Data Sheet

TDA6107AJF
Triple video output amplifier
Rev. 02 — 28 April 2005
Product data sheet
1. General description
The TDA6107AJF contains three video output amplifiers which are intended to drive the
three cathodes of a color CRT. The device is contained in a plastic DIL-bent-SIL 9-pin
medium power (DBS9MPF) package, and uses high-voltage DMOS technology.
To obtain maximum performance, the amplifier should be used with black-current control.
2. Features
■
■
■
■
■
■
■
■
Typical bandwidth of 5.5 MHz for an output signal of 60 V (p-p)
High slew rate of 900 V/µs
No external components required
Very simple application
Single supply voltage of 200 V
Internal reference voltage of 2.5 V
Fixed gain of 81
Black-Current Stabilization (BCS) circuit with voltage window from 1.8 V to 6 V and
current window from +100 µA to −10 mA
■ Thermal protection
■ Internal protection against positive flashover discharges appearing on the CRT
3. Ordering information
Table 1:
Ordering information
Type number
TDA6107AJF
Package
Name
Description
Version
DBS9MPF
plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
TDA6107AJF
Philips Semiconductors
Triple video output amplifier
4. Block diagram
VDD
6
MIRROR 5
MIRROR 1
TDA6107AJF
CASCODE 1
3×
MIRROR 4
CURRENT
SOURCE
9, 8, 7
1×
Voc(1),
Voc(2),
Voc(3)
1×
THERMAL
PROTECTION
CIRCUIT
Vi(1),
Vi(2),
Vi(3)
1, 2, 3
Rf
VIP
REFERENCE
DIFFERENTIAL
STAGE
5
MIRROR 3
Ri
Iom
Ra
3×
CASCODE 2
MIRROR 2
4
mce457
Fig 1. Block diagram (one amplifier shown)
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Product data sheet
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Rev. 02 — 28 April 2005
2 of 16
TDA6107AJF
Philips Semiconductors
Triple video output amplifier
5. Pinning information
5.1 Pinning
Vi(1)
1
Vi(2)
2
Vi(3)
3
GND
4
Iom
5
VDD
6
Voc(3)
7
Voc(2)
8
Voc(1)
9
TDA6107AJF
001aac587
Fig 2. Pin configuration
5.2 Pin description
Table 2:
Pin description
Symbol
Pin
Description
Vi(1)
1
inverting input 1
Vi(2)
2
inverting input 2
Vi(3)
3
inverting input 3
GND
4
ground (fin)
Iom
5
black-current measurement output
VDD
6
supply voltage
Voc(3)
7
cathode output 3
Voc(2)
8
cathode output 2
Voc(1)
9
cathode output 1
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Rev. 02 — 28 April 2005
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TDA6107AJF
Philips Semiconductors
Triple video output amplifier
6. Internal circuitry
to cascode
stage
GND
VDD
4
6
to black-current
measurement circuit
TDA6107AJF
1, 2, 3
(1)
esd
from
input
circuit
flash
7, 8, 9
esd
esd
to black-current
measurement circuit
from
input
circuit
from
control
circuit
5
esd
6.8 V
Vbias
from blackcurrent
measurement
circuit
from
control
circuit
esd
esd
to black-current
measurement circuit
to black-current
measurement circuit
mce458
(1) All pins have an energy protection for positive or negative overstress situations.
Fig 3. Internal pin configuration
7. Limiting values
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages measured with respect to ground; currents
as specified in Figure 9; unless otherwise specified.
Symbol
Parameter
Min
Max
Unit
VDD
supply voltage
Conditions
0
250
V
Vi
input voltage at pins Vi(1), Vi(2) and Vi(3)
0
12
V
Vom
measurement output voltage
0
6
V
|Iom(mean)|
absolute value of mean current of
measurement output (for three channels)
-
5.6
mA
Voc
cathode output voltage
0
VDD
V
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
Vesd
electrostatic discharge voltage
Voc = 0 V to VDD;
Vom = 1.8 V to 6 V
−20
+150
°C
Human Body Model (HBM)
-
±3000
V
Machine Model (MM)
-
±300
V
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Rev. 02 — 28 April 2005
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TDA6107AJF
Philips Semiconductors
Triple video output amplifier
8. Thermal characteristics
Table 4:
Thermal characteristics
Symbol
Parameter
Rth(j-a)
thermal resistance from junction to ambient in free air
Rth(j-fin)
[1]
Conditions
[1]
thermal resistance from junction to fin
Typ
Unit
56
K/W
11
K/W
An external heatsink is necessary; see Application Note AN10227-01.
mbh989
8
Ptot
(W)
(1)
6
4
(2)
2
0
−40
0
40
80
120
160
Tamb (°C)
(1) Infinite heatsink.
(2) No heatsink.
Fig 4. Power derating curves
8.1 Thermal protection
The internal thermal protection circuit gives a decrease of the slew rate at high
temperatures: 10 % decrease at 130 °C and 30 % decrease at 145 °C (typical values on
the spot of the thermal protection circuit).
outputs
5 K/W
thermal protection circuit
6 K/W
fin
mgk279
Fig 5. Equivalent thermal resistance network
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Rev. 02 — 28 April 2005
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TDA6107AJF
Philips Semiconductors
Triple video output amplifier
9. Characteristics
Table 5:
Characteristics
Operating range: Tj = −20 °C to +150 °C; VDD = 180 V to 210 V; test conditions: Tamb = 25 °C; VDD = 200 V;
Voc(1) = Voc(2) = Voc(3) = 1⁄2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in
test circuit of Figure 9; unless otherwise specified.
Symbol
Parameter
Min
Typ
Max
Unit
Iq
quiescent supply current
Conditions
5.6
6
7.6
mA
Vref(int)
internal reference voltage (input
stage)
-
2.5
-
V
kΩ
Ri
input resistance
-
2.1
-
G
gain of amplifier
73
81
89
∆G
gain difference
−4.2
0
+4.2
-
55
-
dB
-
−50
-
dB
µA
PSRR
power supply rejection ratio
αct(DC)
DC crosstalk between channels
f < 50 kHz
[1]
Measurement output pin Iom; Voc = Voc(min) to Voc(max)
Iom(offset)
offset current of measurement
output (for three channels)
Ioc = 0 µA;
Vom = 1.8 V to 6 V
−50
-
+50
∆Iom/∆Ioc
linearity of current transfer
(for three channels)
Ioc = −100 µA to +100 µA;
Vom = 1.8 V to 6 V
−0.9
−1.0
−1.1
Ioc = −100 µA to +10 mA;
Vom = 1.8 V to 4 V
−0.9
−1.0
−1.1
Output pins Voc(1), Voc(2), Voc(3)
Voc(DC)
DC output voltage
Ii = 0 µA
76
87
97
V
∆Voc(DC)(offset)
differential DC output offset
Ii = 0 µA
voltage between two output pins
−5
0
+5
V
∆Voc(T)
output voltage temperature drift
-
10
-
mV/K
∆Voc(T)(offset)
differential output offset voltage
temperature drift between two
output pins
-
0
-
mV/K
Ioc(max)
maximum peak output current
Voc = 50 V to VDD − 50 V
-
20
-
mA
Voc(min)
minimum output voltage
Vi = 4.5 V; at Ioc = 0 mA
[2]
-
-
10
V
[2]
VDD − 15
-
-
V
-
5.5
-
MHz
Voc(max)
maximum output voltage
Vi = 0.5 V; at Ioc = 0 mA
BS
small signal bandwidth
Voc = 60 V (p-p)
BL
large signal bandwidth
Voc = 100 V (p-p)
-
4.5
-
MHz
tco(p)
cathode output propagation time Voc = 100 V (p-p) square
50 % input to 50 % output
wave
[3]
-
60
-
ns
∆tco(p)
difference in cathode output
propagation time 50 % input to
50 % output (between two
output pins)
Voc = 100 V (p-p) square
wave
[3]
−10
0
+10
ns
toc(r)
cathode output rise time
10 % output to 90 % output
Voc = 50 V to 150 V square
wave
[3]
67
91
113
ns
toc(f)
cathode output fall time
90 % output to 10 % output
Voc = 150 V to 50 V square
wave
[3]
67
91
113
ns
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Rev. 02 — 28 April 2005
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TDA6107AJF
Philips Semiconductors
Triple video output amplifier
Table 5:
Characteristics …continued
Operating range: Tj = −20 °C to +150 °C; VDD = 180 V to 210 V; test conditions: Tamb = 25 °C; VDD = 200 V;
Voc(1) = Voc(2) = Voc(3) = 1⁄2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W; measured in
test circuit of Figure 9; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
350
ns
tst
settling time input (50 %) to
output (99 % to 101 %)
Voc = 100 V (p-p) square
wave
[3]
SR
slew rate between
50 V to VDD − 50 V
Vi = 2.5 V (p-p) square
wave
[3]
-
900
-
V/µs
Ov
cathode output voltage
overshoot
Voc = 100 V (p-p) square
wave
[3]
-
2
-
%
[1]
The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.
[2]
See Figure 6 for the typical DC-to-DC transfer of Vi to Voc.
[3]
f < 1 MHz; tr = tf = 40 ns [pins Vi(1), Vi(2) and Vi(3)]; see Figure 7 and Figure 8.
mce455
200
Voc
(V)
160
120
80
40
0
0
1
2
3
4
Vi (V)
Fig 6. Typical DC-to-DC transfer of Vi to Voc
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Rev. 02 — 28 April 2005
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TDA6107AJF
Philips Semiconductors
Triple video output amplifier
2.96
Vi
(V)
2.34
t
1.73
tst
Ov (in %)
151
150
140
149
Voc
(V)
100
60
50
t
toc(r)
tco(p)
mce477
Fig 7. Output voltage [pins Voc(1), Voc(2) and Voc(3)] rising edge as a function of the AC input signal
9397 750 14728
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Rev. 02 — 28 April 2005
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TDA6107AJF
Philips Semiconductors
Triple video output amplifier
2.96
Vi
(V)
2.34
t
1.73
tst
150
140
Voc
(V)
100
Ov (in %)
51
60
50
49
t
toc(f)
tco(p)
mce476
Fig 8. Output voltage [pins Voc(1), Voc(2) and Voc(3)] falling edge as a function of the AC
input signal
10. Application information
10.1 Cathode output
The cathode output is protected against peak currents (caused by positive voltage peaks
during high-resistance flash) of 3 A maximum with a charge content of 100 µC. External
protection against higher currents is described in Application note AN10227-01.
The cathode is also protected against peak currents (caused by positive voltage peaks
during low-resistance flash) of 6 A maximum with a charge content of 100 nC. External
protection against higher currents is described in Application note AN10227-01.
The DC voltage of pin VDD must be within the operating range of 180 V to 210 V during
the peak currents.
10.2 Flashover protection
The TDA6107AJF incorporates protection diodes against CRT flashover discharges that
clamp the cathodes output voltage up to a maximum of VDD + Vd.
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TDA6107AJF
Philips Semiconductors
Triple video output amplifier
To limit the diode current an external 1.5 kΩ carbon high-voltage resistor in series with the
cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to
be connected to the main PCB).
VDD must be decoupled to GND:
1. With a capacitor > 20 nF with good HF behavior (e.g. foil); this capacitor must be
placed as close as possible to pins VDD and GND and must be within 5 mm.
2. With a capacitor > 3.3 µF on the picture tube base print, depending on the CRT size.
10.3 Switch-off behavior
The switch-off behavior of the TDA6107AJF is controllable. This is because the output
pins of the TDA6107AJF are still under control of the input pins for low power supply
voltages (approximately 30 V and higher).
10.4 Bandwidth
The addition of the flash resistor produces a decreased bandwidth and increases the rise
and fall times.
10.5 Dissipation
A distinction must first be made between static dissipation (independent of frequency) and
dynamic dissipation (proportional to frequency).
The static dissipation of the TDA6107AJF is due to voltage supply currents and load
currents in the feedback network and CRT.
The static dissipation Pstat equals: Pstat = VDD × IDD + 3 × Voc × Ioc
Where:
VDD = supply voltage
IDD = supply current
Voc = DC value of cathode output voltage
Ioc = DC value of cathode output current
The dynamic dissipation Pdyn equals: Pdyn = 3 × VDD × (CL + Cint) × fi × Voc(p-p) × δ
Where:
CL = load capacitance
Cint = internal load capacitance (≈4 pF)
fi = input frequency
Voc(p-p) = cathode output voltage (peak-to-peak value)
δ = non-blanking duty cycle
The TDA6107AJF must be mounted on the picture tube base print to minimize the load
capacitance.
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TDA6107AJF
Philips Semiconductors
Triple video output amplifier
11. Test information
VDD
J1
C1
22 µF
6
Rf
Vi(1) 1
Ri
C7
20 nF
Vof
C2
9
1
Ra
Voc(1)
C10
6.8 pF
Iom
22 nF
C8
10 µF
R1
2 MΩ
C9
3.2 pF
J2
C3
22 µF
Rf
Vi(2) 2
Ri
Vof
C4
8
2
Ra
C11
136 pF
R2
100 kΩ
C13
6.8 pF
R3
2 MΩ
C14
136 pF
R4
100 kΩ
C16
6.8 pF
R5
2 MΩ
C17
136 pF
R6
100 kΩ
Voc(2)
Iom
22 nF
probe 1
C12
3.2 pF
J3
C5
22 µF
Rf
Vi(3) 3
Ri
Vof
C6
7
3
probe 2
Voc(3)
Ra
22 nF
C15
3.2 pF
VIP
REFERENCE
5
probe 3
Iom
TDA6107AJF
Vom
4
4V
GND
mce459
Current sources J1, J2 and J3 must be adjusted so that the DC output voltage of pins Voc(1), Voc(2) and Voc(3) is set to 100 V.
Fig 9. Test circuit
11.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
9397 750 14728
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Rev. 02 — 28 April 2005
11 of 16
TDA6107AJF
Philips Semiconductors
Triple video output amplifier
12. Package outline
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
SOT111-1
D
D1
A2
q
P
P1
Q
A3
q2
q1
A
seating plane
A4
E
pin 1 index
c
L
1
9
e2
b
e
Z
b2
0
θ
w M
b1
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
mm
18.5
17.8
A2
A3
max.
3.7
8.7
8.0
A4
b
b1
b2
c
D (1)
D1
E (1)
e
e2
15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54
15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
L
P
P1
3.9
3.4
2.75
2.50
3.4
3.2
Q
q
1.75 15.1
1.55 14.9
q1
q2
w
Z (1)
max.
θ
4.4
4.2
5.9
5.7
0.25
1
65o
o
55
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-03-11
03-03-12
SOT111-1
Fig 10. Package outline SOT 111-1 (DBS9MPF)
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Rev. 02 — 28 April 2005
12 of 16
TDA6107AJF
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Triple video output amplifier
13. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe, it is desirable to take normal precautions appropriate to
handling integrated circuits.
14. Soldering
14.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
14.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
14.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
14.4 Package related soldering information
Table 6:
Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
−
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable [1]
PMFP [2]
−
not suitable
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2]
For PMFP packages hot bar soldering or manual soldering is suitable.
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Triple video output amplifier
15. Revision history
Table 7:
Revision history
Document ID
Release date
Data sheet status
Change notice Doc. number
Supersedes
TDA6107AJF_2
20050428
Product data sheet
-
TDA6107AJF_1
Modifications:
TDA6107AJF_1
•
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•
Changed data sheet status to product data sheet
20030919
Preliminary specification -
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-
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14 of 16
TDA6107AJF
Philips Semiconductors
Triple video output amplifier
16. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
18. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
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Triple video output amplifier
20. Contents
1
2
3
4
5
5.1
5.2
6
7
8
8.1
9
10
10.1
10.2
10.3
10.4
10.5
11
11.1
12
13
14
14.1
14.2
14.3
14.4
15
16
17
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application information. . . . . . . . . . . . . . . . . . . 9
Cathode output . . . . . . . . . . . . . . . . . . . . . . . . . 9
Flashover protection . . . . . . . . . . . . . . . . . . . . . 9
Switch-off behavior . . . . . . . . . . . . . . . . . . . . . 10
Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Test information . . . . . . . . . . . . . . . . . . . . . . . . 11
Quality information . . . . . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Handling information. . . . . . . . . . . . . . . . . . . . 13
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Soldering by dipping or by solder wave . . . . . 13
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13
Package related soldering information . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information . . . . . . . . . . . . . . . . . . . . 15
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 28 April 2005
Document number: 9397 750 14728
Published in The Netherlands
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