Module Parameters Minimum substrate thickness 450um (assumes 4 copper layers and minimum 75um die thickness) Minimum feature size 75um Minimum module XY size die XY dimension + 1.4mm Encapsulation yes Traceability yes Embedded components yes SMD components on top layer yes Packaging JEDEC tray or tape and reel. Footprint LGA Test Group Moisture Sensitivity Preconditioning: Test Standard Result JESD22-A113F, IPC/JEDEC J-STD-020 Level 2a Temperature Cycling -40°C to 60°C, 5 cycles Bake 125°C for 24 hrs Moisture Soak 120 hrs, 60°C/60%RH 3x Reflow JESD22-A113F, 260°C 3 Thermal Stress: Low Temperature Storage -40°C, 72 hrs High Temperature Storage 125°C, 72 hrs Temperature Cycling MIL-STD-883 Method 1010, Condition B, -55°C to 125°C, 20 cycles 3 Mechanical Stress: Mechanical Shock MIL-STD-883 Method 2002, Condition B, 5 shocks, 1500g Mechanical Vibration MIL-STD-883 Method 2007, Condition A, 20-2000Hz, 20G Constant Acceleration MIL-STD-883 Method 2001, 10,000G 3 Steady State Life Testing: Low and High Temperature Testing 0°C, 55°C HTOL 125°C, 1000 hrs 3 Exposure: Resistance to Solvents MIL-STD-883 Method 2016 ESD MIL-883 Method 3015, 1000V HBM 3 Assembly: Component Shear MIL-STD-883 Method 2019/2011 External physical dimensions MIL-883 Method 2016 Solderability MIL-STD-883 Method 2003.8/2022.2 Ionic Cleanliness IPC-TM-650 3