Data Sheet

TFA9810
Stereo full-bridge audio amplifier 2 x 12 W
Rev. 03 — 20 February 2008
Product data sheet
1. General description
The TFA9810 is a two-channel power comparator for high-efficiency class D audio
amplifier systems. It contains two full-bridge Bridge-Tied Load (BTL) power stages, drive
logic, protection control logic and full differential input comparators. By using this power
comparator a compact closed-loop self-oscillating digital amplifier system or open-loop
system can be built. The TFA9810 does not require a heat sink and operates using an
asymmetrical supply voltage.
2. Features
n
n
n
n
n
n
Stereo full-bridge power comparator for class D audio amplifier applications
No external heat sink required
Operating voltage range: asymmetrical from 8 V to 20 V
Thermally protected
Zero dead-time switching
Current-limiting (no audible interruptions)
3. Applications
n
n
n
n
n
n
Self-oscillating or open-loop class D audio amplifier applications
Flat-panel television sets
Flat-panel monitors
Multimedia systems
Wireless speakers
High-end CRT television sets
4. Quick reference data
Table 1.
Quick reference data
Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified
Symbol
Parameter
Condition
Min
Typ
Max
Unit
VP
supply voltage
VP = VDDPx − VSSPx
8
12
20
V
Ioff
off-state current
off mode
-
110
200
µA
Iq
quiescent current
with load, filter and
snubbers connected
-
35
45
mA
ηpo
output power
efficiency
output power
2 x 9 W into 8 Ω;
Po = Po(nom)
87
89
-
%
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
Table 1.
Quick reference data …continued
Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified
Symbol
Parameter
Condition
Min
Typ
Max
Unit
Po(RMS)
RMS output power
RL = 8 Ω; VP = 12 V;
THD = 10 %; Two channel
driven; no heat sink
required.
-
9.5
-
W
Po
output power
VP = 12 V; RL = 8 Ω
-
-
-
-
8.5
9.5
-
W
THD = 10 %
6.5
7.5
-
W
VP = 14 V; RL = 8 Ω;
THD = 10 %; thermally
limited
THD = 1 %
-
15
-
W
VP = 16 V; RL = 8 Ω;
THD = 10 %; thermally
limited
-
15
-
W
VP = 12 V; RL = 6 Ω;
THD = 10 %; thermally
limited
-
12
-
W
VP = 12 V; RL = 4 Ω;
THD = 10 %; thermally
limited
-
15
-
W
5. Ordering information
Table 2.
Ordering information
Type number
TFA9810T
Package
Name
Description
Version
SO32
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
2 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
6. Block diagram
TFA9810
27
BOOT1P
25
VDDP1
DRIVER
HIGH
26 OUT1P
CONTROL
LOGIC
VDDA1 4
DRIVER
LOW
30 VSSP1
IN1P 2
COMPARATOR 1
IN1N 3
STABI1
VSSA1 5
DRIVER
HIGH
DIAG 10
TEST 11
29 BOOT1N
VDDP1
PROTECTION
OVP
UVP
OCP
OTP
ODP
WP
28 OUT1N
CONTROL
LOGIC
DRIVER
LOW
VSSP1
31 STAB1
SO/OL 6
REFERENCE
22 BOOT2P
ENABLE 7
24 VDDP2
DRIVER
HIGH
CDELAY 8
23 OUT2P
CONTROL
LOGIC
DRIVER
LOW
VDDA2 13
19 VSSP2
IN2P 15
IN2N 14
STABI2
COMPARATOR 2
20 BOOT2N
VDDP2
VSSA2 12
DRIVER
HIGH
21 OUT2N
CONTROL
LOGIC
DRIVER
LOW
VSSP2
18
STAB2
HEATSPREADER
1
16
17
32
VSSD(HW)
Fig 1.
9
n.c.
010aaa016
Block diagram
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
3 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
7. Pinning information
7.1 Pinning
VSSD(HW)
1
IN1P
2
32 VSSD(HW)
31 STAB1
IN1N
3
VDDA1
4
30 VSSP1
29 BOOT1N
VSSA1
5
28 OUT1N
SO/OL
6
27 BOOT1P
ENABLE
7
26 OUT1P
CDELAY
8
n.c.
9
TFA9810
SO32
25 VDDP1
24 VDDP2
DIAG 10
23 OUT2P
TEST 11
22 BOOT2P
VSSA2 12
21 OUT2N
VDDA2 13
20 BOOT2N
IN2N 14
19 VSSP2
18 STAB2
IN2P 15
17 VSSD(HW)
VSSD(HW) 16
010aaa017
Fig 2.
Pin configuration
The SO32 package has four corner leads. These leads (1, 16, 17, and 32) are internally
connected to the die pad and must be connected to VSSA in the application. Together with
the applied copper area on the Printed Circuit Board (PCB) these leads determine the
ambient temperature, which affects the thermal resistance of the junction.
7.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
VSSD(HW)
1, 16, 17,
32
Negative digital supply voltage and handle wafer
IN1P
2
Positive input comparator channel 1
IN1N
3
Negative input comparator channel 1
VDDA1
4
Positive analog supply voltage channel 1
VSSA1
5
Negative analog supply voltage channel 1
SO/OL
6
SO/OL input enables self-oscillating / open-loop configuration
ENABLE
7
Enable input to switch between SLEEP and OPERATING
CDELAY
8
CDELAY input determines the switch on/off timing
n.c.
9
Not connected
DIAG
10
Diagnostic output; open drain
TEST
11
Test signal input; for testing purposes only
VSSA2
12
Negative analog supply voltage channel 2
VDDA2
13
Positive analog supply voltage channel 2
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
4 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
Table 3.
Pin description …continued
Symbol
Pin
Description
IN2N
14
Negative input comparator channel 2
IN2P
15
Positive input comparator channel 2
STAB2
18
Decoupling of internal 11 V regulator for channel 2 drivers
VSSP2
19
Negative power-supply voltage channel 2
BOOT2N
20
Bootstrap high-side driver negative output channel 2
OUT2N
21
Negative output channel 2
BOOT2P
22
Bootstrap high-side driver positive output channel 2
OUT2P
23
Positive output channel 2
VDDP2
24
Positive supply voltage power channel 2
VDDP1
25
Positive power supply voltage channel 1
OUT1P
26
Positive output channel 1
BOOT1P
27
Bootstrap high-side driver positive output channel 1
OUT1N
28
Negative output channel 1
BOOT1N
29
Bootstrap high-side driver negative output channel 1
VSSP1
30
Negative supply voltage power channel 1
STAB1
31
Decoupling of internal 11 V regulator for channel 1 drivers
8. Functional description
8.1 General
The TFA9810 is a dual-switching power comparator. It is the main building block for a
stereo high-efficiency Class D audio power amplifier system. It contains two full-bridge
BTL power stages, drive logic, protection-control logic and full differential input
comparators and references (see Figure 1). By using this power comparator a compact
closed-loop self-oscillating digital amplifier system or open-loop system can be built. A
second-order low-pass filter converts the Pulse Width Modulation (PWM) output signal
into an analog audio signal across the speaker.
8.2 Interfacing
The pins ENABLE and SO/OL control the operating mode of the TFA9810. Both the
ENABLE and the SO/OL pins refer to VSSD(HW).
When the SO/OL pin is connected to VSSA the TFA9810 is in self-oscillating mode: when
the SO/OL pin is floating the TFA9810 is in open-loop mode.
The TEST pin needs to be connected to VDDA in both situations.
Table 4.
SO/OL connections
Interfacing
SO/OL connected to
Configuration
VSSD(HW)
Self-oscillating
Open
Open-loop
The device has two modes: SLEEP and OPERATING.
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
5 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
In SLEEP mode the TFA9810 is not biased and has a very low supply current.
When the TFA9810 is set to OPERATING mode the device is started via the start-up
sequence, which provides a pop-free start-up behavior. After start-up the reference
voltages STAB are present and the outputs start switching.
Table 5.
Start-up
Interfacing
ENABLE [V]
Mode
ENABLE < 0.8 V
SLEEP
ENABLE > 3 V
OPERATING
8.3 Input comparators
The input stages have a differential input and are optimized for low noise and low offset.
This results in maximum flexibility in the application.
8.3.1 Operating in self-oscillating configuration
The inputs (IN1P, IN1N, IN2P, IN2N) of the comparators are internally set to a voltage level
of 0.5VP, but only during the start-up sequence. In operating mode the inputs are
high-ohmic.
8.3.2 Operating in open-loop configuration
No internal voltages are applied to the inputs. The input pins (IN1P, IN1N, IN2P, IN2N) are
pulled down to VSSA level by internal resistors.
8.4 Diagnostic
The DIAG output is an open-drain output. The maximum current is 2 mA. Whenever one
of the protections is triggered the DIAG output is activated low. The DIAG output refers to
VSSD.
8.5 Protections
Overtemperature, overcurrent, overvoltage, undervoltage, overdissipation sensors, and
window protection are included in the TFA9810. When one of these sensors exceeds its
threshold level either the output power stage is switched off and the outputs (OUT1N,
OUT1P, OUT2N, OUT2P) become floating, or the TFA9810 shuts down and starts up
immediately.
• OverTemperature Protection (OTP)
If the junction temperature (Tj) exceeds a threshold level of about 150 °C then the
outputs become floating. The device will start switching again after 5 µs and when the
temperature is below 150 °C. This is thermal limitation without audible interruptions.
• OverCurrent Protection (OCP)
If the output current exceeds the maximum output current threshold level the output
becomes floating. The device will start switching again after 5 µs. This is current
limitation without audible interruptions.
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
6 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
• OverVoltage Protection (OVP)
When the supply voltage applied to the TFA9810 exceeds the maximum supply
voltage threshold level the device will shut down. The device will restart when the
supply voltage is within the operating range.
• UnderVoltage Protection (UVP)
When the supply voltage applied to the TFA9810 falls below the minimum supply
voltage threshold level the device will shut down. The device will restart when the
supply voltage is within the operating range.
• OverDissipation Protection (ODP)
The ODP in the TFA9810 is a combination of two protections. Exceeding a
temperature threshold level of 135 °C an internal pre-warning is generated. When an
overcurrent is detected during the pre-warning the device will shut down. When the
ENABLE pin is high the TFA9810 will restart automatically. The restart sequence
(switch-off → switch-on) will take 200 ms to 500 ms.
• Window Protection (WP)
During start-up, if one of the outputs is shorted to VSS or VDD the device will not start.
This is an effective measure to protect the device against shorts between the outputs
(before the filter) and the ground or supply lines. The supply must be switched off prior
to removing any short. The WP protects the device against failure during board
assembly.
Table 6.
Overview protections
Protections
Symbol
Condition
DIAG
Outputs
Recovering
OTP
Tj > 150 °C
LOW
Floating
Automatic, after 5 µs and Tj < 150 °C
OCP
IO > IORM
LOW
Floating
Automatic, after 5 µs and IO < IORM
OVP
VP > 20 V
LOW
Floating
Restart (switch-off → switch-on when VP < 20 V)
UVP
VP < 8 V
LOW
Floating
Restart (switch-off → switch-on when VP > 8 V)
ODP
Tj > 135 °C and IO > IORM
LOW
Floating
Restart (switch-off → switch-on when
Tj < 135 °C or IO < IORM)
WP
OUTX > VDDA - 1 V or
OUTX < VSSA + 1 V
LOW
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
7 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
8.6 Start-up sequence
VP
ENABLE
STAB1
CDELAY
V IN x
FLOATING
FLOATING
PWM
PWM
AUDIO
AUDIO
OUT x
AUDIO
DIAG
SLEEP
START-UP
OPERATING
FAULT
RESTART
OPERATING
SHUT-DOWN
SLEEP
010aaa018
Fig 3.
Start-up sequence
9. Internal circuitry
1,16, 17, 32
VDDA
22 V
VSSA
010aaa024
Fig 4.
Internal circuitry 0001
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
8 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
VDDA1
2
135 kΩ
5.5 V
VSSA
hvp
135 kΩ
5.5 V
3
VSSA1
010aaa025
Fig 5.
Internal circuitry 0002
4
22 V
5
010aaa026
Fig 6.
Internal circuitry 0003
VDDA1
VDDA1
50 µA
110 kΩ
6
VSSA1
VSSA
010aaa027
Fig 7.
Internal circuitry 0004
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
9 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
VDDA1
3 kΩ
7
250 nA
VSSA
010aaa028
Fig 8.
Internal circuitry 0005
VDDA1
2 nA
8
200 nA
5 kΩ
DISCHARGE
VSSA1
010aaa029
Fig 9.
Internal circuitry 0006
VDDA1
10
VSSA1
VSSD
010aaa030
Fig 10. Internal circuitry 0007
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
10 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
VDDA1
11
13 kΩ
VSSA1
010aaa031
Fig 11. Internal circuitry 0008
Fig 12. Internal circuitry 0009
VDDA2
14
5.5 V
130 kΩ
hvp
VSSA2
130 kΩ
5.5 V
15
VSSA2
010aaa033
Fig 13. Internal circuitry 0010
VDDA2
100 mA
18
12 V
VSSD
010aaa034
Fig 14. Internal circuitry 0011
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
11 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
24
23.5 V
19
010aaa035
Fig 15. Internal circuitry 0012
20
12 V
OUT2N
010aaa036
Fig 16. Internal circuitry 0013
VDDP2
21
VSSP2
010aaa037
Fig 17. Internal circuitry 0014
22
12 V
OUT2P
010aaa038
Fig 18. Internal circuitry 0015
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
12 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
VDDP2
23
VSSP2
010aaa039
Fig 19. Internal circuitry 0016
25
23.5 V
30
010aaa040
Fig 20. Internal circuitry 0017
VDDP1
26
VSSP1
010aaa041
Fig 21. Internal circuitry 0018
Fig 22. Internal circuitry 0019
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
13 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
VDDP1
28
VSSP1
010aaa043
Fig 23. Internal circuitry 0020
29
12 V
OUT1N
010aaa044
Fig 24. Internal circuitry 0021
VDDA1
100 mA
31
12 V
VSSD
010aaa045
Fig 25. Internal circuitry 0022
10. Limiting values
Table 7.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
asymmetrical
−0.3
+23
V
3
-
A
VP
supply voltage
IORM
repetitive peak output current
Tj
junction temperature
-
+150
°C
Tstg
storage temperature
−55
+150
°C
Tamb
ambient temperature
−40
+85
°C
Pmax
maximum power dissipation
-
2.5
W
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
14 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
Table 7.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
Vx
DIAG
VSS − 0.3
+12
V
IN1P - IN1N
−12
+12
V
IN2P - IN2N
−12
+12
V
all other pins
VSS − 0.3
VDD + 0.3
V
VINX with
respect to
other pins
−1500
+1500
V
all other pins
−2000
+2000
V
Min
Typ
Max
Unit
-
41
44
K/W
-
44
-
K/W
30
K/W
8
K/W
Vesd
voltage on pin x
electrostatic discharge voltage
11. Thermal characteristics
Table 8.
Characteristics
Symbol
Parameter
Conditions
[1]
thermal resistance
from junction to
ambient
SO32. JEDEC test board
Ψj-lead
thermal
characterization
parameter from
junction to lead
SO32
[1]
Ψj-top
thermal
characterization
parameter from
junction to top of
package
SO32
[1] [2]
Rth(j-a)
SO32. Two-layer application
board
4
[1]
Measured in a JEDEC high K-factor test board (standard EIA/JESD 51-7) in free air with natural convection.
[2]
Strongly depends on where the measurement is taken on the case.
12. Characteristics
12.1 Static characteristics
Table 9.
Static characteristics
Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage
VP
supply voltage
VP = VDDPx − VSSPx
8
12
20
V
Ioff
off-state current
off mode
-
110
200
µA
Iq
quiescent current
with load, filter, and snubbers
connected
-
35
45
mA
with respect to VSSD
−0.3
-
+0.8
V
3
-
VP
V
ENABLE input
VIL
LOW-level input voltage
VIH
HIGH-level input voltage with respect to VSSD
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
15 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
Table 9.
Static characteristics …continued
Tamb = 25 °C; VP = 12 V; fosc = 550 kHz; Figure 33 unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
II
input current
VI = 5 V
-
1
20
µA
SO/OL input
VIL
LOW-level input voltage
with respect to VSSD
-
-
0.4
V
VIH
HIGH-level input voltage with respect to VSSD
3
4
4.5
V
voltage on pin STABI
10
11
12
V
-
-
1
mV
-
-
15
µV
STABI
VSTABI
with respect to VSS
Comparator full-differential input stage
Voffset(i)(eq)
equivalent input offset
voltage
20 Hz < f < 20 kHz
Vcm
common mode voltage
VSSA + 3
-
VDDA −1
V
IIB
input bias current
-
-
1
µA
150
-
-
°C
level internal fixed
20
21.5
23
V
level internal fixed
7
7.5
8
V
3
3.5
-
A
high level
-
VDDA − 1
-
V
low level
-
VSSA + 1
-
V
OverTemperature Protection (OTP)
Tprot
protection temperature
OverVoltage Protection (OVP)
Vth(ovp)
overvoltage protection
threshold voltage
UnderVoltage Protection (UVP)
VP(uvp)
undervoltage protection
supply voltage
OverCurrent Protection (OCP)
IO(ocp)
[1]
overcurrent protection
output current
Window Protection (WP)
output voltage
VO
[1]
Current limiting concept: in overcurrent condition no interruption of the audio signal in case of impedance drop.
12.2 Dynamic characteristics
Table 10. Dynamic characteristics
Tamb = 25 °C; VP = 12 V; RL = 8 Ω; Figure 33 unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
PWM output
tr
rise time
-
10
-
ns
tf
fall time
-
10
-
ns
TFA9810_3
Product data sheet
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Rev. 03 — 20 February 2008
16 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
Table 10. Dynamic characteristics …continued
Tamb = 25 °C; VP = 12 V; RL = 8 Ω; Figure 33 unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tresp
response time
transition PWM output from
LOW to HIGH
-
60
-
ns
-
50
-
ns
-
60
-
ns
-
50
-
ns
VI = 70 mV
VI = 3.3 V
transition PWM output from
HIGH to LOW
VI = 70 mV
VI = 3.3 V
tw(min)
minimum pulse width
RDSon
drain-source on-state
resistance
ηpo
output power
efficiency
PWM output
output power 2 x 9 W into 8 Ω.
Po = Po(nom)
-
60
-
ns
[1]
-
0.28
0.35
Ω
[2]
87
89
-
%
[1]
High-side and low-side power switch have the same series resistance.
[2]
Output power measured across the loudspeaker load. Output power is measured indirectly via RDSon.
12.3 AC characteristics measured in a typical application
Table 11. AC characteristics measured in typical application
Tamb = 25 °C; VP = 12 V; RL = 8 Ω; fosc = 550 kHz; Figure 33 unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VP
supply voltage
VP = VDDPx − VSSPx
8
12
20
V
Po(RMS)
RMS output power
RL = 8 Ω; VP = 12 V;
THD = 10 %; Two channel
driven; no heat sink required.
-
9.5
-
W
Po
output power
VP = 12 V; RL = 8 Ω
8.5
9.5
-
W
THD = 10 %
6.5
7.5
-
W
VP = 14 V; RL = 8 Ω;
THD = 10 %; thermally limited
THD = 1 %
-
12
-
W
VP = 16 V; RL = 8 Ω;
THD = 10 %; thermally limited
-
15
-
W
VP = 12 V; RL = 6 Ω;
THD = 10 %; thermally limited
-
12
-
W
VP = 12 V; RL = 4 Ω;
THD = 10 %; thermally limited
-
15
-
W
THD+N
total harmonic
distortion-plus-noise
Po is 1 W; f = 1 kHz; AES17
brick-wall filter
-
0.04
0.1
%
ηpo
output power
efficiency
Po = 9 W
87
89
-
%
Gv(cl)
closed-loop voltage
gain
VI = 100 mV (RMS); fi = 1 kHz
19
19.7
21
dB
Vn(o)
output noise voltage
Inputs shorted;
-
150
-
µV
AES17 brick-wall filter
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
17 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
Table 11. AC characteristics measured in typical application …continued
Tamb = 25 °C; VP = 12 V; RL = 8 Ω; fosc = 550 kHz; Figure 33 unless otherwise specified.
Symbol
Parameter
Conditions
S/N
signal-to-noise ratio
Vo = 10 V (RMS); gain 20 dB
SVRR
supply voltage ripple
rejection
Vripple = 2 V(p-p); fi= 1 kHz
αcs
channel separation
Po = 1 W; fi = 1 kHz
[1]
[1]
Min
Typ
Max
Unit
-
96
-
dB
34
45
-
dB
55
70
-
dB
Minimum value determined by R5, R10, R17, R22 equalling +1 % and R7, R14, R18, R20 equalling −1 %.
13. Quality specification
In accordance with SNW-FQ-611-E, ‘if this type is used as an audio amplifier’. The
number of the quality specification can be found in the Quality Reference Handbook. The
handbook can be ordered using the code 9398 510 63011.
14. Application information
14.1 Output power estimation
For BTL configuration the output power just before clipping can be estimated using
Equation 1:
BTL : Po 0.5 %
2
RL
------------------------------------------------------ × V P
R L + 2 × ( R DSon + R s )
= -------------------------------------------------------------------------------2 × RL
(1)
Where,
•
•
•
•
•
VP = supply voltage (VDDPx − VSSPx) [V]
RL = load resistance [Ω]
RDSon = drain-source on-state resistance [Ω]
Rs = series resistance [Ω]
Po0.5 % = output power at the THD level of 0.5 % [W]
The output power at 10 % THD can be estimated by using Equation 2:
P o 10 % = 1.25 × P o 0.5 %
(2)
Figure 26 and Figure 27 below show the estimated output power at THD = 0.5 % and
THD = 10 % as a function of the BLT supply voltage for different load impedances.
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
18 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
010aaa019
25
Po
(W)
20
(3)
(2)
15
(1)
10
5
0
8
12
16
20
VP (V)
(1) RL = 4 Ω
(2) RL = 6 Ω
(3) RL = 8 Ω
Fig 26. BTL output power as function of supply voltage: THD = 0.5 %. 3 A
010aaa020
30
(3)
Po
(W)
(2)
20
(1)
10
0
8
12
16
20
VP (V)
(1) RL = 4 Ω
(2) RL = 6 Ω
(3) RL = 8 Ω
Fig 27. BTL output power as function of supply voltage: THD = 10 %. 3 A
14.2 Output current limiting
The peak output current is internally limited above a level of 3 A minimum. During normal
operation the output current should not exceed this threshold level of 3 A, otherwise the
output signal will be distorted. The peak output current in BTL can be estimated using
Equation 3:
VP
I O max ≤ ------------------------------------------------------ ≤ 3 A
R L + 2 × ( R DSon + R s )
(3)
Where:
• VP = supply voltage (VDDPx − VSSPx) [V].
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
19 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
• RL = load resistance [Ω].
• RDSon = drain-source on-state resistance [Ω].
• Rs = series resistance [Ω].
Example:
A 4 Ω speaker in BTL configuration can be used up to a supply voltage of 12 V without
running into current limiting. Current limiting (clipping) will avoid audio holes, but it causes
a sound distortion similar to voltage clipping.
14.3 Speaker configuration and impedance
For a flat-frequency response (second-order Butterworth filter) it is necessary to change
the low-pass filter components LLC and CLC according to the speaker configuration and
impedance. Table 12 shows the practical required values:
Table 12.
Filter component values
Configuration
Impedance [Ω]
LLC [µF]
CLC [nF]
BTL
4
10
1500
6
16
1000
8
22
680
14.4 Differential input
For a high common-mode rejection ratio and a maximum of flexibility in the application,
the audio inputs of the application are fully differential.
The input configuration for a differential-input application is illustrated in Figure 28.
OUT1P
+
AUDIO
DSP
VSS
−
IN1P
IN1N
OUT1N
010aaa021
Fig 28. Input configuration for differential input
14.5 Single-ended input
When using an audio source with a single-ended ‘out’, it is important to connect the IN1N
from the application board to the VSS/GND of the audio source (e.g. Audio DSP).
The input configuration for single-ended ‘in’ application is illustrated in Figure 29.
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
20 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
OUT1P
+
IN1P
AUDIO
DSP
IN1N
−
OUT1N
010aaa022
Fig 29. Input configuration for single-ended input
14.6 Curves measured in a typical application
010aaa197
+30
Gv
(dB)
+25
+20
(1)
(2)
+15
+10
10−2
10−1
1
102
10
fi (Hz)
VP = 12 V, Vi = 100 mV
(1) OUT1
(2) OUT2
Fig 30. Gain as a function of frequency
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
21 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
010aaa195
10
THD+N
(%)
1
10−1
(2)
(1)
10−2
10
102
103
104
105
fi (Hz)
VP = 12 V, RL = 8 Ω, Po = 1 W
(1) OUT1
(2) OUT2
Fig 31. Total harmonic distortion + noise as a function of frequency
010aaa196
10
THD+N
(%)
1
10−1
(1)
(2)
10−2
10−2
10−1
1
10
Po (W)
VP = 12 V, RL = 8 Ω, fi = 1 kHz
(1) OUT1
(2) OUT2
Fig 32. Total harmonic distortion as a function of output power
14.7 Typical application diagram TFA9810
The typical application diagram with the TFA9810 supplied from an asymmetrical supply is
shown in Figure 33.
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
22 of 29
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12 V
12 V
C32
220 µF
12 V
L1
BEAD
R3
10 Ω
C33
100 nF
C3
100 nF
1
2 IN1
C4
100 nF
VDDA1
4
R7
R6
10 kΩ
10 kΩ
R31 IN1P
Rev. 03 — 20 February 2008
R10 GND
C10
220 pF
10 kΩ
R11
R14
100 kΩ
GND
13
9
2
R32 IN1N
3
29
CDELAY
28
31
10 kΩ
10 kΩ
C21
220 pF
23
R23
22
15
R26
100 kΩ
GND
OUT2+
1
OUT1
L4
22 µH
C16
1µF
Snubber network
(Optional)
GND
STABI2
GND
L5
22 µH
OUT2P
C19
220 nF
BOOT2P
2
J6
R29
10 Ω
C29
470 pF
R30
10 Ω
C30
470 pF
C20
680 nF
20
C22
68 pF
BOOT2N
C25
220 nF
R34 IN2N
21
OUT2N
12
1
16
17
32
30 19
C23 GND
680 nF
1
10 kΩ
5
GND
OUT2−
L6
22 µH
OUT2
R100
22 Ω
VSSA1 VSSA2 VSSD VSSD VSSD VSSDVSSP1 VSSP2
Fig 33. Typical application diagram TFA9810
GND
010aaa023
TFA9810
23 of 29
© NXP B.V. 2008. All rights reserved.
J7
10 kΩ
C13 GND
680 nF
10 kΩ
14
10 kΩ
GND
Audio amplifier 2 x 12 W
R22 GND
C24
220 pF
C28
470 pF
STABI1
OUT2+
11, TEST
R33 IN2P
R28
10 Ω
C12
680 nF
C17
1µF
R17
100 kΩ
R19
C27
470 pF
OUT1N
10
VDDA2
C26
1 µF
18
7
DIAG
R27
10 Ω
OUT1−
6
2
J3
BOOT1N
8
TFA9810
ENABLE
J5
C9
220 nF
BOOT1P
C14
220 nF
SO/OL
R18
L3
22 µH
OUT1+
OUT1P
10 kΩ
C15
330 nF
OUT2−
24
26
GND
2 IN2
25
GND
VDDP2
27
OUT1+
1
GND
n.c VDDP1
C11
47 pF
10 kΩ
J4
VDDA2
C5
100 nF
10 kΩ
C8
220 pF
C18
1 µF
ENABLE
GND
R5
100 kΩ
J2
C7
1 µF
SW1
C31
100 nF
GND
OUT1−
C6
1 µF
L2
BEAD
C2
220 µF
C1
220 µF
2
GND
NXP Semiconductors
TFA9810_3
Product data sheet
1
VP J1
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
12 V
12 V
C32
220 µF
12 V
L1
BEAD
R3
10 Ω
C33
100 nF
C3
100 nF
1
2 IN1
ENABLE
C4
100 nF
GND
VDDA1
R5
100 kΩ
4
R7
R6
10 kΩ
10 kΩ
R31 IN1P
Rev. 03 — 20 February 2008
R10 GND
C10
220 pF
10 kΩ
R11
9
25
2
GND
VDDP2
24
26
27
R32 IN1N
3
29
R35
200 kΩ
28
CDELAY
SO/OL
31
OUT2−
1
R18
10
VDDA2
11
R33 IN2P
R19
10 kΩ
C21
220 pF
J5
R22 GND
C24
220 pF
R23
R26
100 kΩ
GND
OUT2+
GND
C13 GND
680 nF
1
OUT1
L4
22 µH
STAB1
C16
1µF
Snubber network
(Optional)
GND
STAB2
OUT2+
23
22
15
GND
L5
22 µH
OUT2P
C19
220 nF
BOOT2P
2
J6
R29
10 Ω
C29
470 pF
R30
10 Ω
C30
470 pF
C20
680 nF
10 kΩ
20
C22
68 pF
BOOT2N
C25
220 nF
R34 IN2N
21
OUT2N
12
1
16
17
32
30 19
C23 GND
680 nF
1
10 kΩ
5
GND
OUT2−
L6
22 µH
OUT2
R100
22 Ω
VSSA1 VSSA2 VSSD VSSD VSSD VSSDVSSP1 VSSP2
GND
Fig 34. Typical application diagram TFA9810 with externally adjusted switch-on time
010aaa431
TFA9810
24 of 29
© NXP B.V. 2008. All rights reserved.
J7
10 kΩ
C28
470 pF
C17
1µF
14
10 kΩ
R28
10 Ω
C12
680 nF
Audio amplifier 2 x 12 W
C26
1 µF
DIAG
R17
100 kΩ
10 kΩ
2 IN2
18
7
ENABLE
C27
470 pF
OUT1N
6
TFA9810
GND
R27
10 Ω
OUT1−
8
2
J3
BOOT1N
C14
220 nF
OUT1+
C18
1 µF
C9
220 nF
BOOT1P
10 kΩ
C15
4.7 µF
L3
22 µH
OUT1+
OUT1P
STAB1
R14
100 kΩ
GND
13
GND
n.c VDDP1
C11
47 pF
10 kΩ
J4
VDDA2
C5
100 nF
10 kΩ
C8
220 pF
J2
C7
1 µF
SW1
C31
100 nF
GND
OUT1−
C6
1 µF
L2
BEAD
C2
220 µF
C1
220 µF
2
GND
NXP Semiconductors
TFA9810_3
Product data sheet
1
VP J1
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
14.8 Typical application: bill of materials
Table 13.
Typical application: bill of materials
Item
Quantity
Reference
Part
Description
1
2
C1, C2.
220 µF/35 V
General purpose 85 °C, diameter 8 mm
2
5
C3, C4, C5, C31, C33.
100 nF/50 V
SMD 0805 X7R
3
2
C16, C17.
1 µF/50 V
SMD 1206 X7R
4
4
C6, C7, C18, C26
1 µF/25 V
MKT
5
4
C8, C10, C21, C24.
220 pF/25 V
SMD 0402 NP0
6
4
C9, C14, C19, C25.
220 nF/25 V
SMD 0805 X7R
7
1
C11
47 pF/25 V
SMD 0402 NP0
8
4
C12, C13, C20, C23.
680 nF/25 V
MKT
9
1
C15
330 nF/25 V
SMD 0805 X7R
10
1
C22.
68 pF/25 V
SMD 0402 NP0
11
1
C32
1000 µF/25 V
CE12-02R
12
3
J1, J3, J6.
Screw terminal
Two pins
13
2
J2, J5.
CINCH
CINCH
14
2
J4, J7
Jumper
Closed on demo board only
15
2
L1, L2.
BEAD
SMD 1206 Würth Elektronik
DC < 0.5 Ω 10 MHz > 80 Ω
16
4
L3, L4, L5, L6.
22 µH
8RDY TOKO A7040HN-220M,
11RHBP TOKO A7503CY-220M or Sagami
7311NA-220M
17
5
R3
10 / 0.25 W / 5 %
SMD 1206
18
4
R5, R14, R17, R26.
100 k / 0.1 W /
1 % for 20 dB
SMD 0603
200 k / 0.1 W /
1 % for 26 dB
19
12
R6, R7, R10, R11, R18,
10 k / 0.1 W / 1 %
R19, R22, R23, R31, R32,
R33, R34.
SMD 0603
20
1
SW1
PCB switch
Secme 090320901
21
1
U1
TFA9810T
SOT287-1 (SO32) NXP Semiconductors
14.9 Snubber network
Table 14.
Snubber network: bill of materials
Item
Quantity Reference
1
4
C27, C28, C29, C30 470 pF, 25 V
Part
SMD 0805 X7R
Footprint
2
4
R27, R28, R29, R30 10 / 0.25 W /
5%
SMD 1206
15. Test information
General Quality Specification for General Applications, Power management and
RF Power. Document SNW-FQ-611 refers.
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
25 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
16. Package outline
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
D
E
A
X
c
y
HE
v M A
Z
17
32
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
16
1
0
detail X
w M
bp
e
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.27
0.18
20.7
20.3
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.2
1.0
0.25
0.25
0.1
0.95
0.55
0.01
0.02
0.01
0.011
0.007
0.81
0.80
0.30
0.29
0.05
0.419
0.394
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.055
0.016
0.047
0.039
0.01
0.01
0.037
0.004
0.022
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT287-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-08-17
03-02-19
MO-119
Fig 35. Package outline SOT287-1 (SO23)
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
26 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
17. Revision history
Table 15.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TFA9810_3
20080220
Product data sheet
-
TFA9810_2
Modifications:
•
•
Figure 33 has been updated.
Figure 34 has been added.
TFA9810_2
20070831
Preliminary data sheet
-
TFA9810_1
TFA9810_1
20070815
Preliminary data sheet
-
-
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
27 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TFA9810_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 20 February 2008
28 of 29
TFA9810
NXP Semiconductors
Audio amplifier 2 x 12 W
20. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.3
8.3.1
8.3.2
8.4
8.5
8.6
9
10
11
12
12.1
12.2
12.3
13
14
14.1
14.2
14.3
14.4
14.5
14.6
14.7
14.8
14.9
15
16
17
18
18.1
18.2
18.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Interfacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Input comparators. . . . . . . . . . . . . . . . . . . . . . . 6
Operating in self-oscillating configuration . . . . . 6
Operating in open-loop configuration . . . . . . . . 6
Diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Start-up sequence . . . . . . . . . . . . . . . . . . . . . . 8
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
Thermal characteristics. . . . . . . . . . . . . . . . . . 15
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15
Static characteristics. . . . . . . . . . . . . . . . . . . . 15
Dynamic characteristics . . . . . . . . . . . . . . . . . 16
AC characteristics measured in a typical
application. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Quality specification . . . . . . . . . . . . . . . . . . . . 18
Application information. . . . . . . . . . . . . . . . . . 18
Output power estimation. . . . . . . . . . . . . . . . . 18
Output current limiting. . . . . . . . . . . . . . . . . . . 19
Speaker configuration and impedance . . . . . . 20
Differential input . . . . . . . . . . . . . . . . . . . . . . . 20
Single-ended input . . . . . . . . . . . . . . . . . . . . . 20
Curves measured in a typical application . . . . 21
Typical application diagram TFA9810 . . . . . . . 22
Typical application: bill of materials. . . . . . . . . 25
Snubber network. . . . . . . . . . . . . . . . . . . . . . . 25
Test information . . . . . . . . . . . . . . . . . . . . . . . . 25
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27
Legal information. . . . . . . . . . . . . . . . . . . . . . . 28
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
18.4
19
20
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Contact information . . . . . . . . . . . . . . . . . . . . 28
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 20 February 2008
Document identifier: TFA9810_3
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