Transfer Rate Read Mode (4DTRD)................................................................................. 47
Preamble Bit ............................................................................................................................................ 49
Burst Read................................................................................................................................................ 53
Performance Enhance Mode.................................................................................................................... 54
Performance Enhance Mode Reset.......................................................................................................... 57
Sector Erase (SE)..................................................................................................................................... 58
Block Erase (BE32K)................................................................................................................................ 59
Block Erase (BE)...................................................................................................................................... 60
2
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-25.
9-26.
9-27.
9-28.
9-29.
9-30.
9-31.
9-32.
Chip Erase (CE)........................................................................................................................................ 61
Page Program (PP).................................................................................................................................. 62
4 x I/O Page Program (4PP)..................................................................................................................... 64
Deep Power-down (DP)............................................................................................................................ 65
Enter Secured OTP (ENSO)..................................................................................................................... 66
Exit Secured OTP (EXSO)........................................................................................................................ 66
Read Security Register (RDSCUR).......................................................................................................... 66
Write Security Register (WRSCUR).......................................................................................................... 66
Table 9. Security Register Definition..........................................................................................................67
9-33. Write Protection Selection (WPSEL)......................................................................................................... 68
9-34. Advanced Sector Protection..................................................................................................................... 70
9-35. Program/Erase Suspend/Resume............................................................................................................ 76
9-36. Erase Suspend......................................................................................................................................... 76
9-37. Program Suspend..................................................................................................................................... 76
9-38.Write-Resume........................................................................................................................................... 78
9-39. No Operation (NOP)................................................................................................................................. 78
9-40. Software Reset (Reset-Enable (RSTEN) and Reset (RST)).................................................................... 78
9-41. Read SFDP Mode (RDSFDP)................................................................................................................... 80
Table 10. Signature and Parameter Identification Data Values .................................................................81
Table 11. Parameter Table (0): JEDEC Flash Parameter Tables...............................................................83
Table 12. Parameter Table (1): 4-Byte Instruction Tables..........................................................................90
Table 13. Parameter Table (2): Macronix Flash Parameter Tables............................................................92
10. RESET.................................................................................................................................................................. 94
Table 14. Reset Timing-(Power On)...........................................................................................................94
Table 15. Reset Timing-(Other Operation).................................................................................................94
11. POWER-ON STATE.............................................................................................................................................. 95
12. ELECTRICAL SPECIFICATIONS......................................................................................................................... 96
Table 16. ABSOLUTE MAXIMUM RATINGS.............................................................................................96
Table 17. CAPACITANCE TA = 25°C, f = 1.0 MHz.....................................................................................96
Table 18. DC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V - 3.6V) .........................98
Table 19. AC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V - 3.6V) ........................99
13. OPERATING CONDITIONS................................................................................................................................ 101
Table 20. Power-Up/Down Voltage and Timing .......................................................................................103
13-1. INITIAL DELIVERY STATE..................................................................................................................... 103
14. ERASE AND PROGRAMMING PERFORMANCE............................................................................................. 104
15. ERASE AND PROGRAMMING PERFORMANCE (Factory Mode) ................................................................. 104
16. DATA RETENTION............................................................................................................................................. 105
17. LATCH-UP CHARACTERISTICS....................................................................................................................... 105
18. ORDERING INFORMATION............................................................................................................................... 106
19. PART NAME DESCRIPTION.............................................................................................................................. 107
20. PACKAGE INFORMATION................................................................................................................................. 108
20-1. 16-PIN SOP (300mil).............................................................................................................................. 108
20-2. 8-pins SOP (200mil)................................................................................................................................ 109
20-3. 8-land WSON (6x5mm)...........................................................................................................................110
21. REVISION HISTORY .......................................................................................................................................... 111
P/N: PM2145
3
REV. 1.1, FEB. 18, 2016
MX25L12845G
3V 128M-BIT [x 1/x 2/x 4] CMOS MXSMIO® (SERIAL MULTI I/O)
FLASH MEMORY
1. FEATURES
GENERAL
• Supports Serial Peripheral Interface -- Mode 0 and Mode 3
• Single Power Supply Operation
- 2.7 to 3.6 volt for read, erase, and program operations
• 128Mb: 134,217,728 x 1 bit structure or 67,108,864 x 2 bits (two I/O mode) structure or 33,554,432 x 4 bits (four
I/O mode) structure
• Protocol Support
- Single I/O, Dual I/O and Quad I/O
• Latch-up protected to 100mA from -1V to Vcc +1V
• Low Vcc write inhibit is from 1.5V to 2.5V
• Fast read for SPI mode
- Support clock frequency up to 133MHz for all protocols
- Support Fast Read, 2READ, DREAD, 4READ, QREAD instructions
- Support DTR (Double Transfer Rate) Mode
- Configurable dummy cycle number for fast read operation
• Quad Peripheral Interface (QPI) available
• Equal Sectors with 4K byte each, or Equal Blocks with 32K byte each or Equal Blocks with 64K byte each
- Any Block can be erased individually
• Programming:
- 256byte page buffer
- Quad Input/Output page program(4PP) to enhance program performance
• Typical 100,000 erase/program cycles
• 20 years data retention
SOFTWARE FEATURES
• Input Data Format
- 1-byte Command code
• Advanced Security Features
- Block lock protection
The BP0-BP3 and T/B status bits define the size of the area to be protected against program and erase
instructions
- Individual sector protection function (Solid Protect)
• Additional 4K bit security OTP
- Features unique identifier
- Factory locked identifiable, and customer lockable
• Command Reset
• Program/Erase Suspend and Resume operation
• Electronic Identification
- JEDEC 1-byte manufacturer ID and 2-byte device ID
- RES command for 1-byte Device ID
- REMS command for 1-byte manufacturer ID and 1-byte device ID
• Support Serial Flash Discoverable Parameters (SFDP) mode
P/N: PM2145
4
REV. 1.1, FEB. 18, 2016
MX25L12845G
HARDWARE FEATURES
• SCLK Input
- Serial clock input
• SI/SIO0
- Serial Data Input or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode
• SO/SIO1
- Serial Data Output or Serial Data Input/Output for 2 x I/O read mode and 4 x I/O read mode
• WP#/SIO2
- Hardware write protection or serial data Input/Output for 4 x I/O read mode
• RESET#/SIO3
- Hardware Reset pin or Serial input & Output for 4 x I/O read mode
• PACKAGE
- 16-pin SOP (300mil)
- 8-pins SOP (200mil)
- 8-land WSON (6x5mm)
- All devices are RoHS Compliant and Halogen-free
P/N: PM2145
5
REV. 1.1, FEB. 18, 2016
MX25L12845G
2. GENERAL DESCRIPTION
MX25L12845G is 128Mb bits Serial Flash memory, which is configured as 16,777,216 x 8 internally. When it is in
two or four I/O mode, the structure becomes 67,108,864 bits x 2 or 33,554,432 bits x 4. MX25L12845G feature a
serial peripheral interface and software protocol allowing operation on a simple 3-wire bus while it is in single I/O
mode. The three bus signals are a clock input (SCLK), a serial data input (SI), and a serial data output (SO). Serial
access to the device is enabled by CS# input.
When it is in two I/O read mode, the SI pin and SO pin become SIO0 pin and SIO1 pin for address/dummy bits
input and data output. When it is in four I/O read mode, the SI pin, SO pin, WP# and RESET# pin become SIO0
pin, SIO1 pin, SIO2 pin and SIO3 pin for address/dummy bits input and data output.
The MX25L12845G MXSMIO® (Serial Multi I/O) provides sequential read operation on the whole chip.
After program/erase command is issued, auto program/erase algorithms which program/erase and verify the
specified page or sector/block locations will be executed. Program command is executed on byte basis, or page (256
bytes) basis, or word basis. Erase command is executed on 4K-byte sector, 32K-byte block, or 64K-byte block, or
whole chip basis.
To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read
command can be issued to detect completion status of a program or erase operation via WIP bit.
Advanced security features enhance the protection and security functions, please see security features section for
more details.
When the device is not in operation and CS# is high, it is put in standby mode.
The MX25L12845G utilizes Macronix's proprietary memory cell, which reliably stores memory contents even after
100,000 program and erase cycles.
Table 1. Read performance Comparison
Numbers
of Dummy
Cycles
Fast Read
(MHz)
Dual Output
Fast Read
(MHz)
Quad Output
Fast Read
(MHz)
Dual IO
Fast Read
(MHz)
Quad IO
Fast Read
(MHz)
Quad I/O DT
Read
4
-
-
-
80*
54
-
6
-
-
-
-
80*
54*
8
120*/133R
120*/133R
120*/133R
120/133R
84/104R
70/80R
10
-
-
-
-
120/133R
84/100R
(MHz)
Notes:
1. * mean default status.
2. R mean VCC range = 3.0V-3.6V.
P/N: PM2145
6
REV. 1.1, FEB. 18, 2016
MX25L12845G
4. PIN DESCRIPTION
3. PIN CONFIGURATIONS
8-PIN SOP (200mil)
CS#
SO/SIO1
WP#/SIO2
GND
1
2
3
4
SYMBOL
CS#
DESCRIPTION
Chip Select
Serial Data Input (for 1 x I/O)/ Serial
SI/SIO0
Data Input & Output (for 2xI/O or 4xI/
O read mode)
Serial Data Output (for 1 x I/O)/ Serial
SO/SIO1
Data Input & Output (for 2xI/O or 4xI/
O read mode)
SCLK
Clock Input
Write Protection Active Low or Serial
WP#/SIO2 Data Input & Output (for 4xI/O read
mode)
Hardware Reset Pin Active low or
RESET#/SIO3 Serial Data Input & Output (for 4xI/O
read mode)
NC or Serial Data Input &
NC/SIO3
Output (for 4xI/O read mode)
RESET#* Hardware Reset Pin Active low
VCC
+ 3V Power Supply
GND
Ground
NC
No Connection
VCC
RESET#/SIO3
SCLK
SI/SIO0
8
7
6
5
16-PIN SOP (300mil)
NC/SIO3
VCC
RESET#
NC
NC
NC
CS#
SO/SIO1
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SCLK
SI/SIO0
NC
NC
NC
NC
GND
WP#/SIO2
Notes:
1. RESET# pin has internal pull up.
8-WSON (6x5mm)
CS#
SO/SIO1
WP#/SIO2
GND
P/N: PM2145
1
2
3
4
8
7
6
5
VCC
RESET#/SIO3
SCLK
SI/SIO0
7
REV. 1.1, FEB. 18, 2016
MX25L12845G
5. BLOCK DIAGRAM
X-Decoder
Address
Generator
SI/SIO0
SO/SIO1
SIO2 *
SIO3 *
Y-Decoder
Data
Register
WP# *
HOLD# *
RESET# *
CS#
SCLK
Memory Array
Sense
Amplifier
SRAM
Buffer
Mode
Logic
State
Machine
HV
Generator
Clock Generator
Output
Buffer
* Depends on part number options.
P/N: PM2145
8
REV. 1.1, FEB. 18, 2016
MX25L12845G
6. DATA PROTECTION
During power transition, there may be some false system level signals which result in inadvertent erasure or
programming. The device is designed to protect itself from these accidental write cycles.
The state machine will be reset as standby mode automatically during power up. In addition, the control register
architecture of the device constrains that the memory contents can only be changed after specific command
sequences have completed successfully.
In the following, there are several features to protect the system from the accidental write cycles during VCC powerup and power-down or from system noise.
• Valid command length checking: The command length will be checked whether it is at byte base and completed
on byte boundary.
• Write Enable (WREN) command: WREN command is required to set the Write Enable Latch bit (WEL) before
other command to change data.
• Deep Power Down Mode: By entering deep power down mode, the flash device also is under protected from
writing all commands except Release from deep power down mode command (RDP) and Read Electronic
Signature command (RES), and softreset command.
• Advanced Security Features: there are some protection and security features which protect content from
inadvertent write and hostile access.
P/N: PM2145
9
REV. 1.1, FEB. 18, 2016
MX25L12845G
I. Block lock protection
- The Software Protected Mode (SPM) use (BP3, BP2, BP1, BP0 and T/B) bits to allow part of memory to
be protected as read only. The protected area definition is shown as "Table 2. Protected Area Sizes", the
protected areas are more flexible which may protect various area by setting value of BP0-BP3 bits.
- The Hardware Proteced Mode (HPM) use WP#/SIO2 to protect the (BP3, BP2, BP1, BP0) bits and Status
Register Write Protect bit.
- In four I/O and QPI mode, the feature of HPM will be disabled.
Table 2. Protected Area Sizes
Protected Area Sizes (T/B bit = 0)
Status bit
BP3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
BP2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
BP1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
Protect Level
BP0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
128Mb
0 (none)
1 (1 block, protected block 255th)
2 (2 blocks, block 254th-255th)
3 (4 blocks, block 252nd-255th)
4 (8 blocks, block 248th-255th)
5 (16 blocks, block 240th-255th)
6 (32 blocks, block 224th-255th)
7 (64 blocks, block 192nd-255th)
8 (128 blocks, block 128th-255th)
9 (256 blocks, protected all)
10 (256 blocks, protected all)
11 (256 blocks, protected all)
12 (256 blocks, protected all)
13 (256 blocks, protected all)
14 (256 blocks, protected all)
15 (256 blocks, protected all)
Protected Area Sizes (T/B bit = 1)
Status bit
BP3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
P/N: PM2145
BP2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
BP1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
BP0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Protect Level
128Mb
0 (none)
1 (1 block, protected block 0th)
2 (2 blocks, protected block 0th~1th)
3 (4 blocks, protected block 0th~3rd)
4 (8 blocks, protected block 0th~7th)
5 (16 blocks, protected block 0th~15th)
6 (32 blocks, protected block 0th~31st)
7 (64 blocks, protected block 0th~63rd)
8 (128 blocks, protected block 0th~127th)
9 (256 blocks, protected all)
10 (256 blocks, protected all)
11 (256 blocks, protected all)
12 (256 blocks, protected all)
13 (256 blocks, protected all)
14 (256 blocks, protected all)
15 (256 blocks, protected all)
10
REV. 1.1, FEB. 18, 2016
MX25L12845G
II. Additional 4K-bit secured OTP for unique identifier: to provide 4K-bit one-time program area for setting
device unique serial number - Which may be set by factory or system customer.
- Security register bit 0 indicates whether the chip is locked by factory or not.
- To program the 4K-bit secured OTP by entering 4K-bit secured OTP mode (with Enter Security OTP command),
and going through normal program procedure, and then exiting 4K-bit secured OTP mode by writing Exit
Security OTP command.
- Customer may lock-down the customer lockable secured OTP by writing WRSCUR(write security register)
command to set customer lock-down bit1 as "1". Please refer to "Table 9. Security Register Definition" for
security register bit definition and "Table 3. 4K-bit Secured OTP Definition" for address range definition.
- Note: Once lock-down whatever by factory or customer, it cannot be changed any more. While in 4K-bit secured
OTP mode, array access is not allowed.
Table 3. 4K-bit Secured OTP Definition
Address range
Size
Standard Factory Lock
xxx000~xxx00F
128-bit
ESN (electrical serial number)
xxx010~xxx1FF
3968-bit
N/A
P/N: PM2145
11
Customer Lock
Determined by customer
REV. 1.1, FEB. 18, 2016
MX25L12845G
7. Memory Organization
Table 4. Memory Organization
Block(64K-byte) Block(32K-byte)
Sector
254
508
individual block
lock/unlock unit:64K-byte
507
253
506
FF8FFFh
4087
FF7000h
FF7FFFh
…
individual 16 sectors
lock/unlock unit:4K-byte
4080
FF0000h
FF0FFFh
4079
FEF000h
FEFFFFh
…
509
FF8000h
4072
FE8000h
FE8FFFh
4071
FE7000h
FE7FFFh
…
510
4088
4064
FE0000h
FE0FFFh
4063
FDF000h
FDFFFFh
…
255
FFFFFFh
4056
FD8000h
FD8FFFh
4055
FD7000h
FD7FFFh
4048
FD0000h
FD0FFFh
47
02F000h
02FFFFh
…
511
Address Range
FFF000h
…
4095
3
1
2
1
028FFFh
027000h
027FFFh
…
028000h
39
32
020000h
020FFFh
31
01F000h
01FFFFh
…
4
individual block
lock/unlock unit:64K-byte
40
24
018000h
018FFFh
23
017000h
017FFFh
16
010000h
010FFFh
15
00F000h
00FFFFh
…
2
…
5
…
individual block
lock/unlock unit:64K-byte
0
8
008000h
008FFFh
7
007000h
007FFFh
000000h
000FFFh
0
P/N: PM2145
individual 16 sectors
lock/unlock unit:4K-byte
…
0
12
REV. 1.1, FEB. 18, 2016
MX25L12845G
8. DEVICE OPERATION
1. Before a command is issued, status register should be checked to ensure device is ready for the intended
operation.
2. When incorrect command is inputted to this device, it enters standby mode and remains in standby mode until
next CS# falling edge. In standby mode, SO pin of this device should be High-Z.
3. When correct command is inputted to this device, it enters active mode and remains in active mode until next
CS# rising edge.
4. Input data is latched on the rising edge of Serial Clock (SCLK) and data is shifted out on the falling edge of
SCLK. The difference of Serial mode 0 and mode 3 is shown as "Figure 1. Serial Modes Supported".
5. For the following instructions: RDID, RDSR, RDSCUR, READ, FAST_READ, 2READ, DREAD, 4READ,
QREAD, RDSFDP, RES, REMS, QPIID, RDDPB, RDSPB, RDLR, RDCR, the shifted-in instruction sequence is
followed by a data-out sequence. After any bit of data being shifted out, the CS# can be high. For the following
instructions: WREN, WRDI, WRSR, SE, BE32K, BE, CE, PP, 4PP, DP, ENSO, EXSO, WRSCUR, WPSEL,
GBLK, GBULK, SUSPEND, RESUME, NOP, RSTEN, RST, EQIO, RSTQIO the CS# must go high exactly at the
byte boundary; otherwise, the instruction will be rejected and not executed.
6.While a Write Status Register, Program or Erase operation is in progress, access to the memory array is
neglected and will not affect the current operation of Write Status Register, Program, Erase.
Figure 1. Serial Modes Supported
CPOL
CPHA
shift in
(Serial mode 0)
0
0
SCLK
(Serial mode 3)
1
1
SCLK
SI
shift out
MSB
SO
MSB
Note:
CPOL indicates clock polarity of Serial master, CPOL=1 for SCLK high while idle, CPOL=0 for SCLK low while not
transmitting. CPHA indicates clock phase. The combination of CPOL bit and CPHA bit decides which Serial mode is
supported.
P/N: PM2145
13
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 2. Serial Input Timing
tSHSL
CS#
tCHSL
tSLCH
tCHSH
tSHCH
SCLK
tDVCH
tCHCL
tCHDX
tCLCH
LSB
MSB
SI
High-Z
SO
Figure 3. Output Timing (STR mode)
CS#
tCH
SCLK
tCLQV
tCLQX
tCL
tCLQV
tSHQZ
tCLQX
LSB
SO
SI
ADDR.LSB IN
Figure 4. Output Timing (DTR mode)
CS#
tCH
SCLK
tCLQV
tCLQV
tCLQX
tCL
tSHQZ
tCLQX
SIO0
SIO1
SIO2
SIO3
tQVD
P/N: PM2145
14
REV. 1.1, FEB. 18, 2016
MX25L12845G
8-1. Quad Peripheral Interface (QPI) Read Mode
QPI protocol enables user to take full advantage of Quad I/O Serial Flash by providing the Quad I/O interface in
command cycles, address cycles and as well as data output cycles.
Enable QPI mode
By issuing EQIO(35h) command, the QPI mode is enabled. After QPI mode is enabled, the device enters quad
mode (4-4-4) without QE bit status changed.
Figure 5. Enable QPI Sequence
CS#
MODE 3
SCLK
0
1
2
3
4
5
6
7
MODE 0
SIO0
35h
SIO[3:1]
Reset QPI (RSTQIO)
To reset the QPI mode, the RSTQIO (F5h) command is required. After the RSTQIO command is issued, the device
returns from QPI mode (4 I/O interface in command cycles) to SPI mode (1 I/O interface in command cycles).
Note:
For EQIO and RSTQIO commands, CS# high width has to follow "write spec" tSHSL (as defined by "Table 19. AC
CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V - 3.6V)") for next instruction.
Figure 6. Reset QPI Mode
CS#
SCLK
SIO[3:0]
P/N: PM2145
F5h
15
REV. 1.1, FEB. 18, 2016
MX25L12845G
9. COMMAND DESCRIPTION
Table 5. Command Set
Read/Write Array Commands
Command
(byte)
Mode
READ
FAST READ
(normal read) (fast read data)
2READ
(2 x I/O read
command)
DREAD
(1I 2O read)
4READ
QREAD
(1I 4O read)
4DTRD (Quad
I/O DT Read)
1st byte
SPI
3
03 (hex)
SPI
3
0B (hex)
SPI
3
BB (hex)
SPI
3
3B (hex)
SPI/QPI
3
EB (hex)
SPI
3
6B (hex)
SPI/QPI
3
ED (hex)
2nd byte
ADD1
ADD1
ADD1
ADD1
ADD1
ADD1
ADD1
3rd byte
ADD2
ADD2
ADD2
ADD2
ADD2
ADD2
ADD2
4th byte
ADD3
ADD3
ADD3
ADD3
ADD3
ADD3
ADD3
Dummy*
Dummy*
Dummy*
Dummy*
Dummy*
Dummy*
Address Bytes
5th byte
Data Cycles
Action
n bytes read
out until CS#
goes high
Command
(byte)
PP
(page program)
Mode
SPI/QPI
n bytes read
n bytes read
n bytes read Quad I/O read n bytes read
n bytes read
out until CS# out by 2 x I/O
out by Dual
for bottom
out by Quad
out (Double
goes high
until CS# goes output until
128Mb with 6
output until Transfer Rate)
high
CS# goes high dummy cycles CS# goes high by 4xI/O until
CS# goes high
4PP
(quad page
program)
SPI
SE
(sector erase)
SPI/QPI
BE 32K
(block erase
32KB)
SPI/QPI
BE
(block erase
64KB)
SPI/QPI
CE
(chip erase)
SPI/QPI
Address Bytes
3
3
3
3
3
0
1st byte
02 (hex)
38 (hex)
20 (hex)
52 (hex)
D8 (hex)
60 or C7 (hex)
2nd byte
ADD1
ADD1
ADD1
ADD1
3rd byte
ADD2
ADD2
ADD2
ADD2
4th byte
ADD3
ADD3
ADD3
ADD3
5th byte
Data Cycles
Action
1-256
1-256
to program the quad input to
to erase the
to erase the
selected page program the selected sector selected 32K
selected page
block
to erase the to erase whole
selected block
chip
* Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in configuration register.
P/N: PM2145
16
REV. 1.1, FEB. 18, 2016
MX25L12845G
Register/Setting Commands
Mode
SPI/QPI
SPI/QPI
SPI/QPI
SPI/QPI
RDCR
(read
configuration
register)
SPI/QPI
1st byte
06 (hex)
04 (hex)
41 (hex)
05 (hex)
15 (hex)
Command
(byte)
FMEN
WREN
WRDI
(factory mode
(write enable) (write disable)
enable)
RDSR
(read status
register)
WRSR
(write status/
configuration
register)
SPI/QPI
01 (hex)
2nd byte
Values
3rd byte
Values
WPSEL
(Write Protect
Selection)
SPI/QPI
68 (hex)
4th byte
5th byte
Data Cycles
Action
sets the (WEL)
resets the
enable factory to read out the to read out the
write enable
(WEL) write
mode
values of the values of the
latch bit
enable latch bit
status register configuration
register
Command
(byte)
EQIO
(Enable QPI)
RSTQIO
(Reset QPI)
Mode
1st byte
SPI
35 (hex)
QPI
F5 (hex)
Entering the
QPI mode
Exiting the QPI
mode
PGM/ERS
Suspend
(Suspends
Program/
Erase)
SPI/QPI
B0 (hex)
PGM/ERS
Resume
(Resumes
Program/
Erase)
SPI/QPI
30 (hex)
1-2
to write new
to enter and
values of the enable individal
block protect
status/
mode
configuration
register
DP (Deep
power down)
RDP (Release
from deep
power down)
SBL
(Set Burst
Length)
SPI/QPI
B9 (hex)
SPI/QPI
AB (hex)
SPI/QPI
C0 (hex)
enters deep
power down
mode
release from
deep power
down mode
to set Burst
length
2nd byte
3rd byte
4th byte
5th byte
Data Cycles
Action
P/N: PM2145
17
REV. 1.1, FEB. 18, 2016
MX25L12845G
ID/Security Commands
REMS
RDID
RES
(read electronic
QPIID
(read identific(read
manufacturer (QPI ID Read)
ation)
electronic ID)
& device ID)
Mode
SPI
SPI/QPI
SPI
QPI
Address Bytes
0
0
0
0
1st byte
9F (hex)
AB (hex)
90 (hex)
AF (hex)
Command
(byte)
2nd byte
x
3rd byte
x
4th byte
RDSFDP
ENSO
(enter secured
OTP)
EXSO
(exit secured
OTP)
SPI/QPI
3
5A (hex)
SPI/QPI
0
B1 (hex)
SPI/QPI
0
C1 (hex)
x
ADD1
x
ADD2
ADD1(Note 1)
ADD3
Dummy (8)(Note 5)
5th byte
Data Cycles
Action
RDSCUR
WRSCUR
(read security (write security
register)
register)
Mode
SPI/QPI
SPI/QPI
Address Bytes
0
0
Command
(byte)
1st byte
ID in QPI
interface
outputs JEDEC to read out
output the
ID: 1-byte
1-byte Device Manufacturer
Manufacturer
ID
ID & Device
ID & 2-byte
ID(Note 2)
Device ID
2B (hex)
2F (hex)
2nd byte
Read SFDP
mode
to enter the
to exit the
4K-bit secured 4K-bit secured
OTP mode
OTP mode
WRSPB
(SPB bit
program)
SPI
4
ESSPB
(all SPB bit
erase)
SPI
0
RDSPB
(read SPB
status)
SPI
4
WRDPB
(write DPB
register)
SPI
4
RDDPB
(read DPB
register)
SPI
4
E3 (hex)
E4 (hex)
E2 (hex)
E1 (hex)
E0 (hex)
ADD1
ADD1
ADD1
ADD1
3rd byte
ADD2
ADD2
ADD2
ADD2
4th byte
ADD3
ADD3
ADD3
ADD3
5th byte
ADD4
ADD4
ADD4
ADD4
1
1
1
Data Cycles
Action
to read value to set the lockof security
down bit as
register
"1" (once lockdown, cannot
be updated)
Mode
Address Bytes
GBLK
(gang block
lock)
SPI/QPI
0
GBULK
(gang block
unlock)
SPI/QPI
0
WRLR
(write lock
register)
SPI
0
RDLR
(read lock
register)
SPI
0
1st byte
7E (hex)
98 (hex)
2C (hex)
2D (hex)
2
2
whole chip
write protect
whole chip
unprotect
Command
(byte)
2nd byte
3rd byte
4th byte
5th byte
Data Cycles
Action
P/N: PM2145
18
REV. 1.1, FEB. 18, 2016
MX25L12845G
Reset Commands
Command
(byte)
NOP
RSTEN
(No Operation) (Reset Enable)
RST
(Reset Memory)
Mode
SPI/QPI
SPI/QPI
SPI/QPI
1st byte
00 (hex)
66 (hex)(Note 4)
99 (hex)
2nd byte
3rd byte
4th byte
5th byte
Action
Note 1: The count base is 4-bit for ADD(2) and Dummy(2) because of 2 x I/O. And the MSB is on SO/SIO1 which is different from 1 x I/O condition.
Note 2: ADD=00H will output the manufacturer ID first and ADD=01H will output device ID first.
Note 3: It is not recommended to adopt any other code not in the command definition table, which will potentially enter
the hidden mode.
Note 4: The RSTEN command must be executed before executing the RST command. If any other command is issued
in-between RSTEN and RST, the RST command will be ignored.
Note 5: The number in parentheses after "Dummy" stands for how many clock cycles it has.
P/N: PM2145
19
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-1. Write Enable (WREN)
The Write Enable (WREN) instruction is for setting Write Enable Latch (WEL) bit. For those instructions like PP, 4PP,
SE, BE32K, BE, CE, and WRSR, which are intended to change the device content WEL bit should be set every time
after the WREN instruction setting the WEL bit.
The sequence of issuing WREN instruction is: CS# goes low→sending WREN instruction code→ CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care in
SPI mode.
Figure 7. Write Enable (WREN) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
Command
SI
06h
High-Z
SO
Figure 8. Write Enable (WREN) Sequence (QPI Mode)
CS#
0
Mode 3
1
SCLK
Mode 0
Command
06h
SIO[3:0]
P/N: PM2145
20
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-2. Write Disable (WRDI)
The Write Disable (WRDI) instruction is to reset Write Enable Latch (WEL) bit.
The sequence of issuing WRDI instruction is: CS# goes low→sending WRDI instruction code→CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care in
SPI mode.
The WEL bit is reset by following situations:
- Power-up
- Reset# pin driven low
- WRDI command completion
- WRSR command completion
- PP command completion
- 4PP command completion
- SE command completion
- BE32K command completion
- BE command completion
- CE command completion
- PGM/ERS Suspend command completion
- Softreset command completion
- WRSCUR command completion
- WPSEL command completion
- GBLK command completion
- GBULK command completion
- WRLR command completion
- WRSPB command completion
- WRDPB command completion
- ESSPB command completion
Figure 9. Write Disable (WRDI) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
SI
SO
P/N: PM2145
Command
04h
High-Z
21
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 10. Write Disable (WRDI) Sequence (QPI Mode)
CS#
0
Mode 3
1
SCLK
Mode 0
Command
04h
SIO[3:0]
9-3. Factory Mode Enable (FMEN)
The Factory Mode Enable (FMEN) instruction is for enhance Program and Erase performance for increase factory
production throughput. The FMEN instruction need to combine with the instructions which are intended to change
the device content, like PP/PP4B, 4PP/4PP4B, SE/SE4B, BE32K/BE32K4B, BE/BE4B, and CE.
The sequence of issuing FMEN instruction is: CS# goes low→sending FMEN instruction code→ CS# goes high. A
valid factory mode operation need to included three sequences: WREN instruction → FMEN instruction→ Program
or Erase instruction.
Suspend command is not acceptable under factory mode.
The FMEN is reset by following situations
- Power-up
- Reset# pin driven low
- PP/PP4B command completion
- 4PP/4PP4B command completion
- SE/SE4B command completion
- BE32K/BE32K4B command completion
- BE/BE4B command completion
- CE command completion
- Softreset command completion
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care in
SPI mode.
Figure 11. Factory Mode Enable (FMEN) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
Command
SI
SO
P/N: PM2145
41h
High-Z
22
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 12. Factory Mode Enable (FMEN) Sequence (QPI Mode)
CS#
0
Mode 3
1
SCLK
Mode 0
Command
41h
SIO[3:0]
9-4. Read Identification (RDID)
The RDID instruction is for reading the manufacturer ID of 1-byte and followed by Device ID of 2-byte. The Macronix
Manufacturer ID and Device ID are listed as "Table 6. ID Definitions".
The sequence of issuing RDID instruction is: CS# goes low→ sending RDID instruction code→24-bits ID data out
on SO→ to end RDID operation can drive CS# to high at any time during data out.
While Program/Erase operation is in progress, it will not decode the RDID instruction, therefore there's no effect on
the cycle of program/erase operation which is currently in progress. When CS# goes high, the device is at standby
stage.
Figure 13. Read Identification (RDID) Sequence (SPI mode only)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
13 14 15 16 17 18
28 29 30 31
SCLK
Mode 0
Command
SI
9Fh
Manufacturer Identification
SO
High-Z
7
6
5
2
MSB
P/N: PM2145
1
Device Identification
0 15 14 13
3
2
1
0
MSB
23
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-5. Release from Deep Power-down (RDP), Read Electronic Signature (RES)
The Release from Deep Power-down (RDP) instruction is completed by driving Chip Select (CS#) High. When Chip
Select (CS#) is driven High, the device is put in the Stand-by Power mode. If the device was not previously in the
Deep Power-down mode, the transition to the Stand-by Power mode is immediate. If the device was previously
in the Deep Power-down mode, though, the transition to the Stand-by Power mode is delayed by tRES2, and
Chip Select (CS#) must remain High for at least tRES2(max), as specified in "Table 19. AC CHARACTERISTICS
(Temperature = -40°C to 85°C, VCC = 2.7V - 3.6V)". Once in the Stand-by Power mode, the device waits to be
selected, so that it can receive, decode and execute instructions. The RDP instruction is only for releasing from
Deep Power Down Mode. Reset# pin goes low will release the Flash from deep power down mode.
RES instruction is for reading out the old style of 8-bit Electronic Signature, whose values are shown as "Table 6.
ID Definitions". This is not the same as RDID instruction. It is not recommended to use for new design. For new
design, please use RDID instruction.
Even in Deep power-down mode, the RDP and RES are also allowed to be executed, only except the device is in
progress of program/erase/write cycle; there's no effect on the current program/erase/write cycle in progress.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
The RES instruction is ended by CS# goes high after the ID been read out at least once. The ID outputs repeatedly
if continuously send the additional clock cycles on SCLK while CS# is at low. If the device was not previously in
Deep Power-down mode, the device transition to standby mode is immediate. If the device was previously in Deep
Power-down mode, there's a delay of tRES2 to transit to standby mode, and CS# must remain to high at least
tRES2(max). Once in the standby mode, the device waits to be selected, so it can be receive, decode, and execute
instruction.
Figure 14. Read Electronic Signature (RES) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38
SCLK
Mode 0
Command
SI
ABh
tRES2
3 Dummy Bytes
23 22 21
3
2
1
0
MSB
SO
Electronic Signature Out
High-Z
7
6
5
4
3
2
1
0
MSB
Deep Power-down Mode
P/N: PM2145
24
Stand-by Mode
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 15. Read Electronic Signature (RES) Sequence (QPI Mode)
CS#
MODE 3
0
1
2
3
4
5
6
7
SCLK
MODE 0
3 Dummy Bytes
Command
SIO[3:0]
X
ABh
X
X
X
X
X
H0
L0
MSB LSB
Data In
Data Out
Stand-by Mode
Deep Power-down Mode
Figure 16. Release from Deep Power-down (RDP) Sequence (SPI Mode)
CS#
0
Mode 3
1
2
3
4
5
6
tRES1
7
SCLK
Mode 0
Command
SI
ABh
High-Z
SO
Deep Power-down Mode
Stand-by Mode
Figure 17. Release from Deep Power-down (RDP) Sequence (QPI Mode)
CS#
Mode 3
tRES1
0
1
SCLK
Mode 0
Command
SIO[3:0]
ABh
Deep Power-down Mode
P/N: PM2145
25
Stand-by Mode
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-6. Read Electronic Manufacturer ID & Device ID (REMS)
The REMS instruction is an alternative to the Release from Power-down/Device ID instruction that provides both the
JEDEC assigned manufacturer ID and the specific device ID.
The REMS instruction is very similar to the Release from Power-down/Device ID instruction. The instruction is
initiated by driving the CS# pin low and shift the instruction code "90h" followed by two dummy bytes and one
bytes address (A7~A0). After which, the Manufacturer ID for Macronix (C2h) and the Device ID are shifted out
on the falling edge of SCLK with most significant bit (MSB) first. The Device ID values are listed in "Table 6. ID
Definitions". If the one-byte address is initially set to 01h, then the device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to the other.
The instruction is completed by driving CS# high.
Figure 18. Read Electronic Manufacturer & Device ID (REMS) Sequence (SPI Mode only)
CS#
SCLK
Mode 3
0
1
2
Mode 0
3
4
5
6
7
8
Command
SI
9 10
2 Dummy Bytes
15 14 13
90h
3
2
1
0
High-Z
SO
CS#
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCLK
ADD (1)
SI
7
6
5
4
3
2
1
0
Manufacturer ID
SO
7
6
5
4
3
2
1
Device ID
0
7
MSB
MSB
6
5
4
3
2
1
0
7
MSB
Notes: (1) ADD=00H will output the manufacturer's ID first and ADD=01H will output device ID first.
P/N: PM2145
26
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-7. QPI ID Read (QPIID)
User can execute this QPIID Read instruction to identify the Device ID and Manufacturer ID. The sequence of issue
QPIID instruction is CS# goes low→sending QPI ID instruction→Data out on SO→CS# goes high. Most significant
bit (MSB) first.
After the command cycle, the device will immediately output data on the falling edge of SCLK. The manufacturer ID,
memory type, and device ID data byte will be output continuously, until the CS# goes high.
Table 6. ID Definitions
Command Type
RDID
9Fh
RES
ABh
REMS
90h
QPIID
AFh
P/N: PM2145
MX25L12845G
Manufacturer ID
C2
Manufacturer ID
C2
Manufacturer ID
C2
Memory type
20
Electronic ID
17
Device ID
17
Memory type
20
27
Memory density
18
Memory density
18
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-8. Read Status Register (RDSR)
The RDSR instruction is for reading Status Register Bits. The Read Status Register can be read at any time (even
in program/erase/write status register condition). It is recommended to check the Write in Progress (WIP) bit before
sending a new instruction when a program, erase, or write status register operation is in progress.
The sequence of issuing RDSR instruction is: CS# goes low→ sending RDSR instruction code→ Status Register data
out on SO.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
Figure 19. Read Status Register (RDSR) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
SCLK
Mode 0
command
05h
SI
SO
Status Register Out
High-Z
7
6
5
4
3
2
1
Status Register Out
0
7
6
5
4
3
2
1
0
7
MSB
MSB
Figure 20. Read Status Register (RDSR) Sequence (QPI Mode)
CS#
Mode 3 0
1
2
3
4
5
6
7
N
SCLK
Mode 0
SIO[3:0]
05h H0 L0 H0 L0 H0 L0
H0 L0
MSB LSB
Status Byte Status Byte Status Byte
P/N: PM2145
28
Status Byte
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-9. Read Configuration Register (RDCR)
The RDCR instruction is for reading Configuration Register Bits. The Read Configuration Register can be read at
any time (even in program/erase/write configuration register condition). It is recommended to check the Write in
Progress (WIP) bit before sending a new instruction when a program, erase, or write configuration register operation
is in progress.
The sequence of issuing RDCR instruction is: CS# goes low→ sending RDCR instruction code→ Configuration
Register data out on SO.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
Figure 21. Read Configuration Register (RDCR) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
SCLK
Mode 0
command
15h
SI
SO
Configuration register Out
High-Z
7
6
5
4
3
2
1
0
Configuration register Out
7
6
5
4
3
2
1
0
7
MSB
MSB
Figure 22. Read Configuration Register (RDCR) Sequence (QPI Mode)
CS#
Mode 3 0
1
2
3
4
5
6
7
N
SCLK
Mode 0
SIO[3:0]
15h H0 L0 H0 L0 H0 L0
H0 L0
MSB LSB
Config. Byte Config. Byte Config. Byte
P/N: PM2145
29
Config. Byte
REV. 1.1, FEB. 18, 2016
MX25L12845G
For user to check if Program/Erase operation is finished or not, RDSR instruction flow are shown as follows:
Figure 23. Program/Erase flow with read array data
start
WREN command
RDSR command*
WEL=1?
No
Yes
Program/erase command
Write program data/address
(Write erase address)
RDSR command
WIP=0?
No
Yes
RDSR command
Read WEL=0, BP[3:0], QE,
and SRWD data
Read array data
(same address of PGM/ERS)
No
Verify OK?
Yes
Program/erase successfully
Program/erase
another block?
No
Program/erase fail
Yes
* Issue RDSR to check BP[3:0].
* If WPSEL = 1, issue RDSPB to check the block status.
Program/erase completed
P/N: PM2145
30
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 24. Program/Erase flow without read array data (read P_FAIL/E_FAIL flag)
start
WREN command
RDSR command*
WEL=1?
No
Yes
Program/erase command
Write program data/address
(Write erase address)
RDSR command
WIP=0?
No
Yes
RDSR command
Read WEL=0, BP[3:0], QE,
and SRWD data
RDSCUR command
Yes
P_FAIL/E_FAIL =1 ?
No
Program/erase fail
Program/erase successfully
Program/erase
another block?
No
Yes
* Issue RDSR to check BP[3:0].
* If WPSEL = 1, issue RDSPB to check the block status.
Program/erase completed
P/N: PM2145
31
REV. 1.1, FEB. 18, 2016
MX25L12845G
Status Register
The definition of the status register bits is as below:
WIP bit. The Write in Progress (WIP) bit, a volatile bit, indicates whether the device is busy in program/erase/write
status register progress. When WIP bit sets to 1, which means the device is busy in program/erase/write status
register progress. When WIP bit sets to 0, which means the device is not in progress of program/erase/write status
register cycle.
WEL bit. The Write Enable Latch (WEL) bit, a volatile bit, indicates whether the device is set to internal write enable
latch. When WEL bit sets to 1, which means the internal write enable latch is set, the device can accept program/
erase/write status register instruction. When WEL bit sets to 0, which means no internal write enable latch; the
device will not accept program/erase/write status register instruction. The program/erase command will be ignored
if it is applied to a protected memory area. To ensure both WIP bit & WEL bit are both set to 0 and available for next
program/erase/operations, WIP bit needs to be confirm to be 0 before polling WEL bit. After WIP bit confirmed, WEL
bit needs to be confirm to be 0.
BP3, BP2, BP1, BP0 bits. The Block Protect (BP3, BP2, BP1, BP0) bits, non-volatile bits, indicate the protected area
(as defined in "Table 2. Protected Area Sizes") of the device to against the program/erase instruction without hardware
protection mode being set. To write the Block Protect (BP3, BP2, BP1, BP0) bits requires the Write Status Register (WRSR)
instruction to be executed. Those bits define the protected area of the memory to against Page Program (PP), Sector
Erase (SE), Block Erase 32KB (BE32K), Block Erase (BE) and Chip Erase (CE) instructions (only if Block Protect bits
(BP3:BP0) set to 0, the CE instruction can be executed). The BP3, BP2, BP1, BP0 bits are "0" as default. Which is unprotected.
QE bit. The Quad Enable (QE) bit, non-volatile bit, while it is "0" (factory default), it performs non-Quad and WP#,
RESET# are enable. While QE is "1", it performs Quad I/O mode and WP#, RESET# are disabled. In the other
word, if the system goes into four I/O mode (QE=1), the feature of HPM and RESET will be disabled.
SRWD bit. The Status Register Write Disable (SRWD) bit, non-volatile bit, is operated together with Write Protection
(WP#/SIO2) pin for providing hardware protection mode. The hardware protection mode requires SRWD sets to 1 and
WP#/SIO2 pin signal is low stage. In the hardware protection mode, the Write Status Register (WRSR) instruction is
no longer accepted for execution and the SRWD bit and Block Protect bits (BP3, BP2, BP1, BP0) are read only. The
SRWD bit defaults to be "0".
Status Register
bit7
SRWD (status
register write
protect)
bit6
QE
(Quad
Enable)
1=status
register write
1=Quad
disabled
Enable
0=status
0=not Quad
register write
Enable
enabled
Non-volatile Non-volatile
bit
bit
bit5
BP3
(level of
protected
block)
bit4
BP2
(level of
protected
block)
bit3
BP1
(level of
protected
block)
bit2
BP0
(level of
protected
block)
(note 1)
(note 1)
(note 1)
(note 1)
Non-volatile
bit
Non-volatile
bit
Non-volatile
bit
Non-volatile
bit
bit1
bit0
WEL
WIP
(write enable
(write in
latch)
progress bit)
1=write
1=write
enable
operation
0=not write 0=not in write
enable
operation
volatile bit
volatile bit
Note 1: Please refer to "Table 2. Protected Area Sizes".
P/N: PM2145
32
REV. 1.1, FEB. 18, 2016
MX25L12845G
Configuration Register
The Configuration Register is able to change the default status of Flash memory. Flash memory will be configured
after the CR bit is set.
ODS bit
The output driver strength (ODS1, ODS0) bits are volatile bits, which indicate the output driver level (as defined in
"Output Driver Strength Table") of the device. The Output Driver Strength is defaulted as 30 Ohms when delivered
from factory. To write the ODS bits requires the Write Status Register (WRSR) instruction to be executed.
TB bit
The Top/Bottom (TB) bit is a non-volatile OTP bit. The Top/Bottom (TB) bit is used to configure the Block Protect
area by BP bit (BP3, BP2, BP1, BP0), starting from TOP or Bottom of the memory array. The TB bit is defaulted as
“0”, which means Top area protect. When it is set as “1”, the protect area will change to Bottom area of the memory
device. To write the TB bits requires the Write Status Register (WRSR) instruction to be executed.
PBE bit
The Preamble Bit Enable (PBE) bit is a volatile bit. It is used to enable or disable the preamble bit data pattern
output on dummy cycles. The PBE bit is defaulted as “0”, which means preamble bit is disabled. When it is set as “1”,
the preamble bit will be enabled, and inputted into dummy cycles. To write the PBE bits requires the Write Status
Register (WRSR) instruction to be executed.
4BYTE Indicator bit
By writing EN4B instruction, the 4BYTE bit may be set as "1" to access the address length of 32-bit for memory area
of higher density (large than 128Mb). The default state is "0" as the 24-bit address mode. The 4BYTE bit may be
cleared by power-off or writing EX4B instruction to reset the state to be "0".
Table 7. Configuration Register
bit7
DC1
(Dummy
cycle 1)
bit6
DC0
(Dummy
cycle 0)
bit5
(Note 2)
(Note 2)
x
volatile bit
volatile bit
x
Reserved
bit4
bit3
PBE
TB
(Preamble bit (top/bottom
Enable)
selected)
0=Top area
0=Disable
protect
1=Bottom
1=Enable
area protect
(Default=0)
volatile bit
OTP
bit2
Reserved
bit1
bit0
ODS 1
ODS 0
(output driver (output driver
strength)
strength)
x
(Note 1)
(Note 1)
x
volatile bit
volatile bit
Note 1: see "Output Driver Strength Table"
Note 2: see "Dummy Cycle and Frequency Table (MHz)"
P/N: PM2145
33
REV. 1.1, FEB. 18, 2016
MX25L12845G
Output Driver Strength Table
ODS1
0
0
1
1
ODS0
0
1
0
1
Description
tCLQV=8ns (Default)
tCLQV=10ns
tCLQV=16ns
tCLQV=6ns
Note
loading: 30pF
Dummy Cycle and Frequency Table (MHz)
(STR Mode)
DC[1:0]
00 (default)
01
10
11
DC[1:0]
00 (default)
01
10
11
DC[1:0]
00 (default)
01
10
11
Numbers of Dummy
clock cycles
8
8
8
8
Numbers of Dummy
clock cycles
4
8
4
8
Fast Read
120/133R
120/133R
120/133R
120/133R
Dual Output Fast
Read
120/133R
120/133R
120/133R
120/133R
Quad Output Fast
Read
120/133R
120/133R
120/133R
120/133R
Dual IO Fast Read
80
120/133R
80
120/133R
Numbers of Dummy
Quad IO Fast Read
clock cycles
6
80
4
54
8
84/104R
10
120/133R
(DTR Mode)
DC[1:0]
00 (default)
01
10
11
Numbers of Dummy
Quad IO DTR Read
clock cycles
6
54
6
54
8
70/80R
10
84/100R
Note: "R" mean VCC range= 3.0V-3.6V.
P/N: PM2145
34
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-10.Write Status Register (WRSR)
The WRSR instruction is for changing the values of Status Register Bits and Configuration Register Bits. Before
sending WRSR instruction, the Write Enable (WREN) instruction must be decoded and executed to set the Write
Enable Latch (WEL) bit in advance. The WRSR instruction can change the value of Block Protect (BP3, BP2,
BP1, BP0) bits to define the protected area of memory (as shown in "Table 2. Protected Area Sizes"). The WRSR
also can set or reset the Quad enable (QE) bit and set or reset the Status Register Write Disable (SRWD) bit in
accordance with Write Protection (WP#/SIO2) pin signal, but has no effect on bit1(WEL) and bit0 (WIP) of the status
register. The WRSR instruction cannot be executed once the Hardware Protected Mode (HPM) is entered.
The sequence of issuing WRSR instruction is: CS# goes low→ sending WRSR instruction code→ Status Register
data on SI→CS# goes high.
The CS# must go high exactly at the 8 bits or 16 bits data boundary; otherwise, the instruction will be rejected and
not executed. The self-timed Write Status Register cycle time (tW) is initiated as soon as Chip Select (CS#) goes
high. The Write in Progress (WIP) bit still can be check out during the Write Status Register cycle is in progress.
The WIP sets 1 during the tW timing, and sets 0 when Write Status Register Cycle is completed, and the Write
Enable Latch (WEL) bit is reset.
Figure 25. Write Status Register (WRSR) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCLK
Mode 0
SI
SO
command
01h
Status
Register In
7
6
4
5
Configuration
Register In
2
3
0 15 14 13 12 11 10 9
1
8
MSB
High-Z
Note: The CS# must go high exactly at 8 bits or 16 bits data boundary to completed the write register command.
Figure 26. Write Status Register (WRSR) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
Mode 3
SCLK
Mode 0
Mode 0
SR in
Command
SIO[3:0]
P/N: PM2145
01h
H0
35
L0
CR in
H1
L1
REV. 1.1, FEB. 18, 2016
MX25L12845G
Software Protected Mode (SPM):
- When SRWD bit=0, no matter WP#/SIO2 is low or high, the WREN instruction may set the WEL bit and can
change the values of SRWD, BP3, BP2, BP1, BP0. The protected area, which is defined by BP3, BP2, BP1,
BP0 and T/B bit, is at software protected mode (SPM).
- When SRWD bit=1 and WP#/SIO2 is high, the WREN instruction may set the WEL bit can change the values
of SRWD, BP3, BP2, BP1, BP0. The protected area, which is defined by BP3, BP2, BP1, BP0 and T/B bit, is at
software protected mode (SPM)
Note:
If SRWD bit=1 but WP#/SIO2 is low, it is impossible to write the Status Register even if the WEL bit has previously
been set. It is rejected to write the Status Register and not be executed.
Hardware Protected Mode (HPM):
- When SRWD bit=1, and then WP#/SIO2 is low (or WP#/SIO2 is low before SRWD bit=1), it enters the hardware
protected mode (HPM). The data of the protected area is protected by software protected mode by BP3, BP2,
BP1, BP0 and T/B bit and hardware protected mode by the WP#/SIO2 to against data modification.
Note:
To exit the hardware protected mode requires WP#/SIO2 driving high once the hardware protected mode is entered.
If the WP#/SIO2 pin is permanently connected to high, the hardware protected mode can never be entered; only
can use software protected mode via BP3, BP2, BP1, BP0 and T/B bit.
If the system enter QPI or set QE=1, the feature of HPM will be disabled.
Table 8. Protection Modes
Mode
Software protection
mode (SPM)
Hardware protection
mode (HPM)
Status register condition
WP# and SRWD bit status
Memory
Status register can be written
in (WEL bit is set to "1") and
the SRWD, BP0-BP3
bits can be changed
WP#=1 and SRWD bit=0, or
WP#=0 and SRWD bit=0, or
WP#=1 and SRWD=1
The protected area
cannot
be program or erase.
The SRWD, BP0-BP3 of
status register bits cannot be
changed
WP#=0, SRWD bit=1
The protected area
cannot
be program or erase.
Note:
1. As defined by the values in the Block Protect (BP3, BP2, BP1, BP0) bits of the Status Register, as shown in "Table 2. Protected Area Sizes".
P/N: PM2145
36
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 27. WRSR flow
start
WREN command
RDSR command
WEL=1?
No
Yes
WRSR command
Write status register data
RDSR command
WIP=0?
No
Yes
RDSR command
Read WEL=0, BP[3:0], QE,
and SRWD data
Verify OK?
No
Yes
WRSR successfully
P/N: PM2145
WRSR fail
37
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 28. WP# Setup Timing and Hold Timing during WRSR when SRWD=1
WP#
tSHWL
tWHSL
CS#
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCLK
01h
SI
SO
High-Z
Note: WP# must be kept high until the embedded operation finish.
P/N: PM2145
38
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-11.Read Data Bytes (READ)
The read instruction is for reading data out. The address is latched on rising edge of SCLK, and data shifts out on
the falling edge of SCLK at a maximum frequency fR. The first address byte can be at any location. The address
is automatically increased to the next higher address after each byte data is shifted out, so the whole memory can
be read out at a single READ instruction. The address counter rolls over to 0 when the highest address has been
reached.
The sequence of issuing READ instruction is: CS# goes low→sending READ instruction code→ 3-byte address on
SI→ data out on SO→to end READ operation can use CS# to high at any time during data out.
Figure 29. Read Data Bytes (READ) Sequence (SPI Mode only)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39
SCLK
Mode 0
SI
command
03h
24-Bit Address
23 22 21
3
2
1
0
MSB
SO
Data Out 1
High-Z
7
6
5
4
3
2
Data Out 2
1
0
7
MSB
P/N: PM2145
39
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-12.Read Data Bytes at Higher Speed (FAST_READ)
The FAST_READ instruction is for quickly reading data out. The address is latched on rising edge of SCLK, and
data of each bit shifts out on the falling edge of SCLK at a maximum frequency fC. The first address byte can be at
any location. The address is automatically increased to the next higher address after each byte data is shifted out,
so the whole memory can be read out at a single FAST_READ instruction. The address counter rolls over to 0 when
the highest address has been reached.
Read on SPI Mode The sequence of issuing FAST_READ instruction is: CS# goes low→ sending FAST_READ
instruction code→ 3-byte address on SI→ 8 dummy cycles (default)→ data out on SO→ to end FAST_READ
operation can use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, FAST_READ instruction is rejected without any
impact on the Program/Erase/Write Status Register current cycle.
P/N: PM2145
40
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 30. Read at Higher Speed (FAST_READ) Sequence (SPI Mode)
CS#
SCLK
Mode 3
0
1
2
Mode 0
3
5
6
7
8
9 10
Command
SI
SO
4
28 29 30 31
24-Bit Address
23 22 21
0Bh
3
2
1
0
High-Z
CS#
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCLK
Configurable
Dummy Cycle
SI
7
6
5
4
3
2
1
0
DATA OUT 2
DATA OUT 1
SO
7
6
5
4
2
1
0
7
MSB
MSB
P/N: PM2145
3
41
6
5
4
3
2
1
0
7
MSB
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-13.Dual Output Read Mode (DREAD)
The DREAD instruction enable double throughput of Serial Flash in read mode. The address is latched on rising
edge of SCLK, and data of every two bits (interleave on 2 I/O pins) shift out on the falling edge of SCLK at a
maximum frequency fT. The first address byte can be at any location. The address is automatically increased to the
next higher address after each byte data is shifted out, so the whole memory can be read out at a single DREAD
instruction. The address counter rolls over to 0 when the highest address has been reached. Once writing DREAD
instruction, the following data out will perform as 2-bit instead of previous 1-bit.
The sequence of issuing DREAD instruction is: CS# goes low→ sending DREAD instruction→3-byte address on
SIO0→ 8 dummy cycles (default) on SIO0→ data out interleave on SIO1 & SIO0→ to end DREAD operation can
use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, DREAD instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
Figure 31. Dual Read Mode Sequence
CS#
0
1
2
3
4
5
6
7
8
…
Command
SI/SIO0
SO/SIO1
P/N: PM2145
30 31 32
9
SCLK
3B
…
24 ADD Cycle
A23 A22
…
39 40 41 42 43 44 45
A1 A0
High Impedance
Configurable
Dummy Cycle
Data Out
1
Data Out
2
D6 D4 D2 D0 D6 D4
D7 D5 D3 D1 D7 D5
42
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-14.2 x I/O Read Mode (2READ)
The 2READ instruction enable double throughput of Serial Flash in read mode. The address is latched on rising
edge of SCLK, and data of every two bits (interleave on 2 I/O pins) shift out on the falling edge of SCLK at a
maximum frequency fT. The first address byte can be at any location. The address is automatically increased to the
next higher address after each byte data is shifted out, so the whole memory can be read out at a single 2READ
instruction. The address counter rolls over to 0 when the highest address has been reached. Once writing 2READ
instruction, the following address/dummy/data out will perform as 2-bit instead of previous 1-bit.
The sequence of issuing 2READ instruction is: CS# goes low→ sending 2READ instruction→ 3-byte address
interleave on SIO1 & SIO0→ 4 dummy cycles (default) on SIO1 & SIO0→ data out interleave on SIO1 & SIO0→ to
end 2READ operation can use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, 2READ instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
Figure 32. 2 x I/O Read Mode Sequence (SPI Mode only)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
17 18 19 20 21 22 23 24 25 26 27 28 29 30
Mode 3
SCLK
Mode 0
Command
SI/SIO0
SO/SIO1
P/N: PM2145
BBh
12 ADD Cycles
Configurable
Dummy Cycle
Data
Out 1
Data
Out 2
A22 A20 A18
A4 A2 A0
D6 D4 D2 D0 D6 D4 D2 D0
A23 A21 A19
A5 A3 A1
D7 D5 D3 D1 D7 D5 D3 D1
43
Mode 0
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-15.Quad Read Mode (QREAD)
The QREAD instruction enable quad throughput of Serial Flash in read mode. The address is latched on rising
edge of SCLK, and data of every four bits (interleave on 4 I/O pins) shift out on the falling edge of SCLK at a
maximum frequency fQ. The first address byte can be at any location. The address is automatically increased to the
next higher address after each byte data is shifted out, so the whole memory can be read out at a single QREAD
instruction. The address counter rolls over to 0 when the highest address has been reached. Once writing QREAD
instruction, the following data out will perform as 4-bit instead of previous 1-bit.
The sequence of issuing QREAD instruction is: CS# goes low→ sending QREAD instruction → 3-byte address on
SI → 8 dummy cycle (Default) → data out interleave on SIO3, SIO2, SIO1 & SIO0→ to end QREAD operation can
use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, QREAD instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
Figure 33. Quad Read Mode Sequence
CS#
0
1
2
3
4
5
6
7
8
…
Command
SIO0
SIO1
SIO2
SIO3
P/N: PM2145
29 30 31 32 33
9
SCLK
6B
…
24 ADD Cycles
A23 A22
…
High Impedance
38 39 40 41 42
A2 A1 A0
Configurable
dummy cycles
Data Data Data
Out 1 Out 2 Out 3
D4 D0 D4 D0 D4
D5 D1 D5 D1 D5
High Impedance
D6 D2 D6 D2 D6
High Impedance
D7 D3 D7 D3 D7
44
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-16.4 x I/O Read Mode (4READ)
The 4READ instruction enable quad throughput of Serial Flash in read mode. A Quad Enable (QE) bit of status
Register must be set to "1" before sending the 4READ instruction. The address is latched on rising edge of SCLK,
and data of every four bits (interleave on 4 I/O pins) shift out on the falling edge of SCLK at a maximum frequency
fQ. The first address byte can be at any location. The address is automatically increased to the next higher address
after each byte data is shifted out, so the whole memory can be read out at a single 4READ instruction. The address
counter rolls over to 0 when the highest address has been reached. Once writing 4READ instruction, the following
address/dummy/data out will perform as 4-bit instead of previous 1-bit.
4 x I/O Read on SPI Mode (4READ) The sequence of issuing 4READ instruction is: CS# goes low→ sending
4READ instruction→ 3-byte address interleave on SIO3, SIO2, SIO1 & SIO0→ 6 dummy cycles (Default) →data out
interleave on SIO3, SIO2, SIO1 & SIO0→ to end 4READ operation can use CS# to high at any time during data out.
4 x I/O Read on QPI Mode (4READ) The 4READ instruction also support on QPI command mode. The sequence
of issuing 4READ instruction QPI mode is: CS# goes low→ sending 4READ instruction→ 3-byte address interleave
on SIO3, SIO2, SIO1 & SIO0→ 6 dummy cycles (Default) →data out interleave on SIO3, SIO2, SIO1 & SIO0→ to
end 4READ operation can use CS# to high at any time during data out.
While Program/Erase/Write Status Register cycle is in progress, 4READ instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
P/N: PM2145
45
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 34. 4 x I/O Read Mode Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
Mode 3
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
SCLK
Mode 0
Command
6 ADD Cycles
Data
Out 1
Performance
enhance
indicator (Note 1 & 2)
Data
Out 2
Mode 0
Data
Out 3
Configurable
Dummy Cycle (Note 3)
EA/EBh
A20 A16 A12 A8 A4 A0 P4 P0
D4 D0 D4 D0 D4 D0
SIO1
A21 A17 A13 A9 A5 A1 P5 P1
D5 D1 D5 D1 D5 D1
SIO2
A22 A18 A14 A10 A6 A2 P6 P2
D6 D2 D6 D2 D6 D2
SIO3
A23 A19 A15 A11 A7 A3 P7 P3
D7 D3 D7 D3 D7 D3
SIO0
Notes:
1. Hi-impedance is inhibited for the two clock cycles.
2. P7≠P3, P6≠P2, P5≠P1 & P4≠P0 (Toggling) is inhibited.
3. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
Figure 35. 4 x I/O Read Mode Sequence (QPI Mode)
CS#
MODE 3
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
MODE 3
SCLK
MODE 0
SIO[3:0]
P/N: PM2145
MODE 0
EA/EB
A5 A4 A3 A2 A1 A0
Data In
24-bit Address
X
X
X
X
Configurable
Dummy Cycle
46
X
X
H0 L0 H1 L1 H2 L2 H3 L3
MSB
Data Out
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-17.4 x I/O Double Transfer Rate Read Mode (4DTRD)
The 4DTRD instruction enables Double Transfer Rate throughput on quad I/O of Serial Flash in read mode. A Quad
Enable (QE) bit of status Register must be set to "1" before sending the 4DTRD instruction. The address (interleave
on 4 I/O pins) is latched on both rising and falling edge of SCLK, and data (interleave on 4 I/O pins) shift out on
both rising and falling edge of SCLK. The 8-bit address can be latched-in at one clock, and 8-bit data can be read
out at one clock, which means four bits at rising edge of clock, the other four bits at falling edge of clock. The first
address byte can be at any location. The address is automatically increased to the next higher address after each
byte data is shifted out, so the whole memory can be read out at a single 4DTRD instruction. The address counter
rolls over to 0 when the highest address has been reached. Once writing 4DTRD instruction, the following address/
dummy/data out will perform as 8-bit instead of previous 1-bit.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
While Program/Erase/Write Status Register cycle is in progress, 4DTRD instruction is rejected without any impact
on the Program/Erase/Write Status Register current cycle.
P/N: PM2145
47
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 36. Fast Quad I/O DT Read (4DTRD) Sequence (SPI Mode)
CS#
Mode 3
0
7
SCLK
8
9
10
11
16
…
Mode 0
17
18
…
Command
Performance
Enhance Indicator
3 ADD Cycles
Configurable
Dummy Cycle
A20 A16
…
A4 A0
P4 P0
D4 D0 D4 D0 D4
SIO1
A21 A17
…
A5 A1
P5 P1
D5 D1 D5 D1 D5
SIO2
A22 A18
…
A6 A2
P6
P2
D6 D2 D6 D2 D6
SIO3
A23 A19
…
A7 A3
P7
P3
D7 D3 D7 D3 D7
SIO0
EDh
Notes:
1. Hi-impedance is inhibited for this clock cycle.
2. P7≠P3, P6≠P2, P5≠P1 & P4≠P0 (Toggling) will result in entering the performance enhance mode.
3. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
Figure 37. Fast Quad I/O DT Read (4DTRD) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
11
10
SCLK
12
…
Mode 0
Command
3 ADD Cycles
Performance
Enhance Indicator
Configurable
Dummy Cycle
SIO[3:0]
EDh
A20
|
A23
A16
|
A19
A12
|
A15
A8
|
A11
A4
|
A7
A0
|
A3
P1
P0
H0
L0
H1
L1
H2
Note:
1.Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
P/N: PM2145
48
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-18.Preamble Bit
The Preamble Bit data pattern supports system/memory controller to determine valid window of data output more
easily and improve data capture reliability while the flash memory is running in high frequency.
Preamble Bit data pattern can be enabled or disabled by setting the bit4 of Configuration register (Preamble bit
Enable bit). Once the CR<4> is set, the preamble bit is inputted into dummy cycles.
Enabling preamble bit will not affect the function of enhance mode bit. In Dummy cycles, performance enhance
mode bit still operates with the same function. Preamble bit will output after performance enhance mode bit.
The preamble bit is a fixed 8-bit data pattern (00110100). While dummy cycle number reaches 10, the complete
8 bits will start to output right after the performance enhance mode bit. While dummy cycle is not sufficient of 10
cycles, the rest of the preamble bits will be cut. For example, 8 dummy cycles will cause 6 preamble bits to output,
and 6 dummy cycles will cause 4 preamble bits to output.
Figure 38. SDR 1I/O (10DC)
CS#
SCK
…
…
Dummy cycle
Command
cycle
SI
CMD
Address cycle
An
…
Preamble bits
A0
SO
7
6
5
4
3
2
1
0
D7
D6
D7
D6
…
Figure 39. SDR 1I/O (8DC)
CS#
SCK
…
…
Dummy cycle
Command
cycle
SI
SO
P/N: PM2145
CMD
Address cycle
An
…
Preamble bits
A0
7
49
6
5
4
3
2
D5
D4
…
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 40. SDR 2I/O (10DC)
CS#
SCK
…
…
Dummy cycle
Command
cycle
SIO0
CMD
SIO1
Address cycle
Toggle
bits
Preamble bits
A(n-1)
…
A0
7
6
5
4
3
2
1
0
D6
D4
D2
D0
An
…
A1
7
6
5
4
3
2
1
0
D7
D5
D3
D1
…
…
Figure 41. SDR 2I/O (8DC)
CS#
SCK
…
…
Dummy cycle
Command
cycle
SIO0
SIO1
P/N: PM2145
CMD
Address cycle
Toggle
bits
Preamble bits
A(n-1)
…
A0
7
6
5
4
3
2
D6
D4
D2
D0
An
…
A1
7
6
5
4
3
2
D7
D5
D3
D1
50
…
…
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 42. SDR 4I/O (10DC)
CS#
SCK
…
…
Dummy cycle
Command
cycle
Toggle
bits
Address cycle
Preamble bits
A(n-3)
…
A0
7
6
5
4
3
2
1
0
D4
D0
SIO1
A(n-2)
…
A1
7
6
5
4
3
2
1
0
D5
D1
SIO2
A(n-1)
…
A2
7
6
5
4
3
2
1
0
D6
D2
…
SIO3
An
…
A3
7
6
5
4
3
2
1
0
D7
D3
…
SIO0
CMD
…
…
Figure 43. SDR 4I/O (8DC)
CS#
SCK
…
…
Dummy cycle
Command
cycle
Address cycle
Toggle
bits
Preamble bits
A(n-3)
…
A0
7
6
5
4
3
2
D4
D0
SIO1
A(n-2)
…
A1
7
6
5
4
3
2
D5
D1
SIO2
A(n-1)
…
A2
7
6
5
4
3
2
D6
D2
SIO3
An
…
A3
7
6
5
4
3
2
D7
D3
SIO0
P/N: PM2145
CMD
51
…
…
…
…
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 44. DTR4IO (DC=6)
CS#
SCK
…
…
Dummy cycle
Command
cycle
SIO0
Address cycle
CMD
Toggle
Bits
Learning pattern
…
A0
7 6 5 4 3 2 1 0 D4 D0 D4 D0 D4 D0 D4 D0
…
…
A1
7 6 5 4 3 2 1 0 D5 D1 D5 D1 D5 D1 D5 D1
…
…
A2
7 6 5 4 3 2 1 0 D6 D2 D6 D2 D6 D2 D6 D2
…
…
A3
7 6 5 4 3 2 1 0 D7 D3 D7 D3 D7 D3 D7 D3
…
A(n-3)
SIO1
A(n-2)
SIO2
A(n-1)
SIO3
An
P/N: PM2145
52
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-19.Burst Read
This device supports Burst Read in both SPI and QPI mode.
To set the Burst length, following command operation is required to issue command: “C0h” in the first Byte (8-clocks),
following 4 clocks defining wrap around enable with “0h” and disable with“1h”.
The next 4 clocks are to define wrap around depth. Their definitions are as the following table:
Data
00h
01h
02h
03h
1xh
Wrap Around
Yes
Yes
Yes
Yes
No
Wrap Depth
8-byte
16-byte
32-byte
64-byte
X
The wrap around unit is defined within the 256Byte page, with random initial address. It is defined as “wrap-around
mode disable” for the default state of the device. To exit wrap around, it is required to issue another “C0h” command
in which data=‘1xh”. Otherwise, wrap around status will be retained until power down or reset command. To change
wrap around depth, it is requried to issue another “C0h” command in which data=“0xh”. QPI “EBh” and SPI “EBh”
support wrap around feature after wrap around is enabled. Burst read is supported in both SPI and QPI mode. The
device is default without Burst read.
Figure 45. Burst Read - SPI Mode
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9
D7
D6
10
11
12
13
14
15
SCLK
Mode 0
SIO
C0h
D5
D4
D3
D2
D1
D0
Figure 46. Burst Read - QPI Mode
CS#
Mode 3
0
1
2
3
SCLK
Mode 0
SIO[3:0]
C0h
H0
MSB
L0
LSB
Note: MSB=Most Significant Bit
LSB=Least Significant Bit
P/N: PM2145
53
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-20.Performance Enhance Mode
The device could waive the command cycle bits if the two cycle bits after address cycle toggles.
Performance enhance mode is supported in both SPI and QPI mode.
In QPI mode, "EBh" and SPI “EBh” commands support enhance mode. The performance enhance mode is not
supported in dual I/O mode.
To enter performance-enhancing mode, P[7:4] must be toggling with P[3:0]; likewise P[7:0]=A5h, 5Ah, F0h or 0Fh
can make this mode continue and skip the next 4READ instruction. To leave enhance mode, P[7:4] is no longer
toggling with P[3:0]; likewise P[7:0]=FFh, 00h, AAh or 55h along with CS# is afterwards raised and then lowered.
Issuing ”FFh” data cycle can also exit enhance mode. The system then will leave performance enhance mode and
return to normal operation.
After entering enhance mode, following CS# go high, the device will stay in the read mode and treat CS# go low of
the first clock as address instead of command cycle.
Another sequence of issuing 4READ instruction especially useful in random access is : CS# goes low→sending
4READ instruction→3-bytes address interleave on SIO3, SIO2, SIO1 & SIO0 →performance enhance toggling bit
P[7:0]→ 4 dummy cycles (Default) →data out still CS# goes high → CS# goes low (reduce 4READ instruction) →
3-bytes random access address.
P/N: PM2145
54
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 47. 4 x I/O Read enhance performance Mode Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22
n
SCLK
Mode 0
Data
Out 2
Data
Out n
A20 A16 A12 A8 A4 A0 P4 P0
D4 D0 D4 D0
D4 D0
SIO1
A21 A17 A13 A9 A5 A1 P5 P1
D5 D1 D5 D1
D5 D1
SIO2
A22 A18 A14 A10 A6 A2 P6 P2
D6 D2 D6 D2
D6 D2
SIO3
A23 A19 A15 A11 A7 A3 P7 P3
D7 D3 D7 D3
D7 D3
Command
6 ADD Cycles
Data
Out 1
Performance
enhance
indicator (Note 1)
Configurable
Dummy Cycle (Note 2)
EBh
SIO0
CS#
n+1
...........
n+7 ...... n+9
........... n+13
...........
Mode 3
SCLK
6 ADD Cycles
Performance
enhance
indicator (Note 1)
Data
Out 1
Data
Out 2
Data
Out n
Mode 0
Configurable
Dummy Cycle (Note 2)
SIO0
A20 A16 A12 A8 A4 A0 P4 P0
D4 D0 D4 D0
D4 D0
SIO1
A21 A17 A13 A9 A5 A1 P5 P1
D5 D1 D5 D1
D5 D1
SIO2
A22 A18 A14 A10 A6 A2 P6 P2
D6 D2 D6 D2
D6 D2
SIO3
A23 A19 A15 A11 A7 A3 P7 P3
D7 D3 D7 D3
D7 D3
Notes:
1. If not using performance enhance recommend to keep 1 or 0 in performance enhance indicator.
2. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in
configuration register.
P/N: PM2145
55
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 48. 4 x I/O Read enhance performance Mode Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
A1
A0
8
9
10
11
12
13
14
15
16
17
H0
L0
H1
L1
SCLK
Mode 0
SIO[3:0]
EBh
A5
A4
A3
A2
X
X
X
X
MSB LSB MSB LSB
P(7:4) P(3:0)
Data In
Data Out
performance
enhance
indicator
Configurable
Dummy Cycle (Note 1)
CS#
n+1
.............
SCLK
Mode 0
SIO[3:0]
A5
A4
A3
A2
A1
X
A0
X
X
6 Address cycles
X
H0
L0
H1
L1
MSB LSB MSB LSB
P(7:4) P(3:0)
Data Out
performance
enhance
indicator
Configurable
Dummy Cycle (Note 1)
Note:
1. Configuration Dummy cycle numbers will be different depending on the bit6 & bit 7 (DC0 & DC1) setting in configuration register.
P/N: PM2145
56
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-21.Performance Enhance Mode Reset
To conduct the Performance Enhance Mode Reset operation in SPI mode, FFh data should be issued in 1I/O
sequence. In QPI Mode, FFFFFFFFh data cycle, in 4 I/O should be issued.
If the system controller is being Reset during operation, the flash device will return to the standard SPI operation.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
Figure 49. Performance Enhance Mode Reset for Fast Read Quad I/O (SPI Mode)
Mode Bit Reset
for Quad I/O
CS#
Mode 3
SCLK
０ 1
2
3
4
5
6
Mode 3
7
Mode ０
Mode ０
SIO0
FFh
SIO1
Don’t Care
SIO2
Don’t Care
SIO3
Don’t Care
Figure 50. Performance Enhance Mode Reset for Fast Read Quad I/O (QPI Mode)
Mode Bit Reset
for Quad I/O
CS#
Mode 3
SCLK
SIO[3:0]
P/N: PM2145
０ 1
2
3
4
5
6
Mode ０
7
Mode 3
Mode ０
FFFFFFFFh
57
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-22.Sector Erase (SE)
The Sector Erase (SE) instruction is for erasing the data of the chosen sector to be "1". The instruction is used for
any 4K-byte sector. A Write Enable (WREN) instruction must execute to set the Write Enable Latch (WEL) bit before
sending the Sector Erase (SE). Any address of the sector (see "Table 4. Memory Organization") is a valid address
for Sector Erase (SE) instruction. The CS# must go high exactly at the byte boundary (the least significant bit of the
address byte been latched-in); otherwise, the instruction will be rejected and not executed.
The sequence of issuing SE instruction is: CS# goes low→ sending SE instruction code→ 3-byte on SI→ CS# goes
high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
The self-timed Sector Erase Cycle time (tSE) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while the Sector Erase cycle is in progress. The WIP sets 1 during the tSE
timing, and clears when Sector Erase Cycle is completed, and the Write Enable Latch (WEL) bit is cleared. If the
Block is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect Mode),
the Sector Erase (SE) instruction will not be executed on the block.
Figure 51. Sector Erase (SE) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9
29 30 31
SCLK
Mode 0
24-Bit Address
Command
SI
20h
A23 A22
A2
A1 A0
MSB
Figure 52. Sector Erase (SE) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
24-Bit Address
Command
SIO[3:0]
20h A5 A4 A3 A2 A1 A0
MSB
P/N: PM2145
58
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-23.Block Erase (BE32K)
The Block Erase (BE32K) instruction is for erasing the data of the chosen block to be "1". The instruction is used for
32K-byte block erase operation. A Write Enable (WREN) instruction be executed to set the Write Enable Latch (WEL)
bit before sending the Block Erase (BE32K). Any address of the block (see "Table 4. Memory Organization") is a
valid address for Block Erase (BE32K) instruction. The CS# must go high exactly at the byte boundary (the least
significant bit of address byte been latched-in); otherwise, the instruction will be rejected and not executed.
Address bits [Am-A15] (Am is the most significant address) select the 32KB block address.
The sequence of issuing BE32K instruction is: CS# goes low→ sending BE32K instruction code→ 3-byte address
on SI→CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
The self-timed Block Erase Cycle time (tBE32K) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while during the Block Erase cycle is in progress. The WIP sets during the
tBE32K timing, and clears when Block Erase Cycle is completed, and the Write Enable Latch (WEL) bit is cleared.
If the Block is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect
Mode), the Block Erase (BE32K) instruction will not be executed on the block.
Figure 53. Block Erase 32KB (BE32K) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9
29 30 31
SCLK
Mode 0
Command
SI
24-Bit Address
52h
A23 A22
A2
A1 A0
MSB
Figure 54. Block Erase 32KB (BE32K) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
24-Bit Address
Command
SIO[3:0]
52h
A5 A4 A3 A2 A1 A0
MSB
P/N: PM2145
59
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-24.Block Erase (BE)
The Block Erase (BE) instruction is for erasing the data of the chosen block to be "1". The instruction is used
for 64K-byte block erase operation. A Write Enable (WREN) instruction must be executed to set the Write Enable
Latch (WEL) bit before sending the Block Erase (BE). Any address of the block (Please refer to "Table 4. Memory
Organization") is a valid address for Block Erase (BE) instruction. The CS# must go high exactly at the byte boundary (the
least significant bit of address byte been latched-in); otherwise, the instruction will be rejected and not executed.
The default read mode is 3-byte address, to access higher address (4-byte address) which requires to enter the
4-byte address read mode or to define EAR bit. To enter the 4-byte address mode, please refer to the enter 4-byte
mode (EN4B) Mode section.
The sequence of issuing BE instruction is: CS# goes low→ sending BE instruction code→ 3-byte address on SI→
CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
The self-timed Block Erase Cycle time (tBE) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while the Block Erase cycle is in progress. The WIP sets during the tBE
timing, and clears when Block Erase Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the Block
is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect Mode), the
Block Erase (BE) instruction will not be executed on the block.
Figure 55. Block Erase (BE) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9
29 30 31
SCLK
Mode 0
Command
SI
24-Bit Address
D8h
A23 A22
A2 A1 A0
MSB
Figure 56. Block Erase (BE) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
SIO[3:0]
Command
24-Bit Address
D8h
A5 A4 A3 A2 A1 A0
MSB
P/N: PM2145
60
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-25.Chip Erase (CE)
The Chip Erase (CE) instruction is for erasing the data of the whole chip to be "1". A Write Enable (WREN)
instruction must be executed to set the Write Enable Latch (WEL) bit before sending the Chip Erase (CE). The CS#
must go high exactly at the byte boundary, otherwise the instruction will be rejected and not executed.
The sequence of issuing CE instruction is: CS# goes low→sending CE instruction code→CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
The self-timed Chip Erase Cycle time (tCE) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while the Chip Erase cycle is in progress. The WIP sets during the tCE
timing, and clears when Chip Erase Cycle is completed, and the Write Enable Latch (WEL) bit is cleared.
When the chip is under "Block protect (BP) Mode" (WPSEL=0). The Chip Erase (CE) instruction will not be
executed, if one (or more) sector is protected by BP3-BP0 bits. It will be only executed when BP3-BP0 all set to "0".
When the chip is under "Advances Sector Protect Mode" (WPSEL=1). The Chip Erase (CE) instruction will be
executed on unprotected block. The protected Block will be skipped. If one (or more) 4K byte sector was protected
in top or bottom 64K byte block, the protected block will also skip the chip erase command.
Figure 57. Chip Erase (CE) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
SCLK
Mode 0
Command
SI
60h or C7h
Figure 58. Chip Erase (CE) Sequence (QPI Mode)
CS#
Mode 3
0
1
SCLK
Mode 0
SIO[3:0]
P/N: PM2145
Command
60h or C7h
61
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-26.Page Program (PP)
The Page Program (PP) instruction is for programming the memory to be "0". A Write Enable (WREN) instruction
must be executed to set the Write Enable Latch (WEL) bit before sending the Page Program (PP). The device
programs only the last 256 data bytes sent to the device. If the entire 256 data bytes are going to be programmed,
A7-A0 (The eight least significant address bits) should be set to 0. The last address byte (the 8 least significant
address bits, A7-A0) should be set to 0 for 256 bytes page program. If A7-A0 are not all zero, transmitted data that
exceed page length are programmed from the starting address (24-bit address that last 8 bit are all 0) of currently
selected page. If the data bytes sent to the device exceeds 256, the last 256 data byte is programmed at the request
page and previous data will be disregarded. If the data bytes sent to the device has not exceeded 256, the data
will be programmed at the request address of the page. There will be no effort on the other data bytes of the same
page.
The sequence of issuing PP instruction is: CS# goes low→ sending PP instruction code→ 3-byte address on SI→ at
least 1-byte on data on SI→ CS# goes high.
The CS# must be kept to low during the whole Page Program cycle; The CS# must go high exactly at the byte
boundary( the latest eighth bit of data being latched in), otherwise the instruction will be rejected and will not be
executed.
The self-timed Page Program Cycle time (tPP) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be checked while the Page Program cycle is in progress. The WIP sets during the tPP
timing, and clears when Page Program Cycle is completed, and the Write Enable Latch (WEL) bit is cleared. If the
page is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect Mode),
the Page Program (PP) instruction will not be executed.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
P/N: PM2145
62
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 59. Page Program (PP) Sequence (SPI Mode)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31 32 33 34 35 36 37 38 39
SCLK
1
0
7
6
5
3
2
1
0
2079
2
2078
3
2077
23 22 21
02h
SI
Data Byte 1
24-Bit Address
2076
Command
2075
Mode 0
4
1
0
MSB
MSB
2074
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
2073
2072
CS#
SCLK
Data Byte 2
7
SI
6
5
4
3
2
Data Byte 3
1
MSB
0
7
6
5
4
3
2
Data Byte 256
1
7
0
MSB
6
5
4
3
2
MSB
Figure 60. Page Program (PP) Sequence (QPI Mode)
CS#
Mode 3
0
1
2
SCLK
Mode 0
Command
SIO[3:0]
02h
Data In
P/N: PM2145
24-Bit Address
A5
A4
A3
A2
A1
A0
H0
L0
H1
L1
H2
L2
H3
L3
Data Byte Data Byte Data Byte Data Byte
1
2
3
4
63
H255 L255
......
Data Byte
256
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-27.4 x I/O Page Program (4PP)
The Quad Page Program (4PP) instruction is for programming the memory to be "0". A Write Enable (WREN)
instruction must be executed to set the Write Enable Latch (WEL) bit and Quad Enable (QE) bit must be set to
"1" before sending the Quad Page Program (4PP). The Quad Page Programming takes four pins: SIO0, SIO1,
SIO2, and SIO3 as address and data input, which can improve programmer performance and the effectiveness of
application. The other function descriptions are as same as standard page program.
The sequence of issuing 4PP instruction is: CS# goes low→ sending 4PP instruction code→ 3-byte address on
SIO[3:0]→ at least 1-byte on data on SIO[3:0]→CS# goes high.
If the page is protected by BP bits (WPSEL=0; Block Protect Mode) or SPB (WPSEL=1; Individual Sector Protect
Mode), the Quad Page Program (4PP) instruction will not be executed.
Figure 61. 4 x I/O Page Program (4PP) Sequence (SPI Mode only)
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21
SCLK
Mode 0
Data Data Data Data
Byte 1 Byte 2 Byte 3 Byte 4
6 Address cycle
A0
4
0
4
0
4
0
4
0
SIO1
A21 A17 A13 A9 A5 A1
5
1
5
1
5
1
5
1
SIO2
A22 A18 A14 A10 A6 A2
6
2
6
2
6
2
6
2
SIO3
A23 A19 A15 A11 A7 A3
7
3
7
3
7
3
7
3
SIO0
P/N: PM2145
Command
38h
A20 A16 A12 A8 A4
64
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MX25L12845G
9-28.Deep Power-down (DP)
The Deep Power-down (DP) instruction is for setting the device to minimum power consumption (the standby
current is reduced from ISB1 to ISB2). The Deep Power-down mode requires the Deep Power-down (DP) instruction
to enter, during the Deep Power-down mode, the device is not active and all Write/Program/Erase instruction are
ignored. When CS# goes high, it's only in deep power-down mode not standby mode. It's different from Standby
mode.
The sequence of issuing DP instruction is: CS# goes low→sending DP instruction code→CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
Once the DP instruction is set, all instruction will be ignored except the Release from Deep Power-down mode (RDP)
and Read Electronic Signature (RES) instruction and softreset command. (those instructions allow the ID being
reading out). When Power-down, or software reset command the deep power-down mode automatically stops, and
when power-up, the device automatically is in standby mode. For DP instruction the CS# must go high exactly at the
byte boundary (the latest eighth bit of instruction code been latched-in); otherwise, the instruction will not executed.
As soon as Chip Select (CS#) goes high, a delay of tDP is required before entering the Deep Power-down mode.
Figure 62. Deep Power-down (DP) Sequence (SPI Mode)
CS#
0
Mode 3
1
2
3
4
5
6
tDP
7
SCLK
Mode 0
Command
B9h
SI
Stand-by Mode
Deep Power-down Mode
Figure 63. Deep Power-down (DP) Sequence (QPI Mode)
CS#
Mode 3
0
1
tDP
SCLK
Mode 0
Command
SIO[3:0]
B9h
Stand-by Mode
P/N: PM2145
65
Deep Power-down Mode
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-29.Enter Secured OTP (ENSO)
The ENSO instruction is for entering the additional 4K-bit secured OTP mode. While device is in 4K-bit secured
OTPmode, main array access is not available. The additional 4K-bit secured OTP is independent from main array
and may be used to store unique serial number for system identifier. After entering the Secured OTP mode, follow
standard read or program procedure to read out the data or update data. The Secured OTP data cannot be updated
again once it is lock-down.
The sequence of issuing ENSO instruction is: CS# goes low→ sending ENSO instruction to enter Secured OTP
mode→ CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
Please note that after issuing ENSO command user can only access secure OTP region with standard read or
program procedure. Furthermore, once security OTP is lock down, only read related commands are valid.
9-30.Exit Secured OTP (EXSO)
The EXSO instruction is for exiting the additional 4K-bit secured OTP mode.
The sequence of issuing EXSO instruction is: CS# goes low→ sending EXSO instruction to exit Secured OTP
mode→ CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
9-31.Read Security Register (RDSCUR)
The RDSCUR instruction is for reading the value of Security Register bits. The Read Security Register can be read
at any time (even in program/erase/write status register/write security register condition) and continuously.
The sequence of issuing RDSCUR instruction is : CS# goes low→sending RDSCUR instruction→Security Register
data out on SO→ CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
9-32.Write Security Register (WRSCUR)
The WRSCUR instruction is for changing the values of Security Register Bits. The WREN (Write Enable) instruction
is required before issuing WRSCUR instruction. The WRSCUR instruction may change the values of bit1 (LDSO
bit) for customer to lock-down the 4K-bit Secured OTP area. Once the LDSO bit is set to "1", the Secured OTP area
cannot be updated any more.
The sequence of issuing WRSCUR instruction is :CS# goes low→ sending WRSCUR instruction → CS# goes high.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
The CS# must go high exactly at the boundary; otherwise, the instruction will be rejected and not executed.
P/N: PM2145
66
REV. 1.1, FEB. 18, 2016
MX25L12845G
Security Register
The definition of the Security Register bits is as below:
Write Protection Selection bit. Please reference to "Write Protection Selection bit"
Erase Fail bit. The Erase Fail bit is a status flag, which shows the status of last Erase operation. It will be set to "1",
if the erase operation fails. It will be set to "0", if the last operation is success. Please note that it will not interrupt or
stop any operation in the flash memory.
Program Fail bit. The Program Fail bit is a status flag, which shows the status of last Program operation. It will be
set to "1", if the program operation fails or the program region is protected. It will be set to "0", if the last operation is
success. Please note that it will not interrupt or stop any operation in the flash memory.
Erase Suspend bit. Erase Suspend Bit (ESB) indicates the status of Erase Suspend operation. Users may use
ESB to identify the state of flash memory. After the flash memory is suspended by Erase Suspend command, ESB
is set to "1". ESB is cleared to "0" after erase operation resumes.
Program Suspend bit. Program Suspend Bit (PSB) indicates the status of Program Suspend operation. Users may
use PSB to identify the state of flash memory. After the flash memory is suspended by Program Suspend command,
PSB is set to "1". PSB is cleared to "0" after program operation resumes.
Secured OTP Indicator bit. The Secured OTP indicator bit shows the chip is locked by factory or not. When it is
"0", it indicates non-factory lock; "1" indicates factory-lock.
Lock-down Secured OTP (LDSO) bit. By writing WRSCUR instruction, the LDSO bit may be set to "1" for
customer lock-down purpose. However, once the bit is set to "1" (lock-down), the LDSO bit and the 4K-bit Secured
OTP area cannot be updated any more. While it is in 4K-bit secured OTP mode, main array access is not allowed.
Table 9. Security Register Definition
bit7
bit6
bit5
bit4
WPSEL
E_FAIL
P_FAIL
Reserved
0=normal
WP mode
1=individual
mode
(default=0)
0=normal
Erase
succeed
1=indicate
Erase failed
(default=0)
0=normal
Program
succeed
1=indicate
Program
failed
(default=0)
-
0=Erase
is not
suspended
1= Erase
suspended
(default=0)
Non-volatile
bit (OTP)
Volatile bit
Volatile bit
Volatile bit
Volatile bit
P/N: PM2145
bit3
bit2
ESB
PSB
(Erase
(Program
Suspend bit) Suspend bit)
67
bit1
bit0
LDSO
Secured OTP
(indicate if
indicator bit
lock-down)
0 = not lock0=Program
0 = nondown
is not
factory
1 = lock-down
suspended
lock
(cannot
1= Program
1 = factory
program/
suspended
lock
erase
(default=0)
OTP)
Non-volatile
Non-volatile
Volatile bit
bit
bit (OTP)
(OTP)
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-33.Write Protection Selection (WPSEL)
There are two write protection methods provided on this device, (1) Block Protection (BP) mode or (2) Individual
Sector Protection mode. The protection modes are mutually exclusive. The WPSEL bit selects which protection
mode is enabled. If WPSEL=0 (factory default), BP mode is enabled and Individual Sector Protection mode is
disabled. If WPSEL=1, Individual Sector Protection mode is enabled and BP mode is disabled. The WPSEL
command is used to set WPSEL=1. A WREN command must be executed to set the WEL bit before sending
the WPSEL command. Please note that the WPSEL bit is an OTP bit. Once WPSEL is set to “1”, it cannot be
programmed back to “0”.
When WPSEL = 0: Block Lock (BP) protection mode,
The memory array is write protected by the BP3~BP0 bits.
When WPSEL =1: Individual Sector protection mode,
Blocks are individually protected by their own SPB or DPB. On power-up, all blocks are write protected by the
Dynamic Protection Bits (DPB) by default. The Individual Sector Protection instructions WRLR, RDLR, WRSPB,
ESSPB, WRDPB, RDDPB, GBLK, and GBULK are activated. The BP3~BP0 bits of the Status Register are disabled
and have no effect. Hardware protection is performed by driving WP#=0. Once WP#=0 all blocks and sectors are
write protected regardless of the state of each SPB or DPB.
The sequence of issuing WPSEL instruction is: CS# goes low → send WPSEL instruction to enable the Individual
Sector Protect mode → CS# goes high.
Write Protection Selection
Start
(Default in BP Mode)
WPSEL=1
Set
WPSEL Bit
Individual
Sector Protection
P/N: PM2145
WPSEL=0
Block Protection
(BP)
68
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 64. WPSEL Flow
start
WREN command
RDSCUR command
Yes
WPSEL=1?
No
WPSEL disable,
block protected by BP[3:0]
WPSEL command
RDSR command
WIP=0?
No
Yes
RDSCUR command
WPSEL=1?
No
Yes
WPSEL set successfully
WPSEL set fail
WPSEL enable.
Block protected by Advance Sector Protection
P/N: PM2145
69
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MX25L12845G
9-34.Advanced Sector Protection
Advanced Sector Protection can protect individual 4KB sectors in the bottom and top 64KB of memory and protect
individual 64KB blocks in the rest of memory.
There is one non-volatile Solid Protection Bit (SPB) and one volatile Dynamic Protection Bit (DPB) assigned to each
4KB sector at the bottom and top 64KB of memory and to each 64KB block in the rest of memory. A sector or block
is write-protected from programming or erasing when its associated SPB or DPB is set to “1”. The Unprotect Solid
Protect Bit (USPB) can temporarily override and disable the write-protection provided by the SPB bits.
The figure below helps describing an overview of these methods. The device is default to the Solid mode when
shipped from factory. The detail algorithm of advanced sector protection is shown as follows:
Solid Protection mode permits the SPB bits to be modified after power-on or a reset. The figure below is an
overview of Advanced Sector Protection
Figure 65. Advanced Sector Protection Overview
Start
Set
SPB Lock Bit ?
SPBLKDN# = 0
SPB Lock bit locked
All SPB can not be changeable
SPBLKDN# = 1
SPB Lock bit Unlocked
SPB is changeable
Dynamic Protect Bit Register
(DPB)
DPB=1 sector protect
Sector Array
DPB=0 sector unprotect
P/N: PM2145
SPB Access Register
(SPB)
Temporary Unprotect
SPB bit (USPB)
SPB=1 Write Protect
USPB=0 SPB bit is disabled
SPB=0 Write Unprotect
USPB=1 SPB bit is effective
DPB 0
SA 0
SPB 0
DPB 1
SA 1
SPB 1
DPB 2
SA 2
SPB 2
:
:
:
:
:
:
DPB N-1
SA N-1
SPB N-1
DPB N
SA N
SPB N
70
USPB
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-34-1. Lock Register
The Lock Register is a 16-bit one-time programmable register. Lock Register bit [6] is SPB Lock Down Bit (SPBLKDN)
which is an unique bit assigned to control all SPB bit status.
When SPBLKDN is 1, SPB can be changed. When it is locked as 0, all SPB can not be changed anymore, and
SPBLKDN bit itself can not be altered anymore, either.
The Lock Register is programmed using the WRLR (Write Lock Register) command. A WREN command must be
executed to set the WEL bit before sending the WRLR command.
Lock Register
Bits
Field Name
Function
Type
Default
State
15 to 7
RFU
Reserved
OTP
1
6
SPBLKDN
SPB Lock Down
OTP
1
5 to 0
RFU
Reserved
OTP
1
Description
Reserved for Future Use
1 = SPB changeable
0 = freeze SPB
Reserved for Future Use
Figure 66. Read Lock Register (RDLR) Sequence
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
SCLK
Mode 0
command
2Dh
SI
Register Out
High-Z
SO
7
6
5
4
3
2
Register Out
1
0 15 14 13 12 11 10 9
7
8
MSB
MSB
Figure 67. Write Lock Register (WRLR) Sequence
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
SCLK
Mode 0
SI
SO
P/N: PM2145
Command
2Ch
High-Z
Lock Register In
7
6
5
4
3
2
1
0 15 14 13 12 11 10 9
8
MSB
71
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MX25L12845G
9-34-2.Solid Protection Bits
The Solid Protection Bits (SPBs) are nonvolatile bits for enabling or disabling write-protection to sectors and blocks.
The SPB bits have the same endurance as the Flash memory. An SPB is assigned to each 4KB sector in the bottom
and top 64KB of memory and to each 64KB block in the remaining memory. The factory default state of the SPB bits
is “0”, which has the sector/block write-protection disabled.
When an SPB is set to “1”, the associated sector or block is write-protected. Program and erase operations on the
sector or block will be inhibited. SPBs can be individually set to “1” by the WRSPB command. However, the SPBs
cannot be individually cleared to “0”. Issuing the ESSPB command clears all SPBs to “0”. A WREN command must
be executed to set the WEL bit before sending the WRSPB or ESSPB command.
The RDSPB command reads the status of the SPB of a sector or block. The RDSPB command returns 00h if the
SPB is “0”, indicating write-protection is disabled. The RDSPB command returns FFh if the SPB is “1”, indicating
write-protection is enabled.
In Solid Protection mode, the Unprotect Solid Protect Bit (USPB) can temporarily mask the SPB bits and disable the
write-protection provided by the SPB bits.
Note: If SPBLKDN=0, commands to set or clear the SPB bits will be ignored.
SPB Register
Bit
Description
7 to 0 SPB (Solid Protection Bit)
P/N: PM2145
Bit Status
00h = Unprotect Sector / Block
FFh = Protect Sector / Block
72
Default
Type
00h
Non-volatile
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 68. Read SPB Status (RDSPB) Sequence
CS#
0
Mode 3
1
2
3
4
5
6
7
8
37 38 39 40 41 42 43 44 45 46 47
9
SCLK
Mode 0
Command
SI
32-Bit Address
(Note)
E2h
A31 A30
A2 A1 A0
MSB
Data Out
High-Z
SO
7
6
5
4
3
2
1
0
MSB
Note: A31-A24 are don't care.
Figure 69. SPB Erase (ESSPB) Sequence
CS#
1
0
Mode 3
2
3
4
5
6
7
SCLK
Mode 0
Command
SI
E4h
High-Z
SO
Figure 70. SPB Program (WRSPB) Sequence
CS#
Mode 3
0
1
2
3
4
5
6
7
8
9
37 38 39
SCLK
Mode 0
SI
Command
32-Bit Address
(Note)
E3h
A31 A30
A2 A1 A0
MSB
Note: A31-A24 are don't care
P/N: PM2145
73
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-34-3.Dynamic Protection Bits
The Dynamic Protection Bits (DPBs) are volatile bits for quickly and easily enabling or disabling write-protection
to sectors and blocks. A DPB is assigned to each 4KB sector in the bottom and top 64KB of memory and to each
64KB block in the rest of the memory. The DBPs can enable write-protection on a sector or block regardless of the
state of the corresponding SPB. However, the DPB bits can only unprotect sectors or blocks whose SPB bits are “0”
(unprotected).
When a DPB is “1”, the associated sector or block will be write-protected, preventing any program or erase
operation on the sector or block. All DPBs default to “1” after power-on or reset. When a DPB is cleared to “0”, the
associated sector or block will be unprotected if the corresponding SPB is also “0”.
DPB bits can be individually set to “1” or “0” by the WRDPB command. The DBP bits can also be globally cleared to
“0” with the GBULK command or globally set to “1” with the GBLK command. A WREN command must be executed
to set the WEL bit before sending the WRDPB, GBULK, or GBLK command.
The RDDPB command reads the status of the DPB of a sector or block. The RDDPB command returns 00h if the
DPB is “0”, indicating write-protection is disabled. The RDDPB command returns FFh if the DPB is “1”, indicating
write-protection is enabled.
DPB Register
Bit
Description
Bit Status
00h = Unprotect Sector / Block
FFh = Protect Sector / Block
7 to 0 DPB (Dynamic Protection Bit)
Default
Type
FFh
Volatile
Figure 71. Read DPB Register (RDDPB) Sequence
CS#
0
Mode 3
1
2
3
4
5
6
7
8
37 38 39 40 41 42 43 44 45 46 47
9
SCLK
Mode 0
Command
SI
32-Bit Address
E0h
A31 A30
A2 A1 A0
MSB
Data Out
High-Z
SO
7
6
5
4
3
2
1
0
MSB
Figure 72. Write DPB Register (WRDPB) Sequence
CS#
Mode 3
0
1
2
3
4
5
6
7
8
37 38 39 40 41 42 43 44 45 46 47
9
SCLK
Mode 0
SI
Command
E1h
A31 A30
A2 A1 A0
MSB
P/N: PM2145
Data Byte 1
32-Bit Address
7
6
5
4
3
2
1
0
MSB
74
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-34-4.Temporary Un-protect Solid write protect bit (USPB)
The Unprotect Solid Protect Bit is a volatile bit that defaults to “1” after power-on or reset. When USPB=1, the SPBs
have their normal function. When USPB=0 all SPBs are masked and their write-protected sectors and blocks are
temporarily unprotected (as long as their corresponding DPBs are “0“). The USPB provides a means to temporarily
override the SPBs without having to issue the ESSPB and WRSPB commands to clear and set the SPBs. The
USPB can be set or cleared as often as needed.
Please refer to "9-34-6. Sector Protection States Summary Table" for the sector state with the protection status of
DPB/SPB/USPB bits.
9-34-5.Gang Block Lock/Unlock (GBLK/GBULK)
These instructions are only effective if WPSEL=1. The GBLK and GBULK instructions provide a quick method to set
or clear all DPB bits at once.
The WREN (Write Enable) instruction is required before issuing the GBLK/GBULK instruction.
The sequence of issuing GBLK/GBULK instruction is: CS# goes low → send GBLK/GBULK (7Eh/98h) instruction
→CS# goes high.
The GBLK and GBULK commands are accepted in both SPI and QPI mode.
The CS# must go high exactly at the byte boundary, otherwise, the instruction will be rejected and not be executed.
9-34-6.Sector Protection States Summary Table
DPB
SPB
USPB
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
P/N: PM2145
Sector/Block
Protection State
Unprotected
Unprotected
Unprotected
Protected
Protected
Protected
Protected
Protected
75
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MX25L12845G
9-35.Program/Erase Suspend/Resume
The device allow the interruption of Sector-Erase, Block-Erase or Page-Program operations and conduct other
operations.
After issue suspend command, the system can determine if the device has entered the Erase-Suspended mode
through Bit2 (PSB) and Bit3 (ESB) of security register. (please refer to "Table 9. Security Register Definition")
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
9-36.Erase Suspend
Erase suspend allow the interruption of all erase operations. After the device has entered Erase-Suspended mode,
the system can read any sector(s) or Block(s) except those being erased by the suspended erase operation.
Reading the sector or Block being erase suspended is invalid.
After erase suspend, WEL bit will be clear, only read related, resume and reset command can be accepted,
including: 03h, 0Bh, 3Bh, 6Bh, BBh, EBh, 5Ah, C0h, 06h, 04h, 2Bh, 9Fh, AFh, 05h, ABh, 90h, B1h, C1h, B0h, 30h,
66h, 99h, 00h, 35h, F5h, 15h, 2Dh, E2h, E0h.
If the system issues an Erase Suspend command after the sector erase operation has already begun, the device
will not enter Erase-Suspended mode until tESL time has elapsed.
Erase Suspend Bit (ESB) indicates the status of Erase Suspend operation. Users may use ESB to identify the state
of flash memory. After the flash memory is suspended by Erase Suspend command, ESB is set to "1". ESB is
cleared to "0" after erase operation resumes.
9-37.Program Suspend
Program suspend allows the interruption of all program operations. After the device has entered ProgramSuspended mode, the system can read any sector(s) or Block(s) except those be­ing programmed by the suspended
program operation. Reading the sector or Block being program suspended is invalid.
After program suspend, WEL bit will be cleared, only read related, resume and reset command can be accepted,
including: 03h, 0Bh, 3Bh, 6Bh, BBh, EBh, 5Ah, C0h, 06h, 04h, 2Bh, 9Fh, AFh, 05h, ABh, 90h, B1h, C1h, B0h, 30h,
66h, 99h, 00h, 35h, F5h, 15h, 2Dh, E2h, E0h.
Program Suspend Bit (PSB) indicates the status of Program Suspend operation. Users may use PSB to identify the
state of flash memory. After the flash memory is suspended by Program Suspend command, PSB is set to "1". PSB
is cleared to "0" after program operation resumes.
P/N: PM2145
76
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 73. Suspend to Read Latency
tPSL / tESL
CS#
Suspend Command
Read Command
tPSL: Program Latency
tESL: Erase Latency
Figure 74. Resume to Read Latency
tSE / tBE / tPP
CS#
Resume Command
Read Command
Figure 75. Resume to Suspend Latency
tPRS / tERS
CS#
Resume Command
Suspend Command
tPRS: Program Resume to another Suspend
tERS: Erase Resume to another Suspend
P/N: PM2145
77
REV. 1.1, FEB. 18, 2016
MX25L12845G
9-38.Write-Resume
The Write operation is being resumed when Write-Resume instruction issued. ESB or PSB (suspend status bit) in
Status register will be changed back to “0”.
The operation of Write-Resume is as follows: CS# drives low → send write resume command cycle (30h) → drive
CS# high. By polling Busy Bit in status register, the internal write operation status could be checked to be completed
or not. The user may also wait the time lag of TSE, TBE, TPP for Sector-erase, Block-erase or Page-programming.
WREN (command "06h") is not required to issue before resume.
Please note that, if "performance enhance mode" is executed during suspend operation, the device can not
be resumed. To restart the write command, disable the "performance enhance mode" is required. After the
"performance enhance mode" is disabled, the write-resume command is effective.
9-39.No Operation (NOP)
The “No Operation” command is only able to terminate the Reset Enable (RSTEN) command and will not affect any
other command.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
during SPI mode.
9-40.Software Reset (Reset-Enable (RSTEN) and Reset (RST))
The Software Reset operation combines two instructions: Reset-Enable (RSTEN) command and Reset (RST)
command. It returns the device to standby mode. All the volatile bits and settings will be cleared then, which makes
the device return to the default status as power on.
To execute Reset command (RST), the Reset-Enable (RSTEN) command must be executed first to perform the
Reset operation. If there is any other command to interrupt after the Reset-Enable command, the Reset-Enable will
be invalid.
Both SPI (8 clocks) and QPI (2 clocks) command cycle can accept by this instruction. The SIO[3:1] are don't care
when during SPI mode.
If the Reset command is executed during program or erase operation, the operation will be disabled, the data under
processing could be damaged or lost.
The reset time is different depending on the last operation. For details, please refer to "Table 15. Reset Timing(Other Operation)" for tREADY2.
P/N: PM2145
78
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 76. Software Reset Recovery
Stand-by Mode
66
CS#
99
tReady2
Mode
Note: Refer to "Table 15. Reset Timing-(Other Operation)" for tREADY2 data.
Figure 77. Reset Sequence (SPI mode)
tSHSL
CS#
SCLK
Mode 3
Mode 3
Mode 0
Mode 0
Command
Command
99h
66h
SIO0
Figure 78. Reset Sequence (QPI mode)
tSHSL
CS#
MODE 3
MODE 3
MODE 3
SCLK
MODE 0
SIO[3:0]
P/N: PM2145
Command
MODE 0
66h
Command
MODE 0
99h
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MX25L12845G
9-41.Read SFDP Mode (RDSFDP)
The Serial Flash Discoverable Parameter (SFDP) standard provides a consistent method of describing the functional
and feature capabilities of serial flash devices in a standard set of internal parameter tables. These parameter tables
can be interrogated by host system software to enable adjustments needed to accommodate divergent features
from multiple vendors. The concept is similar to the one found in the Introduction of JEDEC Standard, JESD68 on
CFI.
The sequence of issuing RDSFDP instruction is CS# goes low→send RDSFDP instruction (5Ah)→send 3 address
bytes on SI pin→send 1 dummy byte on SI pin→read SFDP code on SO→to end RDSFDP operation can use CS#
to high at any time during data out.
SFDP is a JEDEC standard, JESD216B.
Figure 79. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence
CS#
0
1
2
3
4
5
6
7
8
9 10
28 29 30 31
SCLK
Command
SI
SO
24 BIT ADDRESS
23 22 21
5Ah
3
2
1
0
High-Z
CS#
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCLK
Dummy Cycle
SI
7
6
5
4
3
2
1
0
DATA OUT 2
DATA OUT 1
SO
7
6
5
3
2
1
0
7
MSB
MSB
P/N: PM2145
4
80
6
5
4
3
2
1
0
7
MSB
REV. 1.1, FEB. 18, 2016
MX25L12845G
Table 10. Signature and Parameter Identification Data Values
SFDP Table (JESD216B) below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
SFDP Signature
Comment
Fixed: 50444653h
Add (h) DW Add Data (h/b) Data
(Byte)
(Bit)
(Note1)
(h)
00h
07:00
53h
53h
01h
15:08
46h
46h
02h
23:16
44h
44h
03h
31:24
50h
50h
SFDP Minor Revision Number
Start from 00h
04h
07:00
06h
06h
SFDP Major Revision Number
Start from 01h
This number is 0-based. Therefore,
0 indicates 1 parameter header.
05h
15:08
01h
01h
06h
23:16
02h
02h
07h
31:24
FFh
FFh
00h: it indicates a JEDEC specified
header.
08h
07:00
00h
00h
Number of Parameter Headers
Unused
ID number (JEDEC)
Parameter Table Minor Revision
Number
Parameter Table Major Revision
Number
Parameter Table Length
(in double word)
Start from 00h
09h
15:08
06h
06h
Start from 01h
0Ah
23:16
01h
01h
How many DWORDs in the
Parameter table
0Bh
31:24
10h
10h
0Ch
07:00
30h
30h
Parameter Table Pointer (PTP)
First address of JEDEC Flash
Parameter table
0Dh
15:08
00h
00h
0Eh
23:16
00h
00h
0Fh
31:24
FFh
FFh
Unused
P/N: PM2145
81
REV. 1.1, FEB. 18, 2016
MX25L12845G
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
ID number
(Macronix manufacturer ID)
Parameter Table Minor Revision
Number
Parameter Table Major Revision
Number
Parameter Table Length
(in double word)
Parameter Table Pointer (PTP)
Comment
it indicates Macronix manufacturer
ID
10h
07:00
C2h
C2h
Start from 00h
11h
15:08
00h
00h
Start from 01h
12h
23:16
01h
01h
How many DWORDs in the
Parameter table
13h
31:24
04h
04h
14h
07:00
10h
10h
15h
15:08
01h
01h
16h
23:16
00h
00h
17h
31:24
FFh
FFh
4-byte Address Instruction
parameter ID
18h
07:00
84h
84h
Start from 00h
19h
15:08
00h
00h
Start from 01h
1Ah
23:16
01h
01h
How many DWORDs in the
Parameter table
1Bh
31:24
02h
02h
1Ch
07:00
C0h
C0h
1Dh
15:08
00h
00h
1Eh
23:16
00h
00h
1Fh
31:24
FFh
FFh
First address of Macronix Flash
Parameter table
Unused
ID number
(4-byte Address Instruction)
Parameter Table Minor Revision
Number
Parameter Table Major Revision
Number
Parameter Table Length
(in double word)
Parameter Table Pointer (PTP)
First address of 4-byte Address
Instruction table
Unused
P/N: PM2145
Add (h) DW Add Data (h/b) Data
(Byte)
(Bit)
(Note1)
(h)
82
REV. 1.1, FEB. 18, 2016
MX25L12845G
Table 11. Parameter Table (0): JEDEC Flash Parameter Tables
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Comment
Block/Sector Erase sizes
00: Reserved, 01: 4KB erase,
10: Reserved,
11: not supported 4KB erase
Write Granularity
0: 1Byte, 1: 64Byte or larger
Write Enable Instruction Required 0: not required
1: required 00h to be written to the
for Writing to Volatile Status
status register
Registers
Add (h) DW Add Data (h/b)
(Byte)
(Bit)
(Note1)
01b
02
1b
03
0b
30h
0: use 50h instruction
1: use 06h instruction
Write Enable Instruction Select for
Note: If target flash status register is
Writing to Volatile Status Registers
nonvolatile, then bits 3 and 4 must
be set to 00b.
Contains 111b and can never be
Unused
changed
4KB Erase Instruction
01:00
31h
E5h
04
0b
07:05
111b
15:08
20h
(1-1-2) Fast Read (Note2)
0=not supported 1=supported
16
1b
Address Bytes Number used in
addressing flash array
Double Transfer Rate (DTR)
Clocking
00: 3Byte only, 01: 3 or 4Byte,
10: 4Byte only, 11: Reserved
18:17
00b
0=not supported 1=supported
19
1b
20
1b
32h
Data
(h)
20h
F9h
(1-2-2) Fast Read
0=not supported 1=supported
(1-4-4) Fast Read
0=not supported 1=supported
21
1b
(1-1-4) Fast Read
0=not supported 1=supported
22
1b
23
1b
33h
31:24
FFh
37h:34h
31:00
07FF FFFFh
Unused
Unused
Flash Memory Density
(1-4-4) Fast Read Number of Wait
states (Note3)
(1-4-4) Fast Read Number of
Mode Bits (Note4)
0 0000b: Not supported; 0 0100b: 4
0 0110b: 6; 0 1000b: 8
Mode Bits:
000b: Not supported; 010b: 2 bits
(1-4-4) Fast Read Instruction
(1-1-4) Fast Read Number of Wait
states
(1-1-4) Fast Read Number of
Mode Bits
39h
0 0000b: Not supported; 0 0100b: 4
0 0110b: 6; 0 1000b: 8
Mode Bits:
000b: Not supported; 010b: 2 bits
(1-1-4) Fast Read Instruction
P/N: PM2145
38h
3Ah
3Bh
83
04:00
0 0100b
07:05
010b
15:08
EBh
20:16
0 1000b
23:21
000b
31:24
6Bh
FFh
44h
EBh
08h
6Bh
REV. 1.1, FEB. 18, 2016
MX25L12845G
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Comment
(1-1-2) Fast Read Number of Wait
states
(1-1-2) Fast Read Number of
Mode Bits
0 0000b: Not supported; 0 0100b: 4
0 0110b: 6; 0 1000b: 8
Mode Bits:
000b: Not supported; 010b: 2 bits
(1-1-2) Fast Read Instruction
(1-2-2) Fast Read Number of Wait
states
(1-2-2) Fast Read Number of
Mode Bits
0 0000b: Not supported; 0 0100b: 4
0 0110b: 6; 0 1000b: 8
Mode Bits:
000b: Not supported; 010b: 2 bits
3Eh
3Fh
0=not supported 1=supported
Unused
(4-4-4) Fast Read
3Ch
3Dh
(1-2-2) Fast Read Instruction
(2-2-2) Fast Read
Add (h) DW Add Data (h/b)
(Byte)
(Bit)
(Note1)
0=not supported 1=supported
40h
Unused
04:00
0 1000b
07:05
000b
15:08
3Bh
20:16
0 0100b
23:21
000b
31:24
BBh
00
0b
03:01
111b
04
1b
07:05
111b
Data
(h)
08h
3Bh
04h
BBh
FEh
Unused
43h:41h
31:08
FFh
FFh
Unused
45h:44h
15:00
FFh
FFh
20:16
0 0000b
23:21
000b
47h
31:24
FFh
FFh
49h:48h
15:00
FFh
FFh
20:16
0 0100b
23:21
010b
4Bh
31:24
EBh
EBh
4Ch
07:00
0Ch
0Ch
4Dh
15:08
20h
20h
4Eh
23:16
0Fh
0Fh
4Fh
31:24
52h
52h
50h
07:00
10h
10h
51h
15:08
D8h
D8h
52h
23:16
00h
00h
53h
31:24
FFh
FFh
(2-2-2) Fast Read Number of Wait
states
(2-2-2) Fast Read Number of
Mode Bits
0 0000b: Not supported; 0 0100b: 4
0 0110b: 6; 0 1000b: 8
Mode Bits:
000b: Not supported; 010b: 2 bits
(2-2-2) Fast Read Instruction
Unused
(4-4-4) Fast Read Number of Wait
states
(4-4-4) Fast Read Number of
Mode Bits
0 0000b: Not supported; 0 0100b: 4
0 0110b: 6; 0 1000b: 8
Mode Bits:
000b: Not supported; 010b: 2 bits
(4-4-4) Fast Read Instruction
Erase Type 1 Size
Sector/block size = 2^N bytes (Note5)
0Ch: 4KB; 0Fh: 32KB; 10h: 64KB
Erase Type 1 Erase Instruction
Erase Type 2 Size
Sector/block size = 2^N bytes
00h: N/A; 0Fh: 32KB; 10h: 64KB
Erase Type 2 Erase Instruction
Erase Type 3 Size
Sector/block size = 2^N bytes
00h: N/A; 0Fh: 32KB; 10h: 64KB
Erase Type 3 Erase Instruction
Erase Type 4 Size
00h: N/A, This sector type doesn't
exist
Erase Type 4 Erase Instruction
P/N: PM2145
84
46h
4Ah
00h
44h
REV. 1.1, FEB. 18, 2016
MX25L12845G
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Add (h) DW Add
(Byte)
(Bit)
Comment
Multiplier value: 0h~Fh (0~15)
Multiplier from typical erase time
Max. time = 2 * (Multiplier + 1) *
to maximum erase time
Typical Time
Erase Type 1 Erase Time
(Typical)
EraseType 2 Erase Time
(Typical)
Erase Type 3 Erase Time
(Typical)
Erase Type 4 Erase Time
(Typical)
Multiplier from typical time
to max time for Page or byte
program
Page Program Size
Page Program Time
(Typical)
Byte Program Time, First Byte
(Typical)
Byte Program Time, Additional
Byte
(Typical)
P/N: PM2145
Data (h/b)
(Note1)
03:00
0110b
07:04
08
1 1101b
10:09
00b
Count value: 00h~1Fh (0~31)
Typical Time = (Count + 1) * Units
15:11
0 1011b
Units
00: 1ms, 01: 16ms
10b: 128ms, 11b: 1s
17:16
01b
22:18
1 0111b
24:23
01b
29:25
0 0000b
31:30
00b
03:00
0010b
07:04
1000h
12:08
1 1111b
13
0b
15:14
17:16
1110b
18
0b
22:19
0000b
23
0b
54h
Count value: 00h~1Fh (0~31)
Typical Time = (Count + 1) * Units
Units
00: 1ms, 01: 16ms
10b: 128ms, 11b: 1s
55h
Count value: 00h~1Fh (0~31)
Typical Time = (Count + 1) * Units
Units
00: 1 ms, 01: 16 ms
10b: 128ms, 11b: 1s
Count value: 00h~1Fh (0~31)
Typical Time = (Count + 1) * Units
Units
00: 1ms, 01: 16ms
10b: 128 ms, 11b: 1 s
Multiplier value: 0h~Fh (0~15)
Max. time = 2 * (Multiplier + 1)
*Typical Time
Page size = 2^N bytes
2^8 = 256 bytes, 8h = 1000b
56h
57h
58h
Count value: 00h~1Fh (0~31)
Typical Time = (Count + 1) * Units
59h
Units
0: 8us, 1: 64us
Count value: 0h~Fh (0~15)
Typical Time = (Count + 1) * Units
Units
0: 1us, 1: 8us
Count value: 0h~Fh (0~15)
Typical Time = (Count + 1) * Units
Units
0: 1us, 1: 8us
85
5Ah
Data
(h)
D6h
59h
DDh
00h
82h
9Fh
03h
REV. 1.1, FEB. 18, 2016
MX25L12845G
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Chip Erase Time
(Typical)
Reserved
Prohibited Operations During
Program Suspend
Prohibited Operations During
Erase Suspend
Reserved
Program Resume to Suspend
Interval (Typical)
Program Suspend Latency
(Max.)
Erase Resume to Suspend
Interval (Typical)
Erase Suspend Latency
(Max.)
Suspend / Resume supported
Program Resume Instruction
Program Suspend Instruction
Erase Resume Instruction
Erase Suspend Instruction
P/N: PM2145
Comment
Count value: 00h~1Fh (0~31)
Typical Time = (Count + 1) * Units
Units
00: 16ms, 01: 256ms
10: 4s, 11: 64s
Reserved: 1b
xxx0b: May not initiate a new erase

anywhere
xx0xb: May not initiate a new page

program anywhere
x1xxb:
May
not initiate a read in

the program suspended
page size
1xxxb: The erase and program

restrictions in bits 1:0 are
sufficient
xxx0b: May not initiate a new erase

anywhere
xx1xb: May not initiate a page

program in the erase
suspended sector size
xx0xb: May not initiate a page

program anywhere
x1xxb: May not initiate a read in

the erase suspended sector
size
1xxxb: The erase and program

restrictions in bits 5:4 are
sufficient
Reserved: 1b
Count value: 0h~Fh (0~15)
Typical Time = (Count + 1) * 64us
Count value: 00h~1Fh (0~31)
Maximum Time = (Count + 1) * Units
Units
00: 128ns, 01: 1us
10: 8us, 11: 64us
Count value: 0h~Fh (0~15)
Typical Time = (Count + 1) * 64us
Count value: 00h~1Fh (0~31)
Maximum Time = (Count + 1) * Units
Units
00: 128ns, 01: 1us
10: 8us, 11: 64us
0= Support 1= Not supported
Instruction to Resume a Program
Instruction to Suspend a Program
Instruction to Resume Write/Erase
Instruction to Suspend Write/Erase
86
Add (h) DW Add
(Byte)
(Bit)
27:24
28
5Bh
Data (h/b)
(Note1)
0 1101b
30:29
10b
31
1b
03:00
0100b
5Ch
5Dh
5Eh
5Fh
60h
61h
62h
63h
Data
(h)
CDh
44h
07:04
0100b
08
1b
12:09
0001b
15:13
17:16
1 1000b
19:18
01b
23:20
0110b
28:24
1 1000b
30:29
01b
31
07:00
15:08
23:16
31:24
0b
30h
B0h
30h
B0h
03h
67h
38h
30h
B0h
30h
B0h
REV. 1.1, FEB. 18, 2016
MX25L12845G
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Comment
Reserved
Reserved: 11b
Bit 2: Read WIP bit [0] by 05h Read

instruction
Status Register Polling Device 
Bit 3: Read bit 7 of Status Register
Busy
by 70h Read instruction
(0=not supported 1=support)
Bit 07:04, Reserved: 1111b

Count value: 00h~1Fh (0~31)
Release from Deep Power-down Maximum Time = (Count + 1) * Units
Units
(RDP) Delay
00: 128ns, 01: 1us
(Max.)
10: 8us, 11: 64us
Release from Deep Power-down
Instruction to Exit Deep Power Down
(RDP) Instruction
Enter Deep Power Down
Instruction to Enter Deep Power
Instruction
Down
Deep Power Down Supported
0: Supported 1: Not supported
Methods to exit 4-4-4 mode
4-4-4 Mode Disable Sequences
xx1xb: issue F5h instruction

Methods to enter 4-4-4 mode
4-4-4 Mode Enable Sequences
x_x1xxb: issue instruction 35h

Performance Enhance Mode,
0-4-4 Mode Supported
Continuous Read, Execute in Place
0: Not supported 1: Supported
xx_xxx1b: Mode Bits[7:0] = 00h will

terminate this mode at the end
of the current read operation.
xx_xx1xb: If 3-Byte address active,

input Fh on DQ0-DQ3 for 8
clocks. If 4-Byte address active,
input Fh on DQ0-DQ3 for 10
0-4-4 Mode Exit Method
clocks.
xx_x1xxb: Reserved

xx_1xxxb: Input Fh (mode bit reset)

on DQ0-DQ3 for 8 clocks.
x1_xxxxb: Mode Bit[7:0]≠Axh

1x_xxxxb: Reserved

xxx1b: Mode Bits[7:0] = A5h Note:

QE must be set prior to using
this mode
0-4-4 Mode Entry Method
x1xxb: Mode Bit[7:0]=Axh

1xxxb: Reserved

000b: No QE bit. Detects 1-1-4/1-4
4 reads based on instruction
Quad Enable (QE) bit
010b: QE is bit 6 of Status Register.

Requirements
where 1=Quad Enable or
0=not Quad Enable
111b: Not Supported

HOLD and RESET Disable by bit
0: Not supported
4 of Ext. Configuration Register
P/N: PM2145
87
Add (h) DW Add
(Byte)
(Bit)
01:00
64h
65h
66h
67h
68h
Data (h/b)
(Note1)
11b
07:02
11 1101b
12:08
1 1101b
14:13
01b
15
22:16
23
30:24
31
1010 1011b
(ABh)
1011 1001b
(B9h)
0b
03:00
1010b
07:04
08
0 0100b
09
1b
69h
Data
(h)
F7h
BDh
D5h
5Ch
4Ah
BEh
15:10
10 1111b
19:16
1001h
6Ah
29h
22:20
010b
23
0b
REV. 1.1, FEB. 18, 2016
MX25L12845G
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Add (h) DW Add
(Byte)
(Bit)
Comment
Reserved
6Bh
xxx_xxx1b: Non-Volatile Status

Register 1, powers-up to last
Volatile or Non-Volatile Register
written value, use instruction
and Write Enable Instruction for
06h to enable write
Status Register 1
x1x_xxxxb: Reserved

1xx_xxxxb: Reserved

6Ch
Reserved
Soft Reset and Rescue
Sequence Support
Exit 4-Byte Addressing
P/N: PM2145
Return the device to its default
power-on state
x1_xxxxb: issue reset enable

instruction 66h, then issue reset
instruction 99h.
xx_xxxx_xxx1b: issue instruction

E9h to exit 4-Byte address
mode (write enable instruction
06h is not required)
xx_xxxx_x1xxb: 8-bit volatile

extended address register used
to define A[31:A24] bits. Read
with instruction C8h. Write
instruction is C5h, data length
is 1 byte. Return to lowest
memory segment by setting
A[31:24] to 00h and use 3-Byte
addressing.
xx_xx1x_xxxxb: Hardware reset

xx_x1xx_xxxxb: Software reset

(see bits 13:8 in this DWORD)
xx_1xxx_xxxxb: Power cycle

x1_xxxx_xxxxb: Reserved

1x_xxxx_xxxxb: Reserved

88
6Dh
6Eh
Data (h/b)
(Note1)
Data
(h)
31:24
FFh
FFh
06:00
111 0000b
07
1b
13:08
01 0000b
15:14
11b
23:16
1111 1111b
F0h
D0h
FFh
REV. 1.1, FEB. 18, 2016
MX25L12845G
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Enter 4-Byte Addressing
P/N: PM2145
Comment
xxxx_xxx1b: issue instruction

B7h (preceding write
enable not required)
xxxx_x1xxb: 8-bit volatile extended

address register used
to define A[31:24] bits.
Read with instruction
C8h. Write instruction
is C5h with 1 byte of
data. Select the active
128 Mbit memory
segment by setting the
appropriate A[31:24]
bits and use 3-Byte
addressing.
xx1x_xxxxb: Supports dedicated

4-Byte address
instruction set. Consult
vendor data sheet
for the instruction set
definition.
1xxx_xxxxb: Reserved

89
Add (h) DW Add
(Byte)
(Bit)
6Fh
31:24
Data (h/b)
(Note1)
Data
(h)
1111 1111b
FFh
REV. 1.1, FEB. 18, 2016
MX25L12845G
Table 12. Parameter Table (1): 4-Byte Instruction Tables
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Support for (1-1-1) READ
Command, Instruction=13h
Support for (1-1-1) FAST_READ
Command, Instruction=0Ch
Support for (1-1-2) FAST_READ
Command, Instruction=3Ch
Support for (1-2-2) FAST_READ
Command, Instruction=BCh
Support for (1-1-4) FAST_READ
Command, Instruction=6Ch
Support for (1-4-4) FAST_READ
Command, Instruction=ECh
Support for (1-1-1) Page Program
Command, Instruction=12h
Support for (1-1-4) Page Program
Command, Instruction=34h
Support for (1-4-4) Page Program
Command, Instruction=3Eh
Support for Erase Command –
Type 1 size, Instruction lookup in
next Dword
Support for Erase Command –
Type 2 size, Instruction lookup in
next Dword
Support for Erase Command –
Type 3 size, Instruction lookup in
next Dword
Support for Erase Command –
Type 4 size, Instruction lookup in
next Dword
Support for (1-1-1) DTR_Read
Command, Instruction=0Eh
Support for (1-2-2) DTR_Read
Command, Instruction=BEh
Support for (1-4-4) DTR_Read
Command, Instruction=EEh
P/N: PM2145
Comment
Add (h) DW Add Data (h/b) Data
(Byte)
(Bit)
(Note1)
(h)
0=not supported 1=supported
00
0b
0=not supported 1=supported
01
0b
0=not supported 1=supported
02
0b
03
0b
04
0b
0=not supported 1=supported
05
0b
0=not supported 1=supported
06
0b
0=not supported 1=supported
07
0b
0=not supported 1=supported
08
0b
0=not supported 1=supported
09
0b
0=not supported 1=supported
10
0b
11
0b
0=not supported 1=supported
12
0b
0=not supported 1=supported
13
0b
0=not supported 1=supported
14
0b
0=not supported 1=supported
15
0b
0=not supported 1=supported
0=not supported 1=supported
0=not supported 1=supported
90
C0h
C1h
00h
00h
REV. 1.1, FEB. 18, 2016
MX25L12845G
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Support for volatile individual
sector lock Read command,
Instruction=E0h
Support for volatile individual
sector lock Write command,
Instruction=E1h
Support for non-volatile individual
sector lock read command,
Instruction=E2h
Support for non-volatile individual
sector lock write command,
Instruction=E3h
Comment
Add (h) DW Add Data (h/b) Data
(Byte)
(Bit)
(Note1)
(h)
0=not supported 1=supported
16
1b
0=not supported 1=supported
17
1b
18
1b
19
1b
23:20
1111b
0=not supported 1=supported
C2h
0=not supported 1=supported
FFh
Reserved
Reserved
Reserved
Reserved
C3h
31:24
FFh
FFh
Instruction for Erase Type 1
FFh=not supported
C4h
07:00
FFh
FFh
Instruction for Erase Type 2
FFh=not supported
C5h
15:08
FFh
FFh
Instruction for Erase Type 3
FFh=not supported
C6h
23:16
FFh
FFh
Instruction for Erase Type 4
FFh=not supported
C7h
31:24
FFh
FFh
P/N: PM2145
91
REV. 1.1, FEB. 18, 2016
MX25L12845G
Table 13. Parameter Table (2): Macronix Flash Parameter Tables
SFDP Table below is for MX25L12845GM2I-10G, MX25L12845GMI-10G, MX25L12845GZNI-10G,
MX25L12845GM2I-08G, MX25L12845GMI-08G and MX25L12845GZNI-08G
Description
Add (h)
(Byte)
Comment
DW Add Data (h/b)
(Bit)
(Note1)
Data
(h)
Vcc Supply Maximum Voltage
2000h=2.000V
2700h=2.700V
3600h=3.600V
111h:110h
07:00
15:08
00h
36h
00h
36h
Vcc Supply Minimum Voltage
1650h=1.650V, 1750h=1.750V
2250h=2.250V, 2300h=2.300V
2350h=2.350V, 2650h=2.650V
2700h=2.700V
113h: 112h
23:16
31:24
00h
27h
00h
27h
H/W Reset# pin
0=not supported 1=supported
00
1b
H/W Hold# pin
0=not supported 1=supported
01
0b
Deep Power Down Mode
0=not supported 1=supported
02
1b
S/W Reset
0=not supported 1=supported
03
1b
S/W Reset Instruction
Reset Enable (66h) should be
issued before Reset Instruction
Program Suspend/Resume
0=not supported 1=supported
12
1b
Erase Suspend/Resume
0=not supported 1=supported
13
1b
14
1b
15
1b
116h
23:16
C0h
C0h
117h
31:24
64h
64h
115h: 114h
Unused
Wrap-Around Read mode
0=not supported 1=supported
Wrap-Around Read mode
Instruction
11:04
1001 1001b F99Dh
(99h)
Wrap-Around Read data length
08h:support 8B wrap-around read
16h:8B&16B
32h:8B&16B&32B
64h:8B&16B&32B&64B
Individual block lock
0=not supported 1=supported
00
1b
Individual block lock bit
(Volatile/Nonvolatile)
0=Volatile 1=Nonvolatile
01
0b
09:02
1110 0001b
(E1h)
10
0b
11
1b
Individual block lock Instruction
Individual block lock Volatile
protect bit default protect status
0=protect 1=unprotect
Secured OTP
0=not supported 1=supported
Read Lock
0=not supported 1=supported
12
0b
Permanent Lock
0=not supported 1=supported
13
0b
Unused
15:14
11b
Unused
31:16
FFh
FFh
31:00
FFh
FFh
Unused
P/N: PM2145
11Bh: 118h
11Fh: 11Ch
92
CB85h
REV. 1.1, FEB. 18, 2016
MX25L12845G
Note 1:h/b is hexadecimal or binary.
Note 2:(x-y-z) means I/O mode nomenclature used to indicate the number of active pins used for the opcode (x),
address (y), and data (z). At the present time, the only valid Read SFDP instruction modes are: (1-1-1), (2-2-2),
and (4-4-4)
Note 3:Wait States is required dummy clock cycles after the address bits or optional mode bits.
Note 4:Mode Bits is optional control bits that follow the address bits. These bits are driven by the system controller
if they are specified. (eg,read performance enhance toggling bits)
Note 5:4KB=2^0Ch, 32KB=2^0Fh, 64KB=2^10h
Note 6:All unused and undefined area data is blank FFh for SFDP Tables that are defined in Parameter
Identification Header. All other areas beyond defined SFDP Table are reserved by Macronix.
P/N: PM2145
93
REV. 1.1, FEB. 18, 2016
MX25L12845G
10. RESET
Driving the RESET# pin low for a period of tRLRH or longer will reset the device. After reset cycle, the device is at
the following states:
- Standby mode
- All the volatile bits such as WEL/WIP/SRAM lock bit will return to the default status as power on.
- 3-byte address mode
If the device is under programming or erasing, driving the RESET# pin low will also terminate the operation and data
could be lost. During the resetting cycle, the SO data becomes high impedance and the current will be reduced to
minimum.
Figure 80. RESET Timing
CS#
tRHSL
SCLK
tRH tRS
RESET#
tRLRH
tREADY1 / tREADY2
Table 14. Reset Timing-(Power On)
Symbol Parameter
tRHSL Reset# high before CS# low
tRS
Reset# setup time
tRH
Reset# hold time
tRLRH Reset# low pulse width
tREADY1 Reset Recovery time
Min.
10
15
15
10
35
Typ.
Max.
Unit
us
ns
ns
us
us
Min.
10
15
15
10
40
35
310
12
25
100
40
Typ.
Max.
Unit
us
ns
ns
us
us
us
us
ms
ms
ms
ms
Table 15. Reset Timing-(Other Operation)
Symbol
tRHSL
tRS
tRH
tRLRH
Parameter
Reset# high before CS# low
Reset# setup time
Reset# hold time
Reset# low pulse width
Reset Recovery time (During instruction decoding)
Reset Recovery time (for read operation)
Reset Recovery time (for program operation)
tREADY2 Reset Recovery time(for SE4KB operation)
Reset Recovery time (for BE64K/BE32KB operation)
Reset Recovery time (for Chip Erase operation)
Reset Recovery time (for WRSR operation)
P/N: PM2145
94
REV. 1.1, FEB. 18, 2016
MX25L12845G
11. POWER-ON STATE
The device is at the following states after power-up:
- Standby mode (please note it is not deep power-down mode)
- Write Enable Latch (WEL) bit is reset
The device must not be selected during power-up and power-down stage until the VCC reaches the following levels:
- VCC minimum at power-up stage and then after a delay of tVSL
- GND at power-down
Please note that a pull-up resistor on CS# may ensure a safe and proper power-up/down level.
An internal power-on reset (POR) circuit may protect the device from data corruption and inadvertent data change
during power up state. When VCC is lower than VWI (POR threshold voltage value), the internal logic is reset and
the flash device has no response to any command.
For further protection on the device, if the VCC does not reach the VCC minimum level, the correct operation is not
guaranteed. The write, erase, and program command should be sent after the below time delay:
- tVSL after VCC reached VCC minimum level
The device can accept read command after VCC reached VCC minimum and a time delay of tVSL.
Please refer to the "Figure 87. Power-up Timing".
Note:
- To stabilize the VCC level, the VCC rail decoupled by a suitable capacitor close to package pins is
recommended. (generally around 0.1uF)
- At power-down stage, the VCC drops below VWI level, all operations are disable and device has no response to
any command. The data corruption might occur during this stage if a write, program, erase cycle is in progress.
P/N: PM2145
95
REV. 1.1, FEB. 18, 2016
MX25L12845G
12. ELECTRICAL SPECIFICATIONS
Table 16. ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature
Industrial grade
-40°C to 85°C
Storage Temperature
-65°C to 150°C
Applied Input Voltage
-0.5V to VCC+0.5V
Applied Output Voltage
-0.5V to VCC+0.5V
VCC to Ground Potential
-0.5V to 4.0V
NOTICE:
1.Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage
to the device. This is stress rating only and functional operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended period may affect reliability.
2. Specifications contained within the following tables are subject to change.
3. During voltage transitions, all pins may overshoot Vss to -2.0V and Vcc to +2.0V for periods up to 20ns, see
"Figure 81. Maximum Negative Overshoot Waveform" and "Figure 82. Maximum Positive Overshoot Waveform".
Figure 81. Maximum Negative Overshoot Waveform
20ns
Figure 82. Maximum Positive Overshoot Waveform
20ns
20ns
Vss
Vcc + 2.0V
Vss-2.0V
Vcc
20ns
20ns
20ns
Table 17. CAPACITANCE TA = 25°C, f = 1.0 MHz
Symbol Parameter
CIN
COUT
P/N: PM2145
Min.
Typ.
Max.
Unit
Input Capacitance
8
pF
VIN = 0V
Output Capacitance
10
pF
VOUT = 0V
96
Conditions
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 83. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL
Input timing reference level
0.8VCC
Output timing reference level
0.7VCC
AC
Measurement
Level
0.8V
0.2VCC
0.5VCC
Note: Input pulse rise and fall time are <5ns
Figure 84. OUTPUT LOADING
25K ohm
DEVICE UNDER
TEST
CL
+3V
25K ohm
CL=30pF Including jig capacitance
P/N: PM2145
97
REV. 1.1, FEB. 18, 2016
MX25L12845G
Table 18. DC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V - 3.6V)
Symbol Parameter
Notes
Min.
Typ.
Max.
Units Test Conditions
ILI
Input Load Current
1
±2
uA
VCC = VCC Max,
VIN = VCC or GND
ILO
Output Leakage Current
1
±2
uA
VCC = VCC Max,
VOUT = VCC or GND
ISB1
VCC Standby Current
1
15
100
uA
VIN = VCC or GND,
CS# = VCC
ISB2
Deep Power-down
Current
3
20
uA
VIN = VCC or GND,
CS# = VCC
25
mA
f=133MHz, (4 x I/O read)
SCLK=0.1VCC/0.9VCC,
SO=Open
20
mA
f=104MHz, (4 x I/O read)
SCLK=0.1VCC/0.9VCC,
SO=Open
15
mA
f=84MHz,
SCLK=0.1VCC/0.9VCC,
SO=Open
12
20
mA
10
12
mA
1
10
25
mA
Erase in Progress,
CS#=VCC
1
14
25
mA
Erase in Progress,
CS#=VCC
-0.5
0.8
V
0.7VCC
VCC+0.4
V
0.2
V
IOL = 100uA
V
IOH = -100uA
ICC1
VCC Read
VIL
VCC Program Current
(PP)
VCC Write Status
Register (WRSR) Current
VCC Sector/Block (32K,
64K) Erase Current
(SE/BE/BE32K)
VCC Chip Erase Current
(CE)
Input Low Voltage
VIH
Input High Voltage
VOL
Output Low Voltage
VOH
Output High Voltage
ICC2
ICC3
ICC4
ICC5
1
12
1
VCC-0.2
Program in Progress,
CS# = VCC
Program status register in
progress, CS#=VCC
Notes :
1. Typical values at VCC = 3.3V, T = 25°C. These currents are valid for all product versions (package and speeds).
2. Typical value is calculated by simulation.
P/N: PM2145
98
REV. 1.1, FEB. 18, 2016
MX25L12845G
Table 19. AC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V - 3.6V)
Symbol
fSCLK
fRSCLK
fTSCLK
Alt.
fC
fR
fT
fQ
tCH(1)
tCLH
tCL(1)
tCLL
(2)
tCLCH
tCHCL(2)
tSLCH tCSS
tCHSL
tDVCH tDSU
tCHDX
tDH
tCHSH
tSHCH
tSHSL
tSHQZ
(2)
tCSH
tDIS
tCLQV
tV
tCLQX
tWHSL(3)
tSHWL(3)
tDP(2)
tHO
tRES1
(2)
tRES2(2)
tW
tBP
tPP
tSE
tBE32
tBE
tCE
tESL(6)
tPSL(6)
tPRS(7)
tERS(8)
tQVD(9)
P/N: PM2145
Parameter
Clock Frequency for all commands (except Read)
Clock Frequency for READ instructions
Clock Frequency for 2READ instructions
Clock Frequency for 4READ instructions
Others (fSCLK)
Clock High Time
Normal Read (fRSCLK)
Others (fSCLK)
Clock Low Time
Normal Read (fRSCLK)
Clock Rise Time (peak to peak)
Clock Fall Time (peak to peak)
CS# Active Setup Time (relative to SCLK)
CS# Not Active Hold Time (relative to SCLK)
Data In Setup Time
Data In Hold Time
CS# Active Hold Time (relative to SCLK)
CS# Not Active Setup Time (relative to SCLK)
Read
CS# Deselect Time
Write/Erase/Program
Output Disable Time
Clock Low to Output Valid Loading: 30pF
Loading: 30pF/15pF
Loading: 15pF
Output Hold Time
Write Protect Setup Time
Write Protect Hold Time
CS# High to Deep Power-down Mode
CS# High to Standby Mode without Electronic Signature
Read
CS# High to Standby Mode with Electronic Signature Read
Write Status/Configuration Register Cycle Time
Byte-Program
Page Program Cycle Time
Sector Erase Cycle Time
Block Erase (32KB) Cycle Time
Block Erase (64KB) Cycle Time
Chip Erase Cycle Time
Erase Suspend Latency
Program Suspend Latency
Latency between Program Resume and next Suspend
Latency between Erase Resume and next Suspend
Data Output Valid Time Difference among all SIO pins
99
Min.
D.C.
Typ.
3.3
7
3.3
7
0.1
0.1
3
3
2
2
3
3
7
30
10
Unit
MHz
MHz
MHz
MHz
ns
ns
ns
ns
V/ns
V/ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
30
us
30
40
30
1.5
400
1000
2000
200
25
25
us
ms
us
ms
ms
ms
ms
s
us
us
us
us
ps
8
8
6
0
20
100
15
0.25
30
180
380
55
0.3
0.3
Max.
120
50
80(5)
80(5)
100
400
600
REV. 1.1, FEB. 18, 2016
MX25L12845G
Notes:
1. tCH + tCL must be greater than or equal to 1/ Frequency.
2. Typical values given for TA=25°C. Not 100% tested.
3. Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.
4. Test condition is shown as "Figure 83. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL" and "Figure
84. OUTPUT LOADING".
5. By default dummy cycle value. Please refer to the "Table 1. Read performance Comparison".
6. Latency time is required to complete Erase/Program Suspend operation until WIP bit is "0".
7. For tPRS, minimum timing must be observed before issuing the next program suspend command. However, a
period equal to or longer than the typical timing is required in order for the program operation to make progress.
8. For tERS, minimum timing must be observed before issuing the next erase suspend command. However, a
period equal to or longer than the typical timing is required in order for the erase operation to make progress.
9. Not 100% tested.
P/N: PM2145
100
REV. 1.1, FEB. 18, 2016
MX25L12845G
13. OPERATING CONDITIONS
At Device Power-Up and Power-Down
AC timing illustrated in "Figure 85. AC Timing at Device Power-Up" and "Figure 86. Power-Down Sequence" are
for the supply voltages and the control signals at device power-up and power-down. If the timing in the figures is
ignored, the device will not operate correctly.
During power-up and power-down, CS# needs to follow the voltage applied on VCC to keep the device not to be
selected. The CS# can be driven low when VCC reach Vcc(min.) and wait a period of tVSL.
Figure 85. AC Timing at Device Power-Up
VCC
VCC(min)
GND
tVR
tSHSL
CS#
tSLCH
tCHSL
tCHSH
tSHCH
SCLK
tDVCH
tCHCL
tCHDX
LSB IN
MSB IN
SI
High Impedance
SO
Symbol
tVR
tCLCH
Parameter
VCC Rise Time
Notes
1
Min.
20
Max.
500000
Unit
us/V
Notes:
1.Sampled, not 100% tested.
2.For AC spec tCHSL, tSLCH, tDVCH, tCHDX, tSHSL, tCHSH, tSHCH, tCHCL, tCLCH in the figure, please refer to
"Table 19. AC CHARACTERISTICS (Temperature = -40°C to 85°C, VCC = 2.7V - 3.6V)".
P/N: PM2145
101
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 86. Power-Down Sequence
During power-down, CS# needs to follow the voltage drop on VCC to avoid mis-operation.
VCC
CS#
SCLK
Figure 87. Power-up Timing
VCC
VCC(max)
Chip Selection is Not Allowed
VCC(min)
tVSL
Device is fully accessible
VWI
time
P/N: PM2145
102
REV. 1.1, FEB. 18, 2016
MX25L12845G
Figure 88. Power Up/Down and Voltage Drop
For Power-down to Power-up operation, the VCC of flash device must below VPWD for at least tPWD timing. Please
check the table below for more detail.
VCC
VCC (max.)
Chip Select is not allowed
VCC (min.)
tVSL
Full Device
Access
Allowed
VPWD (max.)
tPWD
Time
Table 20. Power-Up/Down Voltage and Timing
Symbol
tVSL
VWI
VPWD
tPWD
tVR
VCC
Parameter
VCC(min.) to device operation
Write Inhibit Voltage
VCC voltage needed to below VPWD for ensuring initialization will occur
The minimum duration for ensuring initialization will occur
VCC Rise Time
VCC Power Supply
Min.
1200
1.5
300
20
2.7
Max.
2.5
0.9
500000
3.6
Unit
us
V
V
us
us/V
V
Note: These parameters are characterized only.
13-1.INITIAL DELIVERY STATE
The device is delivered with the memory array erased: all bits are set to 1 (each byte contains FFh). The Status
Register contains 00h (all Status Register bits are 0).
P/N: PM2145
103
REV. 1.1, FEB. 18, 2016
MX25L12845G
14. ERASE AND PROGRAMMING PERFORMANCE
Parameter
Min.
Typ. (1)
Write Status Register Cycle Time
Max. (2)
Unit
40
ms
Sector Erase Cycle Time (4KB)
30
400
ms
Block Erase Cycle Time (32KB)
0.18
1
s
Block Erase Cycle Time (64KB)
0.38
2
s
Chip Erase Cycle Time
55
200
s
Byte Program Time (via page program command)
15
30
us
0.25
1.5
ms
Page Program Time
Erase/Program Cycle
100,000
cycles
Note:
1. Typical program and erase time assumes the following conditions: 25°C, 3.3V, and all zero pattern.
2. Under worst conditions of 85°C and 2.7V.
3. System-level overhead is the time required to execute the first-bus-cycle sequence for the programming
command.
4. The maximum chip programming time is evaluated under the worst conditions of 0°C, VCC=3.3V, and 100K
cycle with 90% confidence level.
15. ERASE AND PROGRAMMING PERFORMANCE (Factory Mode)
Parameter
Min.
Typ.
Max.
Unit
Sector Erase Cycle Time (4KB)
18
ms
Block Erase Cycle Time (32KB)
100
ms
Block Erase Cycle Time (64KB)
200
ms
45
s
0.16
ms
Chip Erase Cycle Time
Page Program Time
Erase/Program Cycle
50
cycles
Notice:
1. Factory Mode must be operated in 20°C to 45°C and VCC 3.0V-3.6V.
2. The Maximum Erase/Program cycles should not exceed 50 cycles.
3. During factory mode, Suspend command (B0) cannot be executed.
P/N: PM2145
104
REV. 1.1, FEB. 18, 2016
MX25L12845G
16. DATA RETENTION
Parameter
Condition
Min.
Data retention
55˚C
20
Max.
Unit
years
17. LATCH-UP CHARACTERISTICS
Min.
Max.
Input Voltage with respect to GND on all power pins, SI, CS#
-1.0V
2 VCCmax
Input Voltage with respect to GND on SO
-1.0V
VCC + 1.0V
-100mA
+100mA
Current
Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at a time.
P/N: PM2145
105
REV. 1.1, FEB. 18, 2016
MX25L12845G
18. ORDERING INFORMATION
Please contact our regional sales for the latest product selection and available form factors.
PART NO.
TEMPERATURE
PACKAGE
MX25L12845GMI-10G
-40°C to 85°C
16-SOP (300mil)
MX25L12845GM2I-10G
-40°C to 85°C
8-SOP(200mil)
MX25L12845GZNI-10G
-40°C to 85°C
8-WSON (6x5mm)
MX25L12845GMI-08G
-40°C to 85°C
16-SOP (300mil)
Support Factory Mode
MX25L12845GM2I-08G
-40°C to 85°C
8-SOP(200mil)
Support Factory Mode
MX25L12845GZNI-08G
-40°C to 85°C
8-WSON (6x5mm)
Support Factory Mode
P/N: PM2145
106
Remark
REV. 1.1, FEB. 18, 2016
MX25L12845G
19. PART NAME DESCRIPTION
MX 25
L
12845G M2
I
10 G
OPTION:
G: RoHS Compliant and Halogen-free
SPEED:
10: 104MHz
08: 133MHz
TEMPERATURE RANGE:
I: Industrial (-40°C to 85°C)
PACKAGE:
M: 16-SOP (300mil)
M2: 8-SOP(200mil)
ZN: 8-WSON (6x5mm)
DENSITY & MODE:
12845G: 128Mb
TYPE:
L: 3V
DEVICE:
25: Serial NOR Flash
P/N: PM2145
107
REV. 1.1, FEB. 18, 2016
MX25L12845G
20. PACKAGE INFORMATION
20-1.16-PIN SOP (300mil)
P/N: PM2145
108
REV. 1.1, FEB. 18, 2016
MX25L12845G
20-2.8-pins SOP (200mil)
P/N: PM2145
109
REV. 1.1, FEB. 18, 2016
MX25L12845G
20-3.8-land WSON (6x5mm)
P/N: PM2145
110
REV. 1.1, FEB. 18, 2016
MX25L12845G
21. REVISION HISTORY
Revision No.Description
1.0
1. Content correction
2. Removed "ADVANCED INFORMATION"
to align with product status
3. Updated Max. ISB1, Typ. Block/Chip Erase cycle time
and Typ. Byte Program Time
4. Added Preamble Bit
5. Updated SFDP tables
6. Added DPB and USPB, GBLK and GBULK information to Advanced Sector Protection chapter
7. Added tQVD parameter
and updated Output Timing (DTR mode) figure.
Page
P4,8,69,72,96
All
P84-85,95-96
P101
P32,48-51
P79-91
P13,18,21
67,73-74
P98-99
P14
1. Added MX25L12845GMI-08G, MX25L12845GM2I-08G and
P106,107
1.1
MX25L12845GZNI-08G Part No.
2. Added Factory Mode information
P17,22-23,104
3. Added a statement for product ordering information
P106
P/N: PM2145
111
Date
JUN/05/2015
FEB/18/2016
REV. 1.1, FEB. 18, 2016
MX25L12845G
Except for customized products which has been expressly identified in the applicable agreement, Macronix's
products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or
household applications only, and not for use in any applications which may, directly or indirectly, cause death,
personal injury, or severe property damages. In the event Macronix products are used in contradicted to their
target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its
actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or
distributors shall be released from any and all liability arisen therefrom.
Copyright© Macronix International Co., Ltd. 2014~2016. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit,
NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC,
Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au­dio, Rich Book, Rich TV, and FitCAM. The names
and brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
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