Comparing Spansion S34ML01G1 with Macronix MX30LF1G08AA

APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
1. Introduction
This application note is a guide for migrating to the Macronix MX30LF1G08AA from the Spansion®
S34ML01G1 1Gb, 3V, NAND flash memory.
The document does not provide detailed information on the individual devices, but highlights the
major similarities and differences between them. The comparison covers the general features,
performance, command codes and other differences.
The information in this document is based on datasheets listed in Section 10. Newer versions of the
datasheets may override the contents of this document.
2. Features
Both flash device families have similar features and functions as shown in Table 2-1.
Table 2-1: Feature Comparison
Feature
Vcc voltage range
Bus Width
Operating Temperature
Interface
Block Size
Page Size
ECC Requirement
OTP size
Guarantee Good blocks at
shipping
Unique ID
ID Code
ONFI signature
Data Retention
Package
P/N: AN0257
Macronix MX30LF1G08AA
2.7V ~ 3.6V
x8
-40°C ~ 85°C
Standard NAND Interface
128KB+4KB
2KB+64B
1b/528B
-
Spansion S34ML01G1
2.7V ~ 3.6V
x8
-40°C ~ 85°C
ONFI 1.0 Standard
128KB+4KB
2KB+64B
1b/528B
128KB
Block 0
Block 0
C2h/F1h/80h/1Dh
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
ONFI standard
01h/F1h/00h/1Dh
4Fh/4Eh/46h/49h
10 Years
48-TSOP (12x20mm)
63-VFBGA (9x11mm)
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Ver.1, Sep. 11, 2013
APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
3. Performance
Table 3-1 and Table 3-2 show MX30LF1G08AA and S34ML01G1 Read/Write performance.
Table 3-1: Read Function Performance (Read Latency time and Sequential Read)
Read function
Macronix MX30LF1G08AA
Spansion S34ML01G1
Read Latency time (tR)
25us (max.)
25us (max.)
Sequential Read time (tRC)
30ns (min.)
25ns (min.)
Table 3-2: Write Function Performance (Program and Erase)
Write Function
Macronix MX30LF1G08AA
Page Program time (tPROG)
250us (typ.)/700us (max.)
Block Erase time (tERASE)
2ms (typ.)/3ms (max.)
NOP
4 (max.)
1
Write/Erase Cycles* (Endurance)
100,000
Spansion S34ML01G1
200us (typ.)/700us (max.)
2ms (typ.)/3ms (max.)
4 (max.)
100,000
Note: 100K Endurance cycle with ECC protection.
4. DC Characteristics
Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar.
Table 4-1: Read / Write Current
DC Characteristic
Macronix MX30LF1G08AA
Spansion S34ML01G1
Sequential Read Current (ICC1)
Program Current (ICC2)
Erase Current (ICC3)
Standby Current – CMOS
15mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
10uA (typ.)/50uA (max.)
15mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
15mA (typ.)/30mA (max.)
10uA (typ.)/50uA (max.)
Macronix MX30LF1G08AA
Spansion S34ML01G1
-0.3V (min.) / 0.2VCC (max.)
0.8VCC (min.) / VCC+0.3V (max.)
0.4V (max.)
2.4V (min.)
-0.3V (min.) / 0.2VCC (max.)
0.8VCC (min.) / VCC+0.3V (max.)
0.4V (max.)
2.4V (min.)
Table 4-2: Input / Output Voltage
DC Characteristic
Input Low Voltage (VIL)
Input High Voltage (VIH)
Output Low Voltage (VOL)
Output High Voltage (VOH)
P/N: AN0257
2
Ver.1, Sep. 11, 2013
APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
5. Package Pin/Ball Definition
Package physical dimensions are similar to each other. For detailed information, please refer to the
individual datasheets. Tables 5-1 and 5-2 show differences in pin assignments between the
Macronix and Spansion devices. However because the corresponding pins of the Macronix
MX30LF1G08AA are NC (no connect / not bonded), the S34ML01G1 can be compared by the
MX30LF1G08AA without pin conflicts. Only 48-TSOP pin #35 (ball G3 on VFBGA) may need
special attention because the pin is designated “DNU” (Do Not Use) on the MX30LF1G08AA-TI. A
DNU pin should not be connected to any signal or power trace on the board.
Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX30LF1G08AA
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
NC
NC
NC
NC
IO7
IO6
IO5
IO4
NC
NC
NC
VCC
VSS
DNU
NC
NC
IO3
IO2
IO1
IO0
NC
NC
NC
NC
Pin35: DNU (Do Not Use)
NC
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
S34ML01G1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS*1
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC*1
NC
VCC
VSS
NC
VCC*1
NC
I/O3
I/O2
I/O1
IO0
NC
NC
NC
VSS*1
Note:
1. These pins should be connected to power supply or ground (as designated)
following the ONFI specification, however they might not be bonded internally.
Macronix is NC for those pinout. It is fine to connect to VCC or VSS
Table 5-1: 48-TSOP Package Pin Definition
Brand
Part Name
Macronix
MX30LF1G08AA-TI
Spansion
S34ML01G1
#48 pin
NC
VSS
(might not be bonded, just for ONFI compatibility)
#39 pin
NC
VCC
(might not be bonded, just for ONFI compatibility)
#35 pin
DNU
NC
#34 pin
NC
VCC
(might not be bonded, just for ONFI compatibility)
#25 pin
NC
VSS
(might not be bonded, just for ONFI compatibility)
P/N: AN0257
3
Ver.1, Sep. 11, 2013
APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
Figure 5-2: 63-VFBGA (9x11mm) Package and Pin Layout Comparison
MX30LF1G08AA
1
2
A
NC
NC
B
NC
3
4
5
6
7
S34ML01G1
8
9
10
NC
NC
NC
NC
1
2
A
NC
NC
B
NC
3
4
5
6
7
8
C
WP#
ALE
VSS
CE#
WE#
R/B#
C
WP#
ALE
VSS
CE#
WE#
R/B#
D
NC
RE#
CLE
NC
NC
NC
D
VCC
*1
RE#
CLE
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
E
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
NC
NC
F
NC
NC
NC
NC
VSS
*1
NC
G
DNU
NC
NC
NC
NC
NC
G
NC
VCC
*1
NC
NC
NC
NC
H
NC
IO0
NC
NC
NC
VCC
H
NC
I/O0
NC
NC
NC
Vcc
J
NC
IO1
NC
VCC
IO5
IO7
J
NC
I/O1
NC
Vcc
I/O5
I/O7
K
VSS
IO2
IO3
IO4
IO6
VSS
K
Vss
I/O2
I/O3
I/O4
I/O6
Vss
9
10
NC
NC
NC
NC
L
NC
NC
NC
NC
L
NC
NC
NC
NC
M
NC
NC
NC
NC
M
NC
NC
NC
NC
G3: DNU (Do Not Use)
Note:
1. These pins should be connected to power supply or ground (as designated)
following the ONFI specification, however they might not be bonded internally.
Macronix is NC for those pinout, and it is fine to connect to Vcc or Vss
Table 5-2: 63-VFBGA Package Ball Definition
Brand
Macronix
Spansion
MX30LF1G08AA-XKI
S34ML01G1
#D3 ball
NC
VCC
(might not be bonded, just for ONFI compatibility)
#G3 ball
DNU
NC
#G4 ball
NC
VCC
(might not be bonded, just for ONFI compatibility)
#F7 ball
NC
VSS
(might not be bonded, just for ONFI compatibility)
Part Name
P/N: AN0257
4
Ver.1, Sep. 11, 2013
APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
6. Command Set
Basic command sets and status checking methods are similar.
The Read and Write operation commands are identical, but the devices have different command
sequences when accessing the cache read function. Additionally, Macronix supports a cache
program function and Spansion® does not (Table 6-1).
Table 6-1: Command Table
Command
Macronix MX30LF1G08AA
Spansion S34ML01G1
1st Cycle
2nd Cycle
1st Cycle
2nd Cycle
Random Data Input
85h
-
85h
-
Random Data Output
05h
E0h
05h
E0h
Cache Read Begin
00h
31h
31h
-
Read Mode
00h
30h
00h
30h
Cache Read End
34h
-
3Fh
-
Read ID
90h
-
90h
-
Reset
FFh
-
FFh
-
Page Program
80h
10h
80h
10h
Cache Program
80h
15h
-
-
Block Erase
60h
D0h
60h
D0h
Read Status
70h
-
70h
-
Read Parameter Pg.
-
-
ECh
-
P/N: AN0257
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Ver.1, Sep. 11, 2013
APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
6-2 Status Register
When a flash read/program/erase operation is in progress, either the “Ready/Busy# pin checking” or
“Status output checking” may be used to monitor the operation. Both are standard NAND flash
algorithms and can be used for both device families. Table 6-2 shows that Status output content
provided by the Read Status command (70h) is compatible.
Table 6-2: Status Output
Status Output
Macronix MX30LF1G08AA
Spansion S34ML01G1
SR[0]
PGM/ERS status: Pass/Fail
PGM/ERS status: Pass/Fail
SR[1]
Cache Program status: Pass/Fail
Cache Program status: Pass/Fail
SR[2]
Reserved
Reserved
SR[3]
Reserved
Reserved
SR[4]
Reserved
Reserved
SR[5]
PGM/ERS/Read internal controller:
Ready/Busy
PGM/ERS/Read internal controller:
Ready/Busy
SR[6]
PGM/ERS/Read status: Ready/Busy
PGM/ERS/Read status: Ready/Busy
SR[7]
Write Protect
Write Protect
P/N: AN0257
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Ver.1, Sep. 11, 2013
APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
7. Read ID Command
The ID of the Macronix MX30LF1G08AA begins with a one-byte Manufacturer Code followed by a
three-byte Device ID. While the same command set is used to read the Manufacturer ID, Device ID,
and flash structure, the IDs are different, allowing software to identify the device manufacturer and
device type (Table 7-1).
Table 7-1: Manufacturer and Device IDs
ID code
Value
1 Code
2nd Code
IO1, IO0
IO3, IO2
st
3rd
Code
IO5, IO4
IO6
4th
Code
IO7
IO1, IO0
IO2
IO7, IO3
IO5, IO4
IO6
P/N: AN0257
Macronix MX30LF1G08AA
Spansion S34ML01G1
C2h/F1h/80h/1Dh
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (exclude Spare Area)
Size of Spare Area (Byte per 512Byte)
Sequential Read Cycle Time (tRC)
Block Size (exclude Spare Area)
Organization
01h/F1h/00h/1Dh
Manufacturer Code
Device Identifier
Number of Die per Chip Enable
Cell Structure
Number of Simultaneously
Programmed Pages
Interleaved Programming
Between Multiple Chips
Cache Program
Page Size (exclude Spare Area)
Size of Spare Area (Byte per 512Byte)
Serial Access Time (tRC)
Block Size (exclude Spare Area)
Organization
7
Ver.1, Sep. 11, 2013
APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
8. Power-Up Timing
Macronix and Spansion® power-up sequences are similar, but the timing is slightly different.
Macronix defines 2.5V (Vth) as the measurement point while Spansion® uses 2.7V (Vcc min.) as the
measurement point. Check the system timing to determine if adjustments are needed.
Table 8-1: Power-Up Timing
H/W Timing Characteristic
Vth (2.5V) to WE# low
Vcc (min.) to WE# low
Vth (2.5V) to R/B# low
Vcc (min.) to R/B# low
Macronix MX30LF1G08AA
1us (min.)
N/A
1ms (max.)
N/A
Spansion S34ML01G1
N/A
100us (max.)
N/A
5ms (max.)
Vth/Vcc(min.
VCC
WE#
R/B#
Figure 8-1: Power-Up Timing
9. Summary
Macronix MX30LF1G08AA and Spansion® S34ML01G1 NAND have similar features and pinouts.
While basic read/program/erase commands are the same, more advanced features such as cache
access are implemented slightly differently. Overall, device migration may require minimal or no
firmware modifications.
P/N: AN0257
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Ver.1, Sep. 11, 2013
APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
10. Reference
Table 10-1 shows the datasheet versions used for comparison in this application note.
For the most current, detailed Macronix specification, please refer to the Macronix
Website at http://www.macronix.com
Table 10-1: Datasheet Version
Datasheet
MX30LF1G08AA
S34ML01G1_04G1
Location
Date Issue
Revision
-
MAR. 28, 2013
MAR. 7, 2013
Rev. 1.2
Rev. 15
Note: Macronix data sheet is subject to change without notice.
11. Appendix
Cross Reference Table 11-1 shows basic part number and package information for the Macronix
MX30LF1G08AA and Spansion® S34ML01G1 product families.
Table 11-1: Part Number Cross Reference
Density Macronix Part No.
Spansion Part No.
MX30LF1G08AA-TI
S34ML01G100TFI00
1Gb
MX30LF1G08AA-XKI
S34ML01G100BHI00
Package
48-TSOP
63-VFBGA
Dimension
12x20mm
9x11x1.0mm
12. Revision History
Revision
1.0
P/N: AN0257
Description
Initial Release
9
Date
Sep. 11, 2013
Ver.1, Sep. 11, 2013
APPLICATION NOTE
Comparing Spansion® S34ML01G1 with Macronix MX30LF1G08AA
Except for customized products which have been expressly identified in the applicable agreement,
Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial,
personal, and/or household applica- tions only, and not for use in any applications which may, directly or
indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are
used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said
Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and
Macronix as well as it’s suppliers and/or distributors shall be released from any and all liabil- ity arisen
therefrom.
Copyright© Macronix International Co., Ltd. 2013. All rights reserved, including the trademarks and
tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit,
Nbit, NBiit, Macronix NBit, eLite- Flash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo,
BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Audio, Rich Book, Rich TV,
and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes
only.
For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com
P/N: AN0257
10
Ver.1, Sep. 11, 2013
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