Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC

APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
1. Introduction
This application note is a guide for migrating to the Macronix MX30LF2G18AC from the Hynix
HY27UF082G2B 2Gb, 3V, NAND flash memory.
The document does not provide detailed information on the individual devices, but highlights the
major similarities and differences between them. The comparison covers the general features,
performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 10. Newer versions of the
datasheets may override the contents of this document.
2. Features
Both flash device families have similar features and functions as shown in Table 2-1. The primary
difference is that the Macronix device requires 4-bit ECC whereas the Hynix device only requires
1-bit ECC.
Table 2-1: Feature Comparison
Feature
Vcc Voltage Range
Macronix MX30LF2G18AC
Hynix HY27UF082G2B
2.7V ~ 3.6V
2.7V ~ 3.6V
x8
x8
Bus Width
Operating Temperature
Interface
-40°C ~ 85°C
-40°C ~ 85°C
ONFI 1.0 Standard
-
Block Size
128KB+4KB
128KB+4KB
Page Size
2KB+64B
2KB+64B
ECC Requirement
4b/528B
1b/528B
OTP Size
30 pages
-
Block 0
Block 0
ONFI standard
-
C2h/DAh/90h/95h/06h
ADh/DAh/10h/95h/44h
ONFI Signature
4Fh/4Eh/46h/49h
-
Data Retention
10 Years
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
Guaranteed Good Blocks at Shipping
Unique ID
ID Code
Packages
P/N: AN0331
1
Ver.1, Aug.11, 2014
APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
3. Performance
Table 3-1 and Table 3-2 show MX30LF2G18AC and HY27UF082G2B Read/Write performance.
Table 3-1: Read Performance (Read Latency and Sequential Read)
Read function
Macronix MX30LF2G18AC
Hynix HY27UF082G2B
Read Latency time (tR)
25us (max.)
25us (max.)
Sequential Read time (tRC)
20ns (min.)
25ns (min.)
Table 3-2: Write Performance (Program and Erase)
Write Function
Page Program time (tPROG)
Block Erase time (tERASE)
Macronix MX30LF2G18AC
Hynix HY27UF082G2B
300us (typ.)/ 600us (max.)
200us (typ.)/ 700us (max.)
1ms (typ.)/ 3.5ms (max.)
1.5ms (typ.)/ 2ms (max.)
4 (max.)
8 (max.)
100,000
100,000
NOP
1
Write/Erase Cycles* (Endurance)
Note: 100K Endurance cycle with ECC protection.
4. DC Characteristics
Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar.
Table 4-1: Read / Write Current
DC Characteristic
Macronix MX30LF2G18AC
Hynix HY27UF082G2B
Sequential Read Current (ICC1)
20mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
Program Current (ICC2)
20mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
Erase Current (ICC3)
15mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
Standby Current – CMOS
10uA (typ.)/50uA (max.)
10uA (typ.)/50uA (max.)
Macronix MX30LF2G18AC
Hynix HY27UF082G2B
Input Low Voltage (VIL)
-0.3V (min.) / 0.2VCC (max.)
-0.3V (min.) / 0.2Vcc (max.)
Input High Voltage (VIH)
0.8VCC (min.) /
VCC+0.3V (max.)
0.8Vcc (min.) /
Vcc+0.3V (max.)
Output Low Voltage (VOL)
0.2V (max.)
0.4V (max.)
Output High Voltage (VOH)
VCC-0.2V (min.)
2.4V (min.)
Table 4-2: Input / Output Voltage
DC Characteristic
P/N: AN0331
2
Ver.1, Aug.11, 2014
APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
5. Package Pin/Ball Definition
Package physical dimensions are similar to each other. For detailed information, please refer to the
individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the
Macronix and Hynix devices. The HY27UF082G2B can be compared by the MX30LF2G18AC
without pin conflicts. Only 48-TSOP pin #38 (63-VFBGA ball G5) may need special attention
because the pin is designated “PT” which, if high during power-up, enables a memory protection
function on the MX30LF2G18AC. The PT pin can be left unconnected as it has a weak internal
pull-down to disable the protection feature.
Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX30LF2G18AC
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
IO7
IO6
IO5
IO4
NC
VCC*1
PT
VCC
VSS
NC
VCC*1
NC
IO3
IO2
IO1
IO0
NC
NC
NC
VSS*1
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
DNU
NC
NC
NC
Pin38: PT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
HY27UF2G2B
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
NC
NC
VCC
VSS
NC
NC
NC
I/O3
I/O2
I/O1
IO0
NC
NC
NC
NC
Pin38: DNU
Note:
1. These pins might not be connected internally. However it is recommended to connect
these pins to power(or ground) as designated for ONFI compatibility.
Table 5-1: 48-TSOP Package Pin Definition
Brand
Macronix
Part Name
#38 pin
Hynix
MX30LF2G18AC-TI
PT
HY27UF082G2BTPI
NC
Note: The PT pin can be left unconnected as it has a weak internal pull-down to disable the protection feature.Please
refer to the datasheet for more details.
P/N: AN0331
3
Ver.1, Aug.11, 2014
APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison
MX30LF2G18AC
1
2
A
NC
NC
B
NC
3
4
5
6
7
HY27UF082G2B
8
9
10
NC
NC
NC
NC
1
2
A
NC
NC
B
NC
3
4
5
6
7
8
C
WP#
ALE
VSS
CE#
WE#
R/B#
C
WP#
ALE
VSS
CE#
WE#
R/B#
D
VCC
*1
RE#
CLE
NC
NC
NC
D
NC
RE#
CLE
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
VSS
*1
NC
F
NC
NC
NC
NC
NC
NC
G
NC
VCC
*1
PT
NC
NC
NC
G
NC
NC
NC
NC
NC
PRE
H
NC
IO0
NC
NC
NC
VCC
H
NC
I/O0
NC
NC
NC
Vcc
J
NC
IO1
NC
VCC
IO5
IO7
J
NC
I/O1
NC
Vcc
I/O5
I/O7
K
VSS
IO2
IO3
IO4
IO6
VSS
K
Vss
I/O2
I/O3
I/O4
I/O6
Vss
9
10
NC
NC
NC
NC
L
NC
NC
NC
NC
L
NC
NC
NC
NC
M
NC
NC
NC
NC
M
NC
NC
NC
NC
G5: PT
G5: DNU
Note:
1. These pins might not be connected internally. However it is recommended to
connect these pins to power(or ground) as designated for ONFI compatibility.
Table 5-2: 63-VFBGA Package Ball Definition
Brand
Macronix
Hynix
Part Name
MX30LF2G18AC-XKI
HY27UF082G2BFPI
#G5 ball
PT
NC
Note: The PT pin can be left unconnected as it has a weak internal pull-down to disable the protection feature. Please
refer to the datasheet for more details.
P/N: AN0331
4
Ver.1, Aug.11, 2014
APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
6. Command Set
Basic command sets and status checking methods are similar. Read, Write, and Erase operation
commands are identical (Table 6-1). There are differences in 2-Plane commands (Table 6-2).
Table 6-1: Command Table
Command
Random Data Input
Random Data Output
Cache Read Begin
Read Mode
Cache Read End
Read ID
Reset
Page Program
Cache Program
Block Erase
Read Status
Read Parameter Pg.
Unique ID Read
Set Feature
Get Feature
Status Enhance Read
Macronix MX30LF2G18AC
1st Cycle
2nd Cycle
85h
05h
E0h
00h
31h
00h
30h
3Fh
90h
FFh
80h
10h
80h
15h
60h
D0h
70h
ECh
EDh
EFh
EEh
78h
-
Table 6-2: Two-Plane Command Table
Macronix MX30LF2G18AC
Command
1st
2nd
3rd
4th
2 Plane Program
2 Plane Cache Program
2 Plane Block Erase
P/N: AN0331
Hynix HY27UF082G2B
1st Cycle
2nd Cycle
85h
05h
E0h
00h
31h
00h
30h
3Fh
90h
FFh
80h
10h
60h
D0h
70h
-
Hynix HY27UF082G2B
Cycle
Cycle
Cycle
Cycle
1st
Cycle
2nd
Cycle
3rd
Cycle
4th
Cycle
80h
80h
60h
11h
11h
D1h
80h
80h
60h
10h
15h
D0h
80h
60h
11h
60h
81h
D0h
10h
-
5
Ver.1, Aug.11, 2014
APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
6-2 Status Register
When a flash Read/Program/Erase operation is in progress, either the “Ready/Busy# Pin Checking”
or “Status Output Checking” method may be used to monitor the operation. Both are standard
NAND flash algorithms and can be used for both device families. Table 6-3 shows that Status
Output content provided by the Read Status command (70h) which is compatible.
Table 6-3: Status Output
Status Output
Macronix MX30LF2G18AC
Hynix HY27UF082G2B
SR[0]
PGM/ERS status: Pass/Fail
PGM/ERS/READ status: Pass/Fail
SR[1]
Cache Program status: Pass/Fail
Reserved
SR[2]
Reserved
Reserved
SR[3]
Reserved
Reserved
SR[4]
SR[6]
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
Reserved
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
SR[5]
P/N: AN0331
6
Ver.1, Aug.11, 2014
APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
7. Read ID Command
The ID of the Macronix MX30LF2G18AC begins with a one-byte Manufacturer Code followed by a
four-byte Device ID. While the same command set is used to read the Manufacturer ID, Device ID,
and flash structure, the IDs are different, allowing software to identify the device manufacturer and
device type (Table 7-1).
Table 7-1: Manufacturer and Device IDs
ID code
Macronix MX30LF2G18AC
Value
1st Byte
2nd Byte
I/O0
I/O1
I/O2
I/O3
3rd Byte
I/O4
I/O5
I/O6
th
4
Byte
5th
Byte
P/N: AN0331
I/O7
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
Hynix HY27UF082G2B
C2h/DAh/90h/95h/06h
Manufacturer Code
Device Identifier
ADh/DAh/10h/95h/44h
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Number of Die per Chip Enable
Cell Structure
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Programming
Number of Simultaneously
Programmed Pages
Page Size (exclude Spare Area)
Page Size (exclude Spare Area)
Size of Spare Area (Byte per 512Byte)
Sequential Read Cycle Time (tRC)
Size of Spare Area (Byte per 512Byte)
Sequential Read Cycle Time (tRC)
Block Size (exclude Spare Area)
Block Size (exclude Spare Area)
Organization
Sequential Read Cycle Time (tRC)
Organization
Sequential Read Cycle Time (tRC)
ECC Level Requirement
Reserved
Number of Planes per CE
Number of Planes per CE
Plane Size
Plane Size
Reserved
Reserved
7
Interleaved Programming
Between Multiple Chips
Cache Programming
Ver.1, Aug.11, 2014
APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
8. Power-Up Timing
Macronix and Hynix power-up sequences are similar, but the timing is slightly different. Although
both devices use 2.7V (VCC min.) as the start point, timing references are different. Check the
system timing to determine if adjustments are needed.
Table 8-1: Power-Up Timing
H/W Timing Characteristic
Vcc (min.) to WE# low
Vcc (min.) to R/B# high
Vcc (min.) to R/B# low
Vcc ramp start to R/B# low
Macronix MX30LF2G18AC
1ms (max.)
N/A
10us (max.)
N/A
Hynix HY27UF082G2B
N/A
1ms (max.)
100us (max.)
N/A
Vcc(min.)
VCC
WE#
R/B#
Figure 8-1: Power-Up Timing
9. Summary
Macronix MX30LF2G18AC and Hynix HY27UF082G2B NAND have similar features and pin outs.
Because basic Read/Program/Erase commands as well as block, page, and spare area sizes are
the same, device migration may require minimal or no firmware modifications to accommodate
differences in ECC requirements.
P/N: AN0331
8
Ver.1, Aug.11, 2014
APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
10. Reference
Table 10-1 shows the datasheet versions used for comparison in this application note. For the
most current, detailed Macronix specification, please refer to the Macronix website at
http://www.macronix.com
Table 10-1: Datasheet Version
Datasheet
MX30LF2G18AC
HY27UF082G2B
Location
-
Date Issue
Sept. 05, 2014
Jan. 09, 2008
Revision
Rev. 0.02
Rev. 0.2
Note: Macronix data sheet is subject to change without notice.
11. Appendix
Cross Reference Table 11-1 shows basic part number and package information for the Macronix
MX30LF2G18AC and Hynix HY27UF082G2B product.
Table 11-1: Part Number Cross Reference
Density
Macronix Part No.
Hynix Part No.
MX30LF2G18AC-TI
HY27UF082G2BTPI
2Gb
MX30LF2G18AC-XKI
HY27UF082G2BFPI
Package
Dimension
48-TSOP
12x20mm
63-VFBGA
9 x 11 x 1.0 mm
12. Revision History
Revision
1.0
P/N: AN0331
Description
Initial Release
9
Date
Aug. 11, 2014
Ver.1, Aug.11, 2014
APPLICATION NOTE
Comparing Hynix HY27UF082G2B with Macronix MX30LF2G18AC
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applications only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2014. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit,
NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC,
Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The
names and brands of third party referred thereto (if any) are for identification purposes only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN0331
10
Ver.1, Aug.11, 2014
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